CN220023441U - Structure of heat conducting plate set - Google Patents

Abstract

The utility model relates to a heat conducting plate group structure, which comprises a heat conducting plate and a cushion pad. The heat-conducting plate is provided with a boss, and the boss comprises an arc surface attached to the heating element and an overflow groove positioned on one side of the arc surface. The buffer cushion is fixed on the boss and surrounds the outer side of the overflow groove. Therefore, the heat conducting plate group structure with good conduction effect is provided, and the heat conducting medium can be prevented from overflowing.

Description

Structure of heat conducting plate set

Technical Field

The present utility model relates to a heat dissipation structure, and more particularly, to a heat-conducting plate assembly structure.

Background

The heat dissipation structure is attached to the heat-generating electronic component through the heat-conducting plate, so that the heat generated by the electronic component is conducted to the heat dissipation structure, and the heat dissipation efficiency is improved. However, since the surface of the heat-generating electronic component has roughness or irregularities at the time of manufacture rather than a true plane, there is a gap at the time of contact with the heat conductive plate, and good adhesion cannot be obtained. In addition, the existence of the gap can retain air and cannot fill the heat conduction paste, so that the heat conduction efficiency is reduced.

Furthermore, the existing heat conducting plate is coated with a heat conducting medium at the position where the heating electronic element is attached, so that the heat conducting effect between the heat conducting plate and the heat conducting plate is improved. However, excessive heat transfer medium may overflow, and the heat transfer plate may be vertically disposed to cause the heat transfer medium to flow out. In this regard, how to avoid overflow of the heat-conducting medium is also a problem to be solved by the present inventors.

In view of the above, the present inventors have made intensive studies and have made an effort to solve the above-mentioned problems in combination with the application of the theory, which is an object of the present inventors.

Disclosure of Invention

The utility model aims to provide a heat conducting plate group structure, which is characterized in that a boss and an arc surface attached to a heating element are arranged on a heat conducting plate, so that gaps are reserved when the heat conducting plate group structure contacts the heating element, and the heat conducting effect is improved.

In order to achieve the above-mentioned objective, the present utility model provides a heat-conducting plate assembly structure, which comprises a heat-conducting plate and a cushion pad. The heat-conducting plate is provided with a boss, and the boss comprises an arc surface attached to the heating element and an overflow groove positioned on one side of the arc surface. The buffer cushion is fixed on the boss and surrounds the outer side of the overflow groove.

In one embodiment, the arcuate surface is provided with two or more grooves.

In one embodiment, the two or more grooves comprise concentric ring grooves of different sizes or are in a staggered grid.

In one embodiment, the boss includes a detent in which the bumper pad is disposed.

In one embodiment, the portion of the detent inside the bumper pad is defined as the isopipe.

In one embodiment, the heat conducting plate set structure further comprises an adhesive, and the buffer pad is combined on the boss through the adhesive.

In one embodiment, the heat conducting plate group structure further comprises a heat dissipating structure, and the heat dissipating structure is disposed on one side of the boss away from the cambered surface.

In one embodiment, the overflow trough and the buffer pad are arranged in a ring shape.

In one embodiment, the overflow trough is configured as a circular trough or a square trough and the bumper pad is configured as a circular pad or a square pad.

In one embodiment, the heat conducting plate group structure further comprises a heat conducting medium, and the heat conducting medium is coated on the cambered surface.

The utility model aims to provide a heat conducting plate group structure, wherein an overflow groove is arranged on one side of an arc surface of a heat conducting plate, so that heat conducting medium coated on the arc surface is prevented from overflowing. Compared with the prior art, the heat conducting plate is provided with the boss, the boss is provided with the cambered surface which is attached to the heating element and the overflow groove which is positioned at one side of the cambered surface, and the buffer cushion is fixed on the boss and surrounds the outer side of the overflow groove; therefore, the heat conducting plate can be well attached to the heating element through the arrangement of the cambered surface, so that no gap exists between the heat conducting plate and the heating element, and the heat conducting effect is improved. In addition, the redundant part of the heat conducting medium coated on the cambered surface overflows into the overflow groove, so that other elements are prevented from being polluted, and the practicability of the utility model is improved.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present utility model will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.

FIG. 1 is an exploded perspective view of a heat conductive plate assembly according to the present utility model.

Fig. 2 is a schematic perspective view of a heat-conducting plate assembly according to the present utility model.

Fig. 3 is a cross-sectional view of the structure of the heat conductive plate pack of the present utility model.

FIG. 4 is a schematic diagram of a heat conducting plate assembly structure according to the present utility model.

FIG. 5 is an enlarged view of a portion of the heat conductive plate assembly of the present utility model.

Fig. 6 is a cross-sectional view of the heat conductive plate pack structure of the present utility model in use.

FIG. 7 is an enlarged view of a portion of the heat conductive plate assembly structure of the present utility model in use.

Fig. 8 is a schematic perspective view of another embodiment of a heat conducting plate assembly structure according to the present utility model.

Fig. 9 is an exploded perspective view of another embodiment of the heat conductive plate pack structure of the present utility model.

Fig. 10 is a cross-sectional view of another embodiment of the thermally conductive plate pack structure of the present utility model.

Fig. 11 is a schematic perspective view of another embodiment of a heat conducting plate assembly structure according to the present utility model.

Reference numerals illustrate:

1. 1a, 1b: a heat conducting plate group structure;

2: a heating element;

10. 10a, 10b: a heat conductive plate;

11. 11a, 11b: a boss;

111. 111a, 111b: a cambered surface;

112. 112a, 112b: an overflow trough;

113: a positioning groove;

12. 12b: a groove;

121: concentric ring grooves;

20. 20a, 20b: a cushion pad;

30: gluing;

40. 40a: a heat dissipation structure;

50: a heat conducting medium.

Detailed Description

The detailed description and technical content of the present utility model are described below with reference to the drawings, which are, however, provided for reference and illustration only and are not intended to limit the present utility model.

Fig. 1 to 3 are schematic perspective views and cross-sectional views illustrating two sides of a heat conducting plate assembly according to the present utility model. The utility model relates to a heat conducting plate group structure 1, which comprises a heat conducting plate 10 and a cushion pad 20. The cushion pad 20 is bonded to the heat conductive plate 10, thereby constituting the heat conductive plate group structure 1.

The heat conductive plate 10 is a plate body made of a material having excellent heat conductivity. The heat conductive plate 10 is provided with a boss 11. The boss 11 includes an arc surface 111 and an overflow groove 112 at one side of the arc surface 111.

In one embodiment of the present utility model, the cambered surface 111 is provided with two or more grooves 12. The two or more grooves 12 include concentric ring grooves 121 of different sizes. The boss 11 includes a positioning groove 113.

The cushion pad 20 is made of a material having a cushioning effect, such as foam. The cushion 20 is fixed to the boss 11 and frames the outside of the overflow trough 112. In this embodiment, the cushion pad 20 is disposed in the positioning groove 113. Further, after the buffer pad 20 is combined with the positioning groove 113, a portion of the groove is remained inside the buffer pad 20, and this portion is defined as the overflow groove 112 (refer to fig. 3).

Specifically, the overflow groove 112 and the buffer pad 20 are disposed in a ring shape. In this embodiment, the overflow trough 112 is configured as a circular trough; the cushion pad 20 is provided as a circular pad.

Furthermore, the heat-conducting plate assembly structure 1 further comprises an adhesive 30. The cushion 20 is coupled to the boss 11 by the adhesive 30. In addition, the heat conducting plate group structure 1 further comprises a heat dissipation structure 40. The heat dissipation structure 40 is disposed on a side of the boss 11 away from the cambered surface 111, so as to increase a heat dissipation area and further improve heat dissipation efficiency. Specifically, the heat dissipation structure 40 may be composed of two or more heat dissipation fins, which are arranged at intervals and are integrally formed on the boss 11. In addition, the heat dissipation structure 40 may also be formed by at least one heat pipe or two or more heat pipes and attached to the side of the boss 11 away from the cambered surface 111, and if necessary, one end of the heat pipe structure may be connected in series with a heat dissipation fin set, so as to be applied as an air-cooled heat sink, but the utility model is not limited thereto.

Fig. 4 and 5 are schematic views and enlarged partial views of the structure of the heat-conducting plate set according to the present utility model. The heat conductive plate pack structure 1 of the present utility model further includes a heat conductive medium 50. The heat conducting medium 50 is coated on the arc surface 111 of the heat conducting plate 10, and the arc surface 111 is used for attaching the heating element 2. The heat conductive medium 50 is a medium having a good heat conductive effect, such as a heat conductive paste. Specifically, the heat-conducting medium 50 is coated on the arc surface 111 and filled in the two or more grooves 12 (concentric ring grooves 121).

In practical implementation, the cambered surface 111 is disposed corresponding to the structural shape of the heat generating element 2 on the side of the heat conducting plate 10. For example, when the side of the heating element 2 facing the heat conducting plate 10 is convex, the cambered surface 111 is configured as a concave cambered surface. When the side of the heating element 2 facing the heat conducting plate 10 is concave, the cambered surface 111 is a convex cambered surface.

Referring to fig. 6 and 7, a cross-sectional view and a partial enlarged view of the heat conducting plate assembly structure of the present utility model are shown. The heat conducting plate group structure 1 of the present utility model is attached to the heating element 2, and is used for conducting the heat of the heating element 2 to the heat conducting plate 10, so as to dissipate the heat through the heat dissipating structure 40 of the heat conducting plate 10. It should be noted that the heat conducting plate 10 is well attached to the surface of the heating element 2 through the arrangement of the cambered surface 111, so that no gap is generated to affect the heat conducting effect.

It should be noted that, when the heat conducting plate assembly structure 1 is attached to the heating element 2 to melt the heat conducting medium 50, or the heat conducting medium 50 coated on the redundant part of the cambered surface 111 overflows into the overflow groove 112.

Fig. 8 to 10 are schematic perspective views, schematic exploded perspective views and sectional views illustrating another embodiment of a heat-conducting plate assembly structure according to the present utility model. In this embodiment, the heat-conducting plate assembly structure 1a includes a heat-conducting plate 10a, a cushion pad 20a and a heat-dissipating structure 40a. As in the previous embodiment, the heat dissipation structure 40a may be composed of two or more heat dissipation fins or at least one heat pipe. The heat conductive plate 10a is provided with a boss 11a. The boss 11a includes a cambered surface 111a. The cushion pad 20a is coupled to the heat conductive plate 10 a. Specifically, the cushion pad 20a frames the arcuate surface 111a. The heat dissipation structure 40a is disposed on a side of the boss 11a away from the arc surface 111a.

The difference between this embodiment and the previous embodiment is that the cambered surface 111a is not provided with a groove or a positioning groove. The buffer pad 20a directly forms an overflow trough 112a around the outside of the arc 111a. In this embodiment, the overflow trough 112a is configured as a square trough. The cushion pad 20a is correspondingly provided as a square pad.

In practical use, the cambered surface 111a is coated with a heat-conducting medium, so as to improve the conduction efficiency between the cambered surface 111a and the heating element.

Referring to fig. 11, a schematic perspective view of another embodiment of a heat-conducting plate assembly according to the present utility model is shown. In this embodiment, the heat-conducting plate assembly structure 1b includes a heat-conducting plate 10b and a cushion pad 20b. The heat conductive plate 10b is provided with a boss 11b. The boss 11a includes a cambered surface 111b and an overflow groove 112b located at one side of the cambered surface 111 b. The present embodiment differs in that the cambered surface 111b is provided with two or more grooves 12b. The two or more grooves 12b are staggered to form a grid shape, such as rhombic patterns.

It is to be noted that the number of the bosses 11, 11a, 11b or the overflow grooves 112, 112a, 112b in the various embodiments of the heat-conductive plate pack structure of the present utility model may be set to one or more according to actual needs, and the grooves 12, 12b or the concentric ring grooves 121 may be provided in accordance with the use needs in the area of all or a part of the bosses 11, 11a, 11b, without being particularly limited thereto.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the scope of the utility model, but rather to limit the scope of the utility model to the equivalents of the claims to which the utility model pertains.

Claims (10)

1. The utility model provides a heat conduction board group structure which characterized in that, heat conduction board group structure is used for the joint heating element to include:

a boss is arranged at the center of the heat conducting plate corresponding to the heating element, and comprises an arc surface attached to the heating element and an overflow groove positioned at one side of the arc surface; and

and the buffer cushion is fixed on the boss and surrounds the outer side of the overflow groove.

2. A thermally conductive plate pack structure according to claim 1 wherein the cambered surface is provided with two or more grooves.

3. The heat conductive plate pack structure according to claim 2, wherein the two or more grooves include concentric ring grooves of different sizes or are in a staggered lattice shape.

4. The heat conductive plate pack structure of claim 1, wherein the boss includes a positioning groove in which the cushion pad is disposed.

5. A thermally conductive plate pack structure as claimed in claim 4 wherein the portion of the detent inside the bumper pad is defined as the overflow trough.

6. The heat conductive plate pack structure of claim 1, further comprising an adhesive by which the cushion pad is bonded to the boss.

7. The heat conducting plate assembly structure according to claim 1, further comprising a heat dissipation structure disposed on a side of the boss away from the cambered surface.

8. The heat conducting plate assembly structure according to claim 1, wherein the overflow trough and the buffer pad are arranged in a ring shape.

9. The heat conductive plate pack structure of claim 8, wherein the overflow groove is provided as a circular groove or a square groove, and the buffer pad is provided as a circular pad or a square pad.

10. The heat conductive plate pack structure according to claim 1, further comprising a heat conductive medium coated on the arc surface.