CN221962167U - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
- Publication number
- CN221962167U CN221962167U CN202420068095.XU CN202420068095U CN221962167U CN 221962167 U CN221962167 U CN 221962167U CN 202420068095 U CN202420068095 U CN 202420068095U CN 221962167 U CN221962167 U CN 221962167U
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- China
- Prior art keywords
- heat
- heat dissipation
- powder particles
- fins
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 35
- 239000002245 particle Substances 0.000 claims abstract description 34
- 239000010410 layer Substances 0.000 claims abstract description 29
- 239000002344 surface layer Substances 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000005855 radiation Effects 0.000 description 9
- 238000005507 spraying Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000005514 two-phase flow Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a heat dissipation structure, comprising: the surface layer of the fins is a heat exchange layer formed by coating a plurality of powder particles, and the heat exchange layer can increase the heat dissipation area of the body so as to improve the heat dissipation efficiency of the body.
Description
Technical Field
The present utility model relates to a heat dissipation structure, and more particularly to a heat dissipation structure with increased heat dissipation area and improved heat dissipation efficiency.
Background
The heat sink is the most common heat dissipation element in the prior art, and the heat sink mainly provides more and larger heat dissipation area for heat dissipation and heat conduction by directly contacting a heat source in the electronic device, so as to prevent the heat generated by the heat source from being accumulated in the heat source to cause the breakage or burning of the heat source.
With the improvement of the operation performance of the chip (heat source) disposed in the present electronic equipment or electronic device, the generated heat is increased, so that a radiator enough to satisfy the high-power heat source needs to be provided additionally to dissipate the heat of the heat source, thereby providing a more effective heat-relieving scheme for the heat source.
In addition, since the existing electronic equipment or electronic device is designed and developed to be light and thin, the internal space is relatively narrow, the distance between the electronic components arranged in the electronic equipment or electronic device is relatively compact, no extra space is needed for additionally adding a heat dissipation or heat conduction element to carry out heat dissipation, and in contrast, no extra space is needed, the heat dissipation area (such as the number of fins) increased by enlarging the volume of the heat sink cannot be adopted as a method for improving the heat dissipation efficiency of the heat sink.
Therefore, how to increase the heat dissipation efficiency of the heat sink without increasing the number of heat dissipation elements and increasing the heat dissipation area of the heat sink with the same size in the limited space is a primary improvement goal of the current industry.
Disclosure of utility model
Therefore, in order to effectively solve the above-mentioned problems, a main object of the present utility model is to provide a heat dissipation structure that increases the heat dissipation area by providing a heat exchange layer on the surface layer thereof without increasing the volume of the heat sink, thereby improving the heat dissipation efficiency of the heat sink.
In order to achieve the above object, the present utility model provides a heat dissipation structure, comprising:
A body with plural fins, the surface layer of which has a heat exchange layer formed by coating plural powder particles.
The heat radiation structure, wherein: the body is a water-cooled head, the inside of the body is provided with a chamber, an outlet and an inlet, the outlet and the inlet are communicated with the chamber, and the fins are arranged in the chamber and are arranged at intervals.
The heat radiation structure, wherein: a nickel layer is respectively arranged between the heat exchange layer and the surface layer of the fin and the wall surface of the chamber.
The heat radiation structure, wherein: the body is of aluminum material, and the powder particles are of copper or aluminum material.
The heat radiation structure, wherein: the powder particles of the heat exchange layer are adhered to each other or are arranged at intervals.
The heat radiation structure, wherein: the powder particles of the heat exchange layer are adhered and stacked.
The heat radiation structure, wherein: the body is provided with a heat absorption side and a heat dissipation side, the fins are formed by extending the heat dissipation side, and the fins are arranged at intervals.
The heat radiation structure, wherein: the body is a radiator.
The heat exchange layer is composed of a plurality of powder particles, and the plurality of powder particles are provided with a plurality of contact surfaces, and the contact surfaces of the plurality of powder particles are beneficial to increasing the heat dissipation area of the surfaces of the plurality of fins and/or the cavity, so that when the space to be arranged by the radiator is limited, the heat dissipation area of the surface layer of the fins is increased by the plurality of contact surfaces provided by the plurality of powder particles and having multiple angles under the condition that the volume size or the number of the fins of the radiator is not changed, and the overall heat dissipation efficiency of the radiator is further improved.
Drawings
Fig. 1 is a perspective cross-sectional view of a first embodiment of a heat dissipating structure according to the present utility model.
Fig. 2 is a perspective view of a second embodiment of the heat dissipating structure of the present utility model.
Fig. 3 is a cross-sectional view of a second embodiment of the heat dissipating structure of the present utility model.
Reference numerals illustrate: a body 1; a heat absorbing side 1A; a heat radiation side 1B; a chamber 11; an outlet 12; an inlet 13; fins 14; a wall surface 111; a heat exchange layer 2; powder particles 21; nickel layer 3.
Detailed Description
The above objects of the present utility model, as well as the structural and functional characteristics thereof, will be described in terms of the preferred embodiments of the present utility model as illustrated in the accompanying drawings.
Referring to fig. 1, which is a perspective cross-sectional view of a first embodiment of a heat dissipation structure according to the present utility model, as shown in the drawings, the heat dissipation structure of the present utility model comprises: a body 1;
The body 1 is a water-cooled head with a chamber 11, an outlet 12 and an inlet 13 are provided on the body 1, the outlet and the inlet 12, 13 are communicated with the chamber 11, a plurality of fins 14 are arranged in the chamber 11 at intervals, and a heat exchange layer 2 formed by a plurality of powder particles 21 is coated on the surface layer of the fins 14 and the wall surface 111 of the chamber 11.
The heat exchange layer 2 is composed of a plurality of powder particles 21, and the heat exchange layer 2 can be coated on the surface layer of the fins 14 and the wall surface 111 of the chamber 11 by electroplating, spraying, sintering, printing or the like.
When the plurality of powder particles 21 are coated on the surface layer of the fin 14 and the wall surface of the chamber 11 by spraying, a nickel layer 3 is formed on the surface layer of the fin 14 and the wall surface 111 of the chamber 11 in advance for increasing the adhesion, then spraying is performed, the plurality of powder particles 21 are coated on the nickel layer 3, and the plurality of powder particles 21 can be selected to be arranged in a manner that the plurality of particles are adhered to each other or the plurality of powder particles are arranged at intervals, and the plurality of powder particles 21 are arranged in a manner of stacking a plurality of layers. The nickel layer 3 can also be used as a protective layer for the fins 14 when the fins 14 and the powder particles 21 are made of different materials, so that eutectic corrosion between the two materials (copper and aluminum) is avoided.
The material of the body 1 may be aluminum or copper, and the material of the powder particles 21 in the heat exchange layer 2 may be the same as or different from the material of the body 1.
Referring to fig. 2 and 3, which are a perspective view and a cross-sectional view of a second embodiment of the heat dissipation structure of the present utility model, as shown in the drawings, the body 1 of the present embodiment is an illustrative embodiment using a heat sink, but not limited to, the upper and lower sides of the body 1 of the present embodiment are respectively provided with a heat absorption side 1A and a heat dissipation side 1B, the heat absorption side 1A is used for directly attaching heat to a heat source, the plurality of fins 14 are formed by extending from the heat dissipation side 1B, the plurality of fins 14 are arranged at intervals, and the heat exchange layer 2 is disposed on the surface layer of the plurality of fins 14.
According to the utility model, the heat exchange layer 2 formed by the plurality of powder particles 21 is arranged on the surface layer of the fin 14 and the wall surface 111 of the cavity 11, and the surface layer (surface) is provided with the plurality of powder particles 21, so that the plurality of powder particles 21 have a plurality of or multi-angle contact surfaces, and the surface layer of the fin 14 is far more than a single contact surface, and the plurality of powder particles 21 have a plurality of contact surfaces to form multi-angle contact surfaces, so that more-angle heat dissipation surfaces are provided, and the heat dissipation area is increased by the plurality of powder particles 21 without changing the whole volume of the radiator and without additionally increasing the volume or area of the fin 14, and the heat of the fin 14 can be quickly transferred to the surface layer of the powder particles 21 by adopting a material with a large heat conductivity coefficient, such as copper, no matter the material is applied to water cooling or air cooling, and the heat can be quickly carried away from the fin 14 by various cooling fluids, such as cooling air flow or cooling liquid, so that the heat dissipation efficiency of the radiator is improved.
Along with the different manufacturing processes (such as spraying), the powder particles 21 are disposed on the surface layer of the fins 14, and can be formed on the surface layer of the fins 14 in a single-layer sparse and dense arrangement manner, or in a single-layer dense arrangement manner and then in a stacked manner to form a porous capillary structure, so as to further improve the heat exchange coefficient and heat dissipation efficiency of the fins 14.
If the porous powder particles are applied to the inside of a heat dissipation structure for two-phase flow heat exchange, the concave-convex structure formed by the dispersion arrangement of the powder particles can be used as a vaporization core, which is beneficial to nucleate boiling, and if the powder particles are densely distributed and are stacked in layers (the powder forms a porous layer structure with each other), capillary force and enough phase-change space can be provided for working fluid, so that the heat exchange efficiency of the two-phase flow inside the evaporator is enhanced.
Therefore, the heat exchange layer 2 composed of the powder particles 21 is directly formed on the surface layer of the fins 14, so that the problem that the volume or area of the fins 14 cannot be increased when the radiator is limited by space is solved as a solution for improving the heat radiation efficiency.
Claims (7)
1. A heat dissipation structure, comprising:
The body is a water cooling head, the inside of the body is provided with a cavity, an outlet and an inlet, the outlet and the inlet are communicated with the cavity, and the fins are arranged in the cavity and are arranged at intervals; the surface layer of the fins has a heat exchange layer formed by coating a plurality of powder particles.
2. The heat dissipating structure of claim 1, wherein: a nickel layer is respectively arranged between the heat exchange layer and the surface layer of the fin and the wall surface of the chamber.
3. The heat dissipating structure of claim 1, wherein: the body is of aluminum material, and the powder particles are of copper or aluminum material.
4. The heat dissipating structure of claim 1, wherein: the powder particles of the heat exchange layer are adhered to each other or are arranged at intervals.
5. The heat dissipating structure of claim 1, wherein: the powders of the heat exchange layer are adhered and stacked.
6. The heat dissipating structure of claim 1, wherein: the body is provided with a heat absorption side and a heat dissipation side, the fins are formed by extending the heat dissipation side, and the fins are arranged at intervals.
7. The heat dissipating structure of claim 1, wherein: the body is a radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420068095.XU CN221962167U (en) | 2024-01-10 | 2024-01-10 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420068095.XU CN221962167U (en) | 2024-01-10 | 2024-01-10 | Heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221962167U true CN221962167U (en) | 2024-11-05 |
Family
ID=93279030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420068095.XU Active CN221962167U (en) | 2024-01-10 | 2024-01-10 | Heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221962167U (en) |
-
2024
- 2024-01-10 CN CN202420068095.XU patent/CN221962167U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |