DE102013222919A1 - Holding element for connector used in electronic control device of internal combustion engine, has first leg formed satisfying specific condition involving cross-sectional areas at first and second boundary lines and first leg portion - Google Patents

Abstract

The holding element (26) has main portion (40) extended above front surface plate (16a) of printed circuit board (16) and attached to connector (20). A first leg (44) has first leg portion (48) and second leg portion (46) which is inserted into through hole (30) of board. The first leg is formed satisfying condition that cross-sectional area at first boundary line (46a) between two leg portions is greater than that of second boundary line (46b) of second leg portion, and condition that cross-sectional area of first leg portion of first leg is greater than that of first boundary line.

Description

The present invention relates to a holding member which is inserted into a through hole of a circuit board and fixed thereto by a reflow soldering process to hold a connector connected to the circuit board. The present invention further relates to a connector with the above holding member.

In recent years, all of the electrical parts and components that are attached to a circuit board have been soldered to the circuit board for cost reduction by a conventional solder deposition process and / or a usual reflow soldering process. In the case where an electrical part or a component has a terminal inserted into a through hole of the printed circuit board, solder paste is applied to one of the board surfaces of the printed circuit board to a region adjacent to the through hole, the terminal is inserted into the through hole, and the reflow Soldering process performed.

The JP 4,626,680 for example, discloses a holding member for holding a connector to a circuit board, wherein the holding member is connected to the circuit board by a reflow soldering process. The holding member has a body portion fixed to an electrical part or a component and a leg portion extending from the body portion toward a through hole of the printed circuit board. The leg portion is inserted into the through hole and connected to the circuit board by the reflow soldering process.

According to the prior art in the above Japanese Patent, a part of the leg portion to be inserted in the through hole is formed in a flat plate shape and constant width. According to the 19 in the JP 4,626,680 A second leg protrudes from a back surface of the circuit board and has a constant width in the direction of its front end.

In the present application, a portion of the leg portion inserted in the through hole and located on the same plane as a front surface plate surface of the printed circuit board is defined as a first boundary line, while a portion of the leg portion inserted in the through hole is on the same plane as a back plate surface of the printed circuit board is defined as a second boundary line.

When a width of the leg portion at the second boundary with respect to an inside diameter of the through-hole is large, a large amount of solder paste is pushed out of the through-hole by the leg portion when the leg portion is inserted into the through-hole, and this solder paste can fall off the circuit board. Even if the solder paste does not fall off the circuit board, the solder paste adhering to a front end of the leg section is separated from the solder paste remaining in the through hole. Thereafter, even if the reflow soldering process has been performed, the solder paste at the front end of the leg portion remains separated from the other solder paste in the through hole. As a result, the amount of solder paste for connecting the holding member to the circuit board is insufficient and high holding strength can not be obtained for holding a connector to the circuit board.

On the other hand, when the width of the leg portion at the second boundary with respect to the inside diameter of the through-hole is small, the amount of the solder paste to be squeezed out of the through-hole can be reduced and the solder paste can be prevented from falling off the circuit board. However, since the width of the leg portion is constant, a width of the leg portion at the first boundary becomes equally small. As a result, a contact portion of the leg portion in contact with the soldering paste for connecting the leg portion to the printed circuit board becomes smaller. And hence, the high holding strength for holding the connector to the circuit board can not be achieved.

The leg portion has a body portion attached to the connector, and the leg portion extends from the body portion into the through hole, so that a portion of the leg portion inserted into the through hole is soldered to the circuit board. When any stress is applied to the support member, the stress may concentrate on a portion of the leg portion between the body portion and the soldered leg portion. If the width of the leg portion is small, the leg portion may be damaged by such a load.

The present invention has been made in view of the above problem, and it is an object of the present invention to provide a connector holding member having sufficient strength for holding the connector to a printed circuit board and according to which any damage to the holding member can be avoided. The holding member has a leg portion which is inserted into a through hole of the circuit board and connected thereto by a reflow soldering process.

According to a feature of the present invention, a retaining element ( 26 ) into a through hole ( 30 ) of a printed circuit board ( 16 ) and connected thereto by a reflow soldering process, so that the retaining element ( 26 ) a connector ( 20 ) on the printed circuit board ( 16 ) holds. The holding element comprises: a body portion ( 40 ) located above a front panel surface ( 16a ) of the printed circuit board ( 16 ) and at the connector ( 20 ), and a leg section ( 42 ), which is constructed of a metal plate and integral with the body portion ( 40 ) is trained.

The leg section ( 42 ) extends from the body portion ( 40 ) in a direction to the through hole ( 30 ), and the leg section ( 42 ) has a first leg ( 44 ) with a front end ( 46c ) from a backplate surface ( 16b ) of the printed circuit board ( 16 ) and connected thereto by the reflow soldering process. The first leg ( 44 ) has a first leg section ( 48 ) and a second leg section ( 46 ), wherein the second leg section ( 46 ) in the through hole ( 30 ) and the first leg section ( 48 ) the second leg section ( 46 ) with the body portion ( 40 ) connects.

The first leg ( 44 ) is made to meet the following conditions:

"S1b>S1s" and "S2s>S1s", where

"S1b" is a cross-sectional area at a first boundary line (FIG. 46a ) between the first and second leg portions ( 46 . 48 ), where the first boundary line ( 46a ) with a plane of the front panel surface ( 16a ),
"S1s" is a cross-sectional area at a second boundary line ( 46b ) of the second leg section ( 46 ), the second boundary line ( 46b ) with a plane of the backplate surface ( 16b ), and
"S2s" a minimum value below cross-sectional areas of the first leg section ( 48 ) of the first leg ( 44 ) describes.

According to the above feature of the present invention, since a leg section (FIG. 42 ) into a through hole ( 30 ), an inner diameter of the through hole into which the leg portion is inserted is reduced. Consequently, a difference in inner diameter between the through hole (FIG. 30 ) for the leg portion and another through hole into which a terminal of an electrical part or a component is inserted are reduced. Accordingly, even if the solder paste is collectively applied to the through hole for the leg portion of the holding member and the through hole for the connection of the electrical part or the component, solder paste can be prevented from falling off the through hole.

Since the ratio "S1b>S1s" is satisfied, a situation can be avoided in which a larger amount of solder paste is removed from the through hole (FIG. 30 ) to a backplate surface ( 16b ) of the printed circuit board ( 16 ) is pushed out compared with a case where the cross-sectional area at the second boundary line (FIG. 46b ) equal to that at the first boundary line ( 46a ), ie, if "S1b = S1s". Further, a contact area between the solder paste and the leg portion can be increased as compared with the case that "S1b = S1s".

Since the ratio "S2s> S1s" is satisfied, any damage to the leg portion can be suppressed even if the stress concentrates on a portion of the leg portion which is not covered with the solder paste.

According to the present invention, as described above, sufficient holding strength for the holding member can be maintained and damage to the leg portion can be suppressed, with the first leg (FIG. 44 ) in the through hole ( 30 ) and connected thereto by the reflow soldering process.

According to another feature of the present invention, the ratio "S2s ≥ S1b" is further in the first leg (FIG. 44 ) Fulfills.

According to the above feature, the strength of the first leg portion (FIG. 48 ) of the leg portion is further increased and the damage of the leg portion is more effectively suppressed.

According to a further feature of the present invention, the first leg ( 44 ) to further satisfy the relationship "S1u ≥ S1d".

In the above relationship, "S1u" describes a cross-sectional area at a first optional line of the second leg portion (FIG. 46 ), while "S1d" has a cross-sectional area at a second optional line of the second leg portion (FIG. 46 ) describes. Further, the second optional line is located at a position extending in a plate extending direction of the leg portion (FIG. 42 ) further away from the body portion ( 40 ) than the one for the first optional line.

According to the above feature ("S1u ≥ S1d"), through the entire portions of the second leg portion (FIG. 46 ) of the leg portion (including the portion accommodated in the through hole and the protrusion portion (FIG. 46c )), the amount of solder paste coming out of the through hole ( 30 ) to the backplate surface ( 16b ) would be reduced.

According to yet another feature of the present invention, the first leg (FIG. 44 ) to further satisfy the following conditions: "W1u ≥ W1d", "W1b>W1s", and "W2s ≥ W1b".

In the above ratios, "W1u" describes a width of the first leg ( 44 ) on the first optional line in a disk width direction perpendicular to a disk thickness direction of the body portion (FIG. 40 ) and perpendicular to the plate extension direction of the leg portion ( 42 ) runs.

"W1d" describes a width of the first leg ( 44 ) on the second optional line in the disk width direction.

"W1b" describes a width of the first leg ( 44 ) at the first boundary line ( 46a ) in the disk width direction.

"W1s" describes a width of the first leg ( 44 ) at the second boundary line ( 46b ) in the disk width direction.

"W2S" describes a low below widths of the first leg section ( 48 ) of the first leg ( 44 ) in the disk width direction.

The above predetermined ratios for the widths of the leg portion are satisfied as described above, so that the predetermined ratios for the cross-sectional areas of the leg portion can be satisfied. If the predetermined ratios for the cross-sectional areas of the leg portion are met by adjusting the widths of the leg portion, the retaining element may (15 26 ) are manufactured with the predetermined shape in a simple manner.

According to yet another feature of the present invention, the first leg (FIG. 44 ) to satisfy the ratio "W2b>W1b", where "W2b" is a maximum below widths of the first leg section (FIG. 48 ) of the first leg ( 44 ) in the disk width direction. According to the above feature, the strength of the first leg portion (FIG. 48 ) of the leg portion is further increased and the damage of the leg portion is more effectively suppressed.

According to yet another feature of the present invention, the first leg ( 44 ) a bending section ( 54 ) extending in the sheet extension direction. The bending section ( 54 ) extends from an upper region of the first leg ( 44 ), which is not protected by solder ( 34 ) is covered, to a lower portion of the first leg ( 44 ) penetrated by the solder ( 34 ) is covered.

According to the above feature, the cross-sectional area of the leg portion may be defined by such a bending portion 54 be made larger than that for the case that the leg portion has the same width but no bending portion. Consequently, the contact area of the leg portion with the solder paste (the solder 34 ) are increased so as to increase the holding strength of the holding element ( 26 ) increase. On the other hand, the width of the leg portion can be made smaller by such a leg portion than that in the case that the leg portion has the same cross-sectional area but no bending portion. Thus, the difference of the inner diameter between the through hole (FIG. 30 ) for the leg portion and the other through hole into which the terminal of the other electrical part or the other component is inserted can be reduced.

The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. In the drawings shows:

1 a schematic illustration illustrating an outline structure - an electronic control device with a connector and a holding member according to a first embodiment of the present invention;

2 an enlarged schematic plan view of a circuit board for illustrating relevant portions including the holding member;

3 an enlarged schematic cross-sectional view taken along the line III-III in the 2 ;

4 a schematic perspective view illustrating the retaining element;

5 an enlarged schematic cross-sectional view for illustrating relevant portions that are connected by a reflow soldering process, in a state in which the holding member is fixed to the circuit board;

6 an enlarged schematic cross-sectional view of a second embodiment according to the 5 to illustrate relevant portions in a holding element attachment state;

7 an enlarged schematic cross-sectional view of a third embodiment according to the 5 to illustrate relevant portions in a holding element attachment state;

8th a schematic perspective view according to the 4 for illustrating an outline structure of a holding element according to a fourth embodiment;

9 a schematic cross-sectional view taken along the line IX-IX in the 8th ;

10 an enlarged schematic cross-sectional view of the fourth embodiment according to the 5 to illustrate relevant portions in a holding element attachment state;

11 a schematic cross-sectional view along the line XI-XI in the 10 ;

12 an enlarged schematic cross-sectional view of a fifth embodiment according to the 5 to illustrate relevant portions in a holding element attachment state;

13 a schematic cross-sectional view taken along the line XIII-XIII in the 12 ;

14 a schematic plan view for illustrating an outline structure of a holding member according to a sixth embodiment;

15 a schematic cross-sectional view taken along a line XV-XV in the 14 ;

16 a schematic illustration for illustrating a process for manufacturing the retaining element in the 14 ;

17 an enlarged schematic cross-sectional view of a seventh embodiment according to the 5 to illustrate relevant portions in a holding element attachment state;

18 a schematic cross-sectional view taken along a line XVIII-XVIII in the 17 ;

19 a schematic cross-sectional view taken along a line XIX-XIX in the 17 ;

20 a schematic perspective view illustrating an outline structure of a holding member according to an eighth embodiment;

21 a schematic illustration for illustrating a process for manufacturing the retaining element in the 20 ;

22 a schematic cross-sectional view according to the 3 to illustrate relevant portions in a holding element attachment state;

23 an enlarged schematic cross-sectional view for illustrating relevant portions that are connected by the reflow soldering process, under the condition that the holding member is fixed to the circuit board;

24 a schematic cross-sectional view taken along the line XXIV-XXIV in the 23 ; and

25 a schematic illustration accordingly 3 to illustrate relevant portions according to a ninth embodiment in a Halteelementbefestigungszustand.

The present invention will be described below with reference to several embodiments. In the embodiments, the same or similar portions and / or structures are denoted by the same reference numerals and will not be described repetitively.

Hereinafter, a direction in which a leg portion of a holding member extends from a body portion of the holding member to a circuit board is referred to as a plate extending direction or vertical direction. The plate extension direction (the vertical direction) corresponds to a thickness direction of the circuit board. A thickness direction of the body portion is referred to as a plate thickness direction. The plate thickness direction corresponds to a direction in which a plurality of terminals of a connector are arranged. A direction that is perpendicular to both the plate extension direction and the plate width direction is referred to as a plate width direction. The plate thickness direction and the plate width direction are parallel to a plate surface of the circuit board.

First Embodiment

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. First, an outline structure of an electronic control device 10 with a connector and a holding member according to a first embodiment with reference to FIGS 1 described. In the 1 is a housing 12 shown in a state in which the housing 12 for the sake of simplicity of a printed circuit board 16 dismantled.

The electronic control device 10 That is, formed in a non-waterproof structure is used as an electronic control unit (ECU) for an internal combustion engine of a vehicle. The electronic control device 10 is out of the case 12 , one in the housing 12 accommodated board 14 and the like.

The housing 12 is made of metal (such as aluminum, iron or the like) or resin built and serves the board 14 to accommodate their protection. A number of components for the housing 12 is not set to a certain number, so the housing 12 can be constructed from one component or from several components.

In the present embodiment, the housing 12 , as in 1 shown constructed of two components, which are divided in the plate extension direction (in the vertical direction). The housing 12 is made of a box-shaped lower case 12a with an open top at the top with a flat bottom and a top case 12b for closing the open end at the top of the lower housing 12a built up. If the upper case 12b and the lower case 12a For example, be connected by screws or bolts with each other, an interior space for housing the board 14 educated.

In the board 14 are electronic parts and / or components 18 , such as a microcomputer, power transistors, resistors, capacitors, and the like on the circuit board 16 attached. The electronic parts and / or components 18 are on at least one of the plate surfaces (a face plate surface 16a and a backplate surface 16b ) of the circuit board 16 arranged. In the present embodiment, the electronic parts and components 18 on both sides 16a and 16b the circuit board 16 attached.

Electrical circuit patterns are on the circuit board 16 educated. A connector 20 , the external electrical and / or electronic devices (not shown) with the electronic parts and / or components 18 connects, is also on the circuit board 16 attached. The connector 20 is made up of several connections 22 which are constructed of a conductive material, and a connector housing 24 made of an insulating material (such as resin) and the terminals 22 holds, built.

In the present embodiment, each of the terminals is 22 into a through hole (in the 1 not shown) inserted in the circuit board 16 is formed, and is electrically connected via solder to a pad portion, wherein the pad portion is formed on a cylindrical wall of the through hole or at a portion adjacent to an open peripheral end of the through hole. The connections 22 are through-hole mounting technology on the circuit board 16 attached and electrically connected to the circuit board by a reflow soldering process 16 connected. Alternatively, the connections 22 using surface mount technology and a surface mount reflow process on the circuit board 16 be attached.

The connector 20 also has a pair of retaining elements 26 on. In the present embodiment, one of the retaining elements 26 , as in 2 shown at one end 24a of the connector housing 24 in the plate thickness direction (at a right end in FIG 2 ) intended. Although not shown in the drawings, another retaining element 26 at another end of the connector housing 24 in the plate thickness direction (at a left end in FIG 2 ) intended. The multiple connections 22 are in the connector 20 between the above pair of holding elements 26 intended.

The holding element 26 is described below with reference to 3 to 5 described in more detail. In the 3 For example, a dummy pad is omitted for the sake of simplicity.

The holding element 26 is how in 3 shown in a through hole 30 inserted in the circuit board 16 is formed, and connected by the reflow soldering process. Consequently, the holding element holds 26 or hold the retaining elements 26 the connector 20 firmly on the circuit board 16 , A dummy interface 32 is how in 5 shown on a cylindrical wall of the through hole 30 formed, more specifically, at peripheral portions of open ends of the through hole 30 in the front panel surface 16a and the back surface surface 16b the circuit board 16 , The dummy pad 32 is not electrical with the electronic parts and / or components 18 connected to the circuit board 16 are attached. Specifically, the dummy pad 32 has no function for an electrical connection. In the present embodiment, pads are for the terminals 22 by copper plating in the circuit board 16 educated. The dummy pad 32 is made by the copper plating equal to the pads for the connections 22 educated. The holding element 26 is like in the 3 and 5 shown in the through hole 30 inserted and soldered 34 mechanically with the dummy pad 32 connected.

The holding element 26 is how in 4 shown constructed of a metal plate having a predetermined thickness, which is processed to a body portion 40 and a part of the body 40 from extending leg section 42 having.

