[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2022073384A1 - Camera module and electronic device having same - Google Patents

Camera module and electronic device having same Download PDF

Info

Publication number
WO2022073384A1
WO2022073384A1 PCT/CN2021/112573 CN2021112573W WO2022073384A1 WO 2022073384 A1 WO2022073384 A1 WO 2022073384A1 CN 2021112573 W CN2021112573 W CN 2021112573W WO 2022073384 A1 WO2022073384 A1 WO 2022073384A1
Authority
WO
WIPO (PCT)
Prior art keywords
camera module
bracket
module according
circuit board
light
Prior art date
Application number
PCT/CN2021/112573
Other languages
French (fr)
Chinese (zh)
Inventor
梁镓俊
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202022230007.6U external-priority patent/CN212992431U/en
Priority claimed from CN202011071767.5A external-priority patent/CN112118377A/en
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2022073384A1 publication Critical patent/WO2022073384A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present application relates to the field of electronic technology, and in particular, to a camera module and an electronic device having the same.
  • an electronic device is usually provided with a camera module.
  • the thickness of the camera module is relatively large and takes up a large space, which is not conducive to the light and thin design of the electronic device.
  • One purpose of the present application is to propose a camera module, the camera module has a small thickness, which is beneficial to realize the light and thin design of electronic equipment.
  • the present application also proposes an electronic device having the above-mentioned camera module.
  • the camera module includes: a circuit board; a photosensitive element, the photosensitive element is arranged on the circuit board; a connecting wire, one end of the connecting wire is connected to the photosensitive element, so The other end of the connecting wire is connected to the circuit board; a bracket, the bracket is arranged on the circuit board, the bracket is provided with a light-passing hole, the light-passing hole is opposite to the photosensitive element, the The projection of the outline of the light-passing hole on the circuit board is located outside the connection line; the filter element is supported on the bracket.
  • the electronic device includes the camera module according to the embodiment of the first aspect of the present application.
  • FIG. 1 is a perspective view of a camera module according to an embodiment of the present application.
  • FIG. 2 is a cross-sectional view of a camera module according to an embodiment of the present application.
  • Figure 2a is an enlarged view of the circled part A in Figure 2;
  • FIG. 3 is a cross-sectional view of a camera module according to another embodiment of the present application.
  • Figure 3a is an enlarged view of the circled part B in Figure 3;
  • FIG. 4 is a cross-sectional view of a camera module according to yet another embodiment of the present application.
  • Figure 4a is an enlarged view of the circled portion C in Figure 4;
  • FIG. 5 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • the camera module 100 includes a circuit board 1 , a photosensitive element 2 , a connecting wire 3 , a bracket 4 and a filter element 5 .
  • the photosensitive element 2 is arranged on the circuit board 1 .
  • the photosensitive element 2 is a chip, the photosensitive element 2 can be laid on the circuit board 1 , and the photosensitive element 2 is electrically connected to the circuit board 1 .
  • One end of the connecting wire 3 is connected to the photosensitive element 2 , and the other end of the connecting wire 3 is connected to the circuit board 1 .
  • the connecting wire 3 is a gold wire.
  • the bracket 4 is arranged on the circuit board 1 , and the filter element 5 is supported on the bracket 4 .
  • the filter element 5 may be blue glass, but is not limited thereto.
  • the bracket 4 is provided with a light-passing hole 40 .
  • the light-passing hole 40 is opposite to the photosensitive element 2 and the filter element 5 .
  • the direction “inside” in this application refers to the side adjacent to the center of the camera module 100
  • the direction “outside” in this application refers to a side away from the center of the camera module 100 . side.
  • the orientation or positional relationship indicated by the terms “inner”, “outer”, “upper”, “lower”, etc. is based on the orientation or positional relationship shown in the accompanying drawings, only for the purpose of It is convenient to describe the application and to simplify the description, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application.
  • the inner end of the connecting wire 3 is connected to the photosensitive element 2
  • the outer end of the connecting wire 3 is connected to the circuit board 1 .
  • the orthographic projection of the outline of the light-passing hole 40 on the circuit board 1 is located outside the connection line 3 .
  • the thickness dimension of the camera module 100 is the sum of the height of the lens body, the back focus distance of the lens, the thickness of the photosensitive element 2 and the thickness of the circuit board 1 .
  • the back focus distance of the lens is the distance between the lens assembly and the photosensitive element 2 .
  • the lens assembly includes a motor 6 and a lens 7 . 2-4, the motor 6 is provided with a mounting groove, and the lens 7 is mounted in the mounting groove. The motor 6 can be directly connected to the circuit board 1 or connected to the bracket 4 .
  • the back focus distance of the lens of the camera module 100 in the present application is the sum of the thickness of the photosensitive element 2 and the height of the avoidance space of the connecting line 3, while the back focus of the lens of the camera module 100 in the related art
  • the distance is the sum of the thickness of the photosensitive element 2 , the thickness of the bracket 4 and the height of the avoidance space for avoiding the connection line 3 .
  • the orthographic projection of the outline of the light-passing hole 40 on the circuit board 1 is located outside the connection line 3, and by making the filter element 5 and the light-passing hole 40 larger, The superposition of the bracket 4 and the connecting line 3 in the thickness direction of the camera is avoided, so that only a space for avoiding the connecting line 3 needs to be reserved between the photosensitive element 2 and the filter element 5, and the thickness space of the bracket 4 is omitted.
  • the lens back focal distance of the camera module 100 is greatly reduced, thereby reducing the thickness and size of the camera module 100 , realizing the lightness and thinness of the camera module 100 , which is beneficial to realize the lightness and thinness of the electronic device 1000 .
  • connection line 3 and the filter element 5 are spaced apart, and the minimum distance between the connection line 3 and the filter element 5 is d, and d satisfies: 0.05mm ⁇ d ⁇ 0.1mm.
  • the connecting line 3 is generally connected between the circuit board 1 and the photosensitive element 2 in an arc or curve.
  • the minimum distance between the connection line 3 and the filter element 5 is the distance between the highest point of the connection line 3 and the filter element 5 .
  • the bracket 4 is provided with an escape portion 8 , and an accommodation space for accommodating electrical components is defined between the escape portion 8 and the circuit board 1 .
  • the avoidance portion 8 may be formed by the lower surface of the bracket 4 being recessed upward. Therefore, the electrical components can be arranged in the above-mentioned accommodating space to prevent dust, liquid, etc. from entering the interior of the electrical components, effectively protecting the electrical components, and there is no need to additionally provide an encapsulation layer for encapsulating the electrical components, which not only further reduces the camera head The thickness of the module 100 also saves packaging costs.
  • the bracket 4 is glued on the circuit board 1 .
  • the bracket 4 can be adhered to the circuit board 1 by adhesive or double-sided tape. Therefore, by directly adhering the bracket 4 to the circuit board 1, the bracket 4 can be conveniently and firmly connected to the circuit board 1.
  • the integrated injection molding and packaging process greatly reduces the cost of the camera module 100 .
  • the bracket 4 is a plastic part. Therefore, the overall quality of the bracket 4 can be reduced, thereby the overall quality of the camera module 100 can be reduced, which is beneficial to realize the light and thin design of the camera module 100 and the electronic device 1000 having the camera module 100 .
  • the bracket 4 includes a bracket body 41 and a reinforcement member 42 , and the reinforcement member 42 is connected to the bracket body 41 .
  • the reinforcement member 42 can improve the overall structural strength of the bracket 4 .
  • the light-passing hole 40 passes through the reinforcing member 42 , and a portion of the reinforcing member 42 close to the light-passing hole 40 extends into the light-passing hole 40 to form a support portion.
  • the filter element 5 may be supported on the stiffener 42 .
  • the reinforcing member 42 and supporting the filter element 5 on the reinforcing member 42, not only the assembly stability of the bracket 4 can be improved, the probability of deformation of the bracket 4 during use and falling can be reduced, but also the bracket can be effectively extended.
  • the service life of 4 is reduced, the possibility of fatigue damage of the bracket 4 during use is reduced, the assembly stability and reliability of the camera module 100 can be improved, and the practicability and imaging effect of the camera module 100 can be improved.
  • the stiffener 42 is formed in a ring shape.
  • the contact area between the filter element 5 and the reinforcing member 42 can be increased, so that the support stability of the bracket 4 can be improved.
  • the reinforcing member 42 can easily realize a ring shape, for example, a through hole can be directly passed through the reinforcing member 42, and the setting method is simple and the production efficiency is high.
  • the reinforcing member 42 is a metal member or a glass fiber member
  • the bracket body 41 is a plastic member. In this way, the overall structural strength of the bracket 4 can be improved, the overall mass of the bracket 4 can be reduced, and the production cost can be reduced.
  • the bracket body 41 and the reinforcement member 42 are injection molded. Therefore, the processing technology of the bracket 4 can be simplified, which is beneficial to improve the production efficiency, reduce the production cost, and can improve the overall structural strength of the bracket 4 .
  • the electronic device 1000 according to the embodiment of the second aspect of the present application includes the camera module 100 according to the embodiment of the first aspect of the present application.
  • the orthographic projection of the outline of the light-passing hole 40 on the circuit board 1 is located on the connection line 3
  • the filter element 5 and the light-pass hole 40 are made larger, so that only the space between the photosensitive element 2 and the filter element 5 needs to be reserved. It is used to avoid the avoidance space of the connecting wire 3, saves the thickness space of the bracket 4, greatly reduces the lens back focal distance of the camera module 100, and further reduces the thickness of the camera module 100.
  • the thinning of the group 100 is beneficial to realize the thinning of the electronic device 1000 .
  • the electronic device 1000 may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 5 ).
  • the electronic device 1000 may be a mobile phone or smart phone (eg, iPhone TM based, Android TM based phone), portable gaming device (eg Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), laptop laptops, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices and devices such as watches, in-ear headphones, pendants, headphones, etc.
  • the electronic device 1000 can also be other wearable devices (eg, Head mounted devices (HMDs) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices 1000 or smart watches.
  • HMDs Head mounted devices
  • the electronic device 1000 may also be any of a plurality of electronic devices 1000 including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music Recorders, VCRs, Cameras, Other Media Recorders, Radios, Medical Equipment, Vehicle Transportation Instruments, Calculators, Programmable Remote Controls, Pagers, Laptops, Desktops, Printers, Netbooks, Personal Digital Assistants (PDAs) , Portable Multimedia Players (PMP), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices and digital cameras and combinations thereof.
  • PDAs Personal Digital Assistants
  • PMP Portable Multimedia Players
  • MPEG-1 or MPEG-2 Moving Picture Experts Group
  • MP3 Audio Layer 3
  • a first feature being "above” or “under” a second feature may include that the first and second features are in direct contact, or that the first and second features are not in direct contact but through them Additional feature contacts between.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)

