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DE69831150D1 - Chemische-mechanische Schleifzusammensetzung für Halbleiterverarbeitung - Google Patents

Chemische-mechanische Schleifzusammensetzung für Halbleiterverarbeitung

Info

Publication number
DE69831150D1
DE69831150D1 DE69831150T DE69831150T DE69831150D1 DE 69831150 D1 DE69831150 D1 DE 69831150D1 DE 69831150 T DE69831150 T DE 69831150T DE 69831150 T DE69831150 T DE 69831150T DE 69831150 D1 DE69831150 D1 DE 69831150D1
Authority
DE
Germany
Prior art keywords
chemical
semiconductor processing
abrasive composition
mechanical abrasive
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69831150T
Other languages
English (en)
Other versions
DE69831150T2 (de
Inventor
Tsung-Ho Lee
Tsui-Ping Yeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Taiwan Co Ltd
Original Assignee
Epoch Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epoch Material Co Ltd filed Critical Epoch Material Co Ltd
Application granted granted Critical
Publication of DE69831150D1 publication Critical patent/DE69831150D1/de
Publication of DE69831150T2 publication Critical patent/DE69831150T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69831150T 1998-08-31 1998-11-30 Chemische-mechanische Schleifzusammensetzung für Halbleiterverarbeitung Expired - Lifetime DE69831150T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN98117452 1998-08-31
CN 98117452 CN1126152C (zh) 1998-08-31 1998-08-31 半导体制程用的化学机械研磨组合物

Publications (2)

Publication Number Publication Date
DE69831150D1 true DE69831150D1 (de) 2005-09-15
DE69831150T2 DE69831150T2 (de) 2006-06-08

Family

ID=5225529

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69831150T Expired - Lifetime DE69831150T2 (de) 1998-08-31 1998-11-30 Chemische-mechanische Schleifzusammensetzung für Halbleiterverarbeitung

Country Status (6)

Country Link
EP (1) EP0984049B1 (de)
CN (1) CN1126152C (de)
DE (1) DE69831150T2 (de)
HK (1) HK1026067A1 (de)
MY (1) MY133054A (de)
SG (1) SG99280A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
TWI227726B (en) 1999-07-08 2005-02-11 Eternal Chemical Co Ltd Chemical-mechanical abrasive composition and method
CN1107097C (zh) * 1999-07-28 2003-04-30 长兴化学工业股份有限公司 化学机械研磨组合物及方法
IL147235A0 (en) * 1999-08-13 2002-08-14 Cabot Microelectronics Corp Chemical mechanical polishing systems and methods for their use
US6443812B1 (en) 1999-08-24 2002-09-03 Rodel Holdings Inc. Compositions for insulator and metal CMP and methods relating thereto
KR100799965B1 (ko) * 2000-07-08 2008-02-01 에포크 머티리얼 컴퍼니, 리미티드 화학-기계적 연마제 조성물 및 연마 방법
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
US6805812B2 (en) 2001-10-11 2004-10-19 Cabot Microelectronics Corporation Phosphono compound-containing polishing composition and method of using same
TWI339680B (en) * 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
GB2393447B (en) * 2002-08-07 2006-04-19 Kao Corp Polishing composition
US7300603B2 (en) * 2003-08-05 2007-11-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers
US7214623B2 (en) 2003-10-13 2007-05-08 International Business Machines Corporation Planarization system and method using a carbonate containing fluid
KR101485630B1 (ko) * 2008-07-11 2015-01-22 니타 하스 인코포레이티드 연마 조성물
CN102477261B (zh) * 2010-11-26 2015-06-17 安集微电子（上海）有限公司 一种化学机械抛光液
CN102477258B (zh) * 2010-11-26 2015-05-27 安集微电子（上海）有限公司 一种化学机械抛光液
KR101922289B1 (ko) * 2015-11-26 2018-11-27 삼성에스디아이 주식회사 Ｃｍｐ 슬러리 조성물 및 이를 이용한 유기막 연마방법
CN106590439B (zh) * 2016-12-07 2019-02-05 中国电子科技集团公司第十一研究所 一种抛光液及应用该抛光液对锑化镓晶片进行抛光的方法
FR3067034B1 (fr) * 2017-06-02 2019-12-20 Treliant Fang Sels halites servant d'agents de gravure du carbure de silicium pour augmenter la vitesse d'elimination de materiau par cmp pour une tranche de sic

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0325232B1 (de) * 1988-01-19 1996-09-11 Fujimi Incorporated Poliermasse
US6039891A (en) * 1996-09-24 2000-03-21 Cabot Corporation Multi-oxidizer precursor for chemical mechanical polishing
US5783489A (en) * 1996-09-24 1998-07-21 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
US6309560B1 (en) * 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates

Also Published As

Publication number Publication date
EP0984049A1 (de) 2000-03-08
MY133054A (en) 2007-10-31
CN1126152C (zh) 2003-10-29
DE69831150T2 (de) 2006-06-08
SG99280A1 (en) 2003-10-27
EP0984049B1 (de) 2005-08-10
CN1246725A (zh) 2000-03-08
HK1026067A1 (en) 2000-12-01

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Legal Events

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8364 No opposition during term of opposition