CN222030274U - Semiconductor refrigeration VPX air-cooled cold plate - Google Patents

Abstract

The utility model discloses a semiconductor refrigeration VPX air-cooled plate, which comprises a heat radiation boss arranged on the VPX air-cooled plate and used for radiating heat of a chip, a semiconductor refrigeration sheet arranged in the heat radiation boss and a heat pipe pre-buried in the VPX air-cooled plate, wherein the heat radiation boss is provided with a groove, the semiconductor refrigerating sheet is fixed in the groove and used for absorbing and transmitting heat generated by the chip, and the heat pipe is arranged in the VPX air-cooled plate below the groove and used for absorbing the heat transmitted by the semiconductor refrigerating sheet and uniformly distributing the heat to the whole VPX air-cooled plate; the advantages are that: the semiconductor refrigerating sheet and the heat pipe improve the upper limit of heat removal of the VPX air-cooled plate, can uniformly part the local overhigh heat flow to the whole VPX air-cooled plate, solve the problem of overhigh local heat flow, widen the application range of the air-cooled plate, and simultaneously are relatively similar to a liquid cooling module, and have simple structure, high reliability and low cost.

Description

Semiconductor refrigeration VPX air-cooled cold plate

Technical Field

The utility model relates to the technical field of electronic equipment heat dissipation, in particular to a semiconductor refrigeration VPX air-cooled plate.

Background

With the continuous improvement of computing power of electronic equipment, the total heat consumption and the local heat flux density of an electronic module are larger and larger, and particularly in the field of military industry, the use environment of scenes such as an airborne scene, a carrier scene and the like is bad, and the heat dissipation problem has become a technical bottleneck for restricting the development of the electronic equipment.

At present, the standard VPX module commonly adopts three heat dissipation modes, namely cold conduction, forced air cooling and liquid cooling, and the heat-relieving capability of the three structures is generally increased in sequence under the same boundary condition.

The overall heat consumption of the VPX module is continuously improved along with the improvement of calculation force, the increase of the heat consumption is mainly caused by the upgrading of a main chip, the integration level of the main chip is continuously improved along with the upgrading of a process, the power consumption is continuously increased, the volume is not greatly changed, and even the volume is reduced, so that the heat dissipation heat flow density of a local area of the module is rapidly increased. Often the overall heat dissipation load of the module does not reach the limit of the heat rejection capability of the air-cooled panels within the VPX module, but the local heat flux density is too high to limit the application of the module. If in the on-board use scene, the use environment temperature requirement reaches more than 70 ℃, and at the moment, for certain chips with higher shell temperature limit requirement, when the heat dissipation of an air cooling plate is used, the heat flow density cannot exceed 2W/cm < 2 >, and when the heat flow density exceeds the value, even if the total heat consumption of the module does not reach the limit, the heat dissipation design cannot be carried out in an air cooling heat dissipation mode, and only the liquid cooling design can be adjusted, so that the complexity and the total cost of the system design are increased.

Disclosure of utility model

The utility model aims to solve the technical problems that the existing air-cooled plate has insufficient heat-relieving capability, the whole heat-dissipating load does not reach the limit of the heat-relieving capability of the air-cooled plate in the VPX module, but the application of the module is limited due to the excessively high local heat flux density, and the liquid cooling module has higher heat-relieving performance but the complexity of system design is increased and the cost is higher; the utility model provides a semiconductor refrigeration VPX forced air cooling cold plate to the problem, including setting up be arranged in for the radiating boss of VPX module middle chip, the semiconductor refrigeration piece of setting in the boss of dispelling the heat and the heat pipe of pre-buried in VPX forced air cooling cold plate on VPX forced air cooling cold plate, the boss department of dispelling the heat opens flutedly, the semiconductor refrigeration piece is fixed in the recess for absorb and transfer the heat that the chip produced, the heat pipe setting is in the VPX forced air cooling cold plate of recess below, be used for absorbing the heat of semiconductor refrigeration piece transmission and evenly distribute the heat on whole VPX forced air cooling cold plate.

The semiconductor refrigerating sheet and the heat pipe improve the upper limit of heat removal of the VPX air-cooled plate, can uniformly part the local overhigh heat flow to the whole VPX air-cooled plate, solve the problem of overhigh local heat flow, widen the application range of the air-cooled plate, and simultaneously are relatively similar to a liquid cooling module, and have simple structure, high reliability and low cost.

Further preferably, the upper and lower surfaces of the semiconductor refrigerating sheet are coated with TIM materials with high heat conductivity coefficient; the method is used for reducing the contact thermal resistance between the semiconductor refrigeration piece and the VPX air cooling plate.

Further preferably, the semiconductor refrigerating sheet is fixed on the radiating boss through the cover plate and the countersunk head screw; the semiconductor refrigerating plate is used for fixing the semiconductor refrigerating plate in the radiating boss and absorbing the heat of the chip.

Further preferably, the cover plate is made of copper materials capable of reducing heat transfer resistance, and the heat transfer resistance can be effectively reduced.

According to the technical scheme of the utility model, a placing groove for placing the heat pipe is formed in the VPX air cooling plate, the heat pipe is embedded in the placing groove and used for absorbing heat transferred by the semiconductor refrigerating sheet and transferring the heat to the whole VPX air cooling plate.

Compared with the prior art, the utility model has the beneficial effects that:

1. the cover plate is made of copper material and TIM material with high heat conductivity coefficient is coated on the upper and lower surfaces of the semiconductor refrigerating sheet, so that the heat resistance in the heat transfer process can be effectively reduced.

2. According to the utility model, the semiconductor refrigerating sheet and the heat pipe in the VPX air-cooled plate at the bottom of the radiating boss are arranged at the radiating boss, so that the upper limit of heat release of the VPX air-cooled plate can be effectively improved, local heat flow is uniformly distributed on the whole VPX air-cooled plate, local heat is prevented from being too high, and the application range of the air-cooled plate is widened.

Drawings

FIG. 1 is a schematic view of a VPX module;

FIG. 2 is a schematic view of a VPX air cooled panel;

FIG. 3 is a partial cross-sectional view of the structure of the air-cooled cold plate of the present embodiment VPX;

FIG. 4 is a partial exploded view of the structure of the air-cooled cold plate of the present embodiment VPX;

FIG. 5 is a schematic diagram of a prior art VPX air cooling module and an electronic device using the same;

Reference numerals illustrate: 1-VPX air cooling plate, 2-heat pipe, 3-heat radiation boss, 4-semiconductor refrigerating sheet and 5-cover plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be further described in detail with reference to the accompanying drawings 1 to 5 and examples.

Example 1

As shown in fig. 1-4, a semiconductor refrigeration VPX air-cooled panel of this embodiment includes a heat dissipation boss 3 disposed on a VPX air-cooled panel 1 for dissipating heat from a chip in a VPX module, a semiconductor refrigeration sheet 4 disposed in the heat dissipation boss 3, and a heat pipe 2 embedded in the VPX air-cooled panel 1, where the heat dissipation boss 3 is provided with a groove, and the semiconductor refrigeration sheet 4 is fixed in the groove and used for absorbing and transmitting heat generated by the chip, so as to improve heat dissipation performance of the air-cooled panel by using thermoelectric effect.

As shown in fig. 3-4, a plurality of mounting holes are formed in the peripheral edges of the groove, and the cover plate 5 is in threaded connection with the groove through countersunk screws, so that the semiconductor refrigeration piece 4 is fixed in the groove, and the countersunk screws can be embedded into the mounting holes to ensure the surface flatness of the heat dissipation boss 3.

In this embodiment, as shown in fig. 4, two interfaces for facilitating the electrical connection between the semiconductor refrigeration sheet 4 and the VPX air-cooled panel 1 are further provided on one side of the groove.

In this embodiment, the cover plate 5 is made of copper material capable of reducing heat transfer resistance, so that the heat transfer resistance of the chip for transferring heat to the cover plate 5 is reduced.

The upper and lower surfaces of the semiconductor refrigeration sheet 4 are coated with a high thermal conductivity TIM material (thermal conductivity interface material), the upper surface is coated with a high thermal conductivity TIM material (thermal conductivity interface material) for reducing thermal conductivity of heat transfer between the cover plate 5 and the semiconductor chip, and the lower surface is coated with a high thermal conductivity TIM material for reducing thermal conductivity of heat transfer between the semiconductor refrigeration sheet 4 and the VPX air-cooled plate 1.

TIM materials (thermally conductive interface materials) of high thermal conductivity are known materials such as liquid gold, high performance silicone grease, and the like.

The VPX air cooling plate 1 is internally provided with a placing groove for placing the heat pipe 2, the heat pipe 2 is placed in the placing groove, and then the same material adopted by the VPX air cooling plate 1 is welded with the placing groove, so that the heat pipe 2 is buried in the placing groove.

The placing groove of the heat pipe 2 is arranged in the VPX air cooling plate 1 below the groove, and the placing groove is arranged to cover the whole VPX air cooling plate 1, so that the heat pipe 2 can uniformly distribute heat to the whole VPX air cooling plate.

As shown in fig. 5, in the prior art chinese patent grant bulletin No.: in the CN219612397U VPX air cooling module and the electronic equipment using the VPX air cooling module, the electronic equipment comprises a case 100 and an air cooling module 200 arranged in the case, the air cooling module 200 is the VPX air cooling module, an air inlet 101 is arranged at the bottom of the case, an air outlet 102 is arranged at the top of the case, a fan 103 for sending cold air from the air inlet to the air outlet is also arranged in the case, and the fan can be arranged at the air inlet and/or the air outlet; when the air conditioner works, cold air enters the inside of the case from the air inlet, and flows out from the side air outlet after passing through the main board radiating teeth, the air channel and the daughter board radiating teeth on the VPX air cooling module in sequence, so that the heat dissipation of the daughter board chip is realized; meanwhile, the cooling air also passes through the main board cooling teeth to realize cooling of the main board chip.

The utility model mainly improves the upper limit of heat release of the VPX air-cooled plate through the semiconductor refrigerating sheet and the heat pipe in the prior art, and can uniformly part the local overhigh heat flow to the whole VPX air-cooled plate, thereby solving the problem of the local overhigh heat flow and widening the application range of the air-cooled plate.

When in use, the utility model is matched with a case and a fan for use.

When the VPX air cooling plate 1 is used, chips in the VPX module transfer heat to the cover plate 5 through the heat-dissipating boss 3 on the VPX air cooling plate, then the cover plate 5 transfers the heat to the semiconductor refrigerating sheet 4, at the moment, the temperature of the chips in the VPX module is gradually reduced through the heat transfer and the effect of the semiconductor refrigerating sheet 4, the semiconductor refrigerating sheet 4 takes away the heat through the Peltier effect, the heat is transferred to the bottom of the groove, namely the VPX air cooling plate 1, then the heat is quickly and uniformly distributed on the whole VPX air cooling plate 1 through the heat-conducting capacity by the heat pipes 2 pre-embedded in the VPX air cooling plate 1, so that local overhigh heat flow is avoided, and finally the heat is dissipated to the atmosphere through the case and the fans in the case, and the heat dissipation is completed.

The above embodiments are only for illustrating the technical idea of the present utility model, and the protection scope of the present utility model is not limited thereto, and any modification made on the basis of the technical scheme according to the technical idea of the present utility model falls within the protection scope of the present utility model.

Claims (5)

1. A semiconductor refrigeration VPX air-cooled cold plate is characterized in that: the VPX air cooling plate (1) comprises a heat dissipation boss (3) arranged on the VPX air cooling plate (1) and used for dissipating heat of chips in the VPX module, a semiconductor refrigerating sheet (4) arranged in the heat dissipation boss (3) and a heat pipe (2) embedded in the VPX air cooling plate (1), the heat dissipation boss (3) is provided with a groove, the semiconductor refrigerating sheet (4) is fixed in the groove and used for absorbing and transmitting heat generated by the chips, and the heat pipe (2) is arranged in the VPX air cooling plate (1) below the groove and used for absorbing the heat transmitted by the semiconductor refrigerating sheet (4) and uniformly distributing the heat to the whole VPX air cooling plate (1).

2. The semiconductor refrigeration VPX air-cooled panel of claim 1, wherein: the upper and lower surfaces of the semiconductor refrigerating sheet (4) are coated with TIM materials with high heat conductivity coefficient.

3. The semiconductor refrigeration VPX air-cooled panel of claim 1, wherein: the semiconductor refrigerating sheet (4) is fixed in the groove of the heat dissipation boss (3) through the cover plate (5) and the countersunk head screw.

4. A semiconductor refrigeration VPX air-cooled panel according to claim 3, characterized in that: the cover plate (5) is made of copper material capable of reducing heat transfer resistance.

5. The semiconductor refrigeration VPX air-cooled panel of claim 1, wherein: the VPX air-cooled cold plate (1) is internally provided with a placing groove for placing the heat pipe (2), and the heat pipe (2) is pre-buried in the placing groove.