Abstract

A camera module (100) and an electronic device (1000) having same. The camera module (100) comprises a circuit board (1), a photosensitive element (2), a connecting wire (3), a support (4) and a light-filtering element (5), wherein the photosensitive element (2) is arranged on the circuit board (1); one end of the connecting wire (3) is connected to the photosensitive element (2), and the other end of the connecting wire (3) is connected to the circuit board (1); the support (4) is arranged on the circuit board (1), a light-transmitting hole (40) is provided in the support (4), the light-transmitting hole (40) is opposite the photosensitive element (2), and the projection of the contour of the light-transmitting hole (40) on the circuit board (1) is located on the outer side of the connecting line (3); and the light-filtering element (5) is supported on the support (4).

Description

摄像头模组及具有其的电子设备Camera module and electronic device having the same
相关申请的交叉引用CROSS-REFERENCE TO RELATED APPLICATIONS
本申请基于申请号为202011071767.5和202022230007.6,申请日为2020年10月09日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。This application is based on the Chinese patent applications with application numbers 202011071767.5 and 202022230007.6, and the filing date is October 09, 2020, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is incorporated herein by reference.
技术领域technical field
本申请涉及电子技术领域,尤其是涉及一种摄像头模组及具有其的电子设备。The present application relates to the field of electronic technology, and in particular, to a camera module and an electronic device having the same.
背景技术Background technique
相关技术中,电子设备上通常设有摄像头模组,然而,摄像头模组的厚度较大,占用空间大,不利于电子设备的轻薄化设计。In the related art, an electronic device is usually provided with a camera module. However, the thickness of the camera module is relatively large and takes up a large space, which is not conducive to the light and thin design of the electronic device.
发明内容SUMMARY OF THE INVENTION
本申请的一个目的在于提出一种摄像头模组,所述摄像头模组的厚度小,有利于实现电子设备的轻薄化设计。One purpose of the present application is to propose a camera module, the camera module has a small thickness, which is beneficial to realize the light and thin design of electronic equipment.
本申请还提出一种具有上述摄像头模组的电子设备。The present application also proposes an electronic device having the above-mentioned camera module.
根据本申请第一方面实施例的摄像头模组,包括:电路板;感光元件,所述感光元件设置在所述电路板上;连接线,所述连接线的一端与所述感光元件相连,所述连接线的另一端与所述电路板相连;支架,所述支架设置在所述电路板上,所述支架上开设有通光孔,所述通光孔与所述感光元件相对,所述通光孔的轮廓在所述电路板上的投影位于所述连接线的外侧;滤光元件,所述滤光元件支撑在所述支架上。The camera module according to the embodiment of the first aspect of the present application includes: a circuit board; a photosensitive element, the photosensitive element is arranged on the circuit board; a connecting wire, one end of the connecting wire is connected to the photosensitive element, so The other end of the connecting wire is connected to the circuit board; a bracket, the bracket is arranged on the circuit board, the bracket is provided with a light-passing hole, the light-passing hole is opposite to the photosensitive element, the The projection of the outline of the light-passing hole on the circuit board is located outside the connection line; the filter element is supported on the bracket.
根据本申请第二方面实施例的电子设备,包括根据本申请上述第一方面实施例的摄像头模组。The electronic device according to the embodiment of the second aspect of the present application includes the camera module according to the embodiment of the first aspect of the present application.
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.
附图说明Description of drawings
图1是根据本申请实施例的摄像头模组的立体图;1 is a perspective view of a camera module according to an embodiment of the present application;
图2是根据本申请实施例的摄像头模组的剖视图;2 is a cross-sectional view of a camera module according to an embodiment of the present application;
图2a是图2中A部圈示的放大图;Figure 2a is an enlarged view of the circled part A in Figure 2;
图3是根据本申请另一个实施例的摄像头模组的剖视图;3 is a cross-sectional view of a camera module according to another embodiment of the present application;
图3a是图3中B部圈示的放大图;Figure 3a is an enlarged view of the circled part B in Figure 3;
图4是根据本申请再一个实施例的摄像头模组的剖视图;4 is a cross-sectional view of a camera module according to yet another embodiment of the present application;
图4a是图4中C部圈示的放大图;Figure 4a is an enlarged view of the circled portion C in Figure 4;
图5是根据本申请实施例的电子设备的示意图。FIG. 5 is a schematic diagram of an electronic device according to an embodiment of the present application.
附图标记:Reference number:
100、摄像头模组;100. Camera module;
1、电路板;2、感光元件;3、连接线;4、支架;40、通光孔;41、支架本体;42、加强件;5、滤光元件;6、马达;7、镜头;8、避让部;1. Circuit board; 2. Photosensitive element; 3. Connecting wire; 4. Bracket; 40. Light hole; 41. Bracket body; 42. Reinforcing piece; 5. Filter element; 6. Motor; 7. Lens; 8 , the avoidance department;
1000、电子设备。1000. Electronic equipment.
具体实施方式Detailed ways
下面详细描述本申请的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。The following describes in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application.
下面参考附图描述根据本申请实施例的摄像头模组100。The following describes the camera module 100 according to the embodiments of the present application with reference to the accompanying drawings.
根据本申请第一方面实施例的摄像头模组100,包括、电路板1、感光元件2、连接线3、支架4和滤光元件5。The camera module 100 according to the embodiment of the first aspect of the present application includes a circuit board 1 , a photosensitive element 2 , a connecting wire 3 , a bracket 4 and a filter element 5 .
其中,感光元件2设置在电路板1上。具体地,感光元件2为芯片,感光元件2可以铺设在电路板1上,感光元件2与电路板1电连接。连接线3的一端与感光元件2相连,连接线3的另一端与电路板1相连。可选地,连接线3为金线。The photosensitive element 2 is arranged on the circuit board 1 . Specifically, the photosensitive element 2 is a chip, the photosensitive element 2 can be laid on the circuit board 1 , and the photosensitive element 2 is electrically connected to the circuit board 1 . One end of the connecting wire 3 is connected to the photosensitive element 2 , and the other end of the connecting wire 3 is connected to the circuit board 1 . Optionally, the connecting wire 3 is a gold wire.
支架4设置在电路板1上,滤光元件5支撑在支架4上。可选地,滤光元件5可以为蓝玻璃,但不限于此。支架4上开设有通光孔40,通光孔40与感光元件2和滤光元件5相对,通光孔40的轮廓在电路板1上的投影位于连接线3的外侧。The bracket 4 is arranged on the circuit board 1 , and the filter element 5 is supported on the bracket 4 . Optionally, the filter element 5 may be blue glass, but is not limited thereto. The bracket 4 is provided with a light-passing hole 40 . The light-passing hole 40 is opposite to the photosensitive element 2 and the filter element 5 .
需要说明的是,本申请中所述的方向“内”指的是邻近摄像头模组100中心的一侧,相应地,本申请中的方向“外”指的是远离摄像头模组100中心的一侧。在本申请的描述中,需要理解的是,术语“内”、“外”、“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。It should be noted that the direction “inside” in this application refers to the side adjacent to the center of the camera module 100 , and correspondingly, the direction “outside” in this application refers to a side away from the center of the camera module 100 . side. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "inner", "outer", "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, only for the purpose of It is convenient to describe the application and to simplify the description, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application.
参照图2-图4,连接线3的内端与感光元件2相连,连接线3的外端与电路板1相连。通光孔40的轮廓在电路板1上的正投影位于连接线3的外侧。2 to 4 , the inner end of the connecting wire 3 is connected to the photosensitive element 2 , and the outer end of the connecting wire 3 is connected to the circuit board 1 . The orthographic projection of the outline of the light-passing hole 40 on the circuit board 1 is located outside the connection line 3 .
可以理解的是,摄像头模组100的厚度尺寸为镜头本体高度、镜头后焦距离、感光元件2的厚度以及电路板1的厚度之和。而镜头后焦距离为镜头组件与感光元件2之间的距离。其中,镜头组件包括马达6和镜头7。参照图2-图4,马达6内设有安装槽,镜头7安装在安装槽内。其中,马达6可以直接连接在电路板1上,也可以连接在支架4上。It can be understood that the thickness dimension of the camera module 100 is the sum of the height of the lens body, the back focus distance of the lens, the thickness of the photosensitive element 2 and the thickness of the circuit board 1 . The back focus distance of the lens is the distance between the lens assembly and the photosensitive element 2 . The lens assembly includes a motor 6 and a lens 7 . 2-4, the motor 6 is provided with a mounting groove, and the lens 7 is mounted in the mounting groove. The motor 6 can be directly connected to the circuit board 1 or connected to the bracket 4 .
参照图2-图4,本申请中摄像头模组100的镜头后焦距离为感光元件2的厚度与连接线3的避让空间的高度之和,而相关技术中的摄像头模组100的镜头后焦距离为感光元件2的厚度、支架4的厚度以及用于避让连接线3的避让空间的高度之和。Referring to FIGS. 2-4 , the back focus distance of the lens of the camera module 100 in the present application is the sum of the thickness of the photosensitive element 2 and the height of the avoidance space of the connecting line 3, while the back focus of the lens of the camera module 100 in the related art The distance is the sum of the thickness of the photosensitive element 2 , the thickness of the bracket 4 and the height of the avoidance space for avoiding the connection line 3 .
根据本申请实施例的摄像头模组100,通过使通光孔40的轮廓在电路板1上的正投影位于连接线3的外侧,通过将滤光元件5和通光孔40做大的方式,避免了支架4与连接线3在摄像头厚度方向上的叠加,从而感光元件2与滤光元件5之间仅需预留用于避让连接线3的避让空间,省去了支架4的厚度空间,极大地减小了摄像头模组100的镜头后焦距离,进而减小了摄像头模组100的厚度尺寸,实现了摄像头模组100的轻薄化,从而有利于实现电子设备1000的轻薄化。According to the camera module 100 of the embodiment of the present application, the orthographic projection of the outline of the light-passing hole 40 on the circuit board 1 is located outside the connection line 3, and by making the filter element 5 and the light-passing hole 40 larger, The superposition of the bracket 4 and the connecting line 3 in the thickness direction of the camera is avoided, so that only a space for avoiding the connecting line 3 needs to be reserved between the photosensitive element 2 and the filter element 5, and the thickness space of the bracket 4 is omitted. The lens back focal distance of the camera module 100 is greatly reduced, thereby reducing the thickness and size of the camera module 100 , realizing the lightness and thinness of the camera module 100 , which is beneficial to realize the lightness and thinness of the electronic device 1000 .
根据本申请的一些实施例,连接线3与滤光元件5间隔开设置,连接线3与滤光元件5之间的最小距离为d,d满足:0.05mm≤d≤0.1mm。连接线3一般呈弧形或曲线连接在电路板1和感光元件2之间。连接线3与滤光元件5之间的最小距离为连接线3的最高点与滤光元件5之间的距离。According to some embodiments of the present application, the connection line 3 and the filter element 5 are spaced apart, and the minimum distance between the connection line 3 and the filter element 5 is d, and d satisfies: 0.05mm≤d≤0.1mm. The connecting line 3 is generally connected between the circuit board 1 and the photosensitive element 2 in an arc or curve. The minimum distance between the connection line 3 and the filter element 5 is the distance between the highest point of the connection line 3 and the filter element 5 .
例如,在本申请的一些具体实施例中,连接线3与滤光元件5之间的最小距离d为d=0.05mm、d=0.06mm、d=0.07mm、d=0.08mm、d=0.09mm、d=0.1mm。由此,可以保证电路板1和感光元件2之间电连接的可靠性,且可以进一步地降低摄像头模组100的镜头后焦距离,从而进一步地减小了摄像头模组100的厚度尺寸。For example, in some specific embodiments of the present application, the minimum distance d between the connecting line 3 and the filter element 5 is d=0.05mm, d=0.06mm, d=0.07mm, d=0.08mm, d=0.09 mm, d = 0.1 mm. Therefore, the reliability of the electrical connection between the circuit board 1 and the photosensitive element 2 can be ensured, and the lens back focus distance of the camera module 100 can be further reduced, thereby further reducing the thickness of the camera module 100 .
根据本申请的一些实施例,支架4上设有避让部8,避让部8与电路板1之间限定出用于容纳电器元件的容纳空间。参照图2,避让部8可以由支架4的下表面向上凹入形成。由此,可以将电器元件设置在上述容纳空间内,避免灰尘、液体等进入电器元件内部,有效地保护了电器元件,且无需额外设置用于封装电器元件的封装层,不仅进一步地降低了摄像头模组100的厚度,还节省了封装成本。According to some embodiments of the present application, the bracket 4 is provided with an escape portion 8 , and an accommodation space for accommodating electrical components is defined between the escape portion 8 and the circuit board 1 . Referring to FIG. 2 , the avoidance portion 8 may be formed by the lower surface of the bracket 4 being recessed upward. Therefore, the electrical components can be arranged in the above-mentioned accommodating space to prevent dust, liquid, etc. from entering the interior of the electrical components, effectively protecting the electrical components, and there is no need to additionally provide an encapsulation layer for encapsulating the electrical components, which not only further reduces the camera head The thickness of the module 100 also saves packaging costs.
根据本申请的一些实施例,支架4粘接在电路板1上。例如,支架4可以通过粘接剂或者双面胶粘接在电路板1上。由此,通过将支架4直接粘接在电路板1上,可以将 支架4方便且牢靠地连接在电路板1上,同时,相对相关技术中的MOB(Molding on board,电路板1和电器元件一体注塑封装工艺)工艺,极大地降低了摄像头模组100的成本。According to some embodiments of the present application, the bracket 4 is glued on the circuit board 1 . For example, the bracket 4 can be adhered to the circuit board 1 by adhesive or double-sided tape. Therefore, by directly adhering the bracket 4 to the circuit board 1, the bracket 4 can be conveniently and firmly connected to the circuit board 1. The integrated injection molding and packaging process) greatly reduces the cost of the camera module 100 .
在本申请的一些实施例,支架4为塑料件。由此,可以降低支架4的整体质量,从而可以降低摄像头模组100的整体质量,有利于实现摄像头模组100和具有该摄像头模组100的电子设备1000的轻薄化设计。In some embodiments of the present application, the bracket 4 is a plastic part. Therefore, the overall quality of the bracket 4 can be reduced, thereby the overall quality of the camera module 100 can be reduced, which is beneficial to realize the light and thin design of the camera module 100 and the electronic device 1000 having the camera module 100 .
在本申请的另一些实施例,支架4包括支架本体41和加强件42,加强件42与支架本体41相连。加强件42可以提高支架4的整体结构强度。通光孔40贯通加强件42,加强件42的靠近通光孔40的部分伸入通光孔40内以构造成支撑部。参照图4,滤光元件5可以支撑在加强件42上。In other embodiments of the present application, the bracket 4 includes a bracket body 41 and a reinforcement member 42 , and the reinforcement member 42 is connected to the bracket body 41 . The reinforcement member 42 can improve the overall structural strength of the bracket 4 . The light-passing hole 40 passes through the reinforcing member 42 , and a portion of the reinforcing member 42 close to the light-passing hole 40 extends into the light-passing hole 40 to form a support portion. Referring to FIG. 4 , the filter element 5 may be supported on the stiffener 42 .
由此,通过设置加强件42,并将滤光元件5支撑在加强件42上,不仅可以提升支架4的装配稳定性,降低支架4在使用、跌落中出现形变的概率,还可以有效延长支架4的使用寿命,降低支架4在使用过程中出现疲劳损坏的可能性,进而可以改善摄像头模组100的装配稳定性和可靠性,提高了摄像头模组100的实用性和成像效果。Therefore, by disposing the reinforcing member 42 and supporting the filter element 5 on the reinforcing member 42, not only the assembly stability of the bracket 4 can be improved, the probability of deformation of the bracket 4 during use and falling can be reduced, but also the bracket can be effectively extended. The service life of 4 is reduced, the possibility of fatigue damage of the bracket 4 during use is reduced, the assembly stability and reliability of the camera module 100 can be improved, and the practicability and imaging effect of the camera module 100 can be improved.
根据本申请的一些实施例,加强件42形成为环形。由此,可以增大滤光元件5与加强件42之间的接触面积,从而可以提高支架4的支撑稳定性。另外,加强件42可以很容易地实现环形状,例如可以直接在加强件42上贯通一个通孔,设置方式简单且生产效率高。According to some embodiments of the present application, the stiffener 42 is formed in a ring shape. Thereby, the contact area between the filter element 5 and the reinforcing member 42 can be increased, so that the support stability of the bracket 4 can be improved. In addition, the reinforcing member 42 can easily realize a ring shape, for example, a through hole can be directly passed through the reinforcing member 42, and the setting method is simple and the production efficiency is high.
根据本申请的一些实施例,加强件42为金属件或玻纤件,支架本体41为塑料件。由此,可以提高支架4的整体结构强度,且可以减小支架4的整体质量,降低生产成本。According to some embodiments of the present application, the reinforcing member 42 is a metal member or a glass fiber member, and the bracket body 41 is a plastic member. In this way, the overall structural strength of the bracket 4 can be improved, the overall mass of the bracket 4 can be reduced, and the production cost can be reduced.
根据本申请的一些实施例,支架本体41与加强件42注塑成型。由此,可以简化支架4的加工工艺,有利于提高生产效率、降低生产成本,且可以提高支架4的整体结构强度。According to some embodiments of the present application, the bracket body 41 and the reinforcement member 42 are injection molded. Therefore, the processing technology of the bracket 4 can be simplified, which is beneficial to improve the production efficiency, reduce the production cost, and can improve the overall structural strength of the bracket 4 .
根据本申请第二方面实施例的电子设备1000,包括根据本申请上述第一方面实施例的摄像头模组100。The electronic device 1000 according to the embodiment of the second aspect of the present application includes the camera module 100 according to the embodiment of the first aspect of the present application.
根据本申请第二方面实施例的电子设备1000,通过设置根据本申请上述第一方面实施例的摄像头模组100,通过使通光孔40的轮廓在电路板1上的正投影位于连接线3的外侧,通过将滤光元件5和通光孔40做大的方式,避免了支架4与连接线3在摄像头厚度方向上的叠加,从而感光元件2与滤光元件5之间仅需预留用于避让连接线3的避让空间,省去了支架4的厚度空间,极大地减小了摄像头模组100的镜头后焦距离,进而减小了摄像头模组100的厚度尺寸,实现了摄像头模组100的轻薄化,从而有利于 实现电子设备1000的轻薄化。According to the electronic device 1000 of the embodiment of the second aspect of the present application, by setting the camera module 100 according to the embodiment of the first aspect of the present application, the orthographic projection of the outline of the light-passing hole 40 on the circuit board 1 is located on the connection line 3 On the outside of the camera, by making the filter element 5 and the light-pass hole 40 larger, the superposition of the bracket 4 and the connecting line 3 in the thickness direction of the camera is avoided, so that only the space between the photosensitive element 2 and the filter element 5 needs to be reserved. It is used to avoid the avoidance space of the connecting wire 3, saves the thickness space of the bracket 4, greatly reduces the lens back focal distance of the camera module 100, and further reduces the thickness of the camera module 100. The thinning of the group 100 is beneficial to realize the thinning of the electronic device 1000 .
示例性的,电子设备1000可以为移动或便携式并执行无线通信的各种类型的计算机系统设备中的任何一种(图5中只示例性的示出了一种形态)。具体的,电子设备1000可以为移动电话或智能电话(例如,基于iPhone TM,基于Android TM的电话),便携式游戏设备(例如Nintendo DS TM,PlayStation Portable TM,Gameboy Advance TM,iPhone TM)、膝上型电脑、PDA、便携式互联网设备、音乐播放器以及数据存储设备,其他手持设备以及诸如手表、入耳式耳机、吊坠、头戴式耳机等,电子设备1000还可以为其他的可穿戴设备(例如,诸如电子眼镜、电子衣服、电子手镯、电子项链、电子纹身、电子设备1000或智能手表的头戴式设备(HMD))。Exemplarily, the electronic device 1000 may be any one of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 5 ). Specifically, the electronic device 1000 may be a mobile phone or smart phone (eg, iPhone TM based, Android TM based phone), portable gaming device (eg Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), laptop laptops, PDAs, portable Internet devices, music players, and data storage devices, other handheld devices and devices such as watches, in-ear headphones, pendants, headphones, etc., the electronic device 1000 can also be other wearable devices (eg, Head mounted devices (HMDs) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices 1000 or smart watches.
电子设备1000还可以是多个电子设备1000中的任何一个,多个电子设备1000包括但不限于蜂窝电话、智能电话、其他无线通信设备、个人数字助理、音频播放器、其他媒体播放器、音乐记录器、录像机、照相机、其他媒体记录器、收音机、医疗设备、车辆运输仪器、计算器、可编程遥控器、寻呼机、膝上型计算机、台式计算机、打印机、上网本电脑、个人数字助理(PDA)、便携式多媒体播放器(PMP)、运动图像专家组(MPEG-1或MPEG-2)音频层3(MP3)播放器,便携式医疗设备以及数码相机及其组合。The electronic device 1000 may also be any of a plurality of electronic devices 1000 including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music Recorders, VCRs, Cameras, Other Media Recorders, Radios, Medical Equipment, Vehicle Transportation Instruments, Calculators, Programmable Remote Controls, Pagers, Laptops, Desktops, Printers, Netbooks, Personal Digital Assistants (PDAs) , Portable Multimedia Players (PMP), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices and digital cameras and combinations thereof.
在本申请的描述中,需要理解的是,术语“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。在本申请的描述中,“多个”的含义是两个或两个以上。In the description of the application, it should be understood that the orientation or positional relationship indicated by the terms "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the application and to simplify the description, rather than to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application. In the description of this application, "plurality" means two or more.
在本申请的描述中,第一特征在第二特征“之上”或“之下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。In the description of this application, a first feature being "above" or "under" a second feature may include that the first and second features are in direct contact, or that the first and second features are not in direct contact but through them Additional feature contacts between.
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本申请的实施例,本领域的普通技术人员可以理解:在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型, 本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (20)

  1. 一种摄像头模组,其特征在于,包括:A camera module, comprising:
    电路板;circuit board;
    感光元件,所述感光元件设置在所述电路板上;a photosensitive element, the photosensitive element is arranged on the circuit board;
    连接线,所述连接线的一端与所述感光元件相连,所述连接线的另一端与所述电路板相连;a connecting line, one end of the connecting line is connected with the photosensitive element, and the other end of the connecting line is connected with the circuit board;
    支架,所述支架设置在所述电路板上,所述支架上开设有通光孔,所述通光孔与所述感光元件相对,所述通光孔的轮廓在所述电路板上的投影位于所述连接线的外侧;A bracket, the bracket is arranged on the circuit board, the bracket is provided with a light-passing hole, the light-passing hole is opposite to the photosensitive element, and the outline of the light-passing hole is projected on the circuit board on the outside of the connecting line;
    滤光元件,所述滤光元件支撑在所述支架上。a filter element, the filter element is supported on the support.
  2. 根据权利要求1所述的摄像头模组,其特征在于,所述连接线与所述滤光元件间隔开设置,所述连接线与所述滤光元件之间的最小距离为d,所述d满足:0.05mm≤d≤0.1mm。The camera module according to claim 1, wherein the connecting line and the filter element are spaced apart, and the minimum distance between the connecting line and the filter element is d, and the d Satisfaction: 0.05mm≤d≤0.1mm.
  3. 根据权利要求1或2所述的摄像头模组,其特征在于,所述连接线呈弧形或曲线连接在所述电路板和所述感光元件之间。The camera module according to claim 1 or 2, wherein the connecting wire is connected between the circuit board and the photosensitive element in an arc or curve.
  4. 根据权利要求1-3中任一项所述的摄像头模组,其特征在于,所述支架上设有避让部,所述避让部与所述电路板之间限定出用于容纳电器元件的容纳空间。The camera module according to any one of claims 1-3, wherein the bracket is provided with an escape portion, and a space for accommodating electrical components is defined between the escape portion and the circuit board space.
  5. 根据权利要求4所述的摄像头模组,其特征在于,所述支架的部分下表面向上凹入以形成所述避让部。The camera module according to claim 4, wherein a part of the lower surface of the bracket is concave upward to form the avoidance portion.
  6. 根据权利要求1-5中任一项所述的摄像头模组,其特征在于,所述支架粘接在所述电路板上。The camera module according to any one of claims 1-5, wherein the bracket is adhered to the circuit board.
  7. 根据权利要求6所述的摄像头模组,其特征在于,所述支架通过粘结剂粘接至所述电路板。The camera module according to claim 6, wherein the bracket is bonded to the circuit board by an adhesive.
  8. 根据权利要求6所述的摄像头模组,其特征在于,所述支架通过双面胶粘接至所述电路板。The camera module according to claim 6, wherein the bracket is bonded to the circuit board by double-sided tape.
  9. 根据权利要求1-8中任一项所述的摄像头模组,其特征在于,所述支架为塑料件。The camera module according to any one of claims 1-8, wherein the bracket is a plastic part.
  10. 根据权利要求1-9中任一项所述的摄像头模组,其特征在于,所述支架包括:The camera module according to any one of claims 1-9, wherein the bracket comprises:
    支架本体;和the bracket body; and
    加强件,所述加强件与所述支架本体相连,所述通光孔贯通所述加强件,所述加强件的靠近所述通光孔的部分伸入所述通光孔内以构造成支撑部。a reinforcing piece, the reinforcing piece is connected with the bracket body, the light-passing hole penetrates the reinforcing piece, and the part of the reinforcing piece close to the light-passing hole protrudes into the light-passing hole to be configured as a support department.
  11. 根据权利要求10所述的摄像头模组,其特征在于,所述滤光元件支撑在所述加 强件上。The camera module according to claim 10, wherein the filter element is supported on the reinforcing member.
  12. 根据权利要求10所述的摄像头模组,其特征在于,所述加强件形成为环形。The camera module according to claim 10, wherein the reinforcing member is formed in a ring shape.
  13. 根据权利要求10所述的摄像头模组,其特征在于,所述加强件为金属件或玻纤件,所述支架本体为塑料件。The camera module according to claim 10, wherein the reinforcing member is a metal member or a glass fiber member, and the bracket body is a plastic member.
  14. 根据权利要求10所述的摄像头模组,其特征在于,所述支架本体与所述加强件注塑成型。The camera module according to claim 10, wherein the bracket body and the reinforcing member are injection-molded.
  15. 根据权利要求1-14中任一项所述的摄像头模组,其特征在于,所述感光元件为芯片,所述芯片铺设在所述电路板上。The camera module according to any one of claims 1-14, wherein the photosensitive element is a chip, and the chip is laid on the circuit board.
  16. 根据权利要求1-15中任一项所述的摄像头模组,其特征在于,所述连接线为金线。The camera module according to any one of claims 1-15, wherein the connecting wire is a gold wire.
  17. 根据权利要求1-16中任一项所述的摄像头模组,其特征在于,所述滤光元件为蓝玻璃。The camera module according to any one of claims 1-16, wherein the filter element is blue glass.
  18. 根据权利要求1-17中任一项所述的摄像头模组,其特征在于,还包括;The camera module according to any one of claims 1-17, further comprising;
    镜头组件,所述镜头组件与所述电路板或所述支架相连。The lens assembly is connected with the circuit board or the bracket.
  19. 根据权利要求18所述的摄像头模组,其特征在于,所述镜头组件包括:The camera module according to claim 18, wherein the lens assembly comprises:
    马达,所述马达内设有安装槽,所述马达与所述电路板或所述支架相连;a motor, wherein a mounting slot is arranged in the motor, and the motor is connected with the circuit board or the bracket;
    镜头,所述镜头安装在所述安装槽内。a lens, and the lens is installed in the installation groove.
  20. 一种电子设备,其特征在于,包括根据权利要求1-19中任一项所述的摄像头模组。An electronic device, characterized by comprising the camera module according to any one of claims 1-19.
PCT/CN2021/112573 2020-10-09 2021-08-13 Camera module and electronic device having same WO2022073384A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202022230007.6U CN212992431U (en) 2020-10-09 2020-10-09 Camera module and electronic equipment with same
CN202022230007.6 2020-10-09
CN202011071767.5 2020-10-09
CN202011071767.5A CN112118377A (en) 2020-10-09 2020-10-09 Camera module and electronic equipment with same

Publications (1)

Publication Number Publication Date
WO2022073384A1 true WO2022073384A1 (en) 2022-04-14

Family

ID=81125618

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/112573 WO2022073384A1 (en) 2020-10-09 2021-08-13 Camera module and electronic device having same

Country Status (1)

Country Link
WO (1) WO2022073384A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115134502A (en) * 2022-07-28 2022-09-30 Oppo广东移动通信有限公司 Support, light filtering assembly, camera and electronic device
WO2024045223A1 (en) * 2022-09-01 2024-03-07 诚瑞光学(南宁)有限公司 Camera base and camera device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120018830A1 (en) * 2010-07-26 2012-01-26 Wen Chang Lin Packaging device of image sensor
US20120093494A1 (en) * 2010-10-15 2012-04-19 Altek Corporation Smart phone with lens
CN107682592A (en) * 2016-08-01 2018-02-09 宁波舜宇光电信息有限公司 Camera module and its molded circuit board component and manufacture method
CN210491015U (en) * 2019-10-28 2020-05-08 Oppo广东移动通信有限公司 Electronic equipment, camera module and circuit board assembly thereof
CN111263046A (en) * 2020-02-26 2020-06-09 昆山丘钛微电子科技有限公司 Camera module and electronic equipment
CN211184077U (en) * 2020-02-25 2020-08-04 南昌欧菲晶润科技有限公司 Camera module and imaging device and electronic equipment with same
CN112118377A (en) * 2020-10-09 2020-12-22 Oppo(重庆)智能科技有限公司 Camera module and electronic equipment with same
CN212992431U (en) * 2020-10-09 2021-04-16 Oppo(重庆)智能科技有限公司 Camera module and electronic equipment with same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120018830A1 (en) * 2010-07-26 2012-01-26 Wen Chang Lin Packaging device of image sensor
US20120093494A1 (en) * 2010-10-15 2012-04-19 Altek Corporation Smart phone with lens
CN107682592A (en) * 2016-08-01 2018-02-09 宁波舜宇光电信息有限公司 Camera module and its molded circuit board component and manufacture method
CN210491015U (en) * 2019-10-28 2020-05-08 Oppo广东移动通信有限公司 Electronic equipment, camera module and circuit board assembly thereof
CN211184077U (en) * 2020-02-25 2020-08-04 南昌欧菲晶润科技有限公司 Camera module and imaging device and electronic equipment with same
CN111263046A (en) * 2020-02-26 2020-06-09 昆山丘钛微电子科技有限公司 Camera module and electronic equipment
CN112118377A (en) * 2020-10-09 2020-12-22 Oppo(重庆)智能科技有限公司 Camera module and electronic equipment with same
CN212992431U (en) * 2020-10-09 2021-04-16 Oppo(重庆)智能科技有限公司 Camera module and electronic equipment with same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115134502A (en) * 2022-07-28 2022-09-30 Oppo广东移动通信有限公司 Support, light filtering assembly, camera and electronic device
WO2024045223A1 (en) * 2022-09-01 2024-03-07 诚瑞光学(南宁)有限公司 Camera base and camera device

Similar Documents

Publication Publication Date Title
KR102606499B1 (en) Electroni device
CN212211129U (en) Camera module and electronic equipment
US11012766B2 (en) Electronic device including speaker module
WO2022073384A1 (en) Camera module and electronic device having same
CN101409298B (en) Imaging device and assembly method thereof
US20080105819A1 (en) Image sensor package and image sensing module using the package
US11924595B2 (en) Electronic device with sealing structure
CN113037894B (en) Electronic equipment
CN212992431U (en) Camera module and electronic equipment with same
CN101601275A (en) Image pick-up device and manufacture method thereof and mobile terminal device
US11457528B2 (en) Electronic device having conductive structure of supporting member
CN112118377A (en) Camera module and electronic equipment with same
CN208386749U (en) CCD camera assembly and electronic equipment for electronic equipment
CN108632409B (en) Display screen, terminal display screen assembly and mobile terminal
CN210745350U (en) Camera module and electronic equipment with same
CN110381689B (en) Shell structure, preparation method thereof and electronic equipment
CN117135540B (en) Electronic devices
CN217113686U (en) Display screen assembly and electronic equipment
CN111273734B (en) Fingerprint module and electronic device having the same
TWI735084B (en) Composite body and manufacturing method therefor, camera module and electronic device
CN112532769B (en) Shell assembly and electronic device
US11048467B2 (en) Electronic device with display panel speaker
KR20180096180A (en) Mobile terminal
CN112099176A (en) Lens barrel, lens assembly, camera module and electronic device
CN110572498A (en) Assembling method of shell assembly, shell assembly and electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21876904

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21876904

Country of ref document: EP

Kind code of ref document: A1