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DE3581319D1 - Verfahren zur bestimmung der phasendifferenz zwischen dem drehanalysator und dem drehphasengeber eines ellipsometers. - Google Patents

Verfahren zur bestimmung der phasendifferenz zwischen dem drehanalysator und dem drehphasengeber eines ellipsometers.

Info

Publication number
DE3581319D1
DE3581319D1 DE8585304198T DE3581319T DE3581319D1 DE 3581319 D1 DE3581319 D1 DE 3581319D1 DE 8585304198 T DE8585304198 T DE 8585304198T DE 3581319 T DE3581319 T DE 3581319T DE 3581319 D1 DE3581319 D1 DE 3581319D1
Authority
DE
Germany
Prior art keywords
rotating
ellipsometer
determining
phase
phase difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585304198T
Other languages
English (en)
Inventor
Makoto Itonaga
Kanji Kayanuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12137784A external-priority patent/JPS60263817A/ja
Priority claimed from JP12331484A external-priority patent/JPS612028A/ja
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Application granted granted Critical
Publication of DE3581319D1 publication Critical patent/DE3581319D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE8585304198T 1984-06-12 1985-06-12 Verfahren zur bestimmung der phasendifferenz zwischen dem drehanalysator und dem drehphasengeber eines ellipsometers. Expired - Fee Related DE3581319D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12137784A JPS60263817A (ja) 1984-06-12 1984-06-12 回転検光子を用いた楕円偏光計
JP12331484A JPS612028A (ja) 1984-06-15 1984-06-15 楕円偏光計の回転検光子と回転位相検出素子との位相差検出法

Publications (1)

Publication Number Publication Date
DE3581319D1 true DE3581319D1 (de) 1991-02-21

Family

ID=26458755

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8585304198T Expired - Fee Related DE3581319D1 (de) 1984-06-12 1985-06-12 Verfahren zur bestimmung der phasendifferenz zwischen dem drehanalysator und dem drehphasengeber eines ellipsometers.
DE198585304198T Pending DE165771T1 (de) 1984-06-12 1985-06-12 Ellipsometer vom typ eines drehanalysators.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE198585304198T Pending DE165771T1 (de) 1984-06-12 1985-06-12 Ellipsometer vom typ eines drehanalysators.

Country Status (3)

