DE3885010D1 - Nichtflüchtige Speicherzelle und Verfahren zu ihrer Herstellung. - Google Patents
Nichtflüchtige Speicherzelle und Verfahren zu ihrer Herstellung.Info
- Publication number
- DE3885010D1 DE3885010D1 DE88401407T DE3885010T DE3885010D1 DE 3885010 D1 DE3885010 D1 DE 3885010D1 DE 88401407 T DE88401407 T DE 88401407T DE 3885010 T DE3885010 T DE 3885010T DE 3885010 D1 DE3885010 D1 DE 3885010D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- memory cell
- volatile memory
- volatile
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28123—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
- H01L21/2815—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects part or whole of the electrode is a sidewall spacer or made by a similar technique, e.g. transformation under mask, plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/031—Manufacture or treatment of data-storage electrodes
- H10D64/035—Manufacture or treatment of data-storage electrodes comprising conductor-insulator-conductor-insulator-semiconductor structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8708214A FR2616576B1 (fr) | 1987-06-12 | 1987-06-12 | Cellule de memoire eprom et son procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3885010D1 true DE3885010D1 (de) | 1993-11-25 |
DE3885010T2 DE3885010T2 (de) | 1994-05-05 |
Family
ID=9351978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88401407T Expired - Lifetime DE3885010T2 (de) | 1987-06-12 | 1988-06-09 | Nichtflüchtige Speicherzelle und Verfahren zu ihrer Herstellung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5138573A (de) |
EP (1) | EP0296030B1 (de) |
JP (1) | JP2671217B2 (de) |
DE (1) | DE3885010T2 (de) |
FR (1) | FR2616576B1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969021A (en) * | 1989-06-12 | 1990-11-06 | California Institute Of Technology | Porous floating gate vertical mosfet device with programmable analog memory |
US5268320A (en) * | 1990-12-26 | 1993-12-07 | Intel Corporation | Method of increasing the accuracy of an analog circuit employing floating gate memory devices |
JP2635831B2 (ja) * | 1991-01-28 | 1997-07-30 | 株式会社東芝 | 半導体装置 |
US5461249A (en) * | 1991-10-31 | 1995-10-24 | Rohm Co., Ltd. | Nonvolatile semiconductor memory device and manufacturing method therefor |
US5640031A (en) * | 1993-09-30 | 1997-06-17 | Keshtbod; Parviz | Spacer flash cell process |
US5459091A (en) * | 1993-10-12 | 1995-10-17 | Goldstar Electron Co., Ltd. | Method for fabricating a non-volatile memory device |
KR0142603B1 (ko) * | 1995-03-14 | 1998-07-01 | 김주용 | 플래쉬 이이피롬 셀 및 그 제조방법 |
US5753525A (en) * | 1995-12-19 | 1998-05-19 | International Business Machines Corporation | Method of making EEPROM cell with improved coupling ratio |
JP3735426B2 (ja) * | 1996-12-11 | 2006-01-18 | 株式会社東芝 | 不揮発性半導体記憶装置及びその製造方法 |
JP2980171B2 (ja) * | 1997-06-04 | 1999-11-22 | 日本電気株式会社 | スプリットゲート型フラッシュメモリセルの製造方法 |
US6194768B1 (en) * | 1998-10-23 | 2001-02-27 | Advanced Micro Devices, Inc. | High dielectric constant gate dielectric with an overlying tantalum gate conductor formed on a sidewall surface of a sacrificial structure |
US6350651B1 (en) * | 1999-06-10 | 2002-02-26 | Intel Corporation | Method for making flash memory with UV opaque passivation layer |
US6294429B1 (en) | 1999-11-24 | 2001-09-25 | International Business Machines Corporation | Method of forming a point on a floating gate for electron injection |
TW441038B (en) * | 2000-01-10 | 2001-06-16 | United Microelectronics Corp | Manufacturing method of ETOX flash memory |
US6838726B1 (en) | 2000-05-31 | 2005-01-04 | Micron Technology, Inc. | Horizontal memory devices with vertical gates |
KR100389918B1 (ko) | 2000-11-14 | 2003-07-04 | 삼성전자주식회사 | 빠른 프로그램 속도를 갖는 고집적 불활성 메모리 셀 어레이 |
KR100414735B1 (ko) * | 2001-12-10 | 2004-01-13 | 주식회사 하이닉스반도체 | 반도체소자 및 그 형성 방법 |
KR100559994B1 (ko) | 2003-08-08 | 2006-03-13 | 동부아남반도체 주식회사 | 측벽 방식을 이용한 플래시 메모리의 플로팅 게이트 형성방법 |
KR100635199B1 (ko) * | 2005-05-12 | 2006-10-16 | 주식회사 하이닉스반도체 | 플래쉬 메모리 소자 및 그의 제조방법 |
JP5063097B2 (ja) * | 2005-12-26 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
US7968932B2 (en) | 2005-12-26 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN102201343A (zh) * | 2011-04-26 | 2011-09-28 | 复旦大学 | 纳米mos器件制备方法及纳米mos器件 |
CN102184961B (zh) * | 2011-04-26 | 2017-04-12 | 复旦大学 | 一种非对称栅mos器件及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3175125D1 (en) * | 1980-11-20 | 1986-09-18 | Toshiba Kk | Semiconductor memory device and method for manufacturing the same |
GB2100507A (en) * | 1981-06-17 | 1982-12-22 | Philips Electronic Associated | Method of making a vertical igfet |
US4419809A (en) * | 1981-12-30 | 1983-12-13 | International Business Machines Corporation | Fabrication process of sub-micrometer channel length MOSFETs |
JPS61105862A (ja) * | 1984-10-30 | 1986-05-23 | Toshiba Corp | 半導体装置 |
US4754320A (en) * | 1985-02-25 | 1988-06-28 | Kabushiki Kaisha Toshiba | EEPROM with sidewall control gate |
JPS62163376A (ja) * | 1986-01-14 | 1987-07-20 | Fujitsu Ltd | 半導体記憶装置の製造方法 |
-
1987
- 1987-06-12 FR FR8708214A patent/FR2616576B1/fr not_active Expired - Lifetime
-
1988
- 1988-06-06 JP JP63137591A patent/JP2671217B2/ja not_active Expired - Lifetime
- 1988-06-07 US US07/203,266 patent/US5138573A/en not_active Expired - Lifetime
- 1988-06-09 DE DE88401407T patent/DE3885010T2/de not_active Expired - Lifetime
- 1988-06-09 EP EP88401407A patent/EP0296030B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2616576B1 (fr) | 1992-09-18 |
JPS63318164A (ja) | 1988-12-27 |
EP0296030B1 (de) | 1993-10-20 |
DE3885010T2 (de) | 1994-05-05 |
JP2671217B2 (ja) | 1997-10-29 |
EP0296030A1 (de) | 1988-12-21 |
FR2616576A1 (fr) | 1988-12-16 |
US5138573A (en) | 1992-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3881986D1 (de) | Nichtfluechtige halbleiterspeicheranordnung und verfahren zu ihrer herstellung. | |
DE3885010D1 (de) | Nichtflüchtige Speicherzelle und Verfahren zu ihrer Herstellung. | |
DE3782328D1 (de) | Chipkarte mit externer programmiermoeglichkeit und verfahren zu ihrer herstellung. | |
DE58902995D1 (de) | Nichtfluechtige speicherzelle und verfahren zur herstellung. | |
DE3586597D1 (de) | Polyetherverbindungen und verfahren zu ihrer herstellung. | |
DE3583150D1 (de) | Festelektrolytbrennstoffzelle und verfahren zu ihrer herstellung. | |
DE3778331D1 (de) | Halbleiterspeicheranordnung und verfahren zu ihrer herstellung. | |
DE3865554D1 (de) | Kreditkarte und verfahren zu ihrer herstellung. | |
DE68921548D1 (de) | Poröse Strukture und Verfahren zu ihrer Herstellung. | |
DE68922254D1 (de) | Halbleiterspeicher und Verfahren zu deren Herstellung. | |
DE3874275D1 (de) | Kollektoren und verfahren zu ihrer herstellung und ihrer verwendung. | |
DE3782994D1 (de) | Erythromycin-a-derivate und verfahren zu ihrer herstellung. | |
DE69013094D1 (de) | Nichtflüchtige Halbleiterspeicheranordnung und Verfahren zu ihrer Herstellung. | |
DE68908061D1 (de) | Verpackte batterien und verfahren zu ihrer herstellung. | |
DE68916297D1 (de) | Nichtflüchtige Halbleiterspeicheranordnung und Verfahren zu ihrer Herstellung. | |
DE3878510D1 (de) | Fluessigkristalline verbindungen und verfahren zu ihrer herstellung. | |
DE3878475D1 (de) | Organopolysiloxanemulsion und verfahren zu ihrer herstellung. | |
DE3870961D1 (de) | Thermotrope fluessigkristalline polyester, und verfahren zu ihrer herstellung. | |
DE3880860D1 (de) | Halbleiterspeicheranordnung und verfahren zu ihrer herstellung. | |
DE3582466D1 (de) | Aminoalkohol-derivate und verfahren zu ihrer herstellung. | |
DE69030946D1 (de) | Nichtflüchtige Halbleiterspeicheranordnung und Verfahren zu ihrer Herstellung | |
DE69129393D1 (de) | Asymmetrische nichtflüchtige Speicherzelle, Matrix und Verfahren zu ihrer Herstellung | |
DE3879335D1 (de) | Trifluorbenzolverbindungen und verfahren zu ihrer herstellung. | |
DE3879719D1 (de) | Halbleiterspeicheranordnung und verfahren zu ihrer herstellung. | |
DE3786452D1 (de) | Benzylether-verbindungen und verfahren zu ihrer herstellung. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |