CN213044012U - Temperature equalization plate and electronic equipment - Google Patents
Temperature equalization plate and electronic equipment Download PDFInfo
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- CN213044012U CN213044012U CN202021464749.9U CN202021464749U CN213044012U CN 213044012 U CN213044012 U CN 213044012U CN 202021464749 U CN202021464749 U CN 202021464749U CN 213044012 U CN213044012 U CN 213044012U
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Abstract
The utility model provides a temperature-uniforming plate and electronic equipment. The temperature equalization plate comprises: the device comprises a first plate body, a second plate body, a closed working cavity, a capillary structure layer and a working medium, wherein the second plate body is covered relative to the first plate body; the inner surfaces of the first plate body and the second plate body are respectively contacted with the upper surface and the lower surface of the capillary structure layer, except the area contacted with the capillary structure layer, the inner surfaces of the other first plate bodies are oppositely spaced from the inner surface of the second plate body to form a steam channel which is coplanar with the capillary structure layer, and the thickness of the uniform temperature plate can be reduced by arranging the capillary structure layer and the steam channel to be coplanar.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a temperature-uniforming plate and electronic equipment.
Background
With the development of technology, the operation speed of electronic devices is faster and faster, and the size and weight of electronic devices are reduced, so that electronic devices are designed to be light, thin, small and compact. This is accompanied by an increasing amount of heat being emitted by the electronic components per unit of time.
Therefore, in order to avoid the performance degradation or breakdown of the electronic device caused by the over-high temperature of the electronic device, a heat dissipation device is usually added on the electronic device. Therefore, the heat emitted by the electronic element can be dissipated by the heat dissipation device, and the temperature of the electronic element is further reduced. With the continuous technology, the heat dissipation technology of electronic devices is continuously updated and iterated, and various heat dissipation technologies, such as graphite heat dissipation, metal back plate, frame heat dissipation, heat conduction gel heat dissipation, heat pipe heat dissipation, and then heat dissipation of a temperature equalization plate, are continuously emerging. In the heat dissipation scheme of the current electronic device, the temperature equalization plate has become a new hot spot of the current heat dissipation technology as a new way to solve the heat dissipation problem, especially the application of the temperature equalization plate in the future 5G commercial product.
Specifically, a Vapor chamber (Vapor chamber) is a heat dissipation device, and its working principle is similar to that of a heat pipe, the difference is that the heat conduction of the heat pipe is the transmission of linear in one-dimensional direction, and the heat conduction of the Vapor chamber is the transmission of linear in two-dimensional direction. The temperature-uniforming plate structurally comprises a lower plate body, a capillary structure, a steam channel and an upper plate body which are sequentially stacked, wherein the capillary structure and the steam channel are used as a working chamber of the temperature-uniforming plate, a working medium is filled in the working chamber, after the lower plate body is contacted with a heat source such as a heating electronic element, the working medium contained in the capillary structure of the working chamber is converted from a liquid state to a gas state and is transmitted to the upper plate body through the steam channel, and finally, after heat energy is transmitted out through a heat dissipation structure such as fins in an area except for the area contacting the heat source on the temperature-uniforming plate or on the outer side of the temperature-uniforming plate, the working medium is re-condensed into a liquid state and returns to the capillary structure of.
Because the capillary structure and the steam channel are arranged in a stacked manner, the thickness of the existing temperature equalizing plate is large, generally more than 0.3mm, when the temperature equalizing plate is applied to electronic equipment such as a smart phone, the thickness of the product is increased, and particularly when the temperature equalizing plate is used on the smart phone, the strength of the middle frame is reduced because the middle frame of the smart phone is required to be cut.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature-uniforming plate can reduce the thickness of temperature-uniforming plate.
An object of the utility model is to provide an electronic equipment uses foretell temperature-uniforming plate, can reduce product thickness under the prerequisite of guaranteeing product intensity.
In order to achieve the above object, the present invention provides a vapor chamber, including: the device comprises a first plate body, a second plate body, a closed working cavity, a capillary structure layer and a working medium, wherein the second plate body is covered relative to the first plate body;
the inner surfaces of the first plate body and the second plate body are respectively contacted with the upper surface and the lower surface of the capillary structure layer, and except the area contacted with the capillary structure layer, the inner surfaces of the other first plate bodies are oppositely spaced from the inner surface of the second plate body to form a steam channel which is coplanar with the capillary structure layer.
The capillary structure layer is printed conductive particles.
The capillary structure layer is printed on the inner surface of the first plate body or the inner surface of the second plate body.
The capillary structure layer comprises a first structure layer and a second structure layer which are arranged in a stacked mode, and the first structure layer and the second structure layer are printed on the inner surface of the first plate body and the inner surface of the second plate body respectively.
The first plate body comprises a first groove sunken towards the direction of keeping away from the second plate body, the second plate body comprises a second groove sunken towards keeping away from the direction of the first plate body, and the first groove and the second groove are combined in a sealing mode to form the working cavity.
The first plate body and the second plate body are sealed through welding.
The capillary structure layer includes: the device comprises a main frame and a plurality of branches extending from the main frame and arranged at intervals.
The main frame comprises a first trunk, a second trunk connected with the first trunk and a third trunk connected with the first trunk and spaced from the second trunk in parallel, and the second trunk and the third trunk are positioned on one side of the first trunk;
the area which is located on one side of the first trunk and on one side of the second trunk, which is far away from the third trunk, is a first area, the area which is located on one side of the first trunk and on one side of the third trunk, which is far away from the second trunk, is a second area, and the area which is located on the other side of the first trunk is a third area;
the branch comprises a plurality of first branches which are arranged in a first area and connected with the first trunk or the second trunk at intervals in parallel, a plurality of second branches which are arranged in a second area and connected with the first trunk or the third trunk at intervals in parallel, and a plurality of third branches which are arranged in a third area and connected with the first trunk at intervals in parallel.
The thickness of the temperature equalizing plate is less than or equal to 0.25 mm.
The utility model also provides an electronic equipment, including foretell temperature-uniforming plate.
The utility model has the advantages that: the utility model provides a temperature-uniforming plate, include: the device comprises a first plate body, a second plate body, a closed working cavity, a capillary structure layer and a working medium, wherein the second plate body is covered relative to the first plate body; the inner surfaces of the first plate body and the second plate body are respectively contacted with the upper surface and the lower surface of the capillary structure layer, except the area contacted with the capillary structure layer, the inner surfaces of the other first plate bodies are oppositely spaced from the inner surface of the second plate body to form a steam channel which is coplanar with the capillary structure layer, and the thickness of the uniform temperature plate can be reduced by arranging the capillary structure layer and the steam channel to be coplanar. The utility model also provides an electronic equipment can reduce product thickness under the prerequisite of guaranteeing product intensity.
Drawings
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the present invention and accompanying drawings, which are provided for the purpose of illustration and description and are not intended to limit the present invention.
In the drawings, there is shown in the drawings,
FIG. 1 is a cross-sectional view of a first embodiment of a vapor chamber of the present invention;
fig. 2 is a schematic view of an outer surface of a first plate body of a first embodiment of the vapor chamber of the present invention;
fig. 3 is a schematic view of the inner surface of the first plate body of the first embodiment of the vapor chamber of the present invention;
fig. 4 is a schematic view of the inner surface of the second plate body of the first embodiment of the vapor chamber of the present invention;
fig. 5 is a schematic view of the outer surface of the second plate body of the first embodiment of the vapor chamber of the present invention;
FIG. 6 is a cross-sectional view of a second embodiment of the vapor chamber of the present invention;
fig. 7 is a schematic view of the outer surface of the first plate body of the second embodiment of the vapor chamber of the present invention;
fig. 8 is a schematic view of the inner surface of the first plate body of the second embodiment of the vapor chamber of the present invention;
fig. 9 is a schematic view of the inner surface of the second plate body of the second embodiment of the vapor chamber of the present invention;
fig. 10 is a schematic view of the outer surface of the second plate body of the second embodiment of the vapor chamber of the present invention;
fig. 11 is a cross-sectional view of a third embodiment of the vapor chamber of the present invention;
fig. 12 is a schematic view of the outer surface of the first plate body of the third embodiment of the vapor chamber of the present invention;
fig. 13 is a schematic view of the inner surface of the first plate body of the third embodiment of the vapor chamber of the present invention;
fig. 14 is a schematic view of the inner surface of the second plate body of the third embodiment of the vapor chamber of the present invention;
fig. 15 is a schematic view of the outer surface of a second plate body of a third embodiment of the vapor chamber of the present invention;
fig. 16 is a schematic view of a capillary structure layer of the vapor chamber of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 1 to 16, the present invention provides a vapor chamber, including: the device comprises a first plate body 1, a second plate body 2 which is oppositely covered with the first plate body 1, a closed working cavity 3 formed between the first plate body 1 and the second plate body 2, a capillary structure layer 4 arranged in the working cavity 3 and a working medium filled in the working cavity 3;
the inner surface of the first plate body 1 and the inner surface of the second plate body 2 are respectively contacted with the upper surface and the lower surface of the capillary structure layer 4, and except the area contacted with the capillary structure layer 4, the inner surfaces of the other first plate bodies 1 and the inner surface of the second plate body 2 are oppositely spaced to form a steam channel 5 which is coplanar with the capillary structure layer 4.
Specifically, the capillary structure layer 4 is printed conductive particles, and the capillary structure layer 4 has a plurality of fine pores therein, and the pores are used for accelerating the vaporization and flow of the working medium.
Meanwhile, the capillary structure layer 4 is made of printed conductive particles, so that a complex capillary circuit design can be realized, and the heat-removing capability of the temperature-equalizing plate is maximized.
Specifically, the working medium is in a liquid state at normal temperature and is heated to volatilize into a gaseous state.
Specifically, first plate body 1 includes to keeping away from the sunken first recess 11 of second plate body 2 direction, second plate body 2 includes to keeping away from the sunken second recess 12 of first plate body 1 direction, first recess 11 with second recess 12 sealing combination forms working chamber 3.
Specifically, the first plate body 1 and the second plate body 2 are sealed through welding, and optionally, the first plate body 1 and the second plate body 2 are sealed through brazing filler metal welding.
Specifically, the shape structure and the forming mode of the first plate body 1 and the second plate body 2 can be selected according to actual needs, preferably, in some embodiments of the present invention, the first plate body 1 includes a plate body and a handle connected to the plate body, and the second plate body 2 has the same shape as the first plate body 1.
Further, as shown in fig. 1 to 5, in the first embodiment of the present invention, the capillary structure layer 4 is printed on the inner surface of the first plate 1, further, the capillary structure layer 4 is printed on the first groove 11, the height of the capillary structure layer 4 is greater than the depth of the first groove 11, specifically, the height of the capillary structure layer 4 is equal to the sum of the depths of the first groove 11 and the second groove 12, the capillary structure layer 4 can be directly utilized to support the first plate 1 and the second plate 2, no additional support column is needed, and the steam channel 5 is changed from the prior art to the capillary structure stacking arrangement in the same plane with the capillary structure layer 4.
Further, as shown in fig. 6 to 10, in the second embodiment of the present invention, the capillary structure layer 4 is printed on the inner surface of the second plate 2, further, the capillary structure layer 4 is printed on the second groove 12, the height of the capillary structure layer 4 is greater than the depth of the second groove 12, specifically, the height of the capillary structure layer 4 is equal to the sum of the depths of the first groove 11 and the second groove 12, the capillary structure layer 4 can be directly utilized to support the first plate 1 and the second plate 2, no additional support column is needed, and the steam channel 5 is changed from the prior art to the capillary structure stacking arrangement in the same plane with the capillary structure layer 4.
Further, as shown in fig. 11 to 15, in a third embodiment of the present invention, the capillary structure layer 4 includes a first structure layer 41 and a second structure layer 42 which are stacked, the first structure layer 41 and the second structure layer 42 are printed on the inner surface of the first plate 1 and the inner surface of the second plate 2, further, the first structure layer 41 and the second structure layer 42 are printed on the first groove 11 and the second groove 12, respectively, the heights of the first structure layer 41 and the second structure layer 42 are equal to the depths of the first groove 11 and the second groove 12, respectively, so that the entire height of the capillary structure layer 4 is equal to the sum of the depths of the first groove 11 and the second groove 12, the capillary structure layer 4 can be directly utilized to support the first plate 1 and the second plate 2, without additionally providing a support column, and the steam channel 5 is changed from the prior art stacked arrangement with the capillary structure to the same level as the capillary structure layer 4 in the present invention The face sets up, compares in prior art, has reduced the height of support column and steam channel to the thickness of samming board has been reduced by a wide margin.
Specifically, the specific pattern design of the capillary structure layer 4 can be selected as required, and in some embodiments of the present invention, as shown in fig. 16, the capillary structure layer 4 includes: a main frame 31 and a plurality of branches 32 extending from the main frame 31 and arranged at intervals.
Further, the main frame 31 includes a first main body 311, a second main body 312 connected to the first main body 311, and a third main body 313 connected to the first main body 311 and spaced from and parallel to the second main body 312, where the second main body 312 and the third main body 313 are located at one side of the first main body 311;
a region located at one side of the first trunk 311 and located at one side of the second trunk 312 away from the third trunk 313 is a first region, a region located at one side of the first trunk 311 and located at one side of the third trunk 313 away from the second trunk 312 is a second region, and a region located at the other side of the first trunk 311 is a third region;
the branch 32 includes a plurality of first branches 321 connected to the first trunk 311 or the second trunk 312 and arranged in parallel at intervals in the first region, a plurality of second branches 322 connected to the first trunk 311 or the third trunk 313 and arranged in parallel at intervals in the second region, and a plurality of third branches 323 connected to the first trunk 311 and arranged in parallel at intervals in the third region.
Specifically, the utility model discloses a temperature-uniforming plate structural design can make the thickness of temperature-uniforming plate is less than or equal to 0.25mm, realizes the ultra-thin design of temperature-uniforming plate, though the utility model discloses a structure has obvious advantage when being used for making the ultra-thin temperature-uniforming plate that is less than or equal to 0.25mm, but this structure is not only applicable to the temperature-uniforming plate that thickness is less than or equal to 0.25mm, and the temperature-uniforming plate of other arbitrary thicknesses can all adopt the utility model discloses a structure, this does not influence the realization of this invention.
Specifically, the working process of the temperature equalization plate is as follows: when the first plate 1 contacts with a heat source, such as a heating electronic component, the working medium contained in the capillary structure layer 4 of the working cavity 3 is converted from a liquid state to a gas state, and is transmitted to the second plate 2 through the steam channel 5 which is coplanar with the capillary structure layer 4, and finally, heat energy is transmitted out through the area of the temperature-uniforming plate except the area contacting with the heat source or the heat-radiating structure, such as fins, outside the temperature-uniforming plate, and the working medium is condensed into a liquid state again, returns to the capillary structure layer 4, and circulates again for the next time.
The utility model also provides an electronic equipment, including foretell temperature-uniforming plate.
Preferably, electronic equipment is the cell-phone, adopts the utility model discloses a cell-phone of samming board because the ultra-thin structure of samming board arranges in the cell-phone the utility model discloses a cell-phone center need not to cut and wear during the samming board, has improved product strength greatly.
To sum up, the utility model provides a temperature-uniforming plate, include: the device comprises a first plate body, a second plate body, a closed working cavity, a capillary structure layer and a working medium, wherein the second plate body is covered relative to the first plate body; the inner surfaces of the first plate body and the second plate body are respectively contacted with the upper surface and the lower surface of the capillary structure layer, except the area contacted with the capillary structure layer, the inner surfaces of the other first plate bodies are oppositely spaced from the inner surface of the second plate body to form a steam channel which is coplanar with the capillary structure layer, and the thickness of the uniform temperature plate can be reduced by arranging the capillary structure layer and the steam channel to be coplanar. The utility model also provides an electronic equipment can reduce product thickness under the prerequisite of guaranteeing product intensity.
From the above, it is obvious to those skilled in the art that various other changes and modifications can be made according to the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protection scope of the claims of the present invention.
Claims (10)
1. A vapor chamber, comprising: the plate comprises a first plate body (1), a second plate body (2) which is oppositely covered with the first plate body (1), a closed working cavity (3) formed between the first plate body (1) and the second plate body (2), a capillary structure layer (4) arranged in the working cavity (3) and a working medium filled in the working cavity (3);
the inner surface of the first plate body (1) and the inner surface of the second plate body (2) are respectively contacted with the upper surface and the lower surface of the capillary structure layer (4), and except the region contacted with the capillary structure layer (4), the inner surfaces of the other first plate bodies (1) are oppositely spaced from the inner surface of the second plate body (2) to form a steam channel (5) which is coplanar with the capillary structure layer (4).
2. A temperature-uniforming plate according to claim 1, wherein the capillary structure layer (4) is printed conductive particles.
3. A temperature-uniforming plate according to claim 2, wherein the capillary structure layer (4) is printed on the inner surface of the first plate body (1) or on the inner surface of the second plate body (2).
4. A temperature-uniforming plate according to claim 2, wherein the capillary structure layer (4) comprises a first structure layer (41) and a second structure layer (42) which are stacked, and the first structure layer (41) and the second structure layer (42) are respectively printed on the inner surface of the first plate body (1) and the inner surface of the second plate body (2).
5. A temperature-uniforming plate according to claim 1, wherein the first plate body (1) includes