CN86105533A - 磁阻读出传感器 - Google Patents
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Abstract
一种磁阻读出传感器组件,由淀积在端区并与之直接接触的反铁磁性材料薄膜产生的互调偏置仅在磁阻层薄膜端区建立纵向偏置磁场。该场强足以保持此端区处于单磁畴状态,由此在磁阻层中心区感生出单磁畴状态。在磁阻层中心区建立偏置磁场,其场强足以保持该区处于线性响应工作状态。彼此隔开的导电元件与磁阻层中心区相连以确定探测区,于是与导电元件相连的信号输出装置可把探测区内磁阻层的电阻变化确定为其截获到的磁场的函数。
Description
本发明概括说来涉及到读出来自磁介质的信息信号的磁传感器,特别是涉及到一种改进型的磁阻读出传感器。
现有技术公开了涉及到磁阻(MR)传感器或探头的磁传感器,该传感器已表明具有从高线性密度能量的磁面读出数据的能力。MR传感器通过由磁阻材料制成的读出元件的电阻变化来检测磁场信号,其电阻的变化是该元件感测到的磁通强度及方向的函数。
现有技术还指明,为实现MR元件的最优工作状态,必须提供两个偏置场。一般提供一个横向偏置场对材料加磁偏置以使其对磁通的响应呈线性。该偏置场与磁介质平面垂直,与平面型MR元件的表面平行。
在现有技术中,另一个偏置场通常通过MR元件来施加,该磁场在工艺上称为纵向偏置场,它与磁介质面平行并沿着MR元件的长度方向。这个纵向偏置场的作用是抑制巴克豪森(Barkhausen)噪声,这种噪声起源于MR元件中多磁畴的活动性。
现已研究出了有数种用于MR传感器的磁场偏置方法和装置,它们既用了纵向偏置也用了横向偏置磁场,对满足现有技术要求,这些现有技术的磁场偏置方法及装置是有效的。然而这种使记录密度增加的努力已导致了要求精密的记录磁路并沿磁路增加了线性记录密度。由于需要对抗的偏置场,所以用现有技术不能制造出满足这些要求所需的小型MR传感器。一方面,纵向偏置场必须强得足以抑制磁畴,并且该偏置产生一个沿着MR元件的磁场。另一方面,横向偏置场与纵向场正交,于是纵向偏置场与横向偏置场以及横向数据信号相对抗。这种偏置磁场相对抗的结果是使MR传感器长期处于磁偏置,信号灵敏度将大大下降。高记录密度的应用要求非常高效率的输出,而用现有技术是无法达到这一要求的。
已知的美国专利3,887,944公开了一种并列的MR读出探头的集成阵列。为消除相邻的MR读出探头之间相互干扰,在相邻MR传感器之间安置了一个高矫顽磁性材料构成的区域。为制造这个高矫顽磁性材料区所讨论的几种方法之一是利用反铁磁性材料与MR传感器之间的互相耦合。然而,这种方法对于由耦合而得到互调偏置磁场的可能性,以及如果这种偏置场确实存在的话,该场的方向,及其得到互调偏置场后MR传感器的磁畴状态等问题都未加以考虑。
已知的美国专利4,103,315公开了一种方法,利用反铁磁性与铁磁性互调耦合来产生一个沿着整个MR传感器的均匀纵向偏置磁场以抑制磁畴。
现有技术没有提出一种仅在端区有纵向偏置场而在完成数据的实际探测的中心活动区有横向偏置场的MR传感器。
因此本发明的主要目的在于提出一种工艺技术以抑制MR传感器中的磁畴同时不损害传感器的灵敏度。依照本发明,磁阻(MR)读出传感器组件包括由磁性材料制成的MR导电层薄膜,并提供装置仅在MR层的端区产生纵向偏置场,该偏置场的场强足以保持MR层的端区处于单磁畴状态。MR层的中心区域承受的不是直接来自纵向偏置的场,而是通过沿MR层方向的静磁力以及互调耦合作用,由端区的单磁畴状态在MR层的中心区域感生出单磁畴状态。本发明提供装置至少在MR层中心区的部分区域产生横向偏置场,该偏置场的场强足以保持MR层的中心区域中加有横向偏置场的部分处于线性响应工作状态。将导电装置在中心区内连接到MR层上,用以限定探测区,以便连接到导电装置上的读出装置可以确定MR层探测区内电阻的变化,这种变化是由MR层感测到的磁场的函数。
在一个具体实施例中,制备了一层仅与MR层端区直接接触的反铁磁性材料薄膜,以便仅在MR层端区产生纵向偏置磁场,该场强度足以保持MR层端区处于单磁畴状态。制备了一层与MR层相平行但与该层有一定间隔的软磁性材料薄膜。电流源连接在导电装置上为组件提供了偏置电流,以便至少在MR层的中心区域的一部分上产生横向偏置磁场,而且此偏置场的强度足以保持MR层的这部分区域处于线性响应工作状态。
通过下面用附图对本发明的一个最佳实施例所做的更详细描述,本发明的前述目的和其它目的及其特征和优点将是显而易见的。
图1大略从概念上表明了依照本发明如何将纵向偏置场非均匀地加在MR层上。
图2简略表明了依照本发明的纵向偏置场的排列情况。
图3简略表明了依照本发明的MR层各区域之间的关系。
图4是本发明的一个MR读出传感器组件具体实施例的端视图。
图5是图4所示传感器的平面图。
图6是图4中沿6-6剖线所作的剖视图。
依照本发明制成的磁阻(MR)传感器的工作原理将借助于图1-3来描述。参考图1,依照本发明制成的磁阻传感器10被加有纵向以及横向偏置磁场,偏置的效果是使传感器具有最佳的灵敏度和边缘读出特性。但是偏置场是非均匀地加在MR传感器上的。用于抑制磁畴的纵向偏置磁场(HBL)仅仅施加在MR传感器10的端区12上,为达到线性响应工作状态而加的横向偏置场(HTB)至少施加到MR传感器10的中心区域14的一部分区域上。
可以采用任何在产生纵向偏置磁场技术中已知的适当方法来产生纵向偏置场。在附图表明的实施例中,纵向偏置磁场是用互调偏置法产生的,通过把反铁磁性层16做成一定的几何形状来产生互调偏置场,使该偏置场仅复盖住MR传感器10的端区12,结果仅有MR传感器10的端区12被互调偏置。反铁磁性层16在图1划斜线的区域16a处产生界面互调作用,其结果是使MR传感器10承受到有效的偏置磁场,且此偏置场指向纵方向以达到抑制磁畴的目的。从图2可以看出纵向偏置场的作用。如图2所示,该纵向偏置场沿着MR传感器一致指向右方,在该场作用下MR传感器10的端区12保持在单磁畴状态。然而MR传感器10的中心区域14受到的是来自纵向偏置场HBL的非直接作用,因此,MR传感器10的横向灵敏度没有明显的损失。在MR传感器10的端区12处排列一致的单磁畴状态对中心区14反方向磁畴的形成相当不利。因此,在MR传感器10的中心区14感生出如图2所示的单畴状态。
一旦纵向偏置场HBL建立起来,至少在MR传感器10的中心区14的部分区域上施加一横向偏置磁场,这个磁场的强度足以保持MR传感器10的中心区14那部分区域处于线性响应的工作状态。横向偏置磁场的建立可以通过分路偏置法、软磁性薄层偏置法或工艺上已知的永磁偏置法,以产生如图3所示的所需的磁矩M的转动,借助于在MR传感器10的中心区域14内与MR传感器相连的导电装置18、20,可把输出信号is连接到读出装置19上。is信号使读出装置能把上述中心区14内的探测区中电阻的变化确定为由MR传感器10截获的磁场的函数,例如由预先记录在磁介质上的数据来确定。导电装置18和20的内侧边缘之间的部分构成了感测输出信号的探测区。
最简单的结构是一种无护层的MR传感器。在这种结构中,由于来自记录下来的磁转变的信号磁通能在传感器的整个高度上进入传感器,所以线性记录密度通常很低。记录密度主要是被传感器的较小的实际高度限额所限制。为了改进线性记录密度,MR元件通常被安置在由软磁性材料制成的两个保护层的间隙中。
这样,我们可以看到,依照本发明制造的MR传感器以新颖的方式解决了现有技术在偏置方法及其结构方面所遇到的问题。本发明认为MR传感器可以分为两个区,一个是工作区,在这个区域内完成实际的数据探测,还有一个是端区。本发明进一步认为这两个区域应以不同的方式施加偏置磁场,纵向偏置场仅加在端区而横向偏置场加在工作区。只要纵向偏置场强度足以保持MR传感器10的端区12处于单磁畴状态,体现了本发明的传感器的信号性能受纵向偏置场强变化的影响就非常小。与此恰恰相反的是,用现有技术的传感器需要施加相互对抗的偏置磁场,由此对MR传感器信号性能产生重大影响,这种影响是由于纵向偏置场强的变化引起的。
本发明所依赖的前提是:端区处于单磁畴工作状态时,中心区是被迫成为单磁畴状态的。只要在纵方向上未加偏置的间隙区(LNLB)与MR传感器的高度相比不是太大的话,上述状态是确实存在的。
图3表明了纵方向未偏置的区域长度LNLB和横向偏置区长度LTB以及探测区长度LD之间的关系。这些长度之间的相互关系如下:
LNLB≥LTB≥LD是普遍成立的。同样,LTB≥LD和LLLB≥LD也是成立的。一般情况下LNLB和LTB不存在交叠,但是只要满足上述有关LD的条件,存在某些交叠是允许的。
当考虑抑制边缘读出的附加约束条件时,虽然LTB不应当大于LD,因为通常选择LD的大小基本上等于记录磁路的宽度,如果传感器在探测区LD外存在横向偏置场,会导致增加来自相邻磁路的边缘读出。同样明显的是LNLB也不应当大于LD,因为强的纵向偏置磁场使端区不受来自相邻磁路的信号的影响。结果,边缘读出会被抑制住。由这些考虑得到的结论是,为了获得最高的灵敏度同时最大限度地抑制边缘读出,最佳设计是LNLB=LTB=LD。
图4、5、6表示一个体现了本发明的MR读出传感器组件的具体实施例。参看图4,MR薄膜层10与反铁磁性薄膜层16之间具有紧密的电接触。在MR层10所复盖的区域内,薄膜层10与16产生互调偏置磁场,于是在端区12,MR层10受纵向偏置磁场的作用而处于单磁畴状态。在MR层10的另一面上,提供一种由软磁性材料薄膜层22组成的装置,用以产生横向偏置磁场,而层22与MR层10之间由薄隔层24隔开。制备层22的目的是在MR层10的中心区域14提供一个软磁性薄膜的横向偏置场。磁防护层26和28的作用是把杂散磁通的影响减至最小,杂散磁通会减小对重复信号的分辨力,用电气绝缘层30和32来使磁保护层与传感器组件的工作元件相绝缘。
图4中MR层10和反铁磁性层16所用材料的选择具有重要意义。对于MR层10,需要一种具有低的磁致伸缩性又有适当高的磁致电阻系数的软磁性材料。一般说来,需要非常薄的薄膜,因为膜愈薄则愈灵敏。然而在实际处理当中,薄层的厚度必须选择好以避免膜薄得难以控制其厚度和特性。厚度大约在200到500埃范围内的MR层10可以可靠地制备出来。在一个具体实施例中,选用透磁合金镍铁(NiFe)以适应上述应用的特殊要求。
层16的材料需选用一种材料,这种材料不仅在淀积于MR层上而且在制成薄膜的形式时均是反铁磁性的。并且该材料的奈耳(Neel)温度应大大高于读出传感器的工作温度。淀积反铁磁性层16是为了产生一个沿着传感器组件长度方向的单向偏置磁场。换言之,通过把MR-反铁磁性材料层加热到高于它的有序温度,然后在一个外加单向磁场中冷却,就能使该层材料建立起单向偏置磁场的方向。该层材料的厚度要足以进行可靠的加工,最低厚度大约是100埃最高为数百埃。在一个实施例中,选锰铁(MnFe)作为满足上述要求的材料。
图4中层22所需的软磁性薄膜材料的选择在建立软磁性膜的偏置磁场中具有重要意义。该材料必须具有高导磁率、高电阻率,以及材料本身没有明显的磁致电阻效应。高导磁率保证了在偏置源21电流适中的条件下就产生足够强的偏置磁场,高电阻率是为使信号的电学分流减至最小而需要的,为了避免信号响应和偏置磁场的抵消,需要该层材料具有比MR层10低的磁致电阻系数。这层软磁偏置层22的厚度通常为100埃到500埃,厚度选择以其达到磁饱和为准。为了选定MR层10与软磁偏置层22的厚度比值以产生符合确定角度的横向偏置磁场加在MR层的中心区14上,还必须考虑到MR层所用材料的性质。在一个实施例中,选择镍铁铑(Ni Fe Rh)作层22的材料以满足上述应用要求。
间隔层24的作用是在MR层10与软磁偏置层22之间造成物理间隙,为了形成反向磁化旋转,层间隙是必要的,间隔层24应当具有高的电阻率,不应扩散进层10或层22,还应具有易于淀积形成薄膜的特性。层24的厚度应尽量薄,但又要适于可靠地加工,如200埃左右。在一个实施例中,选用了钽(Ta)作该层材料,但是其它材料如三氧化二铝(Al2O3)或二氧化硅(Si2O2)也可应用。
制造磁敏电成读出传感器的方法不是本发明的内容。熟悉传感器技术的人都知道可以用任何已知的与制造集成电路芯片的工艺相类似的薄膜制造工艺来制造传感器。这些制造工艺包括在衬底上淀积薄膜层,以及使用适当的工艺技术,例如选择腐蚀和光刻技术来加工形成薄膜的形状。
虽然在这里具体参考了一个最佳实例描述和表明了本发明,但熟悉该领域技术的人都会理解到本发明可以有各种形式或细节的变化,但都没有离开本发明的真意和范围。
Claims (8)
1、具有用磁性材料制成的磁阻导电层的磁阻读出传感器组件,上述磁阻导电层具有被中心区域隔开的端区;
其特征在于:
具有仅在上述磁阻层的上述端区产生纵向偏置磁场的装置,该偏置场的强度足以保持上述磁阻层的上述端区处于单磁畴状态,由此在上述中心区域内感生出单磁畴状态;
具有至少在上述磁阻层的上述中心区的部分区域内产生横向偏置磁场的装置,该偏置场的强度足以保持上述磁阻层的上述加有横向偏置场的部分处于线性响应工作状态;以及具有在上述中心区域内与上述磁阻层相连接的导电装置,用以限定探测区,由此连接到导电装置的读出装置能够确定上述磁阻层探测区内电阻的变化,该变化是由上述磁阻层感测到的磁场的函数。
2、权利要求1的磁阻读出传感器组件,其中,上述磁阻层为镍铁(NiFe)。
3、权利要求2的磁阻读出传感器组件,其中,上述磁阻层的厚度范围在200~500埃。
4、权利要求1的磁阻读出传感器,其进一步的特征在于:
具有仅与上述磁阻层的上述端区直接接触的一个反铁磁性材料薄层,用以通过互调偏置仅在上述端区产生上述纵向偏置饰场。
5、权利要求4的磁阻读出传感器组件,其中上述反铁磁性材料薄膜为锰铁(MnFe)。
6、权利要求5的磁阻读出传感器组件,其中,上述反铁磁性材料薄膜的厚度范围在100~500埃。
7、权利要求1的磁阻读出传感器组件,其中,上述导电装置包括相隔一定间距的导电元件,并且上述探测区的范围由上述导电元件的边缘内侧所限定。
8、权利要求1的磁阻读出传感器组件,其中,上述未加纵向磁场偏置的磁阻层的范围、上述探测区,以及至少一部分施加了横向偏置磁场的上述中心区的尺寸基本相等。
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US06/766,157 US4663685A (en) | 1985-08-15 | 1985-08-15 | Magnetoresistive read transducer having patterned longitudinal bias |
US766,157 | 1985-08-15 |
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CN86105533A true CN86105533A (zh) | 1987-04-29 |
CN1008668B CN1008668B (zh) | 1990-07-04 |
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US (1) | US4663685A (zh) |
EP (1) | EP0216062B1 (zh) |
JP (1) | JPS6240610A (zh) |
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CN (1) | CN1008668B (zh) |
AR (1) | AR241464A1 (zh) |
AU (1) | AU579253B2 (zh) |
BR (1) | BR8603550A (zh) |
DE (1) | DE3672725D1 (zh) |
ES (1) | ES8801964A1 (zh) |
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-
1985
- 1985-08-15 US US06/766,157 patent/US4663685A/en not_active Expired - Lifetime
-
1986
