CN2882205Y - Adhesive sheet contact thermal conduction type heat pipe radiator - Google Patents
Adhesive sheet contact thermal conduction type heat pipe radiator Download PDFInfo
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- CN2882205Y CN2882205Y CN 200520146938 CN200520146938U CN2882205Y CN 2882205 Y CN2882205 Y CN 2882205Y CN 200520146938 CN200520146938 CN 200520146938 CN 200520146938 U CN200520146938 U CN 200520146938U CN 2882205 Y CN2882205 Y CN 2882205Y
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Abstract
The utility model provides a thermotube radiator by conducting heat through a thin contact surface for electric and electronic field, which makes improvement in dimensions and functions of parts of a conventional thermotube, so as to improve the heat radiation capacity of a thermotube radiator. The utility model employs the heat-absorbing end and heat-radiation end of a section-variable cavity thermotube, adopts a thin metallic surface as the contact face between the heat-absorbing cavity and a heat-radiation surface of electronics, so as to reduce the metallic thermal resistance of the contact face. In addition, the inner surface of the cavity of the thin metallic surface is roughened to improve the ebullition feature of the work media. And the inner surface is expanded to increase the ebullition surface. The thermotube section at the heat-radiation end is integrated with the fins, and the inner surface of the expanded inner surface of the thermotube section is roughened. And cooling strength is enhanced by connecting heat radiation ends in parallel way. By above improvements and the design of the delivery section of the thermotube, the heat radiation capacity of the thermotube radiator is greatly improved; hence the operation performance of the electronics is improved.
Description
Technical field
The utility model relates to a kind of large scale integrated circuit or large-capacity power electronics radiator, especially a kind of employing heat pipe and reduce the metal heat-conducting thermal resistance, and the integrated circuit with quick heat radiating effect is with fit sake thermal contact conductance formula heat-pipe radiator.
Background technology
In recent years, the electronic technology develop rapidly, the capacity maximization of the high frequency of electronic device, high speed and integrated circuit and the miniaturization of volume also rapidly increase the caloric value of electronic device unit are.The normal range of operation of electronic device is generally-5 ℃-65 ℃, surpasses this scope, and element stability descends, and performance also significantly descends, and has also just influenced whole system operation stability.Have data to show, single semiconductor element temperature raises 10 ℃, and the reliability of system reduces by 50%, thereby development of electronic technology needs good heat dissipation to guarantee.This heat dissipation requires to have high radiating rate, compactedness, reliability, flexibility and condition such as non-maintaining.In recent years, the basic demand of above-mentioned electronic equipment has been satisfied in the application of hot pipe technique to a certain extent.
Application and development of computer along with heat pipe, the heat that computer CPU produces has reached the above level of 120W/cm2, and the heat radiation power of relevant large power, electrically sub-element reaches the level of 6000W, therefore, need opposite heat tube technology and performance that these are new propose new requirement again, need heat pipe that stronger heat-sinking capability and speed are arranged.
By analyzing the structure of heat-pipe type radiator, can see, the simple structure that adopts the circular pipe type heat pipe to connect heat absorbing end metal and radiating segment, though it is simple in structure, easy to make, cost is also lower, this is the reason that heat-pipe type radiator is applied, but the technical problem underlying that exists is: heat pipe is taken as the part of radiator, therefore, in the entire heat dissipation link, exist many subrings joint as: electronic device is to the heat radiation of connector (mainly being metal), connector is to the heat radiation of heat pipe heat-absorbing section, heat pipe has length and the heat transfer of formation from the endotherm section to the radiating segment itself, the heat pipe heat radiation section is to the heat radiation to air heat radiation shaft of rib, and the air radiator is to the heat radiation of air.In above-mentioned each subring joint, the heat pipe of quick heat radiating and other link can not be mated, there is bigger metal thermal resistance between the metal of heat radiation circular pipe type metal heat pipe and contact, compare with heat pipe with flash heat transfer ability, contact heat resistance between formation metal in the radiator itself and the metal has become the main thermal resistance of heat radiation process, and the method for therefore improving this integral heat sink process thermal resistance is to reduce above-mentioned two kinds of thermal resistances.
