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DE3382676D1 - Wafertransferapparat. - Google Patents

Wafertransferapparat.

Info

Publication number
DE3382676D1
DE3382676D1 DE8383902069T DE3382676T DE3382676D1 DE 3382676 D1 DE3382676 D1 DE 3382676D1 DE 8383902069 T DE8383902069 T DE 8383902069T DE 3382676 T DE3382676 T DE 3382676T DE 3382676 D1 DE3382676 D1 DE 3382676D1
Authority
DE
Germany
Prior art keywords
transfer apparatus
wafer transfer
wafer
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8383902069T
Other languages
English (en)
Inventor
Richard F Foulke
Steven M Lord
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PROCONICS INT
Original Assignee
PROCONICS INT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROCONICS INT filed Critical PROCONICS INT
Application granted granted Critical
Publication of DE3382676D1 publication Critical patent/DE3382676D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
DE8383902069T 1982-05-24 1983-05-18 Wafertransferapparat. Expired - Lifetime DE3382676D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/381,292 US4493606A (en) 1982-05-24 1982-05-24 Wafer transfer apparatus
PCT/US1983/000783 WO1983004240A1 (en) 1982-05-24 1983-05-18 Wafer transfer apparatus

Publications (1)

Publication Number Publication Date
DE3382676D1 true DE3382676D1 (de) 1993-05-27

Family

ID=23504474

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383902069T Expired - Lifetime DE3382676D1 (de) 1982-05-24 1983-05-18 Wafertransferapparat.

Country Status (5)

Country Link
US (1) US4493606A (de)
EP (1) EP0108807B1 (de)
JP (2) JPH0648575A (de)
DE (1) DE3382676D1 (de)
WO (1) WO1983004240A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111776683A (zh) * 2020-07-31 2020-10-16 河北力准机械制造有限公司 一种压缩机活塞的上料机构

