CN115190739B - Composite cold plate structure and electronic equipment - Google Patents

Abstract

The application provides a composite cold plate structure and electronic equipment, wherein the composite cold plate structure comprises a liquid inlet, a liquid outlet and a cold plate assembly, the cold plate assembly comprises a cold plate body, a partition plate and a heat dissipation piece, a containing cavity is formed in the cold plate body, the partition plate is positioned in the containing cavity to divide the containing cavity into a first cavity and a second cavity for fluid circulation, the extending direction of the partition plate is consistent with the extending direction of the cold plate body, and the heat dissipation piece is arranged in the first cavity; the liquid inlet and the liquid outlet are all located the cold plate body, and the liquid inlet and the liquid outlet are close to the opposite both ends of cold plate body extending direction respectively, and first cavity and second cavity all communicate with the liquid inlet, and first cavity and second cavity all communicate with the liquid outlet. The composite cold plate structure provided by the application has a good heat dissipation effect.

Description

Composite cold plate structure and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a composite cooling plate structure and an electronic device.

Background

With the rapid development of 5G communication technology and edge calculation and the continuous evolution of data center equipment performance and business capability such as servers/switches, single-chip power consumption is also continuously and rapidly increased, and with the trend of semiconductor manufacturing process to limit and failure of moore's law, semiconductor chip manufacturers increasingly rely on the purpose of improving chip performance by stacking the number of chip cores, so that the increase of chip power consumption is further promoted, and the heat dissipation of chips with large power consumption needs a heat dissipation technology with strong performance.

At present, the heat dissipation is mainly carried out on the chip with high power consumption through a liquid cooling heat dissipation technology, the cold plate type liquid cooling structure is the development direction of the main liquid cooling technology at present, and the commonly used cold plate type liquid cooling structure is a single-layer micro-channel cold plate type liquid cooling structure. Generally, IT equipment includes a plurality of chips and heat dissipation unit, and heat dissipation unit includes a plurality of individual layer microchannel cold plate type liquid cooling structures, and individual layer microchannel cold plate type liquid cooling structure sets up with the chip one-to-one, and a plurality of individual layer microchannel cold plate type liquid cooling structures establish ties, and the coolant flows through each individual layer microchannel cold plate type liquid cooling structure in proper order to after cooling with the chip that corresponds with each individual layer microchannel cold plate type liquid cooling structure, finally flow out IT equipment.

However, the downstream end of the serial single-layer microchannel cold plate type liquid cooling structure has poor heat dissipation effect.

Disclosure of Invention

Based on the structure, the application provides the composite cold plate structure and the electronic equipment, and the composite cold plate structure has a good heat dissipation effect.

In a first aspect, the application provides a composite cold plate structure, comprising a liquid inlet, a liquid outlet and a cold plate assembly, wherein the cold plate assembly comprises a cold plate body, a partition plate and a heat dissipation piece, a containing cavity is arranged in the cold plate body, the partition plate is positioned in the containing cavity to divide the containing cavity into a first cavity and a second cavity for fluid circulation, the extending direction of the partition plate is consistent with the extending direction of the cold plate body, and the heat dissipation piece is arranged in the first cavity;

The liquid inlet and the liquid outlet are all located the cold plate body, and the liquid inlet and the liquid outlet are close to the opposite both ends of cold plate body extending direction respectively, and first cavity and second cavity all communicate with the liquid inlet, and first cavity and second cavity all communicate with the liquid outlet.

In one possible implementation, the present application provides a composite cold plate structure, the cold plate body having opposite first and second sides, a partition between the first and second sides, a first chamber between the first side and the partition, and a second chamber between the second side and the partition;

the distance between the second side surface and the partition plate is smaller than or equal to the distance between the first side surface and the partition plate.

In one possible implementation manner, the composite cold plate structure provided by the application further comprises an impedance adjusting piece, wherein the impedance adjusting piece is arranged in the second chamber or the liquid inlet, and the impedance adjusting piece is used for adjusting the fluid impedance of the second chamber.

In one possible implementation manner, the composite cold plate structure provided by the application, the impedance adjusting piece comprises at least one first adjusting block, the extending direction of the first adjusting block is consistent with the extending direction of the second chamber, the at least one first adjusting block is positioned in the second chamber, and the first adjusting block is connected with the inner wall of the second chamber.

In a possible implementation manner, the composite cold plate structure provided by the application has two first adjusting blocks, the two first adjusting blocks are oppositely arranged, and a first channel for fluid circulation is formed between the two first adjusting blocks.

In a possible implementation manner, the impedance adjusting piece comprises at least one second adjusting block, the extending direction of the second adjusting block is consistent with that of the liquid inlet, the at least one second adjusting block is located on one side, away from the first cavity, of the liquid inlet, and the second adjusting block is connected with the inner wall of the liquid inlet.

In a possible implementation manner, the composite cold plate structure provided by the application is characterized in that the impedance adjusting piece is an adjusting plate, the adjusting plate is positioned in the second cavity, an included angle is formed between the extending direction of the adjusting plate and the extending direction of the second cavity, the side edge of the adjusting plate is connected with the inner wall of the second cavity, a plurality of impedance adjusting holes are formed in the adjusting plate, and a plurality of second channels for fluid circulation are formed in each impedance adjusting hole.

In one possible implementation, the composite cold plate structure provided by the application, and the heat sink is a micro-channel fin.

In a second aspect, the present application provides an electronic device, including a chip assembly and at least one composite cold plate structure provided in the first aspect, where the composite cold plate structure is covered on the chip assembly.

In one possible implementation manner, the electronic device provided by the application has at least two chip assemblies, the chip assemblies comprise chips, the composite cold plate structures are at least two, the composite cold plate structures are covered on the chips, the composite cold plate structures are arranged in one-to-one correspondence with the chips, and the composite cold plate structures are sequentially communicated.

According to the composite cold plate structure and the electronic equipment, the containing cavity is arranged in the cold plate body and used for fluid circulation, and the liquid inlet and the liquid outlet are arranged near the two opposite ends of the extending direction of the cold plate body, so that the fluid enters the containing cavity through the liquid inlet and flows out of the liquid outlet. Through setting up the baffle in the cold plate body to separate holding the chamber into first cavity and second cavity, first cavity is used for holding the radiator and supplies the fluid circulation, and the radiator is used for the heat dissipation. The second chamber is used for fluid circulation so as to adjust the fluid flow of the first chamber, thereby improving the heat dissipation effect of the heat dissipation piece, and in the serial composite cold plate structure, the second chamber at the upstream end can provide low-temperature fluid for the first chamber at the downstream end so as to improve the heat dissipation effect of the heat dissipation piece at the downstream end, thereby enabling the heat dissipation effect of each heat dissipation piece in the serial composite cold plate structure to be more uniform. Therefore, the heat dissipation effect of the composite cold plate structure is good.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of the composite cold plate structure and chip assembly of FIG. 1;

fig. 3 is a schematic structural diagram of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present application;

FIG. 4 is a front view of FIG. 3;

Fig. 5 is a schematic structural diagram II of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present application;

FIG. 6 is a front view of FIG. 5;

fig. 7 is a schematic structural diagram III of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present application;

FIG. 8 is a front view of FIG. 7;

fig. 9 is a schematic structural diagram of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present application;

Fig. 10 is a schematic diagram of a composite cold plate structure and a chip assembly in an electronic device according to an embodiment of the present application;

fig. 11 is a front view of fig. 10.

Reference numerals illustrate:

100-a composite cold plate structure;

110-a liquid inlet;

120-a liquid outlet;

130-a cold plate assembly; 131-a cold plate body; 1311-a first chamber; 1312-a second chamber; 132-a separator; 133-a heat sink;

140-impedance adjusting piece; 141-a first adjustment block; 142-a second adjustment block; 143-an adjusting plate;

150-a first channel;

160-a second channel;

200-chip assembly;

210-chip; 220-a circuit board; 230-a heat transfer plate;

300-piping component;

310-liquid inlet pipe; 320-a liquid outlet pipe; 330-connecting tube.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the preferred embodiments of the present application will be described in more detail with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the application. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship of the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

The terms first, second, third and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the application described herein may be implemented, for example, in sequences other than those illustrated or otherwise described herein.

Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or display that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or display.

With the rapid development of 5G communication technology and edge calculation and the continuous evolution of data center equipment performance and business capability such as servers/switches, single-chip power consumption is also continuously and rapidly increased, and with the trend of semiconductor manufacturing process to limit and failure of moore's law, semiconductor chip manufacturers increasingly rely on the purpose of improving chip performance by stacking the number of chip cores, so that the increase of chip power consumption is further promoted, and the heat dissipation of chips with large power consumption needs a heat dissipation technology with strong performance.

At present, the heat dissipation is mainly carried out on the chip with high power consumption through a liquid cooling heat dissipation technology, the cold plate type liquid cooling structure is the development direction of the main liquid cooling technology at present, and the commonly used cold plate type liquid cooling structure is a single-layer micro-channel cold plate type liquid cooling structure. Generally, IT equipment includes a plurality of chips and heat dissipation unit, and heat dissipation unit includes a plurality of individual layer microchannel cold plate type liquid cooling structures, and individual layer microchannel cold plate type liquid cooling structure sets up with the chip one-to-one, and a plurality of individual layer microchannel cold plate type liquid cooling structures establish ties, and the coolant flows through each individual layer microchannel cold plate type liquid cooling structure in proper order to after cooling with the chip that corresponds with each individual layer microchannel cold plate type liquid cooling structure, finally flow out IT equipment.

However, the downstream end of the serial single-layer microchannel cold plate type liquid cooling structure has poor heat dissipation effect. The reason is that the cooling liquid gradually absorbs the heat generated by the chip from the liquid inlet end, the temperature of the cooling liquid continuously rises, that is, the chip at the downstream end is far away from the liquid inlet end, and the cooling liquid in the single-layer micro-channel cold plate type liquid cooling structure corresponding to the cooling liquid is higher in temperature, so that the heat dissipation of the chip is more unfavorable, and even the risk of chip overtemperature occurs. And because the power of each chip is inconsistent, the heat dissipation performance of the single-layer micro-channel cold plate type liquid cooling structure cannot be adjusted according to the power of the chip, so that the heat dissipation effect of the single-layer micro-channel cold plate type liquid cooling structure is poor.

Based on the structure, the application provides the composite cold plate structure and the electronic equipment, and the composite cold plate structure has a good heat dissipation effect.

The following describes in detail the technical solution of the composite cooling plate structure and the electronic device provided by the embodiment of the application with reference to the accompanying drawings.

Referring to fig. 1, an embodiment of the present application provides an electronic device including at least one composite cold plate structure 100 and a chip assembly 200, wherein the composite cold plate structure 100 is covered on the chip assembly 200.

It is understood that the electronic device may be a calculator, a server, a data center, or the like, and the embodiment is not limited thereto, and the composite cold plate structure 100 covers the chip assembly 200, and the composite cold plate structure 100 may absorb heat generated by the operation of the chip assembly 200, so as to dissipate heat of the chip assembly 200.

Referring to fig. 1 and 2, in some embodiments, the number of the chip assemblies 200 is at least two, the chip assemblies 200 include chips 210, the number of the composite cold plate structures 100 is at least two, the composite cold plate structures 100 are covered on the chips 210, the composite cold plate structures 100 are arranged in one-to-one correspondence with the chips 210, and each of the composite cold plate structures 100 is sequentially communicated.

It is understood that the chip assembly 200 may further include a circuit board 220 and a heat transfer plate 230, the chip 210 is located between the circuit board 220 and the heat transfer plate 230, the composite cold plate structure 100 is covered on the heat transfer plate 230, the heat transfer plate 230 is used for transferring heat of the chip 210 to the composite cold plate structure 100, and the composite cold plate structure 100 absorbs heat of the chip 210, so as to dissipate heat of the chip 210 and cool down.

The heat transfer plate 230 may be made of TIM (Thermal Interface Material) materials such as a high heat-conductive pad or a heat-conductive gel.

The electronic device may further comprise a pipeline assembly 300, wherein the pipeline assembly 300 comprises a liquid inlet pipe 310, a liquid outlet pipe 320 and at least one connecting pipe 330, the connecting pipe 330 is arranged corresponding to the composite cold plate structure 100, the liquid inlet pipe 310 is communicated with the first composite cold plate structure 100, the liquid outlet pipe 320 is communicated with the last composite cold plate structure 100, and the connecting pipe 330 is used for communicating the first composite cold plate structure 100 and the last composite cold plate structure 100.

Thus, each of the composite cold plate structures 100 are sequentially communicated to form a serial composite cold plate structure 100, and fluid enters from the first composite cold plate structure 100 and flows out from the last composite cold plate structure 100, the composite cold plate structure 100 of the embodiment of the application can reduce the temperature of the fluid in the composite cold plate structure 100 far from the liquid inlet pipe 310, so that the temperature of the fluid in each composite cold plate structure 100 is more uniform and the heat dissipation performance of the composite cold plate structure 100 far from the liquid inlet pipe 310 is improved.

It should be appreciated that the composite cold plate structure 100 can also be used to cool and dissipate heat for other devices requiring heat dissipation. For convenience of description, the embodiment of the present application will be described by taking the composite cold plate structure 100 for dissipating heat from the chip 210 as an example. The chip 210 may be CPU, GPU, LED or a high-energy high-frequency electronic chip, which is not limited in this embodiment.

Referring to fig. 2 to 4, specifically, the composite cold plate structure 100 provided in the embodiment of the application includes a liquid inlet 110, a liquid outlet 120 and a cold plate assembly 130, the cold plate assembly 130 includes a cold plate body 131, a partition 132 and a heat dissipation member 133, a receiving cavity is formed in the cold plate body 131, the partition 132 is located in the receiving cavity to divide the receiving cavity into a first cavity 1311 and a second cavity 1312 for fluid circulation, an extending direction of the partition 132 is consistent with an extending direction of the cold plate body 131, and the heat dissipation member 133 is disposed in the first cavity 1311.

The liquid inlet 110 and the liquid outlet 120 are both located on the cold plate body 131, the liquid inlet 110 and the liquid outlet 120 are respectively close to two opposite ends of the extending direction of the cold plate body 131, the first chamber 1311 and the second chamber 1312 are both communicated with the liquid inlet 110, and the first chamber 1311 and the second chamber 1312 are both communicated with the liquid outlet 120.

In the present application, the liquid inlet 110 and the liquid outlet 120 are used for communicating the pipeline assembly 300, the liquid inlet 110 and the liquid outlet 120 are respectively close to opposite ends of the extending direction of the cold plate body 131, so that fluid enters the cold plate body 131 through the liquid inlet 110 and flows out of the cold plate body 131 through the liquid outlet 120, a containing cavity is provided in the cold plate body 131, the containing cavity is used for fluid to flow, so that fluid flows through the liquid inlet 110, the containing cavity and the liquid outlet 120 in sequence, the containing cavity is divided into a first cavity 1311 and a second cavity 1312 by a partition 132, the second cavity 1312 is located at one side of the first cavity 1311 away from the chip 210, that is, the first cavity 1311 is close to the chip 210, and the heat dissipating member 133 is located in the first cavity 1311, so that when the fluid flows through the heat dissipating member 133, the heat dissipating member 133 absorbs heat of the chip 210, thereby cooling the chip 210. The second chamber 1312 is used for adjusting the fluid flow in the first chamber 1311, when the power of the chip 210 is larger, the heat dissipation effect of the composite cold plate structure 100 can be improved by making the fluid flow in the second chamber 1312 corresponding to the chip 210 smaller than the fluid flow in the first chamber 1311 corresponding to the chip 210, that is, the fluid circulates more through the first chamber 1311, so that the heat dissipation element 133 absorbs and takes away more heat.

It will be appreciated that when multiple composite cold plate structures 100 are connected in series, fluid flows through the first chamber 1311 and the second chamber 1312 of each composite cold plate structure 100 in sequence, and each flow through one composite cold plate structure 100, since the fluid in the first chamber 1311 absorbs heat of the chip 210, the temperature of the fluid in the first chamber 1311 will rise, while the fluid in the second chamber 1312 does not absorb heat of the chip 210, the temperature of the fluid in the second chamber 1312 is lower, and the second chamber 1312 near the liquid outlet pipe 320 can provide low temperature fluid to the first chamber 1311 far from the liquid inlet pipe 310, so that the temperature of the fluid in the first chamber 1311 far from the liquid inlet pipe 310 is reduced, and the heat dissipation element 133 in the first chamber 1311 far from the liquid inlet pipe 310 absorbs more heat, so as to improve the heat dissipation effect of the composite cold plate structure 100 far from the liquid inlet pipe 310.

Wherein the fluid is a cooling liquid, the fluid flows in the direction indicated by the arrows in fig. 2 and 3.

In the composite cold plate structure 100 according to the embodiment of the present application, the accommodating cavity is provided in the cold plate body 131 for fluid circulation, and the liquid inlet 110 and the liquid outlet 120 are provided near opposite ends of the cold plate body 131 in the extending direction, so that the fluid enters the accommodating cavity through the liquid inlet 110 and flows out of the liquid outlet 120. By disposing the partition 132 in the cold plate body 131 to divide the accommodating chamber into the first chamber 1311 and the second chamber 1312, the first chamber 1311 is used for accommodating the heat dissipating member 133 and for fluid circulation, and the heat dissipating member 133 is used for dissipating heat. The second chamber 1312 is used for fluid circulation to adjust the fluid flow of the first chamber 1311, so as to improve the heat dissipation effect of the heat dissipation element 133, and in the tandem type composite cold plate structure 100, the second chamber 1312 at the upstream end can provide low-temperature fluid for the first chamber 1311 at the downstream end, so as to improve the heat dissipation effect of the heat dissipation element 133 at the downstream end, so that the heat dissipation effect of each heat dissipation element 133 in the tandem type composite cold plate structure 100 is more uniform. Thus, the heat dissipation effect of the composite cold plate structure 100 is better.

In some embodiments, the cold plate body 131 has opposite first and second sides, the bulkhead 132 is located between the first and second sides, the first chamber 1311 is located between the first side and the bulkhead 132, and the second chamber 1312 is located between the second side and the bulkhead 132. The distance between the second side and the partition 132 is less than or equal to the distance between the first side and the partition 132.

Thus, the receiving chamber may be partitioned into a first chamber 1311 and a second chamber 1312 by the partition 132, thereby regulating the flow of fluid in the first chamber 1311 through the second chamber 1312.

Specifically, the distance between the second side and the partition 132 may be made smaller than or equal to the distance between the first side and the partition 132. In this way, the fluid impedance of the second chamber 1312 is greater than that of the first chamber 1311, and under the condition that the total flow of the fluid is constant, the fluid entering from the liquid inlet 110 flows more to the liquid outlet 120 through the first chamber 1311, so that the fluid absorbs more heat, and the heat dissipation effect of the heat dissipation element 133 is improved.

In this way, the distance between the second side and the partition 132 and the distance between the first side and the partition 132 may be determined according to the heat radiation power of the heat radiation member 133. That is, when the heat dissipation power required by the heat dissipation element 133 is greater, the distance between the second side surface and the partition 132 may be made to be far smaller than the distance between the first side surface and the partition 132, so as to increase the fluid resistance of the second chamber 1312, thereby increasing the flow rate of the fluid in the first chamber 1311, so as to improve the heat dissipation effect of the heat dissipation element 133. When the heat dissipation power required by the heat dissipation element 133 is smaller, the distance between the second side and the partition 132 may be made equal to the distance between the first side and the partition 132, so that the fluid resistance of the first chamber 1311 and the fluid resistance of the second chamber 1312 are close in magnitude, thereby making the fluid flow rates in the first chamber 1311 and the second chamber 1312 close in order to reduce the heat dissipation power of the heat dissipation element 133.

Referring to fig. 2 and fig. 5 to fig. 11, in a possible implementation manner, the composite cold plate structure 100 provided by the embodiment of the present application further includes an impedance adjuster 140, where the impedance adjuster 140 is disposed in the second chamber 1312 or the liquid inlet 110, and the impedance adjuster 140 is used to adjust the fluid impedance of the second chamber 1312.

In this way, the fluid resistance of the second chamber 1312 may be adjusted by the resistance adjusting member 140, or the resistance of the fluid entering the second chamber 1312 through the fluid inlet 110 may be adjusted by the resistance adjusting member 140, whereby the resistance adjusting member 140 may adjust the fluid resistance of the second chamber 1312, so that the flow rate of the fluid in the first chamber 1311 may be adjusted according to the heat dissipation power of the heat dissipation member 133. That is, when the heat dissipation power required by the heat dissipation member 133 is greater, the fluid resistance of the second chamber 1312 is adjusted by the resistance adjustment member 140 so that the fluid resistance of the second chamber 1312 is greater, so that the fluid flow rate in the first chamber 1311 is increased, thereby improving the heat dissipation performance of the heat dissipation member 133. When the heat dissipation power required by the heat dissipation element 133 is smaller, the fluid impedance of the second chamber 1312 may be adjusted by the impedance adjuster 140, so that the fluid impedance of the second chamber 1312 is smaller, so that the fluid flow in the first chamber 1311 is properly reduced, thereby reducing the heat dissipation power of the heat dissipation element 133.

Referring to fig. 5 to 8, in one possible implementation, the impedance adjusting piece 140 includes at least one first adjusting block 141, an extending direction of the first adjusting block 141 is consistent with an extending direction of the second chamber 1312, the at least one first adjusting block 141 is located in the second chamber 1312, and the first adjusting block 141 is connected with an inner wall of the second chamber 1312.

Thus, by providing the adjustment block in the second chamber 1312 to adjust the cross-sectional area of the flow passage of the fluid in the second chamber 1312, the impedance of the fluid in the second chamber 1312 is adjusted, and the fluid flow rate in the first chamber 1311 is adjusted.

In some embodiments, the number of the first adjusting blocks 141 is two, the two first adjusting blocks 141 are disposed opposite to each other, and a first channel 150 for fluid communication is formed between the two first adjusting blocks 141.

Referring to fig. 2, 5 and 6, it will be appreciated that one of the two first adjustment blocks 141 may be provided on the partition 132 and the other may be provided on the second side such that the two first adjustment blocks 141 are disposed opposite to each other, and the cross-sectional area of the first passage 150 is adjusted by the two first adjustment blocks 141 to adjust the fluid resistance of the second chamber 1312, thereby adjusting the fluid flow rate in the first chamber 1311.

Referring to fig. 2, 7 and 8, or two first adjustment blocks 141 are respectively disposed at opposite sides of the second chamber 1312 in the fluid flow direction such that the two first adjustment blocks 141 are disposed opposite to each other, the cross-sectional area of the first passage 150 is adjusted by the two first adjustment blocks 141 to adjust the fluid resistance of the second chamber 1312, thereby adjusting the fluid flow rate in the first chamber 1311.

Referring to fig. 9, in a possible implementation manner of the composite cold plate structure 100 provided by the present application, the impedance adjusting member 140 includes at least one second adjusting block 142, an extending direction of the second adjusting block 142 is consistent with an extending direction of the liquid inlet 110, at least one second adjusting block 142 is located at a side of the liquid inlet 110 facing away from the first chamber 1311, and the second adjusting block 142 is connected to an inner wall of the liquid inlet 110.

Therefore, by disposing the second adjusting block 142 on the side of the liquid inlet 110 away from the first chamber 1311, the impedance of the fluid in the liquid inlet 110 entering the second chamber 1312 is increased, and the fluid impedance of the second chamber 1312 is further increased, so that the fluid flow of the first chamber 1311 is increased, and the heat dissipation effect of the heat dissipation element 133 is improved.

Referring to fig. 2, 10 and 11, in one possible implementation, the impedance adjusting member 140 is an adjusting plate 143, the adjusting plate 143 is located in the second chamber 1312, an extending direction of the adjusting plate 143 forms an included angle with an extending direction of the second chamber 1312, a side edge of the adjusting plate 143 is connected with an inner wall of the second chamber 1312, and a plurality of impedance adjusting holes are formed in the adjusting plate 143, and each impedance adjusting hole forms a plurality of second channels 160 for fluid circulation.

It is understood that the adjusting plate 143 may be disposed at any position in the second chamber 1312, that is, the adjusting plate 143 may be disposed at an end of the second chamber 1312 near the liquid inlet 110, the adjusting plate 143 may be disposed at an end of the second chamber 1312 near the liquid outlet 120, or the adjusting plate 143 may be disposed between two ends of the second chamber 1312 in the extending direction, so long as the fluid flows sequentially through the liquid inlet 110, each second channel 160, and the liquid outlet 120, which is not limited in this embodiment.

In this way, the fluid impedance of the second chamber 1312 can be adjusted by providing the adjusting plate 143 in the second chamber 1312, and in particular, the fluid impedance of the second chamber 1312 can be adjusted by adjusting the number of the impedance adjusting holes, which is simple and convenient. That is, the greater the number of the resistance adjustment holes in the adjustment plate 143, the greater the fluid resistance of the second chamber 1312, and the lesser the number of the resistance adjustment holes in the adjustment plate 143, the lesser the fluid resistance of the second chamber 1312.

In some embodiments, the heat sink 133 is a microchannel fin.

The micro-channel fin has the advantages of small volume, compact structure and higher heat transfer coefficient, and the micro-channel fin is selected as the heat dissipation element 133 to effectively absorb the heat of the chip 210 and transfer the heat to the cooling liquid, so that the chip 210 is effectively dissipated.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims (9)

1. The composite cold plate structure is characterized by comprising a liquid inlet, a liquid outlet and a cold plate assembly, wherein the cold plate assembly comprises a cold plate body, a partition plate and a heat dissipation piece, a containing cavity is formed in the cold plate body, the partition plate is positioned in the containing cavity so as to divide the containing cavity into a first cavity and a second cavity for fluid circulation, the extending direction of the partition plate is consistent with the extending direction of the cold plate body, and the heat dissipation piece is arranged in the first cavity;

the liquid inlet and the liquid outlet are both positioned on the cold plate body, the liquid inlet and the liquid outlet are respectively close to two opposite ends of the cold plate body in the extending direction, the first chamber and the second chamber are both communicated with the liquid inlet, and the first chamber and the second chamber are both communicated with the liquid outlet;

The device further comprises an impedance adjusting piece, wherein the impedance adjusting piece comprises at least one first adjusting block, the extending direction of the first adjusting block is consistent with that of the second chamber, the at least one first adjusting block is located in the second chamber, and the first adjusting block is connected with the inner wall of the second chamber.

2. The composite cold plate structure of claim 1 wherein the cold plate body has opposed first and second sides, the partition being located between the first and second sides, the first chamber being located between the first side and the partition, the second chamber being located between the second side and the partition;

The distance between the second side and the separator is less than or equal to the distance between the first side and the separator.

3. The composite cold plate structure of claim 2, wherein the impedance adjuster is disposed in the second chamber or the liquid inlet, and the impedance adjuster is configured to adjust the fluid impedance of the second chamber.

4. The composite cold plate structure of claim 1, wherein the number of the first adjusting blocks is two, the two first adjusting blocks are oppositely arranged, and a first channel for fluid circulation is formed between the two first adjusting blocks.

5. A composite cold plate structure according to claim 3, wherein the impedance adjusting member comprises at least one second adjusting block, the extending direction of the second adjusting block is consistent with the extending direction of the liquid inlet, the at least one second adjusting block is located at one side of the liquid inlet away from the first chamber, and the second adjusting block is connected with the inner wall of the liquid inlet.

6. A composite cold plate structure according to claim 3, wherein the impedance adjusting member is an adjusting plate, the adjusting plate is located in the second chamber, an included angle is formed between an extending direction of the adjusting plate and an extending direction of the second chamber, a side edge of the adjusting plate is connected with an inner wall of the second chamber, a plurality of impedance adjusting holes are formed in the adjusting plate, and a plurality of second channels for fluid circulation are formed in each of the impedance adjusting holes.

7. The composite cold plate structure of any one of claims 1-6, wherein the heat sink is a micro-channel fin.

8. An electronic device comprising a chip assembly and at least one composite cold plate structure as claimed in any one of claims 1 to 7, said composite cold plate structure being overlaid on said chip assembly.

9. The electronic device of claim 8, wherein the number of the chip assemblies is at least two, the chip assemblies comprise chips, the number of the composite cold plate structures is at least two, the composite cold plate structures are covered on the chips, the composite cold plate structures are arranged in one-to-one correspondence with the chips, and each composite cold plate structure is sequentially communicated.