Research according to the heat pipe structure of present routine and the property improved structure, there have been some to overcome the technology of above-mentioned technical characterstic, improved cavity type heat pipe or separated heat pipe have occurred, the radiating rate of heat-pipe radiator has been improved on top to a certain degree, has improved the reliability of equipment operation.But on present product result, the needs of electronic device opposite heat tube heat radiation are not also objectively satisfied in above-mentioned improvement, that is to say that above-mentioned improvement only is the pro forma improvement of heat-pipe radiator, does not have too big effect for influencing radiator itself.It is inconsiderate to the thickness of all multifactor particularly metal material that influences metal heat-conducting that its main cause is present product design; In addition in the adopting heat pipes for heat transfer influencing factor, the surface texture of the material that inside heat pipe contacts with working media well do not considered, causes utilizing the radiator of heat pipe can not satisfy the radiating requirements of electronic device.
In sum, the radiator that exploitation has higher radiating rate and effect is effective assurance of making the electronic equipment of large scale integrated circuit and the operation of Large-power High-Speed degree at present, also is that industry is badly in need of one of key issue that solves.
Technical essential
Utility model technical problem to be solved is to overcome present electric power and the existing problem of electronic radiation device, promptly, provide a kind of novel heat pipe radiator of heating electronic component at manufacturing fields such as present power electronics and semiconductor high-efficiency radiator and can't improve the operating frequency speed of electronic component and chip etc. and real current situation such as power output for want of.This radiator is in conjunction with the heat conduction theory of thermal conduction study and the principle of adopting heat pipes for heat transfer, and the heat that electronic devices and components are produced transmits and be dispersed into atmosphere fast, guarantees that high-power electronic component is in normal operating temperature range.Compare with the heat-pipe radiator of relevant same apparent size, have bigger radiating rate and effect.
Problem to be solved in the utility model is achieved through the following technical solutions:
A kind of fit sake thermal contact conductance formula heat-pipe radiator comprises heat absorbing end, radiating end and liquid evaporation and backflow feed tube three parts.
Heat absorbing end be with the evaporation section of conventional heat pipe be connected unite two into one a distortion cavity body of body of metal, the one side that contacts with electronic component of this cavity body is to match with the electronical elements surface shape and can form fit foil, foil with and very thin with the adhesive surface of electronic component, thereby reduce contact heat resistance significantly.
Radiating end be heat pipe heat radiation section and heat radiating metal body unite two into one or the two link together form, heat absorbing end is to realize whole the connection by the liquid evaporation between the two with carrying return duct with being connected of radiating end, form the broad sense integrated thermal thus or become heat-pipe type radiator, cavity is filled with the heat transfer medium of heat pipe work.
Heat absorbing end is cohered the surface at heat-generating electronic elements, to draw the heat radiation of electronic component.The heat of being drawn is transported to the radiating segment cooling with the working media vaporization through the liquid evaporation pipe, and is condensed into liquid, carries the resorption hot junction through feed tube again.Working medium has realized that in the vaporization heat absorption and the condensation cooling procedure of diverse location electronic component is by means of the remote of heat pipe and high strength heat radiation.
Generally speaking, evaporation of liquid is realized by single tube that with conveying during for assurance work, gaseous working medium can arrive radiating end as early as possible, can increase the quantity of evaporation tube or the internal diameter of increase evaporation tube.For making liquid refrigerant can get back to heat absorbing end, when using single evaporation tube to realize liquid return, the evaporation tube inner surface is established backflow wick or capillary; When using liquid return feed tube independently, can adopt delivery pump to quicken to arrive the backflow of heat absorbing end liquid.
In the technical program, used structure bonds together thin metal covering and the electronic material that needs heat radiation for adopting the fit method of thin metal, reduces the thickness of adhesive linkage, overcome the thermal resistance of adhesive linkage between the electronic material of heat pipe metal and heat radiation like this, effectively.