The body section 40 is a part of the retaining element 26 on the connector housing 24 attached and above the front panel surface 16a the circuit board 16 is arranged. In the present embodiment, the body portion 40 formed in a flat plate shape and has a rectangular section 40a and a fork section 40b on. The rectangle section 40a is formed in a rectangular shape, one side of which extends in the plate extension direction (the vertical direction) to the leg portion 42 and the other side thereof extends in the plate width direction, around the fork portion 40b to build. Each of the arms of the fork section 40b extends from the rectangle section 40a in the disk width direction. The connector housing 24 has a groove 24c with an open end on a front 24b of the connector housing 24 on. The body section 40 is so in the groove 24c Inserted that retaining element 26 firmly on the connector housing 24 is fixed, wherein the pair of arms of the fork section 40b on a bottom side of the groove 24c (at the left end in the 3 ) is located.

The leg section 42 is as another part of the retaining element 26 formed to form the rectangle section 40a of the body section 40 in the vertical direction toward the through-hole 30 to extend. The leg section 42 has at least one leg (a first leg 44 ) on.

The first leg 44 thus leads through the through hole 30 in that a part (a front end) of the first leg 44 on one side of the back panel surface 16b protrudes. The first leg 44 has a first leg portion 48 and a second leg portion 46 on. The second leg section 46 is an insertion section 46 in the through hole 30 is inserted, and the first leg section 48 is a basic section 48 for connecting the insertion section 46 with the body section 40 , The second leg section 46 (the insertion section 46 ) of the first leg 44 corresponds to a part of the leg section 42 that is from a first boundary line 46a to a front end of the leg section 42 extends. The first borderline 46a corresponds to a line which is at the same position (or the same level) in the plate extension direction as that of the front plate surface 16a is located on the condition that the insertion section 46 through the solder 34 on the dummy pad 32 is attached.

The insertion section 46 points, as in the 3 to 5 shown, an accommodation area between the first boundary line 46a and a second boundary line 46b on. More specifically, the accommodation area corresponds to a part of the leg portion 42 in the through hole 30 is disposed (ie, accommodated) in the sheet extension direction (the vertical direction). The second borderline 46b corresponds to a line located at the same position (or at the same level) as that of the back plate surface 16b in the sheet extension direction, on the condition that the inserting portion 46 through the solder 34 on the dummy pad 32 is attached. The insertion section 46 also has a projecting area 46c on the back of the panel surface 16b protrudes in the plate extension direction. In the present embodiment, the leg portion is 42 (the first leg 44 ) are also formed in the flat plate shape. More specifically, the entire area of the retaining element 26 is formed in the flat plate shape with no bent or curved portions.

If a cross-sectional area of the leg section 42 at the first borderline 46a is defined as "S1b" is a cross-sectional area at the second boundary line 46b is defined as "S1s" and is a minimum of a cross-sectional area of the first leg portion 48 (of the basic section 48 ) defined as "S2s", wherein the first leg 44 is formed to meet the following conditions:

"S1b>S1s" and "S2s>S1s"

Further, according to the present embodiment, the first leg 44 formed to satisfy the following relationship:

"S1u ≥ S1d", where

"S1u" of a cross-sectional area at a first optional point of the first leg 44 in the plate extension direction, while "S1d" corresponds to a cross-sectional area at a second optional point of the first leg 44 corresponds, with the second optional point further away from the body portion 40 is considered the first optional point. That is, the second optional point is closer than the first optional point to the front end of the first leg 44 ,

More specifically, under cross-sectional areas of these points of the accommodating portion of the inserting portion 46 that are in the space of the through hole 30 are the cross-sectional area "S1b" at the first boundary line 46a maximum, while the cross-sectional area "S1s" at the second boundary line 46b is minimal.

Furthermore, the first leg 44 formed to satisfy the following relationship:

"S2s ≥ S1b", where

"S2s" a minimum of the cross-sectional area of the first leg section 48 (of the basic section 48 ) and "S1b" describes the cross-sectional area of the first boundary line 46a describes as described above.

In the present embodiment, the first leg is 44 formed in the flat plate shape, wherein a plate thickness thereof is constant and no step portion in the plate thickness direction exists. A width of the first optional point of the insertion section 46 is how in 5 shown as "W1u", a width of the second optional point is defined as "W1d", a width of the first boundary line 46a is defined as "W1b" and a width of the second boundary line 46b is defined as "W1s". Further, a minimum value of a width of the first leg portion 48 (of the basic section 48 ) are defined as "W2s".

The first leg 44 is formed to satisfy the following ratios for the width to satisfy the above ratios for the sectional area ("S1b>S1s" and "S2s>S1s"):

"W1u ≥ W1d", "W1b>W1s" and "W2s ≥ W1b"

Further, an inner diameter of the through hole 30 greater than the width "W1b" at the first boundary 46a designed. For the sake of simplicity, in the 5 each of the symbols (S1b, S1s, S2s, S1u, and S1d) for the respective cross-sectional areas after each corresponding symbol for the width (W1b, W1s, W2s, W1u, and W1d) are bracketed.

The first leg 44 extends in a straight line along the sheet extension direction. The first leg 44 points from a trunk section between the body section 40 and the first leg portion 48 (the basic section 48 ) up to a step section 50 in the housing area of the second leg section 46 is formed, a constant width. The step section 50 is in the through hole 30 inserted. Consequently, the first leg section 48 the constant width (the width "W2") along its entire length from the root section to the first boundary line 46a on. The width "W2" corresponds to the lowest value "W2s" for the width of the first leg section 48 , Further, the width "W1b" is at the first boundary line 46a equal to the width "W2s".

The second leg section 46 (the insertion section 46 ) has a region of large width from the first boundary line 46a to the step section 50 and a narrow width area of the step portion 50 up to the front end. The wide-width portion has a width equal to that (W1b) of the first leg portion 48 on, and the width is from the first boundary line 46a to the step section 50 constant. The narrow-width region has a constant width (W1u, W1s, W1d) smaller than the width "W1b" (= W2s). Consequently, in the housing area of the second leg section 46 between the first and the second boundary line 46a and 46b in the through hole 30 is housed, the width "W1b" at the first boundary line 46a a maximum width, while the width "W1s" at the second boundary line 46b is a minimum width. More specifically, the cross-sectional area "S1b" at the first boundary line 46a describes a maximum value for the cross-sectional area, while the cross-sectional area "S1s" at the second boundary line 46b describes a minimum value for the cross-sectional area. As described above, the second leg portion 46 (the insertion section 46 ) have two widths "W1b" and "W1u" (= W1s) that pass through the step portion 50 in the insertion area of the through hole 30 are delimited. In the present embodiment, the inserting section 46 a pair of step sections 50 which are formed on both sides in the disk width direction. The area of narrow width of the insertion section 46 that has the constant width extends from a center of the insertion portion 46 between the pair of step sections 50 just in one direction to the back panel surface 16b ,

The solder 34 is in the through hole 30 arranged and with the housing portion of the leg portion 42 between the first and the second boundary line 46a and 46b connected. The solder 34 points as in 5 shown a throat portion (a projection portion) on the front panel surface 16a the circuit board 16 so that such a throat portion of the solder 34 also with a portion of the first leg section 48 (a section above the first boundary line 46a ) connected is. In the same way, the solder has 34 another throat portion on the back plate surface 16b the circuit board 16 so that such a throat portion also with a portion of the projecting portion 46c of the second leg section 46 (of the insertion section 46 ) connected is.

Below is a process for attaching the holding member 26 on the circuit board 16 described.

First, a metal plate (not shown) is punched out to the holding member 26 to prepare with a predetermined shape. The holding element 26 is on the connector housing 24 of the connector 20 attached, which is prepared separately.

A solder paste, which later becomes the solder 34 will be on the dummy pad 32 and the through hole 30 applied by applying a screen printing process to one of the plate surfaces (such as the face plate surface) 16a ). In the screen printing process, the solder paste does not become only the through hole 30 (including the dummy pad 32 ) for the holding element 26 but also on through holes ( including pads) for the connections 22 of the connector 20 and other pads for the electronic parts and components 18 , The screen printing process, as described above, collectively for the through holes (the pads) for the holding member 26 , the connections 22 of the connector 20 and the electronic parts and components 18 executed.

Subsequently, the first leg 44 of the holding element 26 in the through hole 30 inserted while the solder paste towards the back plate surface 16b is pressed down. In the above process are the connections 22 of the connector 20 inserted in the same way in the respective corresponding through holes in the same way. Further, the electronic parts and components 18 attached to the solder paste.

Following this, the reflow soldering process on the holding element 26 , the connector 20 and the electronic parts and components 18 executed. The holding element 26 gets this way on the circuit board 16 attached. At the same time the connections 22 of the connector 20 as well as the electronic parts and components 18 electrically connected to the corresponding pads. That way, the board becomes 14 completed.

Below are advantages of the retaining element 26 and the connector 20 of the present embodiment.

According to the present embodiment, a leg portion 42 in a through hole 30 arranged. Consequently, the inner diameter of the through hole 30 into which the first leg 44 is inserted are reduced. This causes a difference in the inner diameter of the through holes between the through hole 30 for the leg section 42 and the through holes for the other electronic parts and components can be reduced. Specifically, the difference between the inner diameter of the through hole 30 and the inner diameter of the through holes for the terminals 22 of the connector 20 can be downsized. For example, the present embodiment has the following dimensions:

The diameter of the connection 22 is 0.5 mm;
The inner diameter of the through hole for the connection 22 is 0.9 mm;
The width "W1s" of the second boundary line 46b is 0.5 mm;
The width "W1b" of the first boundary line 46a is 1.1 mm;
The inner diameter of the through hole 30 is between 1.2 and 1.4 mm.

This causes the reflow soldering process collectively for the through hole 30 and the through-holes for the other parts and / or components (such as the through-hole for the terminals 22 of the connector 20 ) can be performed to simultaneously apply the solder paste to these of the through holes.

When the difference for the inner diameter of the through holes becomes larger, that is, when the inner diameter of the through hole 30 becomes larger, a movement distance of a squeegee becomes larger. Consequently, since a larger amount of the solder paste in the through hole 30 is pressed, the solder paste from the through hole 30 fall out. However, according to the present embodiment, the difference for the inner diameters of the through holes can be reduced. Consequently, the printed circuit board can be prevented from leaving the through hole 30 fall out.

According to the present embodiment, the inner diameter of the through hole becomes 30 decreases while the width of the first leg 44 the ratio "W1b>W1s" is satisfied, as in the 5 is shown. Consequently, the cross-sectional area for the first leg meets 44 the ratio "S1b>S1s". As a result, the present embodiment is compared with the case that the width "W1s" at the second boundary line 46b equal to the width "W1b" at the first boundary line 46a is, to the effect that the falling out of the solder paste from the through hole 30 towards the backside plate surface 16b can be prevented (or limited) when the second leg section 46 (the insertion section 46 ) in the through hole 30 is inserted. Consequently, not only can the solder paste be prevented from getting out of the through hole 30 falls out, but also prevents the solder paste in the space of the through hole 30 for connecting the retaining element 26 with the circuit board 16 (with the dummy pad 32 ) is needed, is scarce.

Further, since the cross-sectional area "S1b" at the first boundary line 46a greater than the cross-sectional area "S1s" at the second boundary line 46b is (S1b> S1s), a contact area between the leg portion 42 and the solder 34 compared with the case that the width "W1s" at the second boundary line 46b equal to the width "W1b" at the first boundary line 46a is to be enlarged. Due to the relationship of "S1b>S1s", the holding element 26 be provided with a sufficient connector holding strength.

According to the present embodiment, the second leg portion satisfies 46 (the insertion section 46 ) the ratio "W1u ≥ W1d" and thus the ratio "S1u ≥ S1d". Furthermore, in the Housing area of the insertion section 46 , the cross-sectional area "S1b" at the first boundary line 46a maximum, while the cross-sectional area "S1s" at the second boundary line 46b is minimal. Consequently, the present embodiment is compared with the case where the accommodating portion of the inserting portion 46 (between the first and the second boundary line 46a and 46b ) has a constant cross-sectional area, such as the constant cross-sectional area "S1b", is advantageous in that the squeezing of the solder paste is expelled from the through-hole 30 towards the backside plate surface 16b can prevent (or be restricted) when the insert section 46 in the through hole 30 is inserted. Further, the squeezing out of the solder paste by the projecting portion 46c moving in the direction of the back panel surface 16b excuses, can be caused, prevented (or limited). The entire area of the insertion section 46 (Not only the accommodation area, but also the projection area 46c ) prevents, as described above, the pressing out of the solder paste to the back plate surface 16b ,

Furthermore, since the second leg section 46 of the leg section 42 (of the insertion section 46 ) satisfies the relationship "S1u ≥ S1d", a contact area between the accommodating portion of the inserting portion 46 and the solder 34 compared with the case that the housing region has a constant width (such as the width of "W1s") along its entire length, ie, that the housing region has a constant cross-sectional area (such as the cross-sectional area of "S1s") along its entire length, be enlarged. As a result, the connector holding strength of the holding member 26 can be increased.

According to the present embodiment, the front end of the insertion portion protrudes 46 (ie the projection area 46c ) from the back panel surface 16b outward. In the structure of this embodiment, the solder paste is more likely to be pushed out when the inserting portion 46 in the through hole 30 is inserted as compared with the case that the front end of the insertion portion does not project outwardly from the back surface plate surface. However, according to the present embodiment, since the above ratios for the width and the cross-sectional areas are satisfied, dropping or falling off of the solder paste can be prevented (or limited).

Although the solder paste does not fall off, it may happen that a larger amount of the solder paste at the front end of the first leg 44 adheres. As a result, such solder paste can be removed from the solder paste in the through hole 30 after the reflow soldering process has been performed. According to the present embodiment, since the above ratios for the width and the cross-sectional areas are satisfied, an amount of the solder paste to be squeezed out by the leg portion can be reduced, so that a part of the solder paste can be prevented from being removed from the remaining part the solder paste in the through hole 30 is disconnected. Consequently, a required amount of the solder in the space of the through hole 30 being held.

The body section 40 of the holding element 26 is at the connector 20 fastened during the housing area of the first leg 44 (including areas adjacent to the housing area) with the solder 34 connected is. If any stress on the retaining element 26 applied, the load may be on a section of the first leg 44 between the body section 40 and the housing area passing through the solder 34 on the circuit board 16 is attached, ie at a portion of the leg portion 42 with the lowest value for the width, focus.

According to the present embodiment, the first leg is 44 formed to satisfy the relationship "S2s>S1s". Because the first leg section 48 (the basic section 48 ) has a cross sectional area larger than that at the second boundary line 46b has damage to the leg portion can be prevented even if the load on a portion of the first leg portion 48 not concentrated by the solder 34 is covered.

In particular, in the present embodiment, the first leg 44 is formed to satisfy the relationship "S2s ≥ S1b". More precisely, the first leg 44 satisfies the ratio "W2s = W1b", ie "S2s = S1b". That is, the cross-sectional area of the first leg portion 48 is equal to the one on the first boundary line 46a , Consequently, the potential damage in the first leg 44 effectively prevented.

According to the present embodiment, a height (or a length) of the projecting portion becomes 46c of the first leg 44 coming from the back panel surface 16b protrudes outwardly, greater than a height (or a length) of a projection portion (not shown) of the terminal or the terminals 22 of the connector 20 also from the back panel surface 16b outwardly designed, designed. This causes the first leg 44 in the through hole 30 is inserted before the port (s) 22 of the connector 20 is inserted into the corresponding through hole or be. Consequently, the first leg points 44 a function for positioning the connections 22 of the connector 20 regarding the circuit board 16 on. Accordingly, it is possible to prevent the terminals 22 be bent, and further prevents a plated layer is removed.

Second Embodiment

Hereinafter, a second embodiment will be described. Because the connector 20 and the electronic control device 10 of the first embodiment are equally applied to the second embodiment, their description is omitted below.

According to the second embodiment, as in FIG 6 shown at least a portion of the first leg 44 formed in the plate extension direction is tapered, so that the width of the first leg 44 in one direction away from the body section 40 decreases. Part of the tapered section of the first leg 44 is in the through hole 30 accommodated. In the present embodiment, the first leg is 44 formed in the flat plate shape. In the 6 For simplicity, each of the symbols (S1b, S1s, S2s, S1u, and S1d) for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width (W1b, W1s, W2s, W1u, and W1d).

In the second embodiment according to the 6 is an entire area of the first leg 44 (the first leg section 48 and the second leg section 46 (the insertion section 46 )) from the trunk section between the body section 40 and the first leg portion 48 to the front end of the leg section 42 trained to rejuvenate. In the tapered shape, a change in width is constant for a unit length in the sheet extension direction. Both sides of the leg section 42 In the plate width direction, tapered are formed, each of the changes for the unit length on the two sides being equal to each other.

In the tapered shape, the width becomes "W2" of the first leg section 48 at the first borderline 46a minimal (a minimum width "W2s"). The width "W2" of the first leg section 48 takes in the direction of the trunk section between the body section 40 and the first leg portion 48 to. The width of the first leg section 48 becomes maximum at the stem portion (a maximum width "W2b": not shown).

In the second leg section 46 of the first leg 44 (the insertion section 46 ) takes the width of the insertion section 46 towards the body part 40 as well. The insertion section 46 meets a ratio "W1u>W1d" along its entire length. In an accommodation area of the insertion section 46 (a portion of the insertion section 46 in the through hole 30 is to be accommodated) is the width "W1b" at the first boundary line 46a a maximum width, while the width "W1s" at the second boundary line 46b is a minimum width. More specifically, the accommodation area has a maximum value "S1b" for the cross-sectional area at the first boundary line 46a and a bottom value "S1s" for the cross-sectional area at the second boundary line 46b on.

The first leg 44 satisfies the following ratios for the width: "W1u>W1d","W1b>W1s" and "W2s = W1b". Consequently, the first leg meets 44 the following ratios for the cross-sectional area: "S1u>S1d","S1b>S1s" and "S2s = S1b". Furthermore, the first leg meets 44 a ratio "W2b>W1b". This results in the maximum value "S2b" for the cross-sectional area of the first leg section 48 a ratio "S2b>S1b" is satisfied.

According to the second embodiment (the tapered shape of the leg portion), the same advantages as in the first embodiment can be provided. Further, the solder paste removes due to the tapered shape to a surrounding area of the insertion portion 46 when the insertion section 46 in the through hole 30 is inserted. This causes a lot of the solder paste to be added to the backplate surface 16b would be pushed out, compared to the first embodiment (in which the leg section 44 the step section 50 can be reduced). Consequently, the connector holding strength of the holding member can be 26 increase.

In the embodiment according to the 6 is the entire area of the first leg 44 trained to rejuvenate. However, the same advantages can be produced if only such a portion of the first leg section 48 that by the solder 34 is covered, and the second leg section 46 (the insertion section 46 ) are tapered.

Third Embodiment

Hereinafter, a third embodiment will be described. Because the connector 20 and the electronic control device 10 of the first embodiment are equally applied to the third embodiment, their description is omitted below.

The first leg 44 points as in 7 shown a tapered area on. Specifically, an area of the first leg 44 from the trunk section between the body section 40 and the leg section 42 to an intermediate section 52 of the accommodation area is in the tapered shape. The intermediate section 52 corresponds to a section between the first and second boundary lines 46a and 46b and is in the through hole 30 accommodated. A lower section area of the insertion section 46 from the intermediate section 52 to the second borderline 46b has a constant width equal to the width of the intermediate section 52 (the lower portion area is also referred to as a constant width area). Consequently, the intermediate section corresponds 52 a boundary line of the insertion section 46 between the tapered area and the area of constant width. The first leg 44 is formed in the flat plane shape as in the first embodiment. That is, the first leg 44 has the constant thickness over its entire length. In the 7 For simplicity, each of the symbols (S1b, S1s, S2s, S1u, and S1d) for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width (W1b, W1s, W2s, W1u, and W1d).

In the insertion section 46 has a very lower area of the intermediate section 52 (from the borderline 52 ) to the front end of the first leg 44 as well as a constant width.

In the first leg section 48 (the basic section 48 of the first leg 44 ) becomes a lower part (ie, the tapered portion up to the first boundary line 46a ) as a first connection area 48a while an upper part having a constant width serves as a second connection area 48b referred to as. In the first connection area 48a (the tapered portion) is a lower portion through the solder 34 covered, while an upper area is not covered by the solder 34 is covered. The second connection area 48b that is on one side to the body part 40 has the constant width greater than a maximum width of the first connection portion 48a is. A centerline of the insertion section 46 (including the tapered portion and the constant width portion) and a center line of the first connection portion 48a (the tapered portion of the first leg section 48 ) agree with a centerline of the second connection region 48b match.

According to the above structure, a width "W2" of the first leg portion becomes 48 at a boundary area in the first connection area 48a between the first leg section 48 and the second leg portion 46 (the insertion section 46 ), ie at the first boundary line 46a , minimal (a minimum width "W2s"). The width "W2" of the first connection section 48a takes in the direction of the body section 40 to. A width "W2b" of the second connection area 48b is a maximum width of the first leg section 48 , Thus, a cross-sectional area at the minimum width portion corresponds to "W2s" (ie, at the first boundary line 46a ), while a cross-sectional area at the maximum width section "W2b" (ie, in the second connection area 48b ) a maximum value "S2b" for the cross-sectional area of the leg section 42 equivalent.

In the insertion section 46 takes the width of this from the intermediate section 52 towards the body part 40 as well, while the width thereof from the intermediate section 52 to the front end of the leg section 44 is constant. That is, the insertion section 46 satisfies a ratio "W1u ≥ W1d". A width "W1s" of the insertion section 46 at the second borderline 46b corresponds to a bottom value among the widths of the accommodating portion of the inserting portion 46 , A width "W1b" of the insertion section 46 at the first borderline 46a corresponds to a maximum value, ie is greater than the width "W1s" at the second boundary line 46b ,

In the first leg 44 In the present embodiment, the following conditions are satisfied.

"W1u ≥ W1d", "W1b>W1s" and "W2s = W1b"

Consequently, the following conditions are met:

"S1u ≥ S1d", "S1b>S1s" and "S2s = S1b"

Furthermore, the following conditions are fulfilled:

"W2b>W1b" and thus "S2b>S1b"

According to the above structure of the holding member 26 The third embodiment provides the same advantages as the first and second embodiments. That is, the solder paste is removed due to the tapered shape to the surrounding area of the insertion portion 46 when the insertion section 46 in the through hole 30 is inserted. This causes a lot of the solder paste to be added to the backplate surface 16b would be pushed out compared with that of the first embodiment (in which the first leg 44 the step section 50 can be reduced). Consequently, the connector holding strength of the holding member can be 26 increase.

Compared with the second embodiment ( 6 ), in which the insertion section 46 the tapered shape along its entire length to the front end of the first leg 44 and the width "W1b" (ie, the cross-sectional area "S1b") at the first boundary line 46a is equal to that of the third embodiment, a cubic volume of the accommodating portion of the insertion portion 46 (in the through hole 30 inserted) can be reduced. This causes the to Back plate surface 16b herauszudrückende amount of solder paste can be reduced. Consequently, the connector holding strength of the holding member can be 26 increase.

Fourth Embodiment

Hereinafter, a fourth embodiment will be described. The parts and portions equally used in the fourth embodiment (such as the connector 20 , the electronic control device 10 and the like) are not described again below.

The fourth embodiment differs as in FIGS 8th to 11 shown in the following points of the third embodiment. The body section 40 and the first leg 44 have a bending section 54 on, which is formed in its cross section in a convex shape. More specifically, a part of one of the plate surfaces of the holding member 26 is recessed in the plate thickness direction while a part of the other plate surface of the holding member 26 is expanded in the plate thickness direction. The bending portion extends in the sheet extension direction. An upper end of the bending section 54 is in an area of the body section 40 not arranged by the solder 34 is covered while a lower end of the bending section 54 in an area of the first leg 44 is arranged by the solder 34 is covered. In the 10 For simplicity's sake, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

In the first leg 44 In the present embodiment, the following ratios are satisfied for the width:

"W1u ≥ W1d", "W1b>W1s" and "W2s = W1b"

Consequently, the following ratios for the cross-sectional areas are met:

"S1u ≥ S1d", "S1b>S1s" and "S2s = S1b"

Furthermore, the following conditions are fulfilled:

"W2b>W1b" and thus "S2b>S1b"

The bending section 54 is how in 9 shown in the plate thickness direction so deepened and expanded that one of the plate surfaces of the holding element 26 recessed (inwardly curved) while the other of the plate surfaces of the holding element 26 extended (curved outward) is. The bending section 54 is arc-shaped in its cross-section as described above.

The bending section 54 extends, as in the 8th and 10 shown from the top of the body section 40 to a center of the accommodating portion of the inserting portion 46 (equal to or near the intermediate section 52 in the 7 ), over the first leg section 48 of the leg section 42 , where the center point in the space of the through hole 30 ie, between the first and second boundary lines 46a and 46b , is located.

According to the above structure of the fourth embodiment, the cross-sectional area of the leg portion 42 due to the bending section 54 be made larger than that of the third embodiment, when the width of the leg portion between the third and the fourth embodiment is equal to each other. 11 shows a cross-sectional view along the line XI-XI in the 10 wherein a cross-sectional shape of the leg portion is shown as a comparative example by a dotted line. The insertion section 46 of the leg portion of the comparative example has, as in 11 shown the curved or curved section 54 not even though the thickness and the width of the comparative example are the same as those of the present embodiment. According to the present embodiment, a contact area between the insertion portion 46 of the leg section and the solder 34 be enlarged. The connector holding strength of the holding member 26 can thus be increased.

On the other hand, when the cross-sectional areas between the present embodiment and the connector are formed to be equal to each other, the width of the leg portion can be made 42 of the present embodiment by such an amount corresponding to the bending portion 54 be reduced. More specifically, the inner diameter of the through hole 30 can be reduced. This causes the difference for the inner diameter of the through holes between the through hole 30 for the holding element 26 and the through holes for the other parts or components (such as the terminals 22 of the connector 20 ) can be reduced.

In the present embodiment, the bending portion 54 formed as the recessed and extended section. Consequently, the bending portion 54 be formed in a simple manner by pressing the metal plate.

The bending section 54 however, is not limited to the recessed and extended section of the arcuate section. The bending section may have an angular cross-section exhibit. The number of bending sections 54 is not limited to one. There may be formed a plurality of bending portions in the plate width direction. The bending portion is not limited to a continuously expanding shape in the sheet extension direction. The bending portion may be divided into a plurality of sections in the sheet extension direction.

Furthermore, the bending section 54 only in the area of the leg section 42 be formed as long as the following conditions are met:

"S1u ≥ S1d", "S1b>S1s" and "S2s = S1b"

As already described in the first embodiment, then, if any load on the retaining element 26 is applied, the load on the section of the first leg 44 between the body section 40 and the housing area passing through the solder 34 on the circuit board 16 is attached, ie at the section of the leg section 42 with the lowest value for the width, focus. Consequently, the bending section 54 preferably in the leg section 42 from the section of the insertion section 46 in the through hole 30 is housed, to the section of the first leg section 48 that is not caused by the solder 34 covered, formed.

Fifth Embodiment

Hereinafter, a fifth embodiment will be described. Those parts and portions equally used in the fifth embodiment (such as the connector 20 , the electronic control device 10 and the like) are not described again below.

As in the 12 and 13 shown is a bending section 54 formed in the fifth embodiment in a crank shape (crank shape). The other portions are substantially the same as those of the fourth embodiment. In the 13 a comparative example is shown by a dotted line, wherein the insertion portion 46 of the holding element 26 is constructed of a metal plate having a plate thickness and a plate width equal to those of the present embodiment but without a bent portion. In the 12 For simplicity's sake, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

In the first leg 44 In the present embodiment, the following conditions are also satisfied.

"W1u ≥ W1d", "W1b>W1s" and "W2s = W1b"

Consequently, the following ratios for the cross-sectional areas are met:

"S1u ≥ S1d", "S1b>S1s" and "S2s = S1b"

Furthermore, the following conditions are fulfilled:

"W2b>W1b" and thus "S2b>S1b"

Further, the bending portion 54 educated.

The bending section 54 extends, as in the 12 and 13 shown in the plate extending direction from an intermediate point (corresponding to a point of the step portion 50 ) of the second leg section 46 between the first and the second boundary line 46a and 46b to a point of the first leg section 48 that is not caused by the solder 34 is covered. Part of the first leg 44 is shifted in the plate thickness direction, so that the bending portion 54 has the cross section of the crank shape (crank shape). The bending section 54 with the step section 50 can be easily manufactured by applying a pressing to the metal plate in a manner similar to the first embodiment.

In the fifth embodiment with the above bending portion 54 For example, the same advantages as in the fourth embodiment can be produced.

In the 13 is the crank shape of the bending section 54 as a right angle ( 90 Degrees). The step section 50 however, it may be connected to the leg portion via a round portion or a bevelled surface.

Sixth Embodiment

Hereinafter, a sixth embodiment will be described. The parts and portions equally used in the sixth embodiment (such as the connector 20 , the electronic control device 10 and the like) are not described again below.

The bending sections 54 are like in the 14 and 15 shown by bending an outer peripheral portion of the leg portion 42 formed in the sixth embodiment. In the 14 For simplicity's sake, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

In the first leg 44 In the present embodiment, the following conditions are also satisfied.

"W1u ≥ W1d", "W1b>W1s" and "W2s = W1b"

Consequently, the following ratios for the cross-sectional areas are met:

"S1u ≥ S1d", "S1b>S1s" and "S2s = S1b"

Furthermore, the following conditions are fulfilled:

"W2b>W1b" and thus "S2b>S1b"

Furthermore, the bending sections 54 educated.

In the holding element 26 that in the 14 and 15 is shown, each of the bending sections 54 in the leg section 42 from an intermediate point (corresponding to the intermediate point of the fifth embodiment) of the second leg portion 46 between the first and the second boundary line 46a and 46b to a point of the first leg section 48 not formed by the solder 34 is covered. An outer peripheral portion of the leg portion 42 a tapered shape, as in 16 shown in a valley-folding manner along dotted lines on both sides of the leg section 42 bent in the plate width direction.

In the sixth embodiment with the above bending portions 54 For example, the same advantages as in the fourth embodiment can be produced.

In the sixth embodiment, the bending portions 54 on both sides of the leg section 42 formed in the disk width direction. However, the leg portion may be on one side of the leg portion 44 be formed in the disk width direction.

Seventh Embodiment

Hereinafter, a seventh embodiment will be described. The parts and portions equally used in the seventh embodiment (such as the connector 20 , the electronic control device 10 and the like) are not described again below.

In the seventh embodiment, as in FIGS 17 to 19 shown the width of the first leg 44 constant over its entire length, while a bending section 54 such in a part of the first leg 44 is formed in the sheet extension direction, that the following conditions are satisfied:

"S1b>S1s" and "S2s>S1s"

In the 17 For simplicity's sake, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

The bending section 54 is how in 17 shown in the first leg 44 from an intermediate point of the second leg section 46 between the first and the second boundary line 46a and 46b to a point of the first leg section 48 not formed by the solder 34 is covered. The width of the leg section in which the bending section 54 is formed, as in the 18 and 19 shown, almost equal to that of the leg portion in which the bending portion 54 not formed. The insertion section 46 of the leg section coinciding with the bending section 54 is formed, as in 18 shown deepened and expanded (expanded) in the plate thickness direction. The insertion section 46 of the leg section without the bending section 54 points as in 19 shown a rectangular cross section.

According to the present embodiment, therefore, the following conditions are satisfied:

"W1u = W1d", "W1b = W1s" and "W2s = W1b"

The cross-sectional area of the bending section 54 is constant along its entire length in the sheet extension direction and larger than the cross-sectional area of the leg portion without bending portion 54 , As in the 18 and 19 shown, the following conditions are fulfilled:

"S1u>S1d","S1b>S1s" and "S2s = S1b"

The bending section 54 is partially in the first leg as described above 44 formed to meet the following conditions:

"S1b>S1s" and "S2s>S1s"

Furthermore, the first leg 44 be formed to meet the following conditions:

"S1u ≥ S1d", "S1b>S1s" and "S2s ≥ S1b"

(Eighth Embodiment)

An eighth embodiment will be described below. The parts and portions equally used in the eighth embodiment (such as the connector 20 , the electronic control device 10 and the like) are not described again below.

According to the eighth embodiment shown in FIGS 20 to 24 is shown is the leg section 42 from a first leg 44 and a pair of second legs 56 on both sides of the first leg 44 are arranged in the disk width direction. The pair of second legs 56 is in a symmetrical shape with respect to a center line of the first leg 44 educated.

In a holding element 26 the present embodiment according to the 20 is a body section 40c in an L-shape (shape of a letter L) instead of the body portion 40a of the rectangular shape of the fourth embodiment ( 8th ) and is the pair of second legs 56 to the body section 40c added. The second legs 56 are by a punching process and a bending process in the same metal plate of the body portion 40c educated.

In the present embodiment, similar to the above embodiments, a leg portion 42 (the first leg 44 ) in a through hole 30 inserted. That is, each of the second legs 56 is different from the through hole in a respective through hole 30 for the first leg 44 inserted.

A hook section 58 is at a front end of each second leg 56 formed that hook section 58 at or on the circuit board 16 is hooked. Consequently, prevent the second legs 56 in that the retaining element 26 (ie the connector 20 ) before the reflow soldering process from the circuit board 16 drops.

Each front end of the second leg 56 (the hook section 58 protrudes, as in the 22 and 23 shown from the through hole 30 on the back panel surface 16b outward when the second leg 56 in the corresponding through hole 30 is inserted. The hook section 58 is on an outer periphery of an opening on a lower side of the through hole 30 hooked. Since the structure of the second leg in Japanese Patent No. 4,626,680 is described below, this will not be near or just simplified.

In addition to the hook section 58 is the second leg 56 from a first connection section 60 , a spring section 62 and a second connecting portion 64 built up. A width of the second leg 56 is greater than a thickness of the second leg over its entire length 56 ,

The first connection section 60 connects the hook section 58 with the spring section 62 , The first connection section 60 is like in the 20 and 21 shown formed in an L-shape (shape of the letter L). A lower end of the first connection section 60 is with the hook section 58 connected while an upper end thereof with the spring portion 62 connected is. A part of the lower end of the first connection section 60 is in the through hole 30 accommodated. The first connection section 60 as well as the hook section 58 are arranged on a plane that is equal to a plane for the body section 40 and the first leg 44 is (with the exception of the bending section 54 ).

The spring section 62 is elastically deformable in the plate width direction. Consequently, the spring portion 62 elastically deformed when the hook section 58 and the first connection section 60 in the through hole 30 be inserted so that the hook section 58 on the back panel surface 16b the circuit board 16 is hooked. The spring section 62 is formed in a C-shape (shape of the letter C). Each of the spring sections 62 is in the plate thickness direction along a dashed-dotted line ( 21 ) bent in a valley fold manner (valley-folding manner), so that each of the spring sections 62 in the plate width direction is opposite ( 20 ). The bending section 54 is made by pressing along the dotted lines in the 21 educated.

In the present embodiment, since the spring section 62 90 degrees relative to the body section 40 is bent, the thickness direction of the spring section 62 coincide with the disk width direction. The first connection section 60 is with a lower end of the spring section 62 connected, and the second connection section 64 is with an upper end of the spring section 62 connected.

The second connection section 64 connects the spring section 62 with the body section 40 , The first leg 44 and the pair of second legs 56 are with a lower side of the body section 40 (the L-shaped body section 40c ) connected.

An attachment state of the holding element 26 is in the 22 to 24 shown. In the 22 and 23 the dummy pads are omitted for the sake of simplicity. The second legs 56 are through the reflow soldering process with the circuit board 16 connected. The second legs 56 are not necessarily connected to the PCB by the reflow soldering process.

Each of the legs of the leg section 42 (the first leg 44 and the second legs 56 ) is correspondingly in a respective one of the through holes 30 , which differ from each other, inserted. Three of the through holes 30 are, as in 24 shown arranged in a straight line and at equal intervals in the disc width direction.

The first leg 44 is in the through hole 30 inserted in the middle of the three Through holes is located. Like the fourth embodiment ( 8th and 9 ) has the leg section 42 the bending section 54 and the intermediate section 52 between the first and the second boundary line 46a and 46b on. Consequently, the connector holding strength of the holding member can be 26 on the condition that the first leg 44 through the solder 34 with the circuit board 16 is increased.

Each of the second legs 56 is inserted in a respective one of the through-holes located on both sides of the through-hole 30 for the first leg 44 are located. Each of the hook sections 58 is on the outer circumference of the opening on the lower side of the through-hole 30 on the back panel surface 16b hooked. The section of the first connection section 60 is in the through hole 30 , The hooked section and the first connection section 60 are through the solder 34 with the through hole 30 connected.

If the second legs 56 as described above, through the solder 34 with the circuit board 16 may be the connector holding strength of the holding member 26 be further increased.

Further, according to the present embodiment, since the second legs 56 in addition to the first leg 44 are provided by the multiple legs are prevented from the connector 20 before the reflow soldering process with respect to the printed circuit board 16 is inclined. In particular, since the retaining element 26 the pair of second legs 56 has, the inclination of the connector 20 effectively prevented.

Each of the second legs 56 has the hook portion 58 on the back panel surface 16b the circuit board 16 is hooked. Consequently, even in the event that any external force affecting the leg section 42 in the plate extension direction from the through hole 30 pull out on the connector 20 and / or the leg section 42 is applied, pulling out the leg section 42 through the hook section 58 be prevented. Further, each of the hook portions extends 58 in the disk width direction from the first connecting portion 60 outwards, ie in one direction away from each other. A play and / or slip of the connector 20 with respect to the circuit board 16 can be prevented.

In the second leg 56 are the hook section 58 and the spring section 62 formed at different positions and is the spring section 62 above the front panel surface 16a the circuit board 16 , According to the above structure, the spring portion 62 by the spring force itself not directly on the cylindrical side wall of the through hole 30 hooked. The spring section 62 brings its spring force on the hook section 58 on that hook section 58 in the through hole 30 inserted and on the back panel surface 16b the circuit board 16 is hooked. Consequently, it is not necessary, the hook portion 58 provided with a large spring force to the hook portion 58 strongly in contact with the cylindrical side wall of the through hole 30 to bring when the hook section 58 in the through hole 30 is inserted. Accordingly, a force for inserting the hook portion 58 in the through hole 30 be reduced. Consequently, any damage to the dummy pad 32 be prevented.

According to the present embodiment, a protrusion height of the first leg is 44 that from the back panel surface 16b protrudes downwards, larger than that of the second legs 56 , Consequently, the first leg 44 first into the through hole 30 inserted before the second legs 56 in the respective through holes 30 be inserted. This causes the first leg 44 a function for positioning the second legs 56 with respect to the corresponding through holes 30 having. The second legs 56 with the spring sections 62 can smoothly or easily into the appropriate through holes 30 be inserted.

Even in the event that the second legs 56 not by the reflow soldering process with the circuit board 16 can be connected, can prevent the hook sections 58 be solved by any extraction force from their adhered conditions, since the first leg 44 to the circuit board 16 is soldered.

In the present embodiment, the holding element 26 the pair of second legs 56 on. The holding element 26 but it can be a first leg 44 and a second leg 56 exhibit.

In the present embodiment, the second legs are 56 to the holding element 26 the fourth embodiment ( 8th to 11 ) added. The second leg 56 or the second legs 56 However, the present embodiment can also for holding element 26 be added to the other embodiments (the first to third embodiment or the fifth to seventh embodiment).

Ninth Embodiment

Hereinafter, a ninth embodiment will be described. The parts and portions equally used in the ninth embodiment (such as the connector 20 , the electronic control device 10 and the like) are not described again below.

According to the present embodiment, as shown in FIG 25 shown each of the hook sections 58 by a spring force on a wall surface of the through-hole 30 hooked. The first leg 44 has a stepwise bent portion 66 on, leaving the first leg 44 and the pair of second legs 56 are arranged on the same plane extending in the disk width direction. Each of the first leg 44 and the second legs 56 is correspondingly in a respective one of the through holes 30 inserted, which are arranged in a straight line at equal intervals in the disk width direction. The other portions other than the above points are the same as or similar to those of the eighth embodiment ( 20 to 24 ).

The first leg 44 has the stepwise bent portion 66 on, at an upper end of the first leg section 48 the tapered shape is formed. The stepwise bent section 66 is bent stepwise, leaving a cross section of the bent section 66 in the plate extension direction has a crank shape (crank shape). More precisely, the first leg section 48 the tapered shape and the second leg section 46 (the insertion section 46 ) are from the body section 40c in a direction perpendicular to the plane of the 25 elevated. The raised first leg section 48 and the second leg section 46 run parallel to the plane of the body section 40c , If the second leg section 46 in the through hole 30 inserted, become the first leg 44 and the second legs 56 through the solder 34 with the circuit board 16 connected.

Each of the second legs 56 is 90 degrees with respect to the body portion along its entire length in the sheet extension direction 40 bent. Each of the second legs 56 has a first bending section 68 , a second bending section 70 and a third bending section 72 on. The first bending section 68 extends from the body portion 40c in the sheet extension direction, which is almost perpendicular to the circuit board 16 runs. The first bending section 68 is also referred to as a vertical section. The second bending section 70 extends from the first bending section 68 in the disk width direction, which is almost parallel to the printed circuit board 16 runs. The second bending section 70 is also referred to as a parallel section. The third bending section 72 extends from the second bending section 70 in the plate extension direction such that a part of the third bending portion 72 in the through hole 30 is inserted. The third bending section 72 is also referred to as an insert section. The hook section 58 is at a portion near a front end of the third bending portion 72 educated. The second legs 56 are in a symmetrical shape with respect to a center line of the first leg 44 educated.

A thickness direction of the first bending portion 68 agrees with the disk width direction. The second bending section 70 is 90 degrees with respect to the first bending section 68 bent so that a thickness direction of the second bending portion 70 coincides with the plate extension direction. The third bending section 72 is also with respect to the second bending section 70 bent.

In the pair of second legs 56 each of the third bending sections extends 72 almost in the plate extension direction, but not parallel to each other. Each of the third bending sections 72 is so light relative to the midline of the first leg 44 inclined so that the third bending section 72 from the first leg 44 extends outwardly, with increasing distance of the third bending portion 72 from the second bending section 70 , As a result, a distance between the third bending portions becomes 72 which are opposed in the plate width direction at the hook portions 58 maximum. The distance between the third bending sections 72 goes towards the front end of the second leg 56 narrower.

If the first leg 44 as well as the second legs 56 in the respective through holes 30 Inserted, each of the hook sections 58 by the spring force of the second leg 56 in contact with the inner peripheral wall of the through hole 30 brought. Subsequently, the third bending section 72 (the insertion section 72 ) through the solder 34 with the circuit board 16 connected.

The holding element 26 The present embodiment having the above structure brings the same advantages as the holding member 26 of the eighth embodiment.

Furthermore, even in the event that the second legs 56 not by the reflow soldering process with the circuit board 16 be connected, prevents the hook sections 58 be solved by any extraction force from its hooked state, since the first leg 44 to the circuit board 16 is soldered.

In the present embodiment, the holding element 26 the pair of second legs 56 on. The holding element 26 but it can be a first leg 44 and a second leg 56 exhibit. In such a case, the first leg becomes 44 also in contact with the inner peripheral wall of the through hole 30 brought, so the game (backlash) and / or Slipping between the connector and the circuit board through the first leg 44 and the second leg 56 can be limited or suppressed. The pair of second legs 56 However, in view of the damage of the dummy pad 32 through the direct contact between the first leg 44 and the inner peripheral wall of the through hole 30 the sole second leg 56 preferable.

In the present embodiment, the second legs are 56 to the holding element 26 added to the fourth embodiment ( 8th to 11 ). The second leg 56 or the second legs 56 However, the present embodiment may also be the holding element 26 be added to the other embodiments (the first to third embodiment or the fifth to seventh embodiment).

The present invention should be understood as not limited to the above embodiments, but may be variously modified without departing from the scope thereof.

In the above embodiments, the leg portion 42 a first leg 44 on. The leg section 42 however, it may have several first legs.

A number of on a connector 20 fastened holding elements 26 is not limited to two. One or more than two retaining elements may be attached to the one connector 20 be attached. The plurality of holding members may preferably be in a direction corresponding to an arrangement line of a plurality of terminals 22 be arranged of the connector.

In the above embodiments, the following conditions are satisfied:

"S1b>S1s" and "S2s = S1b"

The first leg 44 however, it can be formed to meet the following conditions:

"S1b>S1s" and "S2s>S1s"

The holding element 26 The first embodiment may be modified such that the width of the first leg 44 at the first borderline 46a that with the plane of the front panel surface 16a matches, reduces, and satisfies the following relationship:

"S1b>S2s>S1s"

Even in such a modification, the connector holding strength of the holding member can be 26 be increased in a manner similar to the first embodiment.

Further, since the ratio "S2s>S1s" is satisfied, the damage of the leg portion can be prevented even when the load on the portion of the first leg portion 48 not concentrated by the solder 34 is covered.

The first leg 44 may be formed such that the ratio "S2s>S1b" is satisfied. For example, in the first embodiment, another step portion may be at the first boundary line 46a of the first leg 44 be formed to satisfy the ratio "W2s>W1b". This causes the width of the first leg 44 is reduced twice and the first leg 44 thus has three different widths. According to such a modification, the damages of the leg portion can be more effectively prevented as compared with the case where the ratio is "S2s = S1b".

The holding element 26 may be further modified such that the ratio "S1u ≥ S1d" is not satisfied. In the first embodiment, for example, a recessed and / or extended portion in the projecting area 46c of the first leg 44 be formed so that a cross-sectional area of such a recessed and / or extended portion is greater than the cross-sectional area "S1s" at the second boundary line 46b , Alternatively, the holding member may include such an intermediate portion between the first and second boundary lines 46a and 46b wherein the intermediate portion has a smaller cross-sectional area than that at the second boundary line 46b having.

Above, a connector and an associated holding member are disclosed.

A holding element 26 has a body portion 40 that is connected to a connector 20 is attached, and a leg section 42 that turns into a through hole 30 a circuit board 16 extends, up. The leg section 42 has a first leg 44 on that in the through hole 30 inserted and connected by a reflow soldering process. A front end of the first leg 44 protrudes from a back panel surface 16b the circuit board 16 out. The first leg 44 has a second leg section 46 in the through hole 30 is inserted, and a first leg portion 48 for connecting the second leg section 46 with the body section 40 on. The ratios "S1b>S1s" and "S2s>S1s" are satisfied, where "S1b" is a cross-sectional area at a first boundary line 46a describes that with a front panel surface 16a "S1s" is a cross-sectional area at a second boundary line 46b describes that with the backplate surface 16b matches, and "S2s" a minimum under cross-sectional areas of the first leg section 48 describes.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• JP 4626680 [0003, 0004, 0167]

Claims (15)

Retaining element ( 26 ), which enters a through hole ( 30 ) of a printed circuit board ( 16 ) and connected thereto by a reflow soldering process, so that the holding element ( 26 ) a connector ( 20 ) on the printed circuit board ( 16 ), comprising: - a body portion ( 40 ) located above a front panel surface ( 16a ) of the printed circuit board ( 16 ) and at the connector ( 20 ) is attached; and a leg section ( 42 ), which is constructed of a metal plate and integral with the body portion ( 40 ), wherein - the leg section ( 42 ) of the body portion ( 40 ) in a direction to the through hole ( 30 ), - the leg section ( 42 ) a first leg ( 44 ) with a front end ( 46c ) from a backplate surface ( 16b ) of the printed circuit board ( 16 ) and is connected thereto by the reflow soldering process, comprising, - the first leg ( 44 ) a first leg section ( 48 ) and a second leg section ( 46 ), wherein the second leg portion ( 46 ) in the through hole ( 30 ) and the first leg section ( 48 ) the second leg section ( 46 ) with the body portion ( 40 ), and - the first leg ( 44 ) to satisfy the following relationships: "S1b>S1s" and "S2s>S1s", wherein - "S1b" has a cross-sectional area at a first boundary line (FIG. 46a ) between the first and second leg portions ( 46 . 48 ), where the first boundary line ( 46a ) with a plane of the front panel surface ( 16a ), "S1s" has a cross-sectional area at a second boundary line ( 46b ) of the second leg section ( 46 ), the second boundary line ( 46b ) with a plane of the backplate surface ( 16b ), and "S2s" is a subscript below cross-sectional areas of the first leg section (FIG. 48 ) of the first leg ( 44 ) describes. Retaining element ( 26 ) according to claim 1, characterized in that the first leg ( 44 ) to further satisfy the following relationship: "S2s ≥ S1b". Retaining element ( 26 ) according to claim 2, characterized in that the first leg ( 44 ) to further satisfy the following relationship: "S1u ≥ S1d", wherein - "S1u" has a cross-sectional area at a first optional line of the second leg portion (FIG. 46 ), "S1d" is a cross-sectional area on a second optional line of the second leg portion (FIG. 46 ), and the second optional line is at a position extending in a plate extension direction of the leg portion (FIG. 42 ) extending from the body portion ( 40 ) to the circuit board ( 16 ), further away from the body portion ( 40 ) than the one for the first optional line. Retaining element ( 26 ) according to claim 3, characterized in that the first leg ( 44 ) to further satisfy the following conditions: "W1u ≥ W1d", "W1b>W1s" and "W2s ≥ W1b", where - "W1u" is a width of the first leg (FIG. 44 ) on the first optional line in a disk width direction perpendicular to a disk thickness direction of the body portion (FIG. 40 ) and perpendicular to the plate extension direction of the leg portion ( 42 ), "W1d" is a width of the first leg ( 44 ) on the second optional line in the disk width direction, "W1b" is a width of the first leg ( 44 ) at the first boundary line ( 46a ) in the disk width direction, "W1s" is a width of the first leg ( 44 ) at the second boundary line ( 46b ) in the disk width direction, and "W2S" is a minimum below widths of the first leg section (FIG. 48 ) of the first leg ( 44 ) in the disk width direction. Retaining element ( 26 ) according to claim 4, characterized in that the first leg ( 44 ) to further satisfy the following relationship: "W2b>W1b", where - "W2b" peaks below first leg widths (FIG. 48 ) of the first leg ( 44 ) in the disk width direction. Retaining element ( 26 ) according to claim 4 or 5, characterized in that - the first leg ( 44 ) a bending section ( 54 ) extending in the plate extension direction; and - the bending section ( 54 ) from an upper portion of the first leg ( 44 ), which is not protected by solder ( 34 ) is covered, to a lower portion of the first leg ( 44 ) penetrated by the solder ( 34 ) is covered. Retaining element ( 26 ) according to claim 6, characterized in that the bending section ( 54 ) is formed convex such that a part of a plate surface of the first leg ( 44 ) is recessed in the plate thickness direction and part of the other plate surface of the first leg ( 44 ) is expanded in the plate thickness direction. Retaining element ( 26 ) according to claim 6, characterized in that the bending section ( 54 ) is formed in a crank shape. Retaining element ( 26 ) according to one of claims 4 to 8, characterized in that - a part of the first leg ( 44 ) is formed in a tapered shape so that the width of the first leg ( 44 ) in the direction of the front end of the first leg ( 44 ), and - a portion of the tapered shape in the through hole ( 30 ) is inserted. Retaining element ( 26 ) according to claim 9, characterized in that - the second leg section ( 46 ) of the first leg ( 44 ) the tapered shape from the first boundary line ( 46a ) to an intermediate line between the first and second boundary lines ( 46a . 46b ) having; and - the second leg section ( 46 ) between the intermediate line and the second boundary line ( 46b ) has a width equal to a width at the second boundary line ( 46b ). Retaining element ( 26 ) according to one of claims 1 to 10, characterized in that - the leg section ( 42 ) a second leg ( 56 ), which is in a through hole ( 30 ), which extends from the through hole of the first leg ( 44 ) distinguishes; and - the second leg ( 56 ) a hook portion ( 58 ), which in the circuit board ( 16 ) is hooked. Retaining element ( 26 ) according to claim 11, characterized in that - a front end of the second leg ( 56 ) from the backplate surface ( 16b ) of the printed circuit board ( 16 ) protrudes; and - the hook section ( 58 ) at a peripheral portion of an open end of the through-hole (US Pat. 30 ) in the backplate surface ( 16b ) is hooked. Retaining element ( 26 ) according to claim 11, characterized in that the hook portion ( 58 ) by a spring force of the second leg ( 56 ) on an inner peripheral wall of the through-hole (FIG. 30 ) is hooked. Retaining element ( 26 ) according to one of claims 11 to 13, characterized in that - the leg section ( 42 ) from a first leg ( 44 ) and a pair of second legs ( 56 ) is constructed; and - the first leg ( 44 ) in the disk width direction between the second legs ( 56 ) is arranged. Interconnects ( 20 ) attached to the circuit board ( 16 ) with the retaining element ( 26 ) is attached according to one of claims 1 to 14.

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