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DE3361720D1 - Electrically conductive silicone rubber compositions - Google Patents

Electrically conductive silicone rubber compositions

Info

Publication number
DE3361720D1
DE3361720D1 DE8383108893T DE3361720T DE3361720D1 DE 3361720 D1 DE3361720 D1 DE 3361720D1 DE 8383108893 T DE8383108893 T DE 8383108893T DE 3361720 T DE3361720 T DE 3361720T DE 3361720 D1 DE3361720 D1 DE 3361720D1
Authority
DE
Germany
Prior art keywords
electrically conductive
silicone rubber
rubber compositions
conductive silicone
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383108893T
Other languages
English (en)
Inventor
Hideki Kobayashi
Mitsuo Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Application granted granted Critical
Publication of DE3361720D1 publication Critical patent/DE3361720D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/80—Material per se process of making same
    • Y10S505/801—Composition
    • Y10S505/802—Organic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
DE8383108893T 1982-09-08 1983-09-08 Electrically conductive silicone rubber compositions Expired DE3361720D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57156123A JPS5945356A (ja) 1982-09-08 1982-09-08 導電性シリコ−ンゴム組成物

Publications (1)

Publication Number Publication Date
DE3361720D1 true DE3361720D1 (en) 1986-02-13

Family

ID=15620820

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383108893T Expired DE3361720D1 (en) 1982-09-08 1983-09-08 Electrically conductive silicone rubber compositions

Country Status (5)

Country Link
US (1) US4500447A (de)
EP (1) EP0102650B1 (de)
JP (1) JPS5945356A (de)
CA (1) CA1190737A (de)
DE (1) DE3361720D1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6452748U (de) * 1987-09-30 1989-03-31
JPH01232405A (ja) * 1988-03-11 1989-09-18 Sanyo Electric Co Ltd 多機能端末装置
JPH01232406A (ja) * 1988-03-11 1989-09-18 Sanyo Electric Co Ltd 多機能端末装置
AU630627B2 (en) * 1988-11-14 1992-11-05 General Electric Company Self-lubricating heat curable silicone rubber compositions
US5112885A (en) * 1989-04-28 1992-05-12 Shin-Etsu Chemical Co., Ltd. Room temperature vulcanizable silicon rubber composition
JPH0816195B2 (ja) * 1989-12-19 1996-02-21 信越化学工業株式会社 ゴム組成物の製造方法
US5336442A (en) * 1990-02-21 1994-08-09 Kabushiki Kaisha Fine Rubber Kenkyuusho Extension type conductive rubber and process for making and method for using same
JPH0767784B2 (ja) * 1990-10-11 1995-07-26 信越化学工業株式会社 シリコーンゴム積層体及びその製造方法
JP2787128B2 (ja) * 1992-01-10 1998-08-13 信越化学工業株式会社 接着剤組成物
US5958116A (en) * 1997-03-14 1999-09-28 Kansai Paint Co., Ltd. Antifouling coating composition
JPH1097524A (ja) * 1997-08-18 1998-04-14 Brother Ind Ltd 文書作成装置
JPH11345441A (ja) * 1998-06-01 1999-12-14 Sony Chem Corp 保護膜用組成物及び光学的記録媒体
US6533963B1 (en) 1999-02-12 2003-03-18 Robert A. Schleifstein Electrically conductive flexible compositions, and materials and methods for making same
JP3999994B2 (ja) * 2002-04-03 2007-10-31 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
US20050038188A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
US7045586B2 (en) * 2003-08-14 2006-05-16 Dow Corning Corporation Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
JP2005146057A (ja) * 2003-11-12 2005-06-09 Polymatech Co Ltd 高熱伝導性成形体及びその製造方法
WO2006064782A1 (ja) 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体
US20070267603A1 (en) * 2004-12-17 2007-11-22 Kazuhisa Takagi Method of Controlling Specific Inductive Capacity, Dielectric Material, Mobil Phone and Human Phantom Model
US8088449B2 (en) * 2005-02-16 2012-01-03 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
US8092910B2 (en) * 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
JP4931416B2 (ja) * 2005-08-03 2012-05-16 日産自動車株式会社 自動マニュアルトランスミッションのインターロック防止装置
WO2007018756A1 (en) * 2005-08-04 2007-02-15 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
ATE517947T1 (de) * 2005-12-21 2011-08-15 Dow Corning Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung
JP5543111B2 (ja) * 2006-01-19 2014-07-09 ダウ・コーニング・コーポレイション 自立性シリコーン樹脂フィルム、その調製方法、及び自立性シリコーン樹脂フィルム用ナノ材料充填シリコーン組成物
CN101379153B (zh) * 2006-02-02 2011-12-28 陶氏康宁公司 有机硅树脂膜，其制备方法和纳米材料填充的有机硅组合物
WO2007097835A2 (en) * 2006-02-20 2007-08-30 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
KR101308431B1 (ko) * 2006-04-26 2013-09-30 엘지디스플레이 주식회사 인쇄용 레지스트 및 이를 이용한 패턴형성방법
EP2066757A1 (de) * 2006-10-05 2009-06-10 Dow Corning Corporation Silikonharzfolie und verfahren zu ihrer herstellung
US20100112321A1 (en) * 2007-02-06 2010-05-06 Dow Corning Corporation Silicone Resin, Silicone Composition, Coated Substrate, and Reinforced Silicone Resin Film
US8283025B2 (en) * 2007-02-22 2012-10-09 Dow Corning Corporation Reinforced silicone resin films
WO2008103227A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US8273448B2 (en) * 2007-02-22 2012-09-25 Dow Corning Corporation Reinforced silicone resin films
EP2118203B1 (de) * 2007-02-22 2012-05-23 Dow Corning Corporation Verstärkte silikonharzfolie und verfahren zu ihrer herstellung
WO2008137262A2 (en) * 2007-05-01 2008-11-13 Dow Corning Corporation Reinforced silicone resin film
JP5269885B2 (ja) * 2007-05-01 2013-08-21 ダウ・コーニング・コーポレイション ナノ材料充填シリコーン組成物及び強化シリコーン樹脂フィルム
US20100209687A1 (en) * 2007-10-12 2010-08-19 Bizhong Zhu Reinforced Silicone Resin Film and Nanofiber-Filled Silicone Composition
CN101821200B (zh) * 2007-10-12 2013-09-11 陶氏康宁公司 氧化铝分散体及其制备方法
DE102009001930B4 (de) * 2009-03-27 2018-01-04 Robert Bosch Gmbh Sensorbaustein
JP6191549B2 (ja) * 2013-08-09 2017-09-06 信越化学工業株式会社 導電性液状シリコーンゴム組成物及び高電圧ケーブル用常温収縮ゴム部材
DE102014202858A1 (de) * 2014-02-17 2015-08-20 Wacker Chemie Ag Vernetzbare Mischungen mit alpha-funktionellen Polysiloxanen
CN108530899A (zh) * 2018-03-23 2018-09-14 东莞太洋橡塑制品有限公司 高韧性导电硅胶制造工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2307776C3 (de) * 1973-02-16 1979-08-30 Wacker-Chemie Gmbh, 8000 Muenchen Verwendung von Gemischen auf Basis von OrganopolysUoxanen als Klebstoffe
JPS5367856A (en) * 1976-11-29 1978-06-16 Shinetsu Polymer Co Pressure sensitive resistance element
DE2723488C3 (de) * 1977-05-21 1983-12-29 AEG-Telefunken Kabelwerke AG, Rheydt, 4050 Mönchengladbach Elektrisches Kabel mit Kunststoffisolierung und äußerer Leitschicht
DE2816872A1 (de) * 1978-04-18 1979-10-31 Wacker Chemie Gmbh Verfahren zum herstellen von elektrisch leitfaehigen organopolysiloxanelastomeren
JPS55120656A (en) * 1979-03-09 1980-09-17 Toray Silicone Co Ltd Curable liquid organopolysiloxane composition
US4279783A (en) * 1979-04-04 1981-07-21 Dow Corning Corporation Electrically conductive silicone elastomers
CA1180177A (en) * 1981-01-26 1985-01-02 Harold E. Hall Anti-tracking material for high voltage applications
US4433096A (en) * 1983-03-14 1984-02-21 Dow Corning Corporation Polymerization of polydiorganosiloxane in the presence of filler

Also Published As

Publication number Publication date
EP0102650A1 (de) 1984-03-14
CA1190737A (en) 1985-07-23
US4500447A (en) 1985-02-19
EP0102650B1 (de) 1986-01-02
JPS5945356A (ja) 1984-03-14
JPS6324623B2 (de) 1988-05-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee