CN1967437A - radiator - Google Patents
radiator Download PDFInfo
- Publication number
- CN1967437A CN1967437A CN 200510101499 CN200510101499A CN1967437A CN 1967437 A CN1967437 A CN 1967437A CN 200510101499 CN200510101499 CN 200510101499 CN 200510101499 A CN200510101499 A CN 200510101499A CN 1967437 A CN1967437 A CN 1967437A
- Authority
- CN
- China
- Prior art keywords
- heat
- pedestal
- heating radiator
- conducting piece
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heating radiator comprises a base touched with heat source, and a number of the first-level radiating fins upwardly-extending from the said base, and a heat-transfer element connected with the base for heat conduction and the first-level radiating fins lining up beside the two-side of the heat-transfer element, and a number of the second-level radiating fins extending from the contrary two-side of the heat-transfer element and perpendicular to the first-level radiating fins, and a heat pipe connecting the said base and the said heat-transfer element in order to transfer heat from the former to the latter. The invention mounts two set perpendicular radiating fins, so the smaller size of radiating fins turns into the bigger radiating area as a whole, and it increases the efficiency of the single radiating fins to improve the radiating performance.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly relate to a kind of heating radiator that is used on the electronic component.
[background technology]
Heating radiator has become a requisite configuration of the electronic component of golf calorific values such as central processing unit, and along with the sustained and rapid development of integrated circuit technique, the function of electronic component from strength to strength, performance also constantly promotes, correspondingly the heat of its generation is also more and more.And one efficiently heating radiator be very important to the normal operation that guarantees electronic component, in order timely and effectively electronic component to be dispelled the heat, the heating radiator of various structures also so constantly is devised.
A kind of typical aluminium extruded type heating radiator generally includes a dull and stereotyped pedestal, and this base bottom surface is in order to contact heat absorption with electronic component, and the end face one vertically extends several dissipation fins, and this heating radiator absorbs heat by pedestal and passes to radiating fin and outwards distribute.For improving the heat-sinking capability of this heating radiator, simple principle is to increase area of dissipation, the most direct way is exactly the size that increases radiating fin, but because the restriction that aluminium extruded is made, just very easily distortion or fracture of fin when the depth-width ratio of fin surpasses certain proportion (normally 13: 1), therefore increasing the fin area just needs to increase accordingly simultaneously fin pitch, makes that therefore the radiating fin quantity under the equal volume reduces, and overall area of dissipation does not significantly increase.On the other hand, excessive size can cause the utilization factor of fin to reduce, especially fully outwards dispel the heat less inadequately because of being heated away from the fin marginal portion of pedestal, therefore the heating radiator of large volume has taken inside computer system more space resource, but heat dispersion does not obtain the lifting of respective degrees.
[summary of the invention]
In view of this, be necessary to provide a kind of heating radiator that can small size obtains preferable heat dispersion.
A kind of heating radiator comprises a pedestal and most by upwardly extending first radiating fin of this pedestal, one heat-conducting piece is located on the pedestal and first radiating fin is respectively in this heat-conducting piece both sides, most second radiating fins by the relative two sides of this heat-conducting piece along extending perpendicular to the direction of first radiating fin.
In addition, thus a heat pipe connects said base and heat-conducting piece reaches heat-conducting piece with heat fast by pedestal.
Compared with prior art, this heating radiator is established fin that at least two groups vertically extend and has been changed to increasing area of dissipation and make fin increase the problem that heat dispersion that size causes can not respective degrees ground promotes to single direction.The entire heat dissipation device is outwards dispelled the heat by the fin of two groups of different trends, and overall heat dispersion is promoted.
Heat pipe will be reached heat-conducting piece apace and then reach second radiating fin by the heat that pedestal absorbs, accelerated the transmission speed of heat in heating radiator, so radiating rate is accelerated.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
[description of drawings]
Fig. 1 is the stereographic map of heating radiator preferred embodiment of the present invention.
Fig. 2 is the front elevation of Fig. 1.
Fig. 3 is the three-dimensional exploded view of Fig. 1.
[embodiment]
Heating radiator of the present invention is in order to central processing unit, integrated circuit (IC) chip heat-generating electronic elements such as (figure do not show) are dispelled the heat.
Seeing also Fig. 1 and Fig. 2, is the preferred embodiment of heating radiator of the present invention.This heating radiator comprises a pedestal 10 that absorbs heat in order to contact with electronic component, most first parallel radiating fins 15 are extended by these pedestal 10 upper surfaces, one heat-conducting piece, 20 vertical fixing are on this pedestal 10, most second radiating fins 25 are extended by heat-conducting piece 20, and a C shape heat pipe 30 connects pedestal 10 and heat-conducting piece 20.
See also Fig. 3, these pedestal 10 rectangular tabulars, have a bottom surface and an end face, this bottom surface forms a teat 12 in order to the heat absorption of contact electronic component, the end face middle part is formed with a groove 11,10 4 jiaos of levels of this pedestal are outward extended with four ears 16, can pass heating radiator is fixed on the circuit board (circuit board) for the screw element 40 that is arranged with spring.Above-mentioned first radiating fin 15 is vertically extended by pedestal 10 end faces, forms most first gas channels therebetween.Thereby heat-conducting piece 20 vertical fixing are respectively in this heat-conducting piece 20 both sides in above-mentioned first radiating fin 15 in pedestal 10 end faces middle part, the groove 11 of corresponding pedestal 10 end faces in these heat-conducting piece 20 bottoms also is provided with corresponding groove 21, and the groove 11,21 of this two correspondence is formed a tubular conduit.This heat-conducting piece 20 is parallel with first radiating fin 15 and than first radiating fin, 15 height, second fin 25 is oppositely extended by heat-conducting piece 20 two sides levels above first radiating fin 15, this second fin 25 is parallel to pedestal 10 and perpendicular to first radiating fin 15, has also formed most second gas channels therebetween.
This heat pipe 30 comprises an evaporation part 31, and it is contained in the passage between above-mentioned heat-conducting piece 20 and the pedestal 10 and contacts with the two heat conductivity; One is parallel to the condensation part 33 of evaporation part 31, and it is placed through in the groove 22 on heat-conducting piece 20 tops; One heat transfer part 32 connects evaporation part 31 and condensation part 33.
This heat sink applications is when heat-generating electronic elements, the teat 12 contact electronic components of pedestal 10 bottom surfaces absorb heat, part heat directly outwards distributes to being uploaded to first radiating fin 15, all the other heats are then up along heat-conducting piece 20,30 of heat pipes make heat directly reach heat-conducting piece 20 tops, heat, is outwards distributed to 25 conduction of second radiating fin by heat-conducting piece 20 again.
The pedestal 10 of this heating radiator can be one-body molded by the aluminium extruded processing mode with heat-conducting piece 20 and first, second fin 15,25, and heat pipe 30 is by welding manner combination with it.
In an embodiment of the present invention, because first, second radiating fin 15,25 vertically extends to different directions, needn't make single fin be disabled the increase of rate ground for increasing area, the utilization factor of fin each several part improves, and can obtain overall area of dissipation greatly by single reduced size fin.Because making, this structure do not need single fin that excessive size is arranged for promoting heat dispersion, if so adopt the aluminium extruded moulding, can overcome the restriction on making, compare, all have a distinct increment on the manufacturing feature and on the heat dispersion with aluminium extruded type heating radiator with volume.
Claims (10)
1. heating radiator, comprise a pedestal, be extended with most first radiating fins on it, it is characterized in that: a heat-conducting piece is fixed on the pedestal and these heat-conducting piece both sides of the first radiating fin apportion, and most second radiating fins are extended with the first radiating fin vertical direction by edge, heat-conducting piece two sides.
2. heating radiator as claimed in claim 1 is characterized in that: also comprise a heat pipe, it connects pedestal and heat-conducting piece.
3. heating radiator as claimed in claim 2 is characterized in that: described heat pipe is c-shaped, comprises an evaporation part that is connected with pedestal, and condensation part that with heat-conducting piece be connected and the two a conducting part parallel with the evaporation part.
4. heating radiator as claimed in claim 3 is characterized in that: described heat pipe evaporation part is folded between pedestal and the heat-conducting piece, and the condensation part is placed through on the heat-conducting piece position away from pedestal.
5. heating radiator as claimed in claim 1 is characterized in that: described first radiating fin is perpendicular to pedestal, and second fin is parallel to pedestal.
6. heating radiator as claimed in claim 5 is characterized in that: described first radiating fin vertically extends from pedestal, and second fin extends from heat-conducting piece two opposite lateral vertical.
7. heating radiator as claimed in claim 1 is characterized in that: described pedestal, heat-conducting piece, first and second fin are processed one-body molded by aluminium extruded.
8. heating radiator as claimed in claim 1 is characterized in that: described heat-conducting piece combines with pedestal by welding manner.
9. heating radiator as claimed in claim 1 is characterized in that: described first radiating fin extends between the pedestal and second fin.
10. heating radiator as claimed in claim 1 is characterized in that: described heat-conducting piece parallels with first radiating fin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101014996A CN100561399C (en) | 2005-11-16 | 2005-11-16 | Heating radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101014996A CN100561399C (en) | 2005-11-16 | 2005-11-16 | Heating radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1967437A true CN1967437A (en) | 2007-05-23 |
CN100561399C CN100561399C (en) | 2009-11-18 |
Family
ID=38076243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101014996A Expired - Fee Related CN100561399C (en) | 2005-11-16 | 2005-11-16 | Heating radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100561399C (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102006761A (en) * | 2009-08-28 | 2011-04-06 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN102724849A (en) * | 2012-06-01 | 2012-10-10 | 加弘科技咨询(上海)有限公司 | Heat-radiating system, heat-radiating device and heat-radiating fin base thereof |
CN101839658B (en) * | 2009-03-20 | 2012-12-26 | 富准精密工业(深圳)有限公司 | Heat sink |
CN103517616A (en) * | 2012-06-27 | 2014-01-15 | 富瑞精密组件(昆山)有限公司 | Electronic device |
WO2017117937A1 (en) * | 2016-01-04 | 2017-07-13 | 中兴通讯股份有限公司 | Heat dissipation device for chip |
WO2018214096A1 (en) * | 2017-05-25 | 2018-11-29 | 罗伯特·博世有限公司 | Cooling device |
CN113556916A (en) * | 2020-04-26 | 2021-10-26 | 台达电子企业管理(上海)有限公司 | Data processing apparatus |
-
2005
- 2005-11-16 CN CNB2005101014996A patent/CN100561399C/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101839658B (en) * | 2009-03-20 | 2012-12-26 | 富准精密工业(深圳)有限公司 | Heat sink |
CN102006761A (en) * | 2009-08-28 | 2011-04-06 | 富准精密工业(深圳)有限公司 | Heat radiator |
CN102724849A (en) * | 2012-06-01 | 2012-10-10 | 加弘科技咨询(上海)有限公司 | Heat-radiating system, heat-radiating device and heat-radiating fin base thereof |
CN103517616A (en) * | 2012-06-27 | 2014-01-15 | 富瑞精密组件(昆山)有限公司 | Electronic device |
CN103517616B (en) * | 2012-06-27 | 2017-04-19 | 富瑞精密组件(昆山)有限公司 | Electronic device |
WO2017117937A1 (en) * | 2016-01-04 | 2017-07-13 | 中兴通讯股份有限公司 | Heat dissipation device for chip |
WO2018214096A1 (en) * | 2017-05-25 | 2018-11-29 | 罗伯特·博世有限公司 | Cooling device |
CN113556916A (en) * | 2020-04-26 | 2021-10-26 | 台达电子企业管理(上海)有限公司 | Data processing apparatus |
CN113556916B (en) * | 2020-04-26 | 2023-02-28 | 台达电子企业管理(上海)有限公司 | Data processing apparatus |
US12094802B2 (en) | 2020-04-26 | 2024-09-17 | Delta Electronics (Shanghai) Co., Ltd | Data processing device |
Also Published As
Publication number | Publication date |
---|---|
CN100561399C (en) | 2009-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1851910A (en) | Heat-pipe radiating apparatus | |
CN1889254A (en) | Heat pipe radiating device | |
CN100499977C (en) | Heat sink | |
CN1967437A (en) | radiator | |
CN1925733A (en) | Heat pipe radiator | |
CN101312634A (en) | Heat radiating device | |
CN205693973U (en) | A kind of pcb board assembly | |
CN1855456A (en) | Heat pipe radiator | |
CN101287347A (en) | Heat pipe radiating device | |
CN101115368A (en) | Heat radiating device | |
CN2729902Y (en) | Heat sink device | |
CN2757329Y (en) | Heat radiator | |
CN102819302A (en) | Radiator | |
CN101420834B (en) | Heat Radiation device | |
CN101539792B (en) | Heat dissipating device | |
CN101076236A (en) | Radiator | |
CN2681343Y (en) | Heat sink using heat pipe | |
CN108419416A (en) | A kind of high heat dissipation capacity heat-pipe radiator of IGBT | |
CN208487601U (en) | A kind of radiator for high-power LED light source | |
CN2882205Y (en) | Adhesive sheet contact thermal conduction type heat pipe radiator | |
CN2785322Y (en) | Heat radiator | |
CN2800716Y (en) | Heat radiator | |
CN2909797Y (en) | Heat sink | |
CN2658944Y (en) | Heat sink | |
CN204090421U (en) | The radiator of electronic device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091118 Termination date: 20131116 |