- 1986-06-17 ES ES556133A patent/ES8801964A1/es not_active Expired
- 1986-06-18 JP JP61140399A patent/JPS6240610A/ja active Pending
- 1986-07-02 AU AU59493/86A patent/AU579253B2/en not_active Ceased
- 1986-07-22 EP EP86110054A patent/EP0216062B1/en not_active Expired - Lifetime
- 1986-07-22 DE DE8686110054T patent/DE3672725D1/de not_active Expired - Lifetime
- 1986-07-28 BR BR8603550A patent/BR8603550A/pt unknown
- 1986-07-30 CN CN86105533A patent/CN1008668B/zh not_active Expired
- 1986-07-31 KR KR1019860006295A patent/KR900008860B1/ko not_active IP Right Cessation
- 1986-08-07 IN IN641/MAS/86A patent/IN168073B/en unknown
- 1986-08-08 AR AR86304843A patent/AR241464A1/es active
-
1990
- 1990-09-29 SG SG798/90A patent/SG79890G/en unknown
- 1990-11-22 HK HK963/90A patent/HK96390A/xx not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1068690C (zh) * | 1994-05-04 | 2001-07-18 | 国际商业机器公司 | 磁致电阻磁头中的多层导线 |
CN111381196A (zh) * | 2018-12-28 | 2020-07-07 | Tdk株式会社 | 磁传感器装置 |
CN111381197A (zh) * | 2018-12-28 | 2020-07-07 | Tdk株式会社 | 磁传感器装置 |
CN111381196B (zh) * | 2018-12-28 | 2022-07-12 | Tdk株式会社 | 磁传感器装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1008668B (zh) | 1990-07-04 |
JPS6240610A (ja) | 1987-02-21 |
IN168073B (zh) | 1991-02-02 |
AU5949386A (en) | 1987-02-19 |
SG79890G (en) | 1990-11-23 |
KR900008860B1 (ko) | 1990-12-11 |
HK96390A (en) | 1990-11-30 |
EP0216062A1 (en) | 1987-04-01 |
US4663685A (en) | 1987-05-05 |
ES8801964A1 (es) | 1988-03-01 |
BR8603550A (pt) | 1987-03-04 |
ES556133A0 (es) | 1988-03-01 |
AU579253B2 (en) | 1988-11-17 |
EP0216062B1 (en) | 1990-07-18 |
DE3672725D1 (de) | 1990-08-23 |
AR241464A1 (es) | 1992-07-31 |
KR870002551A (ko) | 1987-03-31 |
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