EP0294195A2

EP0294195A2 - Polyimide resin composition

Info

Publication number: EP0294195A2
Application number: EP88305033A
Authority: EP
Inventors: Masahiro Ohta; Shoji Tamai; Saburo Kawashima; Hideaki Oikawa; Akihiro Yamaguchi; Katsuaki Iiyama
Original assignee: Mitsui Toatsu Chemicals Inc
Current assignee: Mitsui Chemicals Inc
Priority date: 1987-06-05
Filing date: 1988-06-02
Publication date: 1988-12-07
Anticipated expiration: 2008-06-02
Also published as: DE3885796T2; EP0294195A3; AU1736388A; AU597494B2; KR890000597A; EP0294195B1; CA1338391C; KR920002156B1; DE3885796D1

Abstract

Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide;

where X indicates a direct bond or is -S- or and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

Description

This invention relates to a resin composition for molded articles and more particularly, a polyimide resin composition for the same use which is stable at high temperatures, and has improved heat resistance, chemical resistance, mechanical strength and moldability.
Polyimides obtained by reacting the dianhydride of a tetracarboxylic acid with a diamine not only have high-temperature stability, but also are excellent in mechanical strength and distortion resistance, and have a good flame retardant and electric insulative properties. Thus, they are now applied to appliances and equipment in fields of electrical engineering/electronics, aerospace vehicles and transportation, and in the future are expected to be widespread in the field of high temperature applications.
A variety of polyimides having excellent characteristics have been developed.
The polyimide, however, has both merits and demerits with respect to characteristic. For example, it is good in heat resistance, but it does not have a definitive glass transition temperature, and so must be processed, if used as material to be molded, e.g., by sintering-molding. Polyetherimides are good in processibility, but disadvantageous in respect to heat and solvent resistances because it has a low glass transition temperature and is soluble in hydrocarbon halogenide.
The inventors have found polyimides to be excellent in mechanical, thermal, electrical characteristics and solvent resistance, and having heat resistance, which have a repeating unit represented by the formula:
where X indicates a direct bond or is a radical selected from the group consisting of divalent hydrocarbon radicals having carbon atoms of 1 to 10, isopropyridene hexafluoride radical, carbonyl, thio, and sulfonyl, and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage as for example, disclosed in Japanese Laid-open Patent Nos. 14378/1986, 68817/1987, and 86021/1987, and in Japanese Patent Application Nos. 076475/1986 and 274206/1986.
Further the inventors have found other polyimides excellent in mechanical, thermal, electrical characteristics and solvent resistance and having heat resistance, which have a repeating unit represented by the formula:
where R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage (for example, Japanese Laid-open Patent No. 50372/1987).
On the other hand, in the electronic field, there is required higher heat resistance with increasing integration in appliances and instruments.
Also, the aerocraft-material industry requires reduction in weight and improved strength of aircrafts with higher speed and larger amounts of transportation, reflecting the requirement for materials having high heat resistance and good strength compared with conventional thermoplastic resins. Polyimides as above-mentioned are thermoplastic resins having heat resistance, good moldability, and their own favorable physical properties. Their heat resistance and mechanical strength, however, are not enough compared with those of a commercially-available aromatic polyamideimide such as TORLON® (Amco Chemicals Corp., USA).
It is an object of the invention to provide a polyimide resin composition having improved heat resistance and/or mechanical strength in addition to its intrinsic favorable properties.
In accordance with the present invention, there is provided a resin composition which comprises 99.9 to 50 % by weight of a polyimide having a repeating unit represented by the general formula (I):
where X indicates a direct bond or is -S- or
and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals and uncondensed polycycloaromatic radicals including the aromatic radicals interconnected directly or through a cross-linkage and 0.1 to 50 % by weight of an aromatic polyamideimide.
Preparation of polyimides for use in the invention is carried out, for example, in the process disclosed in the above-mentioned Japanese Laid-open Patnet No. 143478/1986, which comprises reacting an ether diamine represented by formula II:
where X is the same as defined above, with at least one tetracarboxylic dianhydride.
Examples of diamines for use in the invention are 4,4′-bis(3-aminophenoxy)biphenyl; bis[4-(3-aminophenoxy)phenyl]sulfide; 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene; and 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene.
Any diamine other than the above-mentioned ether diamines, can be used in mixture therewith within such a range that good physical properties of the polyimide is not impaired. Examples of such a diamine are as follows: m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, bis(3-aminophenyl)ether, (3-aminophenyl)(4-aminophenyl)ether, bis(4-aminophenyl)ether, bis(3-aminophenyl)sulfide, (3-aminophenyl)(4-aminophenyl)sulfide bis(4-aminophenyl)sulfide, bis(4-aminophenyl)sulfide, bis(3-aminophenyl)sulfoxide, (3-aminophenyl)(4-aminophenyl)sulfoxide, bis(4-aminophenyl)sulfoxide, bis(3-aminophenyl)sulfone, (3-aminophenyl)(4-aminophenyl)sulfone, bis(4-aminophenyl)sulfone, 3,3′-diaminobenzophenone, 3,4′-diaminobenzophenone, 4,4′-diaminobenzophenone, bis[4-(3-aminophenoxy)phenyl]methane, bis[4-(4-aminophenoxy)phenyl]methane, 1,1-bis[4-(3-aminophenoxy)phenyl]ethane, 1,1-bis[4-(4-aminophenoxy)phenyl]ethane, 1,2-bis[4-(3-aminophenoxy)phenyl]ethane, 1,2-bis[4-(4-aminophenoxy)phenyl]ethane, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]butane, 2,2-bis[4-(4-aminophenoxy)phenyl]butane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4′-bis(4-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl]ketone, bis[4-(4-aminophenoxy)phenyl]ketone, bis[4-(4-aminophenoxy)phenyl]sulfide, bis[4-(4-aminophenoxy)phenyl] sulfoxide, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ether, etc.
Tetracarboxylic dianhydrides for use in preparation of polyimides of the invention are represented by formula (III):
where R is the same as above-stated, and typical examples of these are ethylenetetracarboxylic acid dianhydride, butanetetracarboxylic acid dianhydride, cyclopentanetetracarboxylic acid dianhydride, pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, 2,2′,3,3′-benzophenonetetracarboxylic acid dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,2′,3,3′-biphenyltetracarboxylic acid dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 4,4′-(p-phenylenedioxy)diphthalic acid dianhydride, 4,4′-(m-phenylenedioxy)diphthalic acid dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 1,4,5,8-naphthalenetetracarboxylic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, 1,2,3,4-benzenetetracarboxylic acid dianhydride, 3,4,9,10-perylenetetracarboxylic acid dianhydride, 2,3,6,7-anthracenetetracarboxylic acid dianhydride, and 1,2,7,8-phenanthrenetetracarboxylic acid dianhydride. These may be used alone or in combination of at least two.
Particularly preferred radicals in the R defined above are tetravalent radicals represented in the formulas:
Aromatic polyamideimides suitable for use in the invention are polymers having as a repeating unit in the main chain a condensation product of imide and amide interconnected, which represented by formula (IV):
where Ar is a trivalent aromatic radical having at least one benzene ring, and Z is a divalent organic radical.
Particularly preferred aromatic polyamideimides are the condensation polymers having a repeating unit represented by formulas (V):
and (VI):
An example of aromatic polyamideimide is commercially-available under the trade name, TORLON® (Acomo Chemicals Corp., USA).
The resin composition to be molded according to the invention is composed of the above-mentioned polyimide of 99.9 to 50 % by weight, and the aromatic polyamideimide of 0.1 to 50 % by weight, the sum amounting to 100 % by weight.
The resin composition according to the invention consisting of the polyimide and the aromatic polyamideimide may be affected with even a small content of the latter with improvement in heat resistance and/or mechanical strength. The lower limit of the latter is 0.1 % by weight, preferably 0.5 % by weight.
Besides, aromatic polyamideimides have very high melt viscosity compared with conventional thermoplastic resins, and therefore, too much aromatic polyamideimide in the resin composition produces unfavorable results, i.e., their moldability falls to an insufficient level, together with a drop in elongation at break. Thus the maximum content of aromatic polyamideimide is limited, and is preferably 50 % by weight or less.
The resin composition according to the invention can usually be prepared by known methods, for example:

