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CN222440565U - Position adjustment assembly and laminating device - Google Patents

Position adjustment assembly and laminating device Download PDF

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Publication number
CN222440565U
CN222440565U CN202420274334.7U CN202420274334U CN222440565U CN 222440565 U CN222440565 U CN 222440565U CN 202420274334 U CN202420274334 U CN 202420274334U CN 222440565 U CN222440565 U CN 222440565U
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CN
China
Prior art keywords
centering
accommodating
adjusted
supporting
position adjustment
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CN202420274334.7U
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Chinese (zh)
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请求不公布姓名
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Wuxi Xianwei Technology Co ltd
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Wuxi Xianwei Technology Co ltd
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Priority to CN202420274334.7U priority Critical patent/CN222440565U/en
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Abstract

本实用新型公开一种位置调整组件及合片装置,所述位置调整组件包括:承托结构,其包括至少两个相对固定的第一承托部;第一承托部包括水平设置的第一承托表面及凸出第一承托表面设置的第一止挡部,第一止挡部限定出一个第一容置部,第一容置部包括用以容置第一待调整件的容置空间;对心结构,其具有第一对心部;第一对心部的上表面至少部分高于第一承托表面,第一对心部的下表面至少部分低于位于第一承托表面的第一待调整件的高度;移动平台,其包括至少一个移动路径;移动平台能够带动承托结构和对心结构的之一沿移动路径向承托结构和对心结构的另一移动;移动平台位于移动路径的终点时,第一对心部至少部分位于第一容置部的容置空间内。

The utility model discloses a position adjustment component and a piece-closing device, the position adjustment component comprising: a supporting structure, which comprises at least two relatively fixed first supporting parts; the first supporting part comprises a horizontally arranged first supporting surface and a first stop part protruding from the first supporting surface, the first stop part defines a first accommodating part, the first accommodating part comprises an accommodating space for accommodating a first part to be adjusted; a centering structure, which has a first centering part; the upper surface of the first centering part is at least partially higher than the first supporting surface, and the lower surface of the first centering part is at least partially lower than the height of the first part to be adjusted located on the first supporting surface; a moving platform, which comprises at least one moving path; the moving platform can drive one of the supporting structure and the centering structure to move along the moving path toward the other of the supporting structure and the centering structure; when the moving platform is located at the end of the moving path, the first centering part is at least partially located in the accommodating space of the first accommodating part.

Description

Position adjustment assembly and laminating device
Technical Field
The utility model relates to the technical field of semiconductor preparation, in particular to a position adjusting assembly and a lamination device.
Background
In the semiconductor manufacturing process, an automatic mode (such as a mode of matching a lifting mechanism with a manipulator) is generally adopted to take and place the wafer from the tray, and the taking and placing mode has extremely high requirements on the center alignment precision of the tray and the wafer.
However, in the semiconductor process, the problem of positional deviation is very easy to occur after the tray is subjected to multiple translation and lifting movements, so that the center alignment precision of the tray and the wafer is reduced, in this case, the tray or the wafer is often required to be manually adjusted, the operation is complex, the adjustment efficiency is low, and the picking and placing efficiency of the wafer is affected.
Disclosure of utility model
The utility model aims to provide a position adjusting assembly and a film combining device, wherein a first part to be adjusted can be driven to touch a first centering part through a moving platform, so that the central position of the first part to be adjusted can be automatically adjusted in the collision process of the first part to be adjusted and the first centering part, and the efficiency of adjusting the central position of the first part to be adjusted is improved.
In order to achieve the above purpose, the present utility model is realized by the following technical scheme:
A position adjustment assembly for adjusting a center position of a wafer or wafer tray, the position adjustment assembly comprising:
The bearing structure comprises at least two first bearing parts which are fixed relatively, wherein each first bearing part comprises a first bearing surface which is horizontally arranged and a first stopping part which is protruded out of the first bearing surface, the first stopping part defines a first accommodating part, and the first accommodating part comprises an accommodating space for accommodating a first part to be adjusted;
A centering structure having a first centering portion with an upper surface at least partially above a first bearing surface and a lower surface at least partially below a height of the first member to be adjusted at the first bearing surface, and
The movable platform comprises at least one moving path, the movable platform can drive one of the bearing structure and the centering structure to move along the moving path to the other of the bearing structure and the centering structure, and when the movable platform is positioned at the end point of the moving path, the first centering part is at least partially positioned in the accommodating space of the first accommodating part.
Optionally, when the moving platform is located at the end point of the moving path, the first centering portion and at least one first stop portion define a second accommodating portion, and a size of the second accommodating portion is matched with a size of the first to-be-adjusted piece.
Optionally, a first accommodation radius is defined as a minimum distance from a center of the first accommodation portion to the first stop portion, and a second accommodation radius is defined as a minimum distance from a center of the second accommodation portion to the first centering portion, wherein the first accommodation radius is larger than the second accommodation radius.
Optionally, the first to-be-adjusted member is configured as a disc.
Optionally, the first centering portion and the first stopping portion are located at the same horizontal level, the first centering portion comprises a first arc-shaped side face facing the accommodating space of the first accommodating portion, the radius of the first arc-shaped side face is matched with the radius of the first to-be-adjusted piece, the first stopping portion comprises a second arc-shaped side face facing the accommodating space of the first accommodating portion, and the radius of the second arc-shaped side face is matched with the radius of the first to-be-adjusted piece.
Optionally, the first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a plurality of first positioning blocks arranged at intervals along a first circular arc, and a radius of the first circular arc is matched with a radius of the first to-be-adjusted piece.
Optionally, the bearing structure further includes a second bearing portion, where the second bearing portion includes a second bearing surface that is horizontally disposed and a second stop portion that protrudes from the second bearing surface, and the second stop portion defines a third accommodating portion for accommodating a second to-be-adjusted member, and the second bearing portion is relatively fixed with the first bearing portion;
The centering structure further comprises a second centering part, a first supporting part and a second supporting part, wherein the second centering part is fixed relative to the first centering part, and the second centering part and the second supporting part are positioned at the same horizontal height;
When the moving platform is positioned at the end point of the moving path, the second centering part is at least partially positioned in the accommodating space of the third accommodating part, the second centering part and at least part of the second stopping part define a fourth accommodating part, and the size of the fourth accommodating part is matched with the size of the second piece to be adjusted.
Optionally, the first supporting portion and the first centering portion are configured as a first position adjustment combination, the second supporting portion and the second centering portion are configured as a second position adjustment combination, the second position adjustment combination and the first position adjustment combination are arranged at intervals in the same vertical direction, and the second position adjustment combination is located above the first position adjustment combination.
In another aspect, the present utility model further provides a wafer bonding apparatus using the above-mentioned position adjustment assembly, for combining a wafer and a wafer tray, where the first to-be-adjusted member in the position adjustment assembly is configured as the wafer tray, and the second to-be-adjusted member is configured as the wafer, and the wafer bonding apparatus further includes:
a sensor fixed relative to the centering structure for identifying the direction of the wafer tray and the wafer;
The driving mechanism is used for driving the bearing structure to rotate along a first axis so as to adjust the direction of the wafer tray, and
And the lifting mechanism can penetrate through the central position of the bearing structure along the vertical direction so as to perform lifting movement and is used for driving the wafer and/or part of the wafer tray to perform lifting or descending movement.
Compared with the prior art, the utility model has at least one of the following advantages:
According to the position adjusting assembly and the film combining device provided by the utility model, the moving platform can drive one of the bearing structure and the centering structure to move along the moving path to the bearing structure and the other of the centering structure, so that the first part to be adjusted on the bearing structure can touch the first centering part, the central position of the first part to be adjusted can be automatically adjusted in the collision process of the first part to be adjusted and the first centering part, and as the adjusting action of the whole position adjusting assembly is single, the linkage with other parts is not needed in the moving process, the moving mechanism is simple to realize, the fault tolerance is high, and the efficiency of the central position adjustment of the first part to be adjusted can be effectively improved.
When the moving platform is positioned at the end point of the moving path, the first centering part is at least partially positioned in the accommodating space of the first accommodating part, at the moment, the first centering part and the first stopping part limit to form the second accommodating part, and the size of the second accommodating part is matched with the size of the first part to be adjusted, so that the second accommodating part limits the position of the first part to be adjusted, and the center position of the first part to be adjusted can be quickly and accurately adjusted.
The movable platform can drive the second to-be-adjusted piece positioned on the bearing structure to touch the second centering part so as to automatically realize the center position adjustment of the second to-be-adjusted piece, and the movable platform can simultaneously drive the first to-be-adjusted piece and the second to-be-adjusted piece to be close to the centering structure so as to simultaneously carry out the center position adjustment of the first to-be-adjusted piece and the second to-be-adjusted piece, thereby effectively improving the adjustment efficiency.
The utility model has the characteristics of simple structure, strong universality, convenient operation and low manufacturing cost.
Drawings
FIG. 1 is a schematic cross-sectional view of a position adjustment assembly according to a first embodiment of the present utility model;
FIG. 2 is a top view of a position adjustment assembly according to a first embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional view of a position adjustment assembly at the end of a moving path according to an embodiment of the present utility model;
FIG. 4 is a top view of a position adjustment assembly at the end of a moving path according to an embodiment of the present utility model;
Fig. 5 is a schematic cross-sectional view of a position adjustment assembly according to a second embodiment of the utility model.
Detailed Description
The following describes a position adjusting assembly and a film combining device according to the present utility model in further detail with reference to the accompanying drawings and the detailed description. The advantages and features of the present utility model will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for the purpose of facilitating and clearly aiding in the description of embodiments of the utility model. For a better understanding of the utility model with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the utility model, are included in the spirit and scope of the utility model which is otherwise, without departing from the spirit or essential characteristics thereof.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
Example 1
Referring to fig. 1-4, the present embodiment provides a position adjustment assembly for adjusting a center position of a wafer or a wafer tray, where the position adjustment assembly includes a supporting structure 20, the supporting structure 20 includes a first supporting portion 210, the first supporting portion 210 includes a first supporting surface 2101 disposed horizontally and a first stopping portion 2102 protruding from the first supporting surface 2101 and located at an edge of the first supporting surface 2101, the first stopping portion 2102 defines a first accommodating portion, the first accommodating portion includes an accommodating space for accommodating a first to-be-adjusted element 101, the centering structure 30 includes a first centering portion 310, an upper surface 3101 of the first centering portion 310 is at least partially higher than the first supporting surface 2101, a lower surface 3102 of the first centering portion 310 is at least partially lower than a height of the first to-be-adjusted element 101 located on the first supporting surface 2101, so that the first centering portion 310 can touch the first to-be-adjusted element 101, and the moving platform 40 has at least one moving path 40. In this embodiment, the moving platform 40 can drive the supporting structure 20 to move along the moving path toward the centering structure 30. Specifically, in this embodiment, at least one of the first stop portion 2102 and the first centering portion 310 are located on opposite sides of the first accommodating portion along the moving path. In other alternative embodiments, the moving platform 40 may be configured to move the centering structure 30 toward the support structure 20 (not shown).
Specifically, in one embodiment, the support structure 20 may be mounted on the mobile platform 40 by a mounting base 50, i.e., the support structure 20 is fixed to the mounting base 50, and the mounting base 50 is mounted on the mobile platform 40. Optionally, the mounting base 50 may be rotatably connected to the moving platform 40 through a bearing 51, so as to facilitate a subsequent wafer and wafer tray lamination operation in a lamination device employing the position adjustment assembly, but the utility model is not limited thereto.
Specifically, in one embodiment, the centering structure 30 may be fixed at the end position of the moving path, the moving platform 40 may reciprocate between the start point and the end point of the moving path to drive the supporting structure 20 and the first part to be adjusted 101 located in the first accommodating portion to approach or separate from the first centering portion 310, and when the first part to be adjusted 101 approaches the first centering portion 310, the edge of the first part to be adjusted 101 touches the first centering portion 310, so that the central position of the first part to be adjusted 101 is automatically adjusted in the collision process of the edge of the first part to be adjusted 101 and the first centering portion 310, and then the central position of the first part to be adjusted 101 is adjusted by a single motion, thereby improving the efficiency and fault tolerance of the central position adjustment of the first part to be adjusted 101. Optionally, the first to-be-adjusted member 101 is disc-shaped, the size of the accommodating space of the first accommodating portion is greater than the size of the first to-be-adjusted member 101, that is, the minimum distance from the center of the first accommodating portion to the first stop portion 2012 is greater than the radius of the first to-be-adjusted member 101, so that the first to-be-adjusted member 101 can be smoothly placed into the first accommodating portion even if the position of the first to-be-adjusted member 101 is greatly deviated in the process of carrying. Preferably, the first to-be-adjusted component 101 is configured as a wafer or a wafer tray with a disc-shaped arrangement, but the utility model is not limited thereto.
Specifically, in one embodiment, at least one of the first stop portions 2102 and the first centering portion 310 are disposed opposite to each other on the moving path, so as to limit the moving travel of the first to-be-adjusted member 101 on the first bearing surface 2101 when the first to-be-adjusted member 101 is centered, thereby preventing the first to-be-adjusted member 101 from being forced to fall off the first bearing surface 2101 during the collision of the first to-be-adjusted member 101 with the first centering portion 310.
With continued reference to fig. 1 to 4, the moving platform 40 includes a first position at a start point of the moving path and a second position at an end point of the moving path, and as shown in fig. 3 and 4, when the moving platform 40 is at the second position, i.e. at the end point of the moving path, the first centering portion 310 is at least partially located in the accommodating space of the first accommodating portion, and the first centering portion 310 and at least one first stop portion 2102 define a second accommodating portion, where a size of the second accommodating portion matches a size of the first to-be-adjusted component 101. Specifically, the first accommodation radius may be defined as a minimum distance from the center of the first accommodation portion to the first stop portion, the second accommodation radius may be defined as a minimum distance from the center of the second accommodation portion to the first centering portion, and the first accommodation radius may be larger than the second accommodation radius, so that when the moving platform 40 is located at the end point of the moving path, the first centering portion 310 may limit the accommodation space of the first accommodation portion, and define that the first to-be-adjusted piece 101 may be accurately limited to a preset position.
Specifically, in one embodiment, as shown in fig. 3 and 4, in the process of moving the moving platform 40 to the end point of the moving path, the first centering portion 310 touches the first to-be-adjusted member 101 in the first accommodating portion and pushes the first to-be-adjusted member 101 to move on the first bearing surface 2101, so that the edge on the other side of the first to-be-adjusted member 101 abuts against the first stop portion 2102, at this time, the first centering portion 310 cooperates with the first stop portion 2102 on the other side of the first to-be-adjusted member 101 to form the second accommodating portion, and the second accommodating portion may just define the position of the first to-be-adjusted member 101, that is, the size of the second accommodating portion matches with the size of the first to-be-adjusted member 101, so as to quickly and accurately adjust the center position of the first to-be-adjusted member 101.
With continued reference to fig. 3 and 4, in the present embodiment, the first centering portion 310 and the first stopping portion 2102 are located at the same level, and the first centering portion 310 includes a first arc-shaped side surface facing the accommodating space of the first accommodating portion, the radius of the first arc-shaped side surface matches with the radius of the first to-be-adjusted member 101, the first stopping portion 2102 includes a second arc-shaped side surface facing the accommodating space of the first accommodating portion, and the radius of the second arc-shaped side surface matches with the radius of the first to-be-adjusted member 101, so that the radius of the second accommodating portion formed by matching the first centering portion 310 with the first stopping portion 2102 matches with the radius of the first to-be-adjusted member 101, and the second accommodating portion can adjust the position of the first to-be-adjusted member 101 at multiple angles, thereby enabling quick and accurate adjustment of the center position of the first to-be-adjusted member 101.
In other embodiments, the first centering portion 310 and the first stopping portion 2102 are located at the same level, and the first centering portion 310 includes a plurality of first positioning blocks arranged at intervals along a first circular arc, where the radius of the first circular arc matches the radius of the first to-be-adjusted member 101, further, the first stopping portion 2102 may be arranged at intervals along a second circular arc, where the radius of the second circular arc matches the radius of the first to-be-adjusted member 101, and in this case, the radius of the second accommodating portion formed by matching the first centering portion 310 and the first stopping portion 2102 may also match the radius of the first to-be-adjusted member 101.
Example two
Referring to fig. 5, the difference between the present embodiment and the first embodiment is that the supporting structure 20 further includes a second supporting portion 220, the second supporting portion 220 includes a second supporting surface 2201 disposed horizontally and a second stopping portion 2202 protruding from the second supporting surface 2201 and located at an edge of the second supporting surface 2201, the second stopping portion 2202 defines a third accommodating portion for accommodating the second member to be adjusted 102, and the second supporting portion 220 is relatively fixed with the first supporting portion 210. The centering structure 30 further comprises a second centering portion 320 fixed relative to the first centering portion 310, wherein the second centering portion 320 and the second supporting portion 220 are located at the same level, at least a portion of the upper surface of the second centering portion 320 is higher than the second supporting surface 2201, and at least a portion of the lower surface of the second centering portion 320 is lower than the second supporting surface 2201 of the second member 102 to be adjusted. When the moving platform 40 is at the end of the moving path, the second centering portion 320 is at least partially located in the accommodating space of the third accommodating portion, and the second centering portion 320 and at least part of the second stopping portion 2202 define a fourth accommodating portion, where a size of the fourth accommodating portion matches a size of the second member to be adjusted 102.
Specifically, in one embodiment, the moving platform 40 reciprocates between the start point and the end point of the moving path, and may further drive the second member to be adjusted 102 located in the third accommodating portion to approach or depart from the second centering portion 320, and when the second member to be adjusted 102 approaches the second centering portion 320, the edge of the second member to be adjusted 102 touches the second centering portion 320, so that the central position adjustment of the second member to be adjusted 102 is automatically achieved in the collision process of the edge of the second member to be adjusted 102 and the second centering portion 320, and the central position adjustment efficiency of the second member to be adjusted 102 is improved. Further, the moving platform 40 may simultaneously drive the first to-be-adjusted member 101 and the second to-be-adjusted member 102 to approach the centering structure 30, so that the first to-be-adjusted member 101 and the second to-be-adjusted member 102 may be simultaneously adjusted in the center position, thereby effectively improving the adjustment efficiency.
Specifically, in one embodiment, the second member to be adjusted 102 is disc-shaped, the size of the third accommodating portion is larger than the size of the second member to be adjusted 102, that is, the minimum distance from the center of the third accommodating portion to the second stop portion 2202 is larger than the radius of the second member to be adjusted 102, so that the second member to be adjusted 102 can be smoothly placed in the third accommodating portion even if the position of the second member to be adjusted 102 deviates greatly during the conveying process, and the fault tolerance of the central position adjustment of the second member to be adjusted 102 is increased.
Specifically, in one embodiment, at least one of the second stop portions 2202 and the second centering portion 320 are disposed opposite to each other on the moving path, that is, at least one of the second stop portions 2202 and the second centering portion 320 are located on opposite sides of the third receiving portion on the moving path, respectively. The second stop portion 2202 may limit the movement travel of the second member to be adjusted 102 when the second member to be adjusted 102 is centered, so as to prevent the second member to be adjusted 102 from being forced to fall off the second supporting surface 2201 during the collision between the second member to be adjusted 102 and the second centering portion 320.
More specifically, in the process of moving the moving platform 40 to the end point of the moving path, the second centering portion 320 touches the second member to be adjusted 102 in the third accommodating portion and pushes the second member to be adjusted 102 to move on the second supporting surface 2201, so that the edge on the other side of the second member to be adjusted 102 abuts against the second stop portion 2202, at this time, the second centering portion 320 and the second stop portion 2202 on the other side of the second member to be adjusted 102 cooperate to form the fourth accommodating portion, and the fourth accommodating portion just can define the position of the second member to be adjusted 102, that is, the size of the fourth accommodating portion matches with the size of the second member to be adjusted 102, so that the center position of the second member to be adjusted 102 can be quickly and accurately adjusted.
In addition, when the second member 102 is disc-shaped, the second centering portion 320 may include a third arc-shaped side surface facing the accommodating space of the third accommodating portion, where the radius of the third arc-shaped side surface matches with the radius of the second member 102, and the second stop portion 2202 includes a fourth arc-shaped side surface facing the accommodating space of the third accommodating portion, where the radius of the fourth arc-shaped side surface matches with the radius of the second member 102, so that the radius of the fourth accommodating portion formed by the second centering portion 320 and the second stop portion 2202 matches with the radius of the second member 102, so that the fourth accommodating portion may adjust the position of the second member 102 at multiple angles, thereby improving the efficiency and precision of adjusting the center position of the second member 102.
In other embodiments, when the second member to be adjusted 102 is disc-shaped, the second centering portion 320 may include a plurality of second positioning blocks arranged at intervals along a third circular arc, where the radius of the third circular arc matches the radius of the second member to be adjusted 102, further, the second stop portion 2202 may be arranged at intervals along a fourth circular arc, where the radius of the fourth circular arc matches the radius of the second member to be adjusted 102, and in this case, the radius of the fourth receiving portion formed by matching the second centering portion 320 with the second stop portion 2202 may also match the radius of the second member to be adjusted 102.
Specifically, in one embodiment, the first supporting portion 210 and the first centering portion 310 are configured as a first position adjustment combination, the second supporting portion 220 and the second centering portion 320 are configured as a second position adjustment combination, the second position adjustment combination and the first position adjustment combination are disposed at intervals in the same vertical direction, and the second position adjustment combination is located above the first position adjustment combination. Optionally, the first to-be-adjusted component 101 is configured as a wafer tray, and the second to-be-adjusted component 102 is configured as a wafer, but the utility model is not limited thereto.
On the other hand, referring to fig. 5, the present utility model further provides a lamination device using the position adjustment assembly according to the second embodiment, wherein the first piece to be adjusted 101 is configured as a wafer tray, and the second piece to be adjusted 102 is configured as a wafer, the lamination device further includes a sensor 60 fixed relative to the centering structure 30 for identifying the direction of the wafer tray and the wafer, a driving mechanism 70 for driving the supporting structure 20 to rotate along the first axis A-A to adjust the direction of the wafer tray, and a lifting mechanism 80 capable of penetrating the center of the supporting structure 20 in the vertical direction to perform lifting movement for driving the wafer and/or part of the wafer tray to perform lifting or lowering movement.
Specifically, the wafer tray may be used as the first to-be-adjusted member and placed in the first accommodating portion, the wafer may be used as the second to-be-adjusted member and placed in the third accommodating portion, a first mark is provided on the wafer tray, a second mark is provided on the wafer, the sensor 60 determines the direction of the wafer tray based on the detected first mark and determines the direction of the wafer based on the detected second mark, and optionally, the sensor 60 uses a polar angle of the first mark or the second mark in a preset polar coordinate system as the direction of the corresponding wafer tray or wafer. More specifically, the sensor 60 is electrically connected to the driving mechanism 70, and the sensor 60 detects that the first mark or the second mark is located at a set position and generates a first driving mechanism stop signal to adjust the direction of the wafer tray to be consistent with the direction of the wafer. Optionally, the wafer tray is configured as a split tray having an inner tray and an outer tray or configured as an annular tray, but the utility model is not limited thereto.
In one embodiment, the second supporting portion 220 is further provided with a shrinking mechanism (not shown in the figure), and the shrinking mechanism can drive the second supporting portion 220 to switch between a shrinking position and a carrying position, wherein in the carrying position, a horizontal distance between the second supporting portion 220 and the first axis A-A is smaller than a radius of the wafer, so that the second supporting surface 2201 can carry the wafer, and in the shrinking position, a horizontal distance between the second supporting portion 220 and the first axis A-A is greater than the radius of the wafer, so as to provide a avoidance space for lifting and lowering the wafer.
Further, in the embodiment, the bonding method adopting the bonding device comprises the step S11 of placing the wafer tray and the wafer in the first accommodating part and the third accommodating part respectively. In step S12, the moving platform 40 drives the wafer tray to touch the first centering portion 310 and drives the wafer to touch the second centering portion 320, so as to adjust the center positions of the wafer tray and the wafer, optionally, after the center positions of the wafer tray and the wafer are adjusted, the center axes of the wafer tray and the wafer are coincident with the first axis A-A, and the first axis A-A may be set to be coincident with the center axis of the moving platform 40. In the step S13, the direction of the wafer and the direction of the wafer tray are identified by the sensor 60, and the direction of the wafer tray is adjusted to be consistent with the direction of the wafer, wherein when the driving mechanism 70 drives only one of the first support 210 and the second support 220 to rotate, the driving mechanism 70 drives the first support 210 or the second support 220 to rotate, and stops after the sensor 60 identifies that the direction of the wafer and the direction of the wafer tray are consistent, or when the driving mechanism 70 drives the first support 210 and the second support 220 to rotate at the same time, the driving mechanism 70 drives the inner tray to indirectly jack up the wafer upwards by the lifting mechanism 80 or directly jack up the wafer upwards by the inner space of the annular tray, and then drives the driving mechanism 70 to drive the first support 210 and the second support 220 to rotate, and stops after the sensor 60 identifies that the direction of the wafer and the direction of the wafer tray are consistent. In step S14, after the wafer is separated from the second supporting surface 2201 by the lifting mechanism 80 directly or indirectly, the second supporting portion 120 is located at the retracted position. And S15, driving the wafer or the combination of the wafer and the inner tray to fall back downwards through the lifting mechanism 80 so as to place the wafer on the wafer tray, thereby realizing the wafer and wafer tray combination.
In summary, according to the position adjusting assembly and the film combining device provided by the utility model, the moving platform can drive one of the supporting structure and the centering structure to move along the moving path to the other one of the supporting structure and the centering structure, so that the first to-be-adjusted piece positioned on the supporting structure touches the first centering portion, thereby automatically adjusting the central position of the first to-be-adjusted piece in the collision process of the first to-be-adjusted piece and the first centering portion. When the moving platform is positioned at the end point of the moving path, the first centering part is at least partially positioned in the accommodating space of the first accommodating part, the first centering part and the first stop part define a second accommodating part, and the size of the second accommodating part is matched with the size of the first part to be adjusted, so that the second accommodating part limits the position of the first part to be adjusted, and the center position of the first part to be adjusted can be quickly and accurately adjusted. In addition, the moving platform can drive the second to-be-adjusted piece positioned on the bearing structure to touch the second centering part so as to automatically realize the center position adjustment of the second to-be-adjusted piece, and when the moving platform drives the first to-be-adjusted piece and the second to-be-adjusted piece to approach the centering structure, the center positions of the first to-be-adjusted piece and the second to-be-adjusted piece can be adjusted at the same time, so that the adjustment efficiency is effectively improved.
While the present utility model has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the utility model. Many modifications and substitutions of the present utility model will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the utility model should be limited only by the attached claims.

Claims (9)

1.一种位置调整组件,用于对晶圆或晶圆托盘的中心位置进行调整,其特征在于,所述位置调整组件包括:1. A position adjustment component for adjusting the center position of a wafer or a wafer tray, characterized in that the position adjustment component comprises: 承托结构,所述承托结构包括至少两个相对固定的第一承托部,所述第一承托部包括水平设置的第一承托表面及凸出所述第一承托表面设置的第一止挡部,所述第一止挡部限定出一个第一容置部,所述第一容置部包括用以容置第一待调整件的容置空间;A supporting structure, the supporting structure comprising at least two relatively fixed first supporting parts, the first supporting part comprising a first supporting surface arranged horizontally and a first stopper arranged protruding from the first supporting surface, the first stopper defining a first accommodating part, the first accommodating part comprising an accommodating space for accommodating a first part to be adjusted; 对心结构,所述对心结构具有第一对心部,所述第一对心部的上表面至少部分高于第一承托表面,所述第一对心部的下表面至少部分低于位于所述第一承托表面的所述第一待调整件的高度;以及A centering structure, the centering structure having a first centering portion, an upper surface of the first centering portion at least partially higher than a first supporting surface, and a lower surface of the first centering portion at least partially lower than a height of the first to-be-adjusted member located on the first supporting surface; and 移动平台,所述移动平台包括至少一个移动路径,所述移动平台能够带动所述承托结构和所述对心结构的之一沿所述移动路径向所述承托结构和所述对心结构的另一移动;所述移动平台位于所述移动路径的终点时,所述第一对心部至少部分位于所述第一容置部的容置空间内。A mobile platform, wherein the mobile platform comprises at least one moving path, and the mobile platform is capable of driving one of the supporting structure and the centering structure to move along the moving path toward the other of the supporting structure and the centering structure; when the mobile platform is located at the end point of the moving path, the first centering portion is at least partially located within the accommodation space of the first accommodation portion. 2.如权利要求1所述的位置调整组件,其特征在于,所述移动平台位于所述移动路径的终点时,所述第一对心部与至少一个所述第一止挡部限定形成一个第二容置部,所述第二容置部的尺寸与所述第一待调整件的尺寸相匹配。2. The position adjustment assembly as described in claim 1 is characterized in that when the movable platform is located at the end point of the moving path, the first centering portion and at least one of the first stop portions define a second accommodating portion, and the size of the second accommodating portion matches the size of the first part to be adjusted. 3.如权利要求2所述的位置调整组件,其特征在于,定义第一容置半径为所述第一容置部的中心到所述第一止挡部的最小距离,定义第二容置半径为所述第二容置部的中心到所述第一对心部的最小距离,所述第一容置半径大于所述第二容置半径。3. The position adjustment component as described in claim 2 is characterized in that the first accommodating radius is defined as the minimum distance from the center of the first accommodating portion to the first stop portion, and the second accommodating radius is defined as the minimum distance from the center of the second accommodating portion to the first centering portion, and the first accommodating radius is larger than the second accommodating radius. 4.如权利要求1所述的位置调整组件,其特征在于,所述第一待调整件配置为圆盘状。4 . The position adjustment assembly according to claim 1 , wherein the first piece to be adjusted is configured in a disc shape. 5.如权利要求4所述的位置调整组件,其特征在于,所述第一对心部与所述第一止挡部位于同一水平高度,且所述第一对心部包括面向所述第一容置部的容置空间的第一弧形侧面,所述第一弧形侧面的半径与所述第一待调整件的半径相匹配;所述第一止挡部包括面向所述第一容置部的容置空间的第二弧形侧面,所述第二弧形侧面的半径与所述第一待调整件的半径相匹配。5. The position adjustment assembly as described in claim 4 is characterized in that the first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a first curved side surface facing the accommodating space of the first accommodating portion, and the radius of the first curved side surface matches the radius of the first part to be adjusted; the first stop portion includes a second curved side surface facing the accommodating space of the first accommodating portion, and the radius of the second curved side surface matches the radius of the first part to be adjusted. 6.如权利要求4所述的位置调整组件,其特征在于,所述第一对心部与所述第一止挡部位于同一水平高度,且所述第一对心部包括沿第一圆弧间隔排布的多个第一定位块,所述第一圆弧的半径与所述第一待调整件的半径相匹配。6. The position adjustment assembly as described in claim 4 is characterized in that the first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a plurality of first positioning blocks arranged at intervals along a first arc, and the radius of the first arc matches the radius of the first part to be adjusted. 7.如权利要求1所述的位置调整组件,其特征在于,所述承托结构还包括第二承托部,所述第二承托部包括水平设置的第二承托表面及凸出所述第二承托表面设置的第二止挡部,第二止挡部限定出用以容置第二待调整件的第三容置部,所述第二承托部与所述第一承托部相对固定;7. The position adjustment assembly according to claim 1, characterized in that the supporting structure further comprises a second supporting portion, the second supporting portion comprises a second supporting surface arranged horizontally and a second stop portion arranged protruding from the second supporting surface, the second stop portion defines a third accommodating portion for accommodating a second to-be-adjusted member, and the second supporting portion is relatively fixed to the first supporting portion; 所述对心结构还包括:第二对心部,其相对于所述第一对心部固定,所述第二对心部与所述第二承托部位于同一水平高度;The centering structure further comprises: a second centering portion, which is fixed relative to the first centering portion, and the second centering portion and the second supporting portion are located at the same level; 所述移动平台位于所述移动路径终点时,所述第二对心部至少部分位于所述第三容置部的容置空间内;所述第二对心部与至少部分所述第二止挡部限定形成一个第四容置部,所述第四容置部的尺寸与所述第二待调整件的尺寸相匹配。When the mobile platform is located at the end point of the moving path, the second centering portion is at least partially located in the accommodating space of the third accommodating portion; the second centering portion and at least part of the second stop portion define a fourth accommodating portion, and the size of the fourth accommodating portion matches the size of the second part to be adjusted. 8.如权利要求7所述的位置调整组件,其特征在于,所述第一承托部及所述第一对心部配置为第一位置调整组合,所述第二承托部与所述第二对心部配置为第二位置调整组合;所述第二位置调整组合与所述第一位置调整组合在同一竖直方向上间隔设置,且所述第二位置调整组合位于所述第一位置调整组合的上方。8. The position adjustment assembly as described in claim 7 is characterized in that the first supporting portion and the first centering portion are configured as a first position adjustment combination, and the second supporting portion and the second centering portion are configured as a second position adjustment combination; the second position adjustment combination and the first position adjustment combination are spaced apart in the same vertical direction, and the second position adjustment combination is located above the first position adjustment combination. 9.一种采用如权利要求7~8中任意一项所述的位置调整组件的合片装置,用于对晶圆及晶圆托盘进行组合,其特征在于,所述位置调整组件中所述第一待调整件配置为晶圆托盘,所述第二待调整件配置为晶圆;所述合片装置还包括:9. A wafer assembly device using the position adjustment assembly as claimed in any one of claims 7 to 8, for assembling a wafer and a wafer tray, characterized in that the first part to be adjusted in the position adjustment assembly is configured as a wafer tray, and the second part to be adjusted is configured as a wafer; the wafer assembly device further comprises: 传感器,其相对于所述对心结构固定,用于识别所述晶圆托盘和所述晶圆的方向;a sensor fixed relative to the centering structure for identifying the orientation of the wafer tray and the wafer; 驱动机构,用于带动所述承托结构沿第一轴线做旋转运动,以对所述晶圆托盘进行方向调整;以及A driving mechanism, used for driving the supporting structure to rotate along a first axis to adjust the direction of the wafer tray; and 升降机构,其能沿竖直方向贯穿所述承托结构的中心位置以进行升降运动,用于带动所述晶圆和/或所述晶圆托盘的局部进行上升或下降运动。The lifting mechanism can penetrate the center position of the supporting structure in the vertical direction to perform lifting movement, and is used to drive the wafer and/or a part of the wafer tray to perform ascending or descending movement.
CN202420274334.7U 2024-02-04 2024-02-04 Position adjustment assembly and laminating device Active CN222440565U (en)

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