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DE602004028430D1 - Halbleiter - Google Patents

Halbleiter

Info

Publication number
DE602004028430D1
DE602004028430D1 DE602004028430T DE602004028430T DE602004028430D1 DE 602004028430 D1 DE602004028430 D1 DE 602004028430D1 DE 602004028430 T DE602004028430 T DE 602004028430T DE 602004028430 T DE602004028430 T DE 602004028430T DE 602004028430 D1 DE602004028430 D1 DE 602004028430D1
Authority
DE
Germany
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004028430T
Other languages
English (en)
Inventor
Yukihiro Takao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of DE602004028430D1 publication Critical patent/DE602004028430D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • HELECTRICITY
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481Internal lead connections, e.g. via connections, feedthrough structures
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    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/023Redistribution layers [RDL] for bonding areas
    • H01L2224/0237Disposition of the redistribution layers
    • H01L2224/02372Disposition of the redistribution layers connecting to a via connection in the semiconductor or solid-state body
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    • H01L2224/0401Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2924/30Technical effects
    • H01L2924/35Mechanical effects
    • H01L2924/351Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE602004028430T 2003-05-26 2004-05-26 Halbleiter Expired - Lifetime DE602004028430D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003147146A JP2004349593A (ja) 2003-05-26 2003-05-26 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE602004028430D1 true DE602004028430D1 (de) 2010-09-16

Family

ID=33128189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004028430T Expired - Lifetime DE602004028430D1 (de) 2003-05-26 2004-05-26 Halbleiter

Country Status (7)

Country Link
US (1) US7579671B2 (de)
EP (1) EP1482552B1 (de)
JP (1) JP2004349593A (de)
KR (1) KR100608184B1 (de)
CN (2) CN100370607C (de)
DE (1) DE602004028430D1 (de)
TW (1) TWI233189B (de)

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JP4745007B2 (ja) * 2005-09-29 2011-08-10 三洋電機株式会社 半導体装置及びその製造方法
JP2007311771A (ja) * 2006-04-21 2007-11-29 Sanyo Electric Co Ltd 半導体装置及びその製造方法
KR100828027B1 (ko) * 2006-06-28 2008-05-08 삼성전자주식회사 스택형 웨이퍼 레벨 패키지 및 그의 제조 방법, 및 웨이퍼레벨 스택 패키지 및 그의 제조 방법
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JP6359444B2 (ja) * 2014-12-25 2018-07-18 東京エレクトロン株式会社 配線層形成方法、配線層形成システムおよび記憶媒体
WO2017130381A1 (ja) * 2016-01-29 2017-08-03 三菱電機株式会社 半導体装置
TWI623049B (zh) * 2016-11-04 2018-05-01 英屬開曼群島商鳳凰先驅股份有限公司 封裝基板及其製作方法
JP6963396B2 (ja) * 2017-02-28 2021-11-10 キヤノン株式会社 電子部品の製造方法
KR102420586B1 (ko) * 2017-07-24 2022-07-13 삼성전자주식회사 반도체 장치, 반도체 패키지 및 반도체 패키지의 제조 방법
JP2019160893A (ja) * 2018-03-09 2019-09-19 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、半導体装置、電子機器、および製造方法
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US20050006783A1 (en) 2005-01-13
US7579671B2 (en) 2009-08-25
CN100370607C (zh) 2008-02-20
EP1482552B1 (de) 2010-08-04
KR100608184B1 (ko) 2006-08-08
CN1574324A (zh) 2005-02-02
EP1482552A3 (de) 2007-03-21
JP2004349593A (ja) 2004-12-09
TW200428608A (en) 2004-12-16
CN101174600A (zh) 2008-05-07
EP1482552A2 (de) 2004-12-01
TWI233189B (en) 2005-05-21
KR20040101924A (ko) 2004-12-03

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