(1) A polyimide powder and an aromatic polyamideimide powder are treated by mixing and/or kneading by means of a mortar, Hensher mixer, drum blender, tumbler blender, ball mill or ribbon blender to obtain the desired powder.
(2) A polyimide powder is dissolved or suspended in an organic solvent. To the solution or suspension, an aromatic polyamideimide is added, and made to be uniformly dispersed or dissolved. Then the solvent is removed to obtain the desired powder.
(3) An aromatic polyamideimide is dissolved or suspended in a solution of a polyamide acid in an organic solvent, which is the precursor of the polyimide according to the invention, and then converted into an imide by heating to 100 to 400°C or in the presence of a usual imidization agent. Then the solvent is removed to obtain the desired powder.

The thus-obtained powdery polyimide composition is subjected, preferably after melt-blending, to various processes, for example, injection, compression, transfer or extrusion molding. Especially, in the preparation of the resin composition, a sample and effective method is to melt-blend both components in the form of powders or pellets or one component of powders and the other component of pellets.
The melt-blending can be accomplished by usual means for blending rubbers or plastics, such as a hot roll, Banbury mixer, Brabender or extruder. The melting temperature may be set within the temperature range where the mixture can be caused to melt without thermal decomposition, usually 280 to 420°C, preferably 300 to 400°C.
For molding the resin composition of the invention, injection and extrusion moldings permitting formation of a uniform melt-blend with high productivity are preferred. Additionally, transfer, compression or sintering molding, or film extrusion may be applied.
The resin composition of the invention may contain as additives at leaset one solid lubricant from molybdenum disulfide, graphite, boron nitride, lead monoxide, lead powder, etc. and at least one of reinforcement from glass fibers, carbon fibers, aromatic polyamide fibers, silicon carbide fibers, potassium titanate fibers, glass beads, etc.
Besides, the resin composition may contain at least one usual additive selected from antioxidants, thermal stabilizers, ultraviolet ray absorbers, fire retardants, fire-retardant-activity enhancing agents, antistatic agents, lubricants, coloring agents, etc.
The invention will be described more fully by way of examples of synthesis and comparative examples hereinafter:

Synthesis 1

In a reaction flask filled with a stirrer, a reflux condenser and a nitrogen introducing tube were placed 3.66 kg (10 mols) of 4,4′-bis(3-aminophenoxy)biphenyl and 52.15 kg of N,N-dimethylacetoamide, followed by addition of 2.11 kg (9.7 mols) of pyromellitic dianhydride at room temperature in nitrogen atmosphere with attention paid to elevation of the temperature of the solution. Then stirring was continued at room temperature for about 20 hours.
To this polyamide acid solution, 2.20 kg (20 mols) of triethylamine and 3.06 kg (30 mols) of acetic anhydride were dripped at room temperature in nitrogen atmosphere. After 20 hours' stirring, there was produced a yellow slurry, which was filtered off to yield a light yellow polyimide powder. To the resultant powder, methanol was added to produce a sludge, which was filtered off and dried at 180°C under reduced pressure for 8 hours to yield 5.36 kg of polyimide powder.
The thus-obtained polyimide powder had a logarithmic viscosity of 0.50 dl/g, as determined in the procedure: polyimide powder (0.5 g) was disolved in 100 ml of solvent with heating, then allowed to cool to 35°C and measured with a mixture of p-chlorophenol and phenol (90:10 parts/parts by weight) as solvent.
The glass transition temperature of the powder was 256°C as measured according to DSC and the thermal decomposition temperature 5 % at 560°C as measured according to DTA-TG.

Synthesis 2 to 4

With different diamines and different tetracarboxylic dianhydrides in varying combination powders of various polyimides were obtained in the same process as described in Synthesis 1.
Table 1 gives summary of Syntheses 1 through 4 which includes synthesis conditions of polyimide resins, and logarithmic viscosities of the produced polyimide powders. It includes the conditions for preparation in Synthesis 1 and the physical properties of the produced polyimide powder.

Synthesis 5

In a reaction flask, which is similar to that used in Synthesis 1, were placed 5 kg (10 mols) of 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene and 40.1 kg of N,N-dimethylacetoamide, and cooled to about 0°C, to which 5 portions (a total of 2,082 kg (9.55 mols)) of pyromellitic dianhydride were added in sequence in nitrogen atmosphere with attention paid to elevation of the temperature of the solution. Stirring was continued for about 2 hours. Subsequently the solution was cooled to room temeprature, followed by about 20 hours' further stirring in nitrogen atmosphere.
To this polyamide acid solution 2,20 kg (20 mols) of triethylamine and 2.55 kg (25 mols) acetic anhydride were dripped at room temperature in nitrogen atmosphere. After 20 hours' stirring, there was produced a yellow slurry, which was filtered off to yield a light yellow polyimide powder. To the resultant powder, methanol was added to produce a sludge, which was filtered off and dried at 150°C under reduced pressure for 8 hours to obtain 6.5 kg (yield: about 97.5 %) of light yellow polyimide powder. The glass transition temperature of this powder was 235°C as measured according DSC, and the logarithmic viscosity was 0.53 dl/g.

Syntheses 6 to 9

With different diamines and different tetracarboxylic acid dianhydrides in varying combinations, powders of various polyimides were obtained in the same process as described in Synthesis 5. Table 2 gives a summary of Syntheses 5 through 9 which includes synthesis conditions and logarithmic viscosities of the obtained polyimide powders.

Examples 1 through 25

Dry-blends of a polyimide powder obtained in any of Syntheses 1 through 9 with an aromatic polyamideimide powder TORLON 4203L® (Amoco Chemicals Corp., USA) commercially available in varying compositions summarized in Tables 2 through 4 were extruded, simultaneously with melting, mixing and kneading, to form uniformly-mixed pellets.
Subsequently a thus-obtained uniformly-mixed pellet was molded in an injection molding machine (Arburg All-Round A-20) under conditions of metal-mold temperature 220°C and barrel temperature 380 to 400°C. The molded test pieces were measured for their physical and thermal properties.
The obtained results are given in Tables 3 through 8.
The individual Tables include minimum injection molding pressures as well.
Data in the Tables were obtained as follows: tensile strength and elongation at break according to ASTM D-638, bending strength and bending modulus of elasticity according to ASTM D-790, Izod impact value according to D-256, glass transition temperature according to the TMA needle-insertion method, and heat distortion temperature according to ASTM D-648.

Comparative Examples 1 through 6

With other compositions out of the scope of the invention and in the same way as in Examples 1 through 25, molded products were obtained and the measured results of their physical and thermal properties are given Tables 3 through 8.

Claims

1. A resin composition which comprises 99.9 to 50 % by weight of a polyimide and 0.1 to 50 % by weight of an aromatic polyamideimide, said polyimide having a repeating unit represented by the general formula (I):

where X indicates a direct bond or is -S- or

and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

2. A resin composition defined in claim 1 wherein R in said general formula (I) is a tetravalent radical selected from the group consisting of radicals represented by

3. A resin composition defined in claim 1 wherein said aromatic polyamideimide is a polymer having a repeating unit represented by formula (IV):

where Ar is a trivalent aromatic radical having at least one benzene ring, and z is a divalent organic radical.

4. A resin composition defined in claim 1 wherein the content of said polyimide is 99.5 to 50 % by weight and the content of said aromatic polyamideimide is 0.5 to 50 % by weight.