In the used structure,, do the improvement design of 2 aspects in order to strengthen the heat transfer of the thin metal pair heat-pipe medium of endotherm section, the one,, to approach the heat dissipation metal surface and carry out coarse processing, improve this surperficial roughness, to reach the best heat-transfer effect that can form nucleate boiling with used medium;
The 2nd,, at the heat-delivery surface of thin metal, metal bar or the ball strong by the welding capacity of heat transmission form the effect that has increased cooling surface area, reach the effect that strengthens heat-sinking capability.
At radiating end, heat pipe and radiating fin are combined into one, form the heat pipe-type fin, opposite heat tube formula fin carries out following improvement simultaneously, and the expansion of (1) inner surface size forms the expansion of surface area; (2) inner surface is carried out the concave-convex surface processing, carry out chemical treatment simultaneously, be beneficial to the rapid condensation of medium; (3) the in parallel or series connection with a plurality of radiating fins is to increase heat-sinking capability.
By above technical scheme as can be known, the utility model mainly is by adopting fit foil to do the bonding plane of heat absorbing end and electronic material, reducing the thermal resistance of adhesive linkage and this Metal Contact face; Simultaneously,, have better heat transfer property, adopt the method that increases the metallic interior surface roughness, make fluid working substance be easy to form nucleate boiling in order better to make fluid working substance in heat absorbing end; Simultaneously,, increase the boiling heat transfer area of inner surface, reach the effect that reduces the boiling heat transfer thermal resistance at high metal bar or the ball of metallic interior surface welding conductive coefficient.And, also there are enlarged metal inner surface, surface to carry out technical applications such as roughened and close dielectric surface processing in the metallic interior surface of radiating segment.
The utility model has farthest been brought into play the high characteristics of adopting heat pipes for heat transfer performance, makes the radiating rate of heat-pipe radiator improve greatly, makes large scale integrated circuit for exploitation, and high power electronic equipment has been established technical foundation; Simultaneously, because liquid evaporation and backflow delivery tube and shape can conveniently be regulated, convenient installation in electric power and electronic equipment internal has great practical value.
Marginal data
Fig. 1 exemplary embodiments structure of the present utility model
This novel structural representation that is used for the electronic radiation device of Fig. 2
Fig. 3 the utility model one has the enforcement structural representation of preferable result of implementation
Another has the enforcement structural representation of preferable result of implementation Fig. 4 the utility model
One of the radiating end embodiment with preferable result of implementation in Fig. 5 the utility model
Another of radiating end has the embodiment of preferable result of implementation in Fig. 6 the utility model
Embodiment
Below pass through specific embodiment, and in conjunction with the accompanying drawings the utility model is described further.
Fig. 1 is the exemplary embodiments that the utlity model has preferable result of implementation, its principal character be with the contacted heat-absorbent surface 1 of radiator be thin metal covering, other parts of cavity body 2 are metal plate type or the shell structure with certain compression strength.Constitute the heat absorbing end of heat radiation heat pipe by other parts of heat-absorbent surface with thin metal and cavity body.Constitute this novel heat pipe heat radiation end by heat pipe heat radiation terminal 4 and radiating fin 5.Heat absorbing end, heat pipe liquid evaporation and backflow transportation section 3 and radiating end constitute the heat-pipe radiator with heat sinking function.
Because be in negative pressure state in the heat absorption cavity, all surface of heat absorbing end bears external atmospheric pressure, therefore, needs metal to have certain thickness, to keep certain intensity and rigidity; And to bearing the metal covering of heat exchange, can particular design become sake, satisfying the requirement of heat transfer rate, and its needed rigidity and intensity are cohered by the high strength of cohering glue and electronic device and are finished jointly, reach existing high heat-transfer intensity, the advantage of structural strength and rigidity is arranged again.
Fig. 2 is the enforcement structure example with preferable implementation result of the present utility model, radiator and electronic equipment or components and parts 6 bond together by cohering glue 7, electronic devices and components institute caloric value is passed heat absorption metal sake 1 by cohering glue 7, metal sake 1 makes the working media vaporization owing to temperature raises, thereby heat is dispersed into heat absorbing end cavity 2, the vaporization medium spreads rising pyrogenicity pipe radiating end in heat pipe, influenced by extraneous heat radiation and become liquid at the heat pipe heat radiation end in the condensation of radiating end inner surface, this liquid is surperficial because gravity or capillary effect along heat pipe, and flow to heat absorbing end, form circulating of medium, this actuating force that circulates is exactly the heat that is provided by cooling electronic component.
Fig. 3 is that this new application is in the embodiment that concavo-convex electron surface is arranged, in this programme, because used metal material is very thin, be beneficial to the profile variation of metal, being beneficial to the overall dimension that makes metal combines closely mutually with the outer surface of electronic devices and components, thereby reduce the thickness of adhesives, reduce the thermal resistance of adhesive linkage;
Heat pipe heat absorbing end of the present utility model has different forms of implementation, promptly the metal sake inner surface except structure shown in Figure 1 is the normal optical face, another has the enforcement structural representation of preferable result of implementation to Fig. 4 for the utility model, and promptly the heat absorption surface increases the structural representation of rough surface processing and metal bar or ball.For further improving the vaporization effect of metal foil in the face of working media, inner surface in the metal sake adopts the method that improves surface roughness, form rough surface 8, make working media under design temperature, can easier formation nucleate boiling, thus the boiling heat transfer thermal resistance of this metal surface further reduced; In thin coarse metal bar or the Metal Ball 9 of metallic interior surface face of weld, improve the effective surface area of this metal surface liquid boiling simultaneously, further improve the speed of conducting heat, reduce the thermal resistance of boiling heat transfer process; In actual engineering, such scheme can be implemented separately, also can Joint Implementation.
In embodiments, because the raising of heat-transfer intensity, the quantity of heat pipe and the size of heat pipe can be done suitable design, when adopting the little heat pipe of size, can be with many heat pipes, and the heat of required transmission is in time spread out of; When size allows, also can adopt the method that strengthens heat pipe sizes to realize.In this programme, establish capillary pipe structure or wick in allowing during heat pipe design itself, also can adopt the mode of independent design return duct, as required, adopt single or many return ducts, simultaneously, for, strengthen back-flow velocity, satisfy big capacity heat transfer actual needs, can adopt delivery pump, realize that big the backflow needs.
For radiating end part of the present utility model, similar to heat absorbing end embodiment characteristics, radiating end also has different forms of implementation.
In this programme, in order to reduce the contact heat resistance of heat pipe condensation end and radiating fin metal, with the root of the terminal 4 condensation location arrangements of the heat pipe of radiating end to radiating fin 5, radiating fin and heat pipe are united two into one, structure shown in Figure 5 is the structure chart that the utlity model has preferable result of implementation.For enlarging heat-sinking capability, this heat pipe heat radiation fin size is enlarged, be about to the heat pipe inwall and be expanded to the radiating fin root; Simultaneously,, take parallel way,, form the heat pipe heat radiation fin of a plurality of parallel connections, thereby improve the integral heat sink ability of heat pipe by the evaporation of different radiating segment heat pipes is in parallel with the backflow feed tube for arrangement convenience.
In the present embodiment, for further improving the heat pipe heat radiation ability, to the different embodiment of doing of heat radiation heat pipe inner surface, Fig. 6 is this novel improvement effect hint effect of terminal 4 inner surfaces that dispel the heat being done different forms of implementation in actual applications: rough inner surface is rolling 11, coarse to grind 10, irregular compacting 10 and close solute Treatment of Metal Surface.Above-mentioned different form can be used to improve the performance of condensing of inner surface medium, accelerates condensation process, improves condensation heat transfer speed, thus the whole heat-sinking capability that improves.
Claims (8)
1. a fit sake thermal contact conductance formula heat-pipe radiator is characterized in that it comprises: heat absorbing end, radiating end and liquid evaporation that is connected the two in the centre and backflow feed tube;
Described heat absorbing end is the distortion cavity body, and thin sheet metal is adopted on the surface that is connected with electronic device, sees through to cohere glue and electronic device coheres, and the link position of heat pipe is positioned at this cavity body geometric position peak; Described radiating end is the radiator that the root of band radiated rib has cavity structure; The link position of heat pipe is positioned at how much extreme lower positions of radiating end.
2. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: the face that heat absorbing end is connected with electronic device is a foil, below the thickness 1.0mm, its overall dimension and surface structure form determine with the appearance according to electronic device;
3. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: the thin metal material of heat absorbing end and electronic device appearance joint face has good thermal conductivity, based on copper, aluminium, steel, also can have the metal of suitable performance with other;
4. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: the thin metal cavitg inner surface that heat absorbing end is connected with electronic device has the surface roughening processing layer.
5. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: thin metal cavitg inner surface weld metal rod or metal tube that heat absorbing end is connected with electronic device, this metal bar or metal tube are the metal materials with good heat conductive performance, and material therefor such as copper, aluminium, steel etc. and sake have the material of good welds performance;
6. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: radiating end is that the radiated rib root has hollow-core construction, can run through with heat pipe to be unitary whole formula radiator structure; Simultaneously, more than one radiating end is connected by mode in parallel or series connection
7. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: radiating end heat pipe inner surface has the geometry and the physical characteristic on surfaces such as the combination of smooth surface, rough surface, convex-concave surface, general close and distant liquid refrigerant characteristic, lyophily attitude working medium or above feature.
8. according to claim 1 described a kind of fit sake thermal contact conductance formula heat-pipe radiator, it is characterized in that: liquid evaporation and backflow feed tube can be one or several, for the liquid return feed tube of independent setting,, also liquid delivery pump can be set for strengthening liquid return speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520146938 CN2882205Y (en) | 2005-12-28 | 2005-12-28 | Adhesive sheet contact thermal conduction type heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520146938 CN2882205Y (en) | 2005-12-28 | 2005-12-28 | Adhesive sheet contact thermal conduction type heat pipe radiator |
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| Publication Number | Publication Date |
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| CN2882205Y true CN2882205Y (en) | 2007-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520146938 Expired - Fee Related CN2882205Y (en) | 2005-12-28 | 2005-12-28 | Adhesive sheet contact thermal conduction type heat pipe radiator |
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| CN (1) | CN2882205Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105706541A (en) * | 2013-10-29 | 2016-06-22 | 保力马科技(日本)株式会社 | Liquid-filled heat dissipation member |
| CN106885485A (en) * | 2017-02-25 | 2017-06-23 | 长沙理工大学 | Hot end variable cross-section multi-pulsation cold end heat pipe radiator |
| CN107548261A (en) * | 2016-06-27 | 2018-01-05 | 上海奇谋能源技术开发有限公司 | A kind of method for improving radiator heat-dissipation efficiency |
| CN114234689A (en) * | 2021-11-25 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Enhanced boiling heat exchange structure and temperature-equalizing plate |
-
2005
- 2005-12-28 CN CN 200520146938 patent/CN2882205Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105706541A (en) * | 2013-10-29 | 2016-06-22 | 保力马科技(日本)株式会社 | Liquid-filled heat dissipation member |
| US10356944B2 (en) | 2013-10-29 | 2019-07-16 | Sekisui Polymatech Co., Ltd. | Liquid-encapsulation heat dissipation member |
| CN107548261A (en) * | 2016-06-27 | 2018-01-05 | 上海奇谋能源技术开发有限公司 | A kind of method for improving radiator heat-dissipation efficiency |
| CN106885485A (en) * | 2017-02-25 | 2017-06-23 | 长沙理工大学 | Hot end variable cross-section multi-pulsation cold end heat pipe radiator |
| CN114234689A (en) * | 2021-11-25 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Enhanced boiling heat exchange structure and temperature-equalizing plate |
| CN114234689B (en) * | 2021-11-25 | 2023-09-01 | 苏州浪潮智能科技有限公司 | Enhanced boiling heat exchange structure and temperature equalization plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070321 Termination date: 20100128 |