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US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus
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US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
JPS60153788U (ja) * 1984-03-21 1985-10-14 シャープ株式会社 位置検知センサ付ロボツトハンド
US4699556A (en) * 1984-05-17 1987-10-13 Proconics International, Inc. Object handling apparatus
US4601521A (en) * 1984-05-17 1986-07-22 Proconics International, Inc. Rolling apparatus
US4611966A (en) * 1984-05-30 1986-09-16 Johnson Lester R Apparatus for transferring semiconductor wafers
US4820930A (en) * 1984-06-20 1989-04-11 Canon Kabushiki Kaisha Photomask positioning device
FR2567160B1 (fr) * 1984-07-09 1994-04-01 Recif Procede et moyens de prehension et de transport de plaquettes de sillicium
DE3681799D1 (de) * 1985-01-22 1991-11-14 Applied Materials Inc Halbleiter-bearbeitungseinrichtung.
DE3684538D1 (de) * 1985-08-13 1992-04-30 Edelhoff Polytechnik System zur bestimming der lage eines objekts relativ zu einer handhabungseinrichtung.
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
FR2586658B1 (fr) * 1985-08-30 1987-12-24 Recif Sa Procede de transfert en ligne de plaquettes de silicium notamment de paniers dans au moins une nacelle et la machine de mise en oeuvre
DE3678812D1 (de) * 1986-01-06 1991-05-23 Stephanois Rech Mec Verfahren und mittel zum greifen und befoerdern von siliziumplaettchen.
US4765793A (en) * 1986-02-03 1988-08-23 Proconics International, Inc. Apparatus for aligning circular objects
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
US4744713A (en) * 1986-05-21 1988-05-17 Texas Instruments Incorporated Misalignment sensor for a wafer feeder assembly
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
US4919342A (en) * 1987-08-31 1990-04-24 Ngk Insulators, Ltd. Method of pretreating a sample for X-ray fluorescence analysis
US5257302A (en) * 1987-08-31 1993-10-26 Ngk Insulators, Ltd. Fluorescent X-ray analyzing system
US4952115A (en) * 1988-02-29 1990-08-28 Tel Sagami Limited Wafer support device
US4987407A (en) * 1988-04-22 1991-01-22 Asq. Boats, Inc. Wafer interleaving with electro-optical safety features
US4986729A (en) * 1989-04-24 1991-01-22 Proconics International, Inc. Wafer transfer apparatus
US5261776A (en) * 1989-04-27 1993-11-16 Micron Technology, Inc. Vacuum operated wafer transfer apparatus
US5100287A (en) * 1989-04-27 1992-03-31 Micron Technology, Inc. Method of transferring wafers using vacuum
US5059079A (en) * 1989-05-16 1991-10-22 Proconics International, Inc. Particle-free storage for articles
US5044752A (en) * 1989-06-30 1991-09-03 General Signal Corporation Apparatus and process for positioning wafers in receiving devices
US5446584A (en) * 1989-09-11 1995-08-29 Kensington Laboratories, Inc. Compact specimen processing station
US5331458A (en) * 1989-09-11 1994-07-19 Kensington Laboratories, Inc. Compact specimen inspection station
FR2656599B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de rangement d'objets plats dans une cassette avec rayonnages intermediaires.
US5153841A (en) * 1990-11-21 1992-10-06 Advanced Micro Devices Method of and apparatus for semi-conductor wafer selection
WO1993019581A1 (en) * 1992-03-27 1993-10-14 Robotic Solutions, Inc. Computer controlled seedling transfer apparatus
US5783754A (en) * 1996-02-28 1998-07-21 Integrated Device Technology, Inc. Apparatus and method for measuring the gripping strength of a vacuum wand
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US5988971A (en) * 1997-07-09 1999-11-23 Ade Optical Systems Corporation Wafer transfer robot
FR2778496B1 (fr) 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
DE19845504A1 (de) * 1998-10-02 2000-04-20 Wacker Siltronic Halbleitermat Hordenaufnahmevorrichtung
US20030048448A1 (en) * 2001-03-19 2003-03-13 Fleming Timothy J. Automated apparatus for testing optical filters
US8796589B2 (en) * 2001-07-15 2014-08-05 Applied Materials, Inc. Processing system with the dual end-effector handling
US7001130B2 (en) * 2001-12-18 2006-02-21 General Motors Corporation Robotic rack loading apparatus and method
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US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
DE10241270B4 (de) * 2002-09-06 2005-12-22 Netstal-Maschinen Ag Entnahmevorrichtung für Spritzgiessteile sowie Verfahren zum automatischen Entnehmen
US7643897B2 (en) * 2007-06-07 2010-01-05 United Microelectronics Corp. Method for automatically checking sequence of loading boats and batches for semiconductor manufacturing process
US7980447B2 (en) * 2008-12-12 2011-07-19 Xerox Corporation Jet stack brazing in a diffusion furnace
AT510154B1 (de) * 2010-10-06 2012-02-15 Wittmann Kunststoffgeraete Verfahren zum umschlag bzw. zur hantierung und transport von werkstücken
JP6275155B2 (ja) * 2012-11-28 2018-02-07 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 半導体ウェハ洗浄方法及び半導体ウェハ洗浄装置
US20160236296A1 (en) * 2015-02-13 2016-08-18 Gold Nanotech Inc Nanoparticle Manufacturing System
TWI637889B (zh) * 2016-06-15 2018-10-11 萬潤科技股份有限公司 貼合製程之元件搬送方法及裝置
CN206076214U (zh) * 2016-08-25 2017-04-05 深圳市捷佳伟创新能源装备股份有限公司 一种用于扩散炉内的石英舟传送机构
CN109051681B (zh) * 2018-09-06 2020-09-01 Oppo（重庆）智能科技有限公司 输送装置
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CN114180353B (zh) * 2021-12-28 2022-08-30 湖南天桥嘉成智能科技有限公司 一种多类型物料备料无人天车智能控制系统及方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111776683A (zh) * 2020-07-31 2020-10-16 河北力准机械制造有限公司 一种压缩机活塞的上料机构
CN111776683B (zh) * 2020-07-31 2021-06-22 河北力准机械制造有限公司 一种压缩机活塞的上料机构

Also Published As

Publication number Publication date
WO1983004240A1 (en) 1983-12-08
JPH0648575A (ja) 1994-02-22
EP0108807A1 (de) 1984-05-23
JPH0640572A (ja) 1994-02-15
US4493606A (en) 1985-01-15
EP0108807B1 (de) 1993-04-21
EP0108807A4 (de) 1987-03-30

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Legal Events

Date Code Title Description
8332 No legal effect for de