Country Link
US (1) US4653924A (de)
EP (1) EP0165771B1 (de)
DE (2) DE3581319D1 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4967152A (en) * 1988-03-11 1990-10-30 Ultra-Probe Apparatus including a focused UV light source for non-contact measurement and alteration of electrical properties of conductors
US4906844A (en) * 1988-08-12 1990-03-06 Rockwell International Corporation Phase sensitive optical monitor for thin film deposition
US5042951A (en) * 1989-09-19 1991-08-27 Therma-Wave, Inc. High resolution ellipsometric apparatus
US5166752A (en) * 1990-01-11 1992-11-24 Rudolph Research Corporation Simultaneous multiple angle/multiple wavelength ellipsometer and method
JP2967651B2 (ja) * 1991-08-12 1999-10-25 ダイキン工業株式会社 位置割出装置
DE4219691A1 (de) * 1992-06-16 1993-12-23 Siemens Ag Meßvorrichtung zur Bestimmung der Richtung der Polarisationsebene von linear polarisiertem Licht
US5412473A (en) * 1993-07-16 1995-05-02 Therma-Wave, Inc. Multiple angle spectroscopic analyzer utilizing interferometric and ellipsometric devices
US5764365A (en) * 1993-11-09 1998-06-09 Nova Measuring Instruments, Ltd. Two-dimensional beam deflector
USRE38153E1 (en) * 1993-11-09 2003-06-24 Nova Measuring Instruments, Ltd. Two-dimensional beam deflector
IL107549A (en) 1993-11-09 1996-01-31 Nova Measuring Instr Ltd Device for measuring the thickness of thin films
US5519493A (en) * 1994-03-30 1996-05-21 Reiley; Daniel J. Remote sample polarimeter
US5548404A (en) * 1994-09-23 1996-08-20 Sunshine Medical Instruments, Inc. Multiple wavelength polarization-modulated ellipsometer with phase-generated carrier
US6734967B1 (en) * 1995-01-19 2004-05-11 Kla-Tencor Technologies Corporation Focused beam spectroscopic ellipsometry method and system
US5608526A (en) * 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US5581350A (en) * 1995-06-06 1996-12-03 Tencor Instruments Method and system for calibrating an ellipsometer
US6104486A (en) * 1995-12-28 2000-08-15 Fujitsu Limited Fabrication process of a semiconductor device using ellipsometry
DE19721043C2 (de) * 1997-05-09 1999-03-04 Forschungsverbund Berlin Ev Verfahren und Vorrichtung zur Bestimmung der optischen Eigenschaften und Schichtdicke von Materialien
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
IL123575A (en) * 1998-03-05 2001-08-26 Nova Measuring Instr Ltd Method and apparatus for alignment of a wafer
US6483580B1 (en) * 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
EP0973069A3 (de) * 1998-07-14 2006-10-04 Nova Measuring Instruments Limited Kontrollgerät und photolithographisches Verfahren zur Behandlung von Substraten
US6414302B1 (en) 1998-08-11 2002-07-02 Interface Studies Inc High photon energy range reflected light characterization of solids
US6212961B1 (en) 1999-02-11 2001-04-10 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system
US6222199B1 (en) 1999-05-25 2001-04-24 Interface Studies Inc. Ultrathin layer measurement having a controlled ambient of light path
US6323947B1 (en) 1999-12-14 2001-11-27 Interface Studies Corporation Angle of incidence accuracy in ultrathin dielectric layer ellipsometry measurement
JP2002267418A (ja) * 2001-03-09 2002-09-18 Horiba Ltd 膜厚測定装置
US6798512B2 (en) * 2001-08-09 2004-09-28 Therma-Wave, Inc. Multiple beam ellipsometer
US6930782B1 (en) 2003-03-28 2005-08-16 Lam Research Corporation End point detection with imaging matching in semiconductor processing
DE102004026326B4 (de) * 2003-05-28 2006-05-04 Gebauer, Gerd, Dr. Motor mit integrierten Bauelementen
US7515253B2 (en) * 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
JP2007040930A (ja) * 2005-08-05 2007-02-15 Ebara Corp 膜厚測定方法及び基板処理装置
US10709327B2 (en) 2017-12-19 2020-07-14 Aizhong Zhang Thin film analysis apparatus and method for a curved surface
US11644412B2 (en) 2020-08-02 2023-05-09 Aizhong Zhang Thin film spectroellipsometric imaging
CN113188457B (zh) * 2021-04-23 2022-10-04 中北大学 一种双旋转补偿器型Mueller矩阵椭偏仪的补偿器同步旋转结构
CN118032666B (zh) * 2024-04-15 2024-06-14 广东大湾区空天信息研究院 一种高负载太赫兹精密椭偏平台

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3880524A (en) * 1973-06-25 1975-04-29 Ibm Automatic ellipsometer
JPS51129279A (en) * 1975-05-02 1976-11-10 Nippon Kogaku Kk <Nikon> Polarizing analyzer
JPS5240388A (en) * 1975-09-26 1977-03-29 Nippon Kogaku Kk <Nikon> Spectroscopic autoellipsometer
US4030836A (en) * 1975-10-28 1977-06-21 The United States Of America As Represented By The Secretary Of The Air Force Method for mapping surfaces with respect to ellipsometric parameters
JPS57132039A (en) * 1981-02-09 1982-08-16 Hitachi Ltd Method for measuring carrier distribution

Also Published As

Publication number Publication date
EP0165771B1 (de) 1991-01-16
EP0165771A3 (en) 1987-06-16
DE165771T1 (de) 1986-04-10
US4653924A (en) 1987-03-31
EP0165771A2 (de) 1985-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE REICHEL UND REICHEL, 60322 FRANKFURT

8339 Ceased/non-payment of the annual fee