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DE10156626A1 - Elektronische Anordnung - Google Patents

Elektronische Anordnung

Info

Publication number
DE10156626A1
DE10156626A1 DE10156626A DE10156626A DE10156626A1 DE 10156626 A1 DE10156626 A1 DE 10156626A1 DE 10156626 A DE10156626 A DE 10156626A DE 10156626 A DE10156626 A DE 10156626A DE 10156626 A1 DE10156626 A1 DE 10156626A1
Authority
DE
Germany
Prior art keywords
carrier
layer
electronic arrangement
signal
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10156626A
Other languages
German (de)
English (en)
Inventor
Rainer Topp
Dirk Balszunat
Christoph Ruf
Andreas Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE10156626A priority Critical patent/DE10156626A1/de
Priority to JP2003548308A priority patent/JP2005510877A/ja
Priority to PCT/DE2002/003883 priority patent/WO2003046988A2/fr
Priority to US10/495,233 priority patent/US7138708B2/en
Priority to EP02779160A priority patent/EP1449252A2/fr
Publication of DE10156626A1 publication Critical patent/DE10156626A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Battery Mounting, Suspending (AREA)
DE10156626A 1999-09-24 2001-11-17 Elektronische Anordnung Withdrawn DE10156626A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE10156626A DE10156626A1 (de) 2001-11-17 2001-11-17 Elektronische Anordnung
JP2003548308A JP2005510877A (ja) 2001-11-17 2002-10-15 電子装置
PCT/DE2002/003883 WO2003046988A2 (fr) 2001-11-17 2002-10-15 Dispositif electronique
US10/495,233 US7138708B2 (en) 1999-09-24 2002-10-15 Electronic system for fixing power and signal semiconductor chips
EP02779160A EP1449252A2 (fr) 2001-11-17 2002-10-15 Dispositif electronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10156626A DE10156626A1 (de) 2001-11-17 2001-11-17 Elektronische Anordnung

Publications (1)

Publication Number Publication Date
DE10156626A1 true DE10156626A1 (de) 2003-06-05

Family

ID=7706161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10156626A Withdrawn DE10156626A1 (de) 1999-09-24 2001-11-17 Elektronische Anordnung

Country Status (4)

Country Link
EP (1) EP1449252A2 (fr)
JP (1) JP2005510877A (fr)
DE (1) DE10156626A1 (fr)
WO (1) WO2003046988A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006003126A1 (fr) * 2004-06-30 2006-01-12 Robert Bosch Gmbh Systeme de module electronique et procede de production correspondant
US8018056B2 (en) 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices
US8823151B2 (en) 2010-09-29 2014-09-02 Mitsubishi Electric Corporation Semiconductor device
DE102022207848A1 (de) 2022-07-29 2023-11-16 Vitesco Technologies Germany Gmbh Kontaktierungselement für Leistungshalbleitermodule, Leistungshalbleitermodul und Inverter mit einem Kontaktierungselement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2444418B2 (de) * 1974-09-17 1977-03-24 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
WO1998015005A1 (fr) * 1996-09-30 1998-04-09 Siemens Aktiengesellschaft Composant microelectronique a structure sandwich
WO2001024260A1 (fr) * 1999-09-24 2001-04-05 Virginia Tech Intellectual Properties, Inc. Configuration tridimensionnelle peu couteuse de puces a bosses pour modules de puissance electroniques integres

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung
DE3201296C2 (de) * 1982-01-18 1986-06-12 Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev Transistoranordnung
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages
US5006921A (en) * 1988-03-31 1991-04-09 Kabushiki Kaisha Toshiba Power semiconductor switching apparatus with heat sinks
US6125039A (en) * 1996-07-31 2000-09-26 Taiyo Yuden Co., Ltd. Hybrid module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2444418B2 (de) * 1974-09-17 1977-03-24 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
WO1998015005A1 (fr) * 1996-09-30 1998-04-09 Siemens Aktiengesellschaft Composant microelectronique a structure sandwich
WO2001024260A1 (fr) * 1999-09-24 2001-04-05 Virginia Tech Intellectual Properties, Inc. Configuration tridimensionnelle peu couteuse de puces a bosses pour modules de puissance electroniques integres

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006003126A1 (fr) * 2004-06-30 2006-01-12 Robert Bosch Gmbh Systeme de module electronique et procede de production correspondant
US8018056B2 (en) 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices
DE102006060768B4 (de) * 2005-12-21 2013-11-28 International Rectifier Corp. Gehäusebaugruppe, DBC-Plantine im Wafermaßstab und Vorrichtung mit einer Gehäusebaugruppe für Geräte mit hoher Leistungsdichte
US8823151B2 (en) 2010-09-29 2014-09-02 Mitsubishi Electric Corporation Semiconductor device
DE102011082781B4 (de) * 2010-09-29 2016-07-07 Mitsubishi Electric Corp. Halbleitervorrichtung mit einer plattenelektrode zum verbinden einer mehrzahl an halbleiterchips
US10529656B2 (en) 2010-09-29 2020-01-07 Mitsubishi Electric Corporation Semiconductor device
DE102022207848A1 (de) 2022-07-29 2023-11-16 Vitesco Technologies Germany Gmbh Kontaktierungselement für Leistungshalbleitermodule, Leistungshalbleitermodul und Inverter mit einem Kontaktierungselement

Also Published As

Publication number Publication date
WO2003046988A2 (fr) 2003-06-05
EP1449252A2 (fr) 2004-08-25
WO2003046988A3 (fr) 2003-08-21
JP2005510877A (ja) 2005-04-21

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee