CN220915298U - Electronic equipment - Google Patents

Abstract

The application provides electronic equipment, which comprises a shell and a loudspeaker module, wherein the loudspeaker module comprises a first shell, a second shell and a loudspeaker monomer, and the first shell and the shell of the electronic equipment are integrally arranged; the second shell is connected with the first shell, and the second shell and the first shell enclose an accommodating cavity; the speaker unit is arranged in the accommodating cavity and divides the accommodating cavity into a front cavity and a rear cavity. The electronic equipment provided by the application can improve the back cavity space of the speaker module and the acoustic performance of the speaker module.

Description

An electronic device

Technical Field

The present application relates to the field of electronic technology, and in particular to an electronic device.

Background technique

With the development of electronic equipment technology, the popularity of speaker modules in electronic equipment (such as mobile phones, tablets, laptops, etc.) is increasing. Electronic equipment is developing towards thinness, and the internal stacking space of electronic equipment is limited. Therefore, the back cavity volume of conventional speaker modules is limited, which affects the performance of acoustic performance.

Utility Model Content

The present application provides an electronic device capable of improving the back cavity space and acoustic performance of a speaker module.

In order to achieve the above objectives, this application adopts the following technical solutions:

An electronic device is provided, comprising:

shell;

The speaker module comprises a first shell, a second shell and a speaker unit, wherein the first shell is integrally arranged with the outer shell; the second shell is connected to the first shell, and the second shell and the first shell form a accommodating cavity; the speaker unit is arranged in the accommodating cavity and divides the accommodating cavity into a front cavity and a rear cavity.

The electronic device provided in the embodiment of the present application includes a housing and a speaker module, the speaker module includes a first shell, a second shell and a speaker unit, the first shell is integrally arranged with the housing, that is, the first shell of the speaker module is directly integrated with the housing, and the space in the housing can be flexibly utilized for stacking and assembly, the speaker module has a high degree of design freedom, and the design avoidance gap between the speaker module and the peripheral components can be smaller than the conventional design, which improves the utilization rate of the stacking space, thereby increasing the back cavity space of the speaker module, and improving the acoustic performance of the speaker module. At the same time, there is no need to use screws or other locking accessories to install the speaker module on the housing of the electronic device, so the assembly is simple, saving material costs and assembly procedures.

In some embodiments, the second shell includes an upper shell and a bracket that are fixedly connected, the upper shell cover is disposed on the first shell, and the bracket is disposed in the accommodating cavity and connected to the speaker unit.

By adopting the above technical solution, the second shell includes an upper shell and a bracket, the bracket is used to install the speaker unit and the upper shell is used to form a accommodating cavity with the first shell, which meets the requirements for assembling the speaker unit and is convenient for manufacturing and assembly.

In some embodiments, the first shell and the upper shell are fixedly connected by colloid.

By adopting the above technical solution, compared with the method of using ultrasound to connect the upper and lower plastic shells, the speaker module provided in the embodiment of the present application can reduce the wall thickness of the first shell and the upper shell and increase the back cavity space, thereby improving the acoustic performance of the speaker module.

In some embodiments, a limiting groove is provided in the first shell body, and one end of the upper shell is at least partially fixed in the limiting groove.

By adopting the above technical solution, the second shell can be limited by the limiting groove, thereby improving the positioning accuracy of the assembly.

In some embodiments, a first accommodating groove is further provided in the first shell body, the limiting groove is opened on the side wall of the first accommodating groove, the upper shell cover is provided on the first accommodating groove and the periphery of the upper shell is fitted in the limiting groove.

By adopting the above-mentioned technical scheme, the internal space of the first shell can be utilized to form a accommodating cavity, which is beneficial to increasing the volume of the rear cavity; the limiting groove is opened on the side wall of the first accommodating groove, the upper shell cover is arranged on the first accommodating groove and the periphery of the upper shell is attached to the limiting groove, so that the limiting groove can limit the upper shell, and at the same time the upper shell can form a accommodating cavity with the first shell.

In some embodiments, the upper shell is in the shape of a sheet, and the periphery of the upper shell is accommodated in the limiting groove.

By adopting the above technical solution, the upper shell does not need to be set too thick, and setting the upper shell in a sheet shape is beneficial to reducing the volume of the speaker module and facilitating the miniaturization of the electronic device.

In some embodiments, the speaker unit is accommodated in the first accommodating groove.

By adopting the above technical solution, the embodiment of the present application utilizes the first accommodating groove in the first shell to accommodate the speaker unit, which can reasonably utilize the space in the shell and is beneficial to reducing the volume and parts cost of the speaker module.

In some embodiments, the upper shell includes a cover plate and a side plate connected to the cover plate, the cover plate and the side plate form a second accommodating groove, the speaker unit is accommodated in the second accommodating groove, and the end of the side plate is fixed in the limiting groove.

By adopting the above technical solution, if it is inconvenient to set a raised side wall on the outer shell to enclose the first accommodating groove, it is only necessary to set a limiting groove on the outer shell to assemble the second shell on the outer shell. The speaker module is easy to assemble and has a wide range of applications.

In some embodiments, a colloid-containing gap for accommodating colloid is provided between the upper shell and the side wall of the limiting groove.

By adopting the above technical solution, the second shell can be bonded to the first shell through the glue in the glue-containing gap, which reduces the wall thickness of the first shell and the upper shell compared to the traditional speaker module, and further releases the back cavity space.

In some embodiments, the glue-containing gap surrounds the circumference of the upper shell, and the upper shell and the first shell are sealed and connected via a glue provided in the glue-containing gap.

By adopting the above technical solution, the glue-containing gap surrounds the circumference of the upper shell, that is, the glue-containing gap is annular and extends along the circumference of the upper shell. In this way, the circumference of the upper shell can be bonded to the first shell through the glue; and, since the glue-containing gap surrounds the circumference of the upper shell, the upper shell and the first shell can be sealed and connected by the glue arranged in the glue-containing gap, so that the accommodating cavity of the speaker module has a better sealing effect.

In some embodiments, the first shell and the upper shell are both metal parts.

By adopting the above technical solution, it is beneficial to reduce the thickness of the first shell and the upper shell, increase the internal space of the first shell and the internal space of the second shell, and then increase the volume of the rear cavity; at the same time, it can also improve the structural strength of the first shell and the upper shell.

In some embodiments, the bracket is a plastic part; the bracket and the upper shell are integrally formed, or the bracket and the upper shell are separately provided and fixedly connected.

By adopting the above technical solution, the bracket is a plastic part, so the bracket is light and easy to manufacture, and it is convenient to manufacture the bracket into a specific shape to meet the needs of installing the speaker unit.

In some embodiments, the bracket and the upper shell are made by injection molding, a connecting hole is provided on the upper shell, and the bracket includes a connecting portion extending into the connecting hole.

By adopting the above technical solution, the bracket and the upper shell are made by injection molding, which can avoid the use of glue or other consumables for achieving connection. The manufacturing method is simple and the cost is low, and the connection between the bracket and the upper shell is relatively stable.

In some embodiments, a first through hole is provided in the upper shell, a second through hole corresponding to and connected to the first through hole is provided in the bracket, and one end of the speaker unit is accommodated in the second through hole.

By adopting the above technical solution and setting corresponding through holes on the upper shell and the bracket, the speaker unit can be exposed from the second shell, which facilitates the sound output of the speaker module.

It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

FIG2 is a cross-sectional view of the electronic device shown in FIG1 ;

FIG3 is a partial enlarged view of portion A in FIG2 ;

FIG4 is a partial enlarged view of the housing and the first housing of the electronic device shown in FIG1 ;

FIG5 is a schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

FIG6 is a cross-sectional view of the electronic device shown in FIG5 ;

FIG. 7 is a partial schematic diagram of an electronic device provided in an embodiment of the present application.

Among them, the reference numerals in the figure are:

100. Speaker module;

110, accommodating chamber; 111, front chamber; 112, rear chamber;

10. first housing; 101. limiting groove; 102. first receiving groove; 11. bottom wall; 12. side wall;

20, second housing; 21, upper housing; 211, cover plate; 2111, first through hole; 212, side plate; 213, second receiving groove; 214, connecting hole; 22, bracket; 221, second through hole; 222, connecting part;

30. Speaker unit;

200. Electronic equipment;

210, housing;

220. Electronic devices.

Detailed ways

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inside", "outside", "up", "down", "left", "right", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

The terms "first", "second", etc. are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Moreover, the terms "first", "second", etc. do not limit the indicated features to be different.

In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In this application, "and/or" is only a description of the association relationship of associated objects, indicating that there can be three relationships; for example, A and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character "/" in this article generally indicates that the associated objects before and after are in an "or" relationship.

It should be noted that, in this application, words such as "in one embodiment", "exemplarily", "for example", etc. are used to indicate examples, illustrations or descriptions. Any embodiment or design described in this application as "in one embodiment", "exemplarily", "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment", "exemplarily", "for example", etc. is intended to present related concepts in a specific way.

In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

With the development of electronic equipment technology, the popularity of speaker modules in electronic equipment (such as mobile phones, tablets, laptops, etc.) is increasing. Electronic equipment is developing towards thinness, and the internal stacking space of electronic equipment is limited. Therefore, the back cavity volume of conventional speaker modules is limited, which affects the performance of acoustic performance.

Research has found that conventional speaker modules include a plastic shell and a speaker unit assembled in the plastic shell. After the speaker module is assembled, the speaker module is installed in the housing. Due to the limited internal stacking space of electronic equipment and the need to consider avoiding surrounding devices when assembling the speaker module, the speaker module has low stacking freedom and the volume of the back cavity is limited.

In view of this, the present application provides an electronic device, including a housing and a speaker module, the speaker module including a first shell, a second shell and a speaker unit, the first shell is integrally arranged with the housing; the second shell is connected to the first shell and encloses a receiving cavity; the speaker unit is arranged in the receiving cavity and divides the receiving cavity into a front cavity and a rear cavity. In this way, the first shell of the speaker module is integrally arranged with the housing, that is, the first shell of the speaker module is directly integrated on the housing, the space in the housing can be flexibly utilized for stacking and assembly, the design gap between the speaker module and the peripheral devices can be smaller than the conventional design, the utilization rate of the stacking space is improved, and then the rear cavity space of the speaker module can be increased, and the acoustic performance of the speaker module is improved.

The speaker module is used to restore audio electrical signals such as music and voice into sound, and can support the function of external audio playback; the speaker module is applied to electronic devices, which are a type of electronic devices with sound playback function. Specifically, the electronic devices include but are not limited to mobile phones, tablet personal computers, notebook computers, laptop computers, personal digital assistants (PDAs), personal computers, vehicle-mounted devices, wearable devices, walkmans, radios, televisions, speakers, etc. Among them, wearable devices include but are not limited to smart bracelets, smart watches, smart head-mounted displays, smart glasses, etc.

The embodiment of the present application provides an electronic device. Referring to FIG. 1 and FIG. 2 , the electronic device 200 includes a housing 210 and a speaker module 100, the speaker module 100 includes a first shell 10, a second shell 20 and a speaker unit 30, the first shell 10 is integrally arranged with the housing 210, the second shell 20 is connected to the first shell 10, and the second shell 20 and the first shell 10 enclose a receiving cavity 110; the speaker unit 30 is arranged in the receiving cavity 110 and divides the receiving cavity 110 into a front cavity 111 and a rear cavity 112.

The housing 210 is used to protect the internal electronic components of the electronic device 200. The housing 210 may be the entire housing of the electronic device 200. For example, if the electronic device 200 is a mobile phone, the housing 210 is connected to the screen and is used to accommodate electronic components such as batteries and circuit boards. It is understood that the material of the housing 210 includes but is not limited to metal, ceramic, plastic and glass. Optionally, the housing 210 is made of metal, which ensures structural strength while achieving lightweight electronic devices.

The speaker module 100 is arranged on the housing 210, wherein the first housing 10 of the speaker module 100 is integrally arranged with the housing 210, that is, the first housing 10 is integrated with the housing 210, and the first housing 10 and the housing 210 are an integral structure. The first housing 10 can be a flat plate or a hollow structure with one end open; since the speaker unit 30 is roughly in the shape of a rectangular parallelepiped, the first housing 10 can also be in the shape of a rectangular parallelepiped, but is not limited thereto. The first housing 10 is integrated with the housing 210, so the shape of the first housing 10 has a high degree of freedom and is flexible to stack.

The second shell 20 is fixedly connected to the first shell 10 to enclose a receiving cavity 110 for accommodating the speaker unit 30. The material of the second shell 20 includes but is not limited to metal, plastic, etc. Since the first shell 10 and the outer shell 210 are integrally arranged, the part of the outer shell 210 used to enclose the receiving cavity 110 with the second shell 20 is the first shell 10. Therefore, the first shell 10 can be arranged flush with the outer shell 210, or it can be protruding or recessed relative to the surface of the outer shell 210, as long as the first shell 10 can be connected to the second shell 20 and enclose the receiving cavity 110.

The speaker unit 30 is a core element for generating sound in the speaker module 100. The speaker unit 30 may include a diaphragm and a driving device disposed on one side of the diaphragm, the driving device being used to drive the diaphragm to vibrate, so as to drive the air in the front cavity 111 to vibrate and form sound waves. The present application does not limit the specific structure of the speaker unit 30.

The speaker unit 30 can be fixedly connected to the first shell 10 or the second shell 20, and then the speaker unit 30 can be fixed in the accommodating cavity 110. Optionally, the speaker unit 30 can be connected to the second shell 20 by bonding, snapping, threading, etc., which are not limited here. The speaker unit 30 divides the accommodating cavity 110 into a front cavity 111 and a rear cavity 112, wherein the first shell 10, the second shell 20 and the speaker unit 30 together enclose the rear cavity 112, and the volume of the rear cavity 112 affects the acoustic performance of the speaker module 100.

During assembly, the speaker unit 30 is first fixed to the second housing 20, and then the second housing 20 is fixedly connected to the first housing 10, so that the speaker module 100 can be assembled and the speaker module 100 can be installed in the electronic device 200. The speaker module 100 of the embodiment of the present application is integrated on the housing 210, eliminating the screws and other locking accessories and assembly procedures for assembling the conventional speaker module 100 to the whole machine, saving the material cost of the whole machine.

The electronic device 200 provided in the embodiment of the present application includes a housing 210 and a speaker module 100. The speaker module 100 includes a first shell 10, a second shell 20 and a speaker unit 30. The first shell 10 is integrally arranged with the housing 210, that is, the first shell 10 of the speaker module 100 is directly integrated with the housing 210, and the space in the housing 210 can be flexibly utilized for stacking and assembly. The speaker module 100 has a high degree of design freedom, and the design gap between the speaker module 100 and the surrounding components can be smaller than the conventional design, which improves the utilization rate of the stacking space, thereby increasing the space of the back cavity 112 and improving the acoustic performance of the speaker module 100. At the same time, the first shell 10 is integrated with the housing 210, and only the second shell 20 needs to be fixedly connected to the first shell 10, and there is no need to use screws or other locking accessories to install the pre-assembled speaker module 100 on the electronic device 200, which is simple to assemble and saves material costs and assembly processes.

Please refer to FIGS. 1 to 4 . In some embodiments, the second shell 20 includes an upper shell 21 and a bracket 22 that are fixedly connected. The upper shell 21 is covered on the first shell 10 . The bracket 22 is disposed in the accommodating cavity 110 and connected to the speaker unit 30 .

The upper shell 21 is used to enclose a receiving cavity 110 with the first shell 10, and the bracket 22 is used to install the speaker unit 30 and limit the speaker unit 30. The upper shell 21 and the bracket 22 can be integrally formed, or they can be separately provided and fixedly connected. The materials of the upper shell 21 and the bracket 22 can be selected from metal, plastic, etc. Optionally, the upper shell 21 is a metal part, and the structural strength of the upper shell 21 is relatively high; the bracket 22 is a plastic part, which is convenient for molding and realizing the function of the bracket 22. The bracket 22 and the speaker unit 30 together divide the receiving cavity 110 into a front cavity 111 and a rear cavity 112. The upper shell 21 can be a flat plate, but is not limited to this. The upper shell 21 can also be a box-shaped structure with one end open.

By adopting the above technical solution, the second shell 20 includes an upper shell 21 and a bracket 22. The bracket 22 is used to install the speaker unit 30 and the upper shell 21 is used to enclose a accommodating cavity 110 with the first shell 10, which meets the assembly requirements of the speaker unit 30 and facilitates manufacturing and assembly.

In some embodiments, the first shell 10 and the upper shell 21 are fixedly connected by colloid.

The upper shell 21 is covered on the first shell 10, and the first shell 10 and the upper shell 21 are fixedly connected by colloid, that is, the peripheral side of the upper shell 21 is fixedly connected to the first shell 10 by colloid. The colloid includes but is not limited to one or more of UV glue (also called shadowless glue), polyurethane, silicone rubber, polysulfide rubber, chloroprene rubber and epoxy resin sealant.

The upper shell and the lower shell in the traditional speaker module are both made of plastic and are fixedly connected by ultrasonic welding, which requires the upper and lower shells to have a certain wall thickness; the speaker module 100 provided in the embodiment of the present application connects the upper shell 21 with the first shell 10 integrated on the outer shell 210, thereby releasing a part of the back cavity space; at the same time, the first shell 10 and the upper shell 21 are bonded by colloid, which reduces the wall thickness of the connection between the first shell 10 and the upper shell 21 compared with the traditional speaker module, thereby further releasing the back cavity space.

By adopting the above technical solution, the speaker module 100 provided in the embodiment of the present application can reduce the wall thickness of the first shell 10 and the upper shell 21 and increase the back cavity space, thereby improving the acoustic performance of the speaker module 100.

In other embodiments, the first shell 10 and the upper shell 21 are not limited to being connected by colloid, for example, the first shell 10 and the upper shell 21 may also be connected by ultrasonic welding.

In some embodiments, a limiting groove 101 is provided in the first shell 10 , and one end of the upper shell 21 is at least partially fixed in the limiting groove 101 .

The limiting groove 101 is used to limit the assembly of the second shell 20. The depth of the limiting groove 101 is not limited and can be set according to the shell 210; the structure of the limiting groove 101 is adapted to one end of the upper shell 21 so as to accommodate at least part of the upper shell 21. For example, in some embodiments, the limiting groove 101 is a rectangular annular groove provided at the edge of the first shell 10. In other embodiments, the limiting groove 101 can also be multiple and spaced apart, and the multiple limiting grooves 101 together limit the upper shell 21.

During assembly, one end of the upper shell 21 is fixed in the limiting groove 101. The bottom of the limiting groove 101 can limit the height direction of the upper shell 21, and the wall of the limiting groove 101 can limit the upper shell 21 in a plane perpendicular to the height direction. Then, glue is applied to the limiting groove 101 to bond and fix the first shell 10 to the upper shell 21. It is understandable that glue can also be applied to the bottom of the limiting groove 101 first, and then one end of the upper shell 21 is fixed in the limiting groove 101.

By providing the limiting groove 101 in the first shell 10 , the limiting groove 101 can be used to limit the second shell 20 , thereby improving the alignment accuracy of the assembly.

In other embodiments, the limiting groove 101 can be omitted as long as the second housing 20 can be accurately aligned with the first housing 10. For example, the first housing 10 is flat and protrudes from the surface of the outer shell 210, and the first housing 10 is accommodated in one end of the upper shell 21, that is, the upper shell 21 covers the entire first housing 10 and fits the side of the first housing 10. For another example, the second housing 20 is assembled by auxiliary tooling to ensure alignment accuracy.

In some embodiments, a first accommodating groove 102 is further provided in the first shell body 10, the upper shell 21 is covered on the first accommodating groove 102, the limiting groove 101 is opened on the side wall of the first accommodating groove 102, the upper shell 21 is covered on the first accommodating groove 102 and the periphery of the upper shell 21 is fitted in the limiting groove 101.

The first housing 10 includes a bottom wall 11 and a side wall 12 connected to one side of the bottom wall 11. The bottom wall 11 and the side wall 12 enclose a first receiving groove 102, and the side wall 12 may protrude from the surface of the housing 210. The first receiving groove 102 is a part of the receiving cavity 110, and the speaker unit 30 may be partially accommodated in the first receiving groove 102. The limiting groove 101 is provided on the side wall 12 of the first receiving groove 102. Specifically, the limiting groove 101 is provided at the top of the side wall 12 of the first receiving groove 102; the first receiving groove 102 may be a rectangular groove and have four side walls 12, and the limiting groove 101 is provided along the four side walls 12, so that the top of the side wall 12 is stepped. It can be understood that the limiting groove 101 is not limited to a rectangular groove, but may also be circular, hexagonal or other shapes.

By setting the first accommodating groove 102 in the first shell 10, the internal space of the first shell 10 can be used to form the accommodating cavity 110, which is beneficial to increase the volume of the rear cavity 112; the limiting groove 101 is opened on the side wall 12 of the first accommodating groove 102, and the upper shell 21 is covered on the first accommodating groove 102 and the periphery of the upper shell 21 is attached to the limiting groove 101, so that the limiting groove 101 can limit the upper shell 21, and at the same time, the upper shell 21 can form the accommodating cavity 110 with the first shell 10.

Please continue to refer to FIG. 1 to FIG. 4 . In some embodiments, the first shell 10 is protruded from the surface of the outer shell 210 .

The housing 210 is an integrally formed structure. When manufacturing the housing 210, a protruding housing structure is directly provided on the surface of the housing 210, so that the first housing 10 having the first receiving groove 102 can be manufactured. Since the first housing 10 is provided protrudingly on the surface of the housing 210, the first receiving groove 102 can have a certain depth to form the receiving cavity 110; it can be understood that the height of the first housing 10 can be set according to the needs of the speaker module 100 and the structure of the electronic device.

By adopting the above technical solution, the first shell 10 is integrated on the outer shell 210 and is convenient for forming a first receiving groove 102 with a certain depth, which is beneficial for increasing the space of the rear cavity 112 .

In other embodiments, the first receiving groove 102 may also be recessed on the housing 210 .

As shown in FIG. 1 , in some embodiments, the upper shell 21 is in a sheet shape, and the periphery of the upper shell 21 is accommodated in the limiting groove 101 .

The upper shell 21 is in sheet shape, that is, the thickness of the upper shell 21 is small, and the thickness of the upper shell 21 is less than the thickness of the first shell 10. The upper shell 21 can be in a rectangular sheet shape, and it can be understood that the upper shell 21 can also be in a circular sheet shape.

The periphery of the upper shell 21 is accommodated in the limiting groove 101, that is, the edge of each side of the upper shell 21 is respectively accommodated in the limiting groove 101. For example, the limiting groove 101 is a rectangular ring groove, the upper shell 21 is a rectangular sheet, the periphery of the upper shell 21 is against the bottom of the limiting groove 101 and is fixed in the limiting groove 101 by colloid, so that the limiting groove 101 can limit the upper shell 21.

In addition, the thickness of the upper shell 21 may be less than or equal to the thickness of the limiting groove 101 so that the top surface of the speaker module 100 is flat; in other embodiments, the thickness of the upper shell 21 may also be greater than the thickness of the limiting groove 101.

Since the side wall 12 of the first shell 10 protrudes from the outer shell 210, the first receiving groove 102 has a certain receiving space to accommodate the battery cell. Therefore, the upper shell 21 does not need to be set too thick. In this embodiment, the upper shell 21 is set to a sheet shape, which is beneficial to reducing the volume of the speaker module 100 and facilitating the miniaturization of the electronic device.

As shown in FIG. 2 , in some embodiments, the speaker unit 30 is received in the first receiving groove 102 .

The upper shell 21 is supported against the bottom of the limiting groove 101, and the bracket 22 is connected to the upper shell 21, so that the bracket 22 can be at least partially accommodated in the first accommodating groove 102; the speaker unit 30 is installed on the bracket 22, so that the speaker unit 30 can be partially or completely accommodated in the first accommodating groove 102.

By adopting the above technical solution, the embodiment of the present application utilizes the first receiving groove 102 in the first shell 10 to accommodate the speaker unit 30, which can reasonably utilize the space in the outer shell 210, which is beneficial to reducing the volume and parts cost of the speaker module 100.

5 and 6, the embodiment of the present application provides another electronic device 200, including a housing 210 and a speaker module 100. The speaker module 100 includes a first housing 10, a second housing 20 and a speaker unit 30, wherein the first housing 10 is integrally provided with the housing 210; the second housing 20 is connected with the first housing 10 and encloses a receiving cavity 110; the speaker unit 30 is provided in the receiving cavity 110 and divides the receiving cavity 110 into a front cavity 111 and a rear cavity 112.

The first housing 10 includes an upper housing 21 and a bracket 22 connected to the upper housing 21. In this embodiment, the upper housing 21 includes a cover plate 211 and a side plate 212 connected to the cover plate 211. The cover plate 211 and the side plate 212 form a second receiving groove 213. The speaker unit 30 is received in the second receiving groove 213, and the end of the side plate 212 is fixed in the limiting groove 101. The cover plate 211 and the side plate 212 can be provided as one piece, or they can be provided separately and fixedly connected.

Optionally, the cover plate 211 is rectangular, and the side plate 212 is vertically connected to the cover plate 211 to enclose a rectangular second receiving groove 213. When manufacturing the upper shell 21, a sheet of metal can be stamped into a cover shape with a certain depth.

In this embodiment, the limiting groove 101 is recessed on the first shell 10, and the limiting groove 101 is a rectangular groove; in other embodiments, the limiting groove 101 may also be a circular groove or a groove of other shapes.

The end of the side plate 212 is fixed in the limiting groove 101, and the limiting groove 101 is used to limit the assembly of the first shell 10; the side plate 212 can be fixedly connected to the first shell 10 by bonding, welding, etc. For example, the bracket 22 is first fixed to the upper shell 21, one end of the side plate 212 is accommodated and limited in the limiting groove 101, and then glue is dispensed in the limiting groove 101 to fix the side plate 212 on the first shell 10 and seal the accommodating cavity 110 with glue.

By adopting the above-mentioned technical solution, the second accommodating groove 213 in the second shell 20 has a larger volume, which can accommodate the speaker unit 30 and form a larger rear cavity space. There is no need to set the first accommodating groove 102 on the first shell 10, and there is no requirement for the depth of the limiting groove 101, as long as the first shell 10 can be limited. Therefore, if it is not convenient to set a raised side wall on the outer shell 210 to enclose the first accommodating groove 102, it is only necessary to set the limiting groove 101 in the first shell 10, and the second shell 20 can be assembled on the outer shell of the whole machine. The speaker module 100 is easy to assemble and has a wide range of applications.

Referring to FIG. 1 to FIG. 6 , in some embodiments, a glue-containing gap for accommodating the colloid is provided between the upper shell 21 and the side wall of the limiting groove 101 .

The glue-containing gap is used to contain the colloid. The upper shell 21 can be bonded to the first shell 10 through the colloid in the glue-containing gap, and the colloid can also seal the containing cavity 110 .

Optionally, as shown in FIG. 3 , the cross-sectional dimension of the limiting groove 101 may be greater than the cross-sectional dimension of the upper shell 21 , and a glue-containing gap is formed between the side plate 212 and the side wall 12 of the limiting groove 101 .

Optionally, as shown in FIG. 6 , an edge of the limiting groove 101 is provided with a guide slope, and a glue-containing gap is formed between the side plate 212 and the guide slope.

By adopting the above technical solution, the second shell 20 can be bonded to the first shell 10 through the glue in the glue gap, which reduces the wall thickness required for ultrasonic welding at the connection between the first shell 10 and the upper shell 21 compared to the traditional speaker module 100, and further releases the back cavity space.

In some embodiments, the glue-containing gap surrounds the circumference of the upper shell 21 , and the upper shell 21 and the first shell 10 are sealed and connected via a glue provided in the glue-containing gap.

The glue-containing gap surrounds the circumference of the upper shell 21, that is, the glue-containing gap is annular and extends along the circumference of the upper shell 21, so that the circumference of the upper shell 21 can be bonded to the first shell 10 through the glue; and because the glue-containing gap surrounds the circumference of the upper shell 21, the upper shell 21 and the first shell 10 can be sealed and connected through the glue provided in the glue-containing gap, so that the accommodating cavity 110 of the speaker module 100 has a better sealing effect. Compared with the traditional ultrasonic welding connection method, the speaker module 100 provided in the embodiment of the present application will not have the problems of ultrasonic fracture and poor sealing effect.

In some embodiments, the first shell 10 and the upper shell 21 are both metal parts.

The first shell 10 and the outer shell 210 are integrally arranged, so the first shell 10 and the outer shell 210 are both made of metal; the upper shell 21 is also made of metal. The metal material can be stainless steel, aluminum alloy, magnesium-aluminum alloy, etc. The metal has a higher hardness, a thinner thickness, and does not require ultrasonic welding, which is conducive to reducing the thickness of the first shell 10 and the upper shell 21, increasing the internal space of the first shell 10 and the internal space of the second shell 20, and then increasing the volume of the rear cavity 112; in addition, the overall strength of the first shell 10 and the upper shell 21 made of metal is also better than that of traditional plastic upper and lower shells. In some embodiments, at the sealing part of the first shell 10 and the upper shell 21, the wall thickness of the first shell 10 and the upper shell 21 can be thinned by more than 70% compared with the wall thickness of conventional plastic upper and lower shells. For example, the wall thickness of conventional plastic upper and lower shells is 0.75mm, and the wall thickness of the first shell 10 and/or upper shell 21 of the embodiment of the present application can be 0.2mm, and the wall thickness is thinned by 73%. It should be noted that the wall thickness of the first shell 10 and/or the upper shell 21 is not limited to 0.2 mm and can be set according to requirements.

In addition, the first shell 10 and the upper shell 21 are both metal parts and are bonded by colloid. Compared with the traditional ultrasonic connection solution, it has lower cost, simpler operation, more reliable sealing, and will not cause the problem of ultrasonic fracture.

In some embodiments, the bracket 22 is a plastic part; the bracket 22 and the upper shell 21 are integrally formed, or the bracket 22 and the upper shell 21 are separately provided and fixedly connected.

The upper shell 21 is a metal part, the bracket 22 is a plastic part, and the bracket 22 is fixedly connected to the upper shell 21. Optionally, the bracket 22 and the upper shell 21 are integrally formed, for example, the bracket 22 and the upper shell 21 are fixed together by injection molding; optionally, the bracket 22 and the upper shell 21 can also be separately provided and fixedly connected by means of clamping, threading, bonding, etc.

By adopting the above technical solution, the bracket 22 is a plastic part, so that the bracket 22 is light and easy to manufacture, and the bracket 22 can be easily manufactured into a specific shape to meet the requirements of installing the speaker unit 30 .

1 and 5 , in some embodiments, the bracket 22 and the upper shell 21 are made by injection molding. The upper shell 21 is provided with a connecting hole 214 , and the bracket 22 includes a connecting portion 222 extending into the connecting hole 214 .

The number of the connection holes 214 and the connection parts 222 can be multiple and they are arranged one by one. For example, as shown in FIG. 5 , multiple connection holes 214 are arranged on at least two sides of the upper shell 21, and multiple connection parts 222 are also arranged on at least two sides of the bracket 22; the connection holes 214 are through holes, and of course, the connection holes 214 can also be blind holes. During production, the bracket 22 with the connection holes 214 can be placed in a mold first, and then molten plastic is injected into the mold, and part of the plastic flows into the connection holes 214; after demolding, the bracket 22 and the upper shell 21 can be formed as an integral body, and the bracket 22 is formed with a connection part 222 extending into the connection hole 214 to improve the connection stability between the bracket 22 and the upper shell 21.

By adopting the above technical solution, the bracket 22 and the upper shell 21 are made by injection molding, which can avoid the use of glue or other materials for achieving connection. The manufacturing method is simple and the cost is low, and the connection between the bracket 22 and the upper shell 21 is relatively stable.

Please refer to Figures 1 and 2. In some embodiments, a first through hole 2111 is defined in the upper shell 21, a second through hole 221 corresponding to and connected to the first through hole 2111 is defined in the bracket 22, the speaker unit 30 is bonded to the bracket 22 and one end of the speaker unit 30 is accommodated in the second through hole 221.

The first through hole 2111 is disposed in the middle of the upper shell 21 , and the second through hole 221 is disposed in the middle of the bracket 22 . The first through hole 2111 corresponds to and is connected with the second through hole 221 , so as to expose the speaker unit 30 .

By providing corresponding through holes on the upper shell 21 and the bracket 22 , the speaker unit 30 can be exposed from the second shell 20 , so that the speaker module 100 can produce sound more easily.

Please refer to Figures 1, 2, 5 and 6. Some embodiments of the present application provide an electronic device 200, including a housing 210 and a speaker module 100. The speaker module 100 includes a first shell 10, a second shell 20 and a speaker unit 30. The first shell 10 is a metal part and is integrally arranged with the housing 210. The second shell 20 includes an upper shell 21 and a bracket 22. The upper shell 21 is a metal part and the bracket 22 is a plastic part. The upper shell 21 and the first shell 10 enclose a receiving cavity 110. The speaker unit 30 is arranged in the receiving cavity and connected to the bracket 22. The speaker unit 30 divides the receiving cavity 110 into a front cavity 111 and a rear cavity 112. Among them, a limiting groove 101 is provided on the first shell 10, and one end of the upper shell 21 is connected to the limiting groove 101 through a colloid, and the colloid can also seal the receiving cavity 110.

In the speaker module 100 provided in the embodiment of the present application, the first shell 10 and the upper shell 21 are both metal parts and are bonded together by colloid, which reduces the wall thickness and increases the space of the back cavity; at the same time, the first shell 10 and the outer shell 210 are arranged integrally, which improves the utilization rate of the stacking space, saves materials and processes for assembling and fixing the speaker module 100 with the whole machine, reduces manufacturing costs and improves manufacturing efficiency.

The first shell 10 of the speaker module 100 shares the shell wall with the whole machine, which releases the wall thickness required for ultrasound of traditional plastic upper and lower shells and the wall thickness of the lower shell in the Z direction (the thickness direction of the electronic device 200), thereby improving the back cavity space and acoustic performance of the speaker module 100 and making the whole machine thinner; moreover, the first shell 10 integrated on the shell can be flexibly stacked in a limited space, thereby improving the utilization rate of the stacking space.

Referring to FIG. 7 , the electronic device 200 further includes an electronic device 220 disposed adjacent to the speaker module 100 . The electronic device 220 may be a battery or a speaker peripheral device.

The first shell 10 of the speaker module 100 is integrated on the outer shell 210. The design avoidance gap between the speaker module 100 and the electronic components 220 around the whole machine assembly can be smaller than that of a conventional assembly, which greatly improves the utilization rate of the stacking space, saves materials and processes for fixing the speaker module 100 and the whole machine assembly, reduces manufacturing costs and improves manufacturing efficiency.

Finally, it should be noted that the above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (14)

1. An electronic device, comprising: shell; A speaker module comprises a first shell, a second shell and a speaker unit, wherein the first shell is integrally arranged with the outer shell and integrated on the outer shell; the second shell is connected to the first shell and the second shell and the first shell form a accommodating cavity; the speaker unit is arranged in the accommodating cavity and divides the accommodating cavity into a front cavity and a rear cavity. 2. The electronic device as claimed in claim 1, characterized in that: the second shell comprises an upper shell and a bracket which are fixedly connected, the upper shell cover is arranged on the first shell, and the bracket is arranged in the accommodating cavity and connected to the speaker unit. 3 . The electronic device as claimed in claim 2 , wherein the first shell and the upper shell are fixedly connected via colloid. 4. The electronic device according to claim 3, characterized in that: a limiting groove is provided in the first shell, and one end of the upper shell is at least partially fixed in the limiting groove. 5. The electronic device as described in claim 4 is characterized in that: a first accommodating groove is also provided in the first shell, the limiting groove is opened on the side wall of the first accommodating groove, the upper shell cover is provided on the first accommodating groove and the periphery of the upper shell is attached to the limiting groove. 6 . The electronic device according to claim 5 , wherein the upper shell is in sheet shape, and the periphery of the upper shell is accommodated in the limiting groove. 7 . The electronic device according to claim 5 , wherein the speaker unit is accommodated in the first accommodation groove. 8. The electronic device as described in claim 4 is characterized in that: the upper shell includes a cover plate and a side plate connected to the cover plate, the cover plate and the side plate form a second accommodating groove, the speaker unit is accommodated in the second accommodating groove, and the end of the side plate is fixed in the limiting groove. 9. The electronic device according to any one of claims 4 to 8, characterized in that a colloid-containing gap for accommodating colloid is provided between the upper shell and the side wall of the limiting groove. 10. The electronic device according to claim 9, wherein the adhesive gap surrounds the circumference of the upper shell, and the upper shell and the first shell are sealed and connected via a colloid disposed in the adhesive gap. 11. The electronic device according to any one of claims 2 to 8, wherein the first housing and the upper housing are both made of metal. 12 . The electronic device according to claim 11 , wherein the bracket is a plastic part; the bracket and the upper shell are integrally formed, or the bracket and the upper shell are separately formed and fixedly connected. 13 . The electronic device according to claim 12 , wherein the bracket and the upper shell are made by injection molding, a connecting hole is provided on the upper shell, and the bracket includes a connecting portion extending into the connecting hole. 14. The electronic device according to any one of claims 2 to 8, characterized in that: a first through hole is provided in the upper shell, a second through hole corresponding to and connected to the first through hole is provided in the bracket, and one end of the speaker unit is accommodated in the second through hole.