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DE60325620D1 - Lotbeschichtete kugel und verfahren zu ihrer herstellung und verfahren zur bildung einer halbleiterverbindungsstruktur - Google Patents

Lotbeschichtete kugel und verfahren zu ihrer herstellung und verfahren zur bildung einer halbleiterverbindungsstruktur

Info

Publication number
DE60325620D1
DE60325620D1 DE60325620T DE60325620T DE60325620D1 DE 60325620 D1 DE60325620 D1 DE 60325620D1 DE 60325620 T DE60325620 T DE 60325620T DE 60325620 T DE60325620 T DE 60325620T DE 60325620 D1 DE60325620 D1 DE 60325620D1
Authority
DE
Germany
Prior art keywords
lotbeschichtete
ball
production
forming
connector structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60325620T
Other languages
English (en)
Inventor
Masuo Kondo
Fumiaki Kikui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Metals Ltd
Original Assignee
Neomax Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002283301A external-priority patent/JP4175857B2/ja
Priority claimed from JP2002291187A external-priority patent/JP4175858B2/ja
Application filed by Neomax Materials Co Ltd filed Critical Neomax Materials Co Ltd
Application granted granted Critical
Publication of DE60325620D1 publication Critical patent/DE60325620D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
DE60325620T 2002-09-27 2003-09-24 Lotbeschichtete kugel und verfahren zu ihrer herstellung und verfahren zur bildung einer halbleiterverbindungsstruktur Expired - Lifetime DE60325620D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002283301A JP4175857B2 (ja) 2002-09-27 2002-09-27 はんだ被覆ボールの製造方法
JP2002291187A JP4175858B2 (ja) 2002-10-03 2002-10-03 はんだ被覆ボールの製造方法
PCT/JP2003/012183 WO2004030428A1 (ja) 2002-09-27 2003-09-24 はんだ被覆ボールおよびその製造方法、ならびに半導体接続構造の形成方法

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KR20050042060A (ko) 2005-05-04
CN100405883C (zh) 2008-07-23
AU2003266588A1 (en) 2004-04-19
US7265046B2 (en) 2007-09-04
WO2004030428A1 (ja) 2004-04-08
CN1572129A (zh) 2005-01-26
EP1551211B1 (de) 2008-12-31
EP1551211A1 (de) 2005-07-06
EP1551211A4 (de) 2005-12-07
US20060055054A1 (en) 2006-03-16

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