DE19616402A1 - Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter - Google Patents
Vorrichtung zum Behandeln von Substraten in einem Fluid-BehälterInfo
- Publication number
- DE19616402A1 DE19616402A1 DE1996116402 DE19616402A DE19616402A1 DE 19616402 A1 DE19616402 A1 DE 19616402A1 DE 1996116402 DE1996116402 DE 1996116402 DE 19616402 A DE19616402 A DE 19616402A DE 19616402 A1 DE19616402 A1 DE 19616402A1
- Authority
- DE
- Germany
- Prior art keywords
- fluid
- nozzles
- fluid container
- container
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/26—Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00049—Controlling or regulating processes
- B01J2219/00051—Controlling the temperature
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
Claims (50)
Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19655219A DE19655219C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19654903A DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
US08/762,199 US5921257A (en) | 1996-04-24 | 1996-12-06 | Device for treating substrates in a fluid container |
EP97915453A EP0895655B1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
KR1019980708443A KR100316823B1 (ko) | 1996-04-24 | 1997-03-27 | 유체용기내의기판처리장치 |
DE59711318T DE59711318D1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
EP02005774A EP1239512A3 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
AT97915453T ATE259989T1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
JP53765197A JP3493030B2 (ja) | 1996-04-24 | 1997-03-27 | 流体容器内で基板を処理する装置 |
PCT/EP1997/001580 WO1997040524A1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
MYPI97001552A MY132460A (en) | 1996-04-24 | 1997-04-09 | Device for treating substrates in a fluid container |
TW086104566A TW446575B (en) | 1996-04-24 | 1997-04-10 | Device for treating substrates in a fluid container |
IDP971344A ID16694A (id) | 1996-04-24 | 1997-04-22 | Alat untuk mengolah lapisan dasar konyeiner fluida |
US09/056,586 US5992431A (en) | 1996-04-24 | 1998-04-07 | Device for treating substrates in a fluid container |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19655219A DE19655219C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19654903A DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19616402A1 true DE19616402A1 (de) | 1997-11-06 |
DE19616402C2 DE19616402C2 (de) | 2001-11-29 |
Family
ID=26032905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996116402 Expired - Fee Related DE19616402C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19616402C2 (de) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19648498C1 (de) * | 1996-11-22 | 1998-06-10 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten, insbesondere von Halbleiter-Wafern |
DE19722423C2 (de) * | 1996-05-29 | 1999-04-22 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19752942A1 (de) * | 1997-11-28 | 1999-06-10 | Steag Micro Tech Gmbh | Vorrichtung zum Anreichern eines Gases mit einer Flüssigkeit |
DE19926462C1 (de) * | 1999-02-18 | 2000-11-30 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Behandeln von Substraten |
US6164300A (en) * | 1996-09-28 | 2000-12-26 | Steag Microtech Gmbh | Substate-treating device |
DE19645425C2 (de) * | 1996-11-04 | 2001-02-08 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten |
DE19960573A1 (de) * | 1999-12-15 | 2001-06-28 | Promos Technologies Inc | Verfahren zum Entfernen von festen Rückständen auf Oberflächen von Halbleiterscheiben |
US6257255B1 (en) | 1996-10-24 | 2001-07-10 | Steag Microtech Gmbh | Substrate treatment device |
US6352084B1 (en) | 1996-10-24 | 2002-03-05 | Steag Microtech Gmbh | Substrate treatment device |
DE10155548A1 (de) * | 2001-11-12 | 2003-05-28 | Mattson Wet Products Gmbh | Vorrichtung zum Behandeln von Substraten |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
JPH05267263A (ja) * | 1992-03-17 | 1993-10-15 | Sony Corp | 半導体ウェーハ洗浄装置 |
US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
US5286657A (en) * | 1990-10-16 | 1994-02-15 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
US5443540A (en) * | 1992-12-25 | 1995-08-22 | Tokyo Electron Limited | Apparatus and method for drying substrates |
DE4413077A1 (de) * | 1994-04-15 | 1995-10-19 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
DE19546990C2 (de) * | 1995-01-05 | 1997-07-03 | Steag Micro Tech Gmbh | Anlage zur chemischen Naßbehandlung |
-
1996
- 1996-04-24 DE DE1996116402 patent/DE19616402C2/de not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
US5286657A (en) * | 1990-10-16 | 1994-02-15 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
JPH05267263A (ja) * | 1992-03-17 | 1993-10-15 | Sony Corp | 半導体ウェーハ洗浄装置 |
US5443540A (en) * | 1992-12-25 | 1995-08-22 | Tokyo Electron Limited | Apparatus and method for drying substrates |
WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
DE4413077A1 (de) * | 1994-04-15 | 1995-10-19 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
Non-Patent Citations (7)
Title |
---|
JP 4-80924 A2. In: Patent Abstracts of Japan, E-1227, 2.7.1992, Vol. 16, No. 300 * |
JP 5-304131 A2. In: Patent Abstracts of Japan, E-1511, 18.2.1994, Vol. 18, No. 102 * |
KANEKO, T. et.al.: Low Temperature Silicon Surface Cleaning by HF Etching/Ultraviolet Ozone Cleaning (HF/UVOC) Method (II)-insitu UVOC. In: Jap. Journal of Applied Physics, Vol. 28, No. 12, Dec. 1989, pp. 2425-29 * |
Method of Cleaning Silicon Wafers. In: IBM TDB, Vol. 34, No. 5, Oct. 1991, p. 331 * |
P 6-196466 A2. In: Patent Abstracts of Japan, E-1617, 18.10.1994, Vol. 18, No. 33 * |
P 6-208984 A2. In: Patent Abstracts of Japan, E-1623, 31.10.1994, Vol. 18, No. 570 * |
Spray Nozzle Configuration... In: IBM TDB, Vol. 38, No. 4, April 1995, pp. 403-405 * |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19722423C2 (de) * | 1996-05-29 | 1999-04-22 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
US6164300A (en) * | 1996-09-28 | 2000-12-26 | Steag Microtech Gmbh | Substate-treating device |
US6352084B1 (en) | 1996-10-24 | 2002-03-05 | Steag Microtech Gmbh | Substrate treatment device |
US6257255B1 (en) | 1996-10-24 | 2001-07-10 | Steag Microtech Gmbh | Substrate treatment device |
DE19644779C2 (de) * | 1996-10-28 | 2001-06-28 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten, insbesondere auch von Halbleiterwafern |
DE19645425C2 (de) * | 1996-11-04 | 2001-02-08 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten |
US6189552B1 (en) | 1996-11-22 | 2001-02-20 | Steag Microtech Gmbh | Substrate processing device |
DE19648498C1 (de) * | 1996-11-22 | 1998-06-10 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten, insbesondere von Halbleiter-Wafern |
DE19752942A1 (de) * | 1997-11-28 | 1999-06-10 | Steag Micro Tech Gmbh | Vorrichtung zum Anreichern eines Gases mit einer Flüssigkeit |
DE19926462C1 (de) * | 1999-02-18 | 2000-11-30 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Behandeln von Substraten |
DE19960573A1 (de) * | 1999-12-15 | 2001-06-28 | Promos Technologies Inc | Verfahren zum Entfernen von festen Rückständen auf Oberflächen von Halbleiterscheiben |
DE19960573C2 (de) * | 1999-12-15 | 2002-10-10 | Promos Technologies Inc | Verfahren zum Entfernen von festen Rückständen auf Oberflächen von Halbleiterscheiben |
DE10155548A1 (de) * | 2001-11-12 | 2003-05-28 | Mattson Wet Products Gmbh | Vorrichtung zum Behandeln von Substraten |
Also Published As
Publication number | Publication date |
---|---|
DE19616402C2 (de) | 2001-11-29 |
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Legal Events
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D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SCP U.S.,INC., WILMINGTON, DEL., US |
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R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20131101 |