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DE3370635D1 - Polyamino-bis-imide resin - Google Patents

Polyamino-bis-imide resin

Info

Publication number
DE3370635D1
DE3370635D1 DE8383305250T DE3370635T DE3370635D1 DE 3370635 D1 DE3370635 D1 DE 3370635D1 DE 8383305250 T DE8383305250 T DE 8383305250T DE 3370635 T DE3370635 T DE 3370635T DE 3370635 D1 DE3370635 D1 DE 3370635D1
Authority
DE
Germany
Prior art keywords
polyamino
bis
imide resin
imide
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383305250T
Other languages
English (en)
Inventor
Atsushi Fujioka
Yasuo Miyadera
Tomio Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE3370635D1 publication Critical patent/DE3370635D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/08—Reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE8383305250T 1982-09-08 1983-09-08 Polyamino-bis-imide resin Expired DE3370635D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57156046A JPS5945322A (ja) 1982-09-08 1982-09-08 ポリアミノビスイミド樹脂の製造方法

Publications (1)

Publication Number Publication Date
DE3370635D1 true DE3370635D1 (de) 1987-05-07

Family

ID=15619130

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383305250T Expired DE3370635D1 (de) 1982-09-08 1983-09-08 Polyamino-bis-imide resin

Country Status (4)

Country Link
US (1) US4526838A (de)
EP (1) EP0107897B1 (de)
JP (1) JPS5945322A (de)
DE (1) DE3370635D1 (de)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705598A (en) 1985-04-23 1998-01-06 The Boeing Company Polyester sulfone oligomers and blends
US5512676A (en) 1987-09-03 1996-04-30 The Boeing Company Extended amideimide hub for multidimensional oligomers
US5969079A (en) 1985-09-05 1999-10-19 The Boeing Company Oligomers with multiple chemically functional end caps
US5516876A (en) 1983-09-27 1996-05-14 The Boeing Company Polyimide oligomers and blends
US5210213A (en) 1983-06-17 1993-05-11 The Boeing Company Dimensional, crosslinkable oligomers
US5693741A (en) 1988-03-15 1997-12-02 The Boeing Company Liquid molding compounds
US5115087A (en) * 1988-03-29 1992-05-19 The Boeing Company Coreactive imido oligomer blends
US5159055A (en) * 1983-06-17 1992-10-27 The Boeing Company Coreactive oligomer blends
US4603061A (en) * 1984-08-23 1986-07-29 The United States Of America As Represented By The National Aeronautics And Space Administration Process for preparing highly optically transparent/colorless aromatic polyimide film
US4696994A (en) * 1984-12-14 1987-09-29 Ube Industries, Ltd. Transparent aromatic polyimide
US5618907A (en) 1985-04-23 1997-04-08 The Boeing Company Thallium catalyzed multidimensional ester oligomers
US5610317A (en) 1985-09-05 1997-03-11 The Boeing Company Multiple chemically functional end cap monomers
JPS62270624A (ja) * 1985-12-19 1987-11-25 Matsushita Electric Works Ltd 付加型イミド樹脂組成物
AT386415B (de) * 1986-05-16 1988-08-25 Greber Gerd Verfahren zur herstellung von neuen loeslichen und/oder schmelzbaren polyimiden und polyamidimiden
JPH0749484B2 (ja) * 1986-08-15 1995-05-31 三井東圧化学株式会社 熱硬化性樹脂組成物
CA1270998A (en) * 1986-07-15 1990-06-26 Akihiro Yamaguchi Thermosetting resin composition
US4769439A (en) * 1986-09-29 1988-09-06 General Electric Company Polyimides and method for making
US5023366A (en) * 1986-11-05 1991-06-11 Mitsui Toatsu Chemicals, Incorporated Salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal salts of the copolymers, and color-developing sheets employing the agents
JP2585552B2 (ja) * 1986-11-19 1997-02-26 三井東圧化学株式会社 ポリイミド
JPS63130637A (ja) * 1986-11-21 1988-06-02 Shin Kobe Electric Mach Co Ltd ポリイミド成形材料の製造法
US4816512A (en) * 1986-12-18 1989-03-28 Monsanto Company Maleimide resin composition comprising polyamine, maleimide and maleamic acid
US4832808A (en) * 1987-01-02 1989-05-23 International Business Machines Corporation Polyimides reaction products and use in electrophoretic deposition
EP0288251B1 (de) * 1987-04-22 1992-11-25 MITSUI TOATSU CHEMICALS, Inc. Hitzehärtbare Harzzusammensetzung
EP0294931B1 (de) * 1987-05-06 1992-09-02 MITSUI TOATSU CHEMICALS, Inc. Selbstschmierende wärmehärtbare Harzzubereitung
EP0294930B1 (de) * 1987-05-06 1992-09-02 MITSUI TOATSU CHEMICALS, Inc. Wärmehärtbare Harzzubereitung
DE3724055A1 (de) * 1987-07-21 1989-02-02 Basf Ag Bismaleinimid-harze
DE3738457A1 (de) * 1987-11-12 1989-05-24 Lentia Gmbh Neue loesliche und/oder schmelzbare polyimide und polyamidimide
JP2511480B2 (ja) * 1987-11-13 1996-06-26 三井石油化学工業株式会社 ポリアミノビスイミド系樹脂組成物
US4870155A (en) * 1987-12-02 1989-09-26 Amoco Corporation Novel poly (etherimide) compositions
JPH01174527A (ja) * 1987-12-28 1989-07-11 Mitsui Petrochem Ind Ltd イミド系プレポリマー
US5314988A (en) * 1988-02-16 1994-05-24 Academy Of Applied Science, Inc. Thermally stable highly sensitive resists and the like
US5817744A (en) 1988-03-14 1998-10-06 The Boeing Company Phenylethynyl capped imides
JPH01151309U (de) * 1988-04-11 1989-10-19
US4906730A (en) * 1988-05-06 1990-03-06 General Electric Company Polyetherimide blends, and molding method
JPH0258540A (ja) * 1988-05-16 1990-02-27 Mitsui Petrochem Ind Ltd イミド系プレポリマーの製造方法およびこのイミド系プレポリマーを用いたワニス
US4987207A (en) * 1988-05-17 1991-01-22 Mitsui Toatsu Chemicals, Inc. Thermosetting resin compositions
EP0361040B1 (de) * 1988-08-15 1994-12-07 MITSUI TOATSU CHEMICALS, Inc. Geruchlose von polyvalenten Metallen modifizierte Salizylsäurecopolymere, deren Herstellungsverfahren und ihre Verwendung als Farbentwicklungsmittel für druckempfindliche Aufzeichnungspapierschichten
US4983705A (en) * 1989-01-17 1991-01-08 Dayco Products, Inc. Thermoplastic elastomeric polyimide linked by oligomeric thio chain
US5032668A (en) * 1989-02-21 1991-07-16 Hoechst Celanese Corp. Thermosetting polyimide prepolymers
EP0390565A3 (de) * 1989-03-31 1992-02-26 Mitsui Petrochemical Industries, Ltd. Imidvorpolymere, Härtungsprodukte, Verfahren zu deren Herstellung, Laminatherstellung und Einkapselungszusammensetzungen
JPH0757803B2 (ja) * 1989-07-12 1995-06-21 松下電工株式会社 付加型イミド樹脂プレポリマーの製造方法、プリプレグおよび積層板
US5106937A (en) * 1990-04-11 1992-04-21 Mitsui Toatsu Chemicals, Inc. Thermosetting resin from penta arylene bis maleimide
US5371173A (en) * 1992-11-25 1994-12-06 Northwestern University Poled polymeric nonlinear optical materials
JP2006090343A (ja) 2004-09-21 2006-04-06 Hitachi Ltd プロペラシャフトのボルト支持構造
US9668345B2 (en) * 2012-03-30 2017-05-30 Hitachi Chemical Company, Ltd. Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole
FR3029684A1 (fr) 2014-12-04 2016-06-10 Valeo Equip Electr Moteur Procede d'encapsulation de composants electroniques

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US29316A (en) * 1860-07-24 Water-metek
FR1537135A (fr) * 1967-07-12 1968-08-23 Rhone Poulenc Sa Nouveaux polyimides réticulés
USRE29316E (en) 1967-07-13 1977-07-19 Rhone-Poulenc S.A. Cross-linked resins
FR1597952A (de) * 1968-12-19 1970-06-29
US4064192A (en) * 1971-02-24 1977-12-20 Rhone-Poulenc S.A. Heat-stable polyimide resins
JPS5230319A (en) * 1975-09-04 1977-03-08 Nippon Hoso Kyokai <Nhk> Compensation circuit of digital type gamma
US4116937A (en) * 1976-08-25 1978-09-26 Trw Inc. Compliant maleimide based plastics
FR2405964A1 (fr) * 1977-10-14 1979-05-11 Rhone Poulenc Ind Polymeres a groupements imide
JPS5534233A (en) * 1978-08-31 1980-03-10 Hitachi Chem Co Ltd Preparation of thermosetting maleimide prepolymer
JPS5628215A (en) * 1979-08-17 1981-03-19 Hitachi Chem Co Ltd Preparation of imide prepolymer
JPS5740462A (en) * 1980-08-25 1982-03-06 Hitachi Ltd Etherimide compound and its preparation
JPS5749621A (en) * 1980-09-09 1982-03-23 Hitachi Ltd Preparation of heat-resistant resin

Also Published As

Publication number Publication date
US4526838A (en) 1985-07-02
JPS5945322A (ja) 1984-03-14
EP0107897B1 (de) 1987-04-01
EP0107897A1 (de) 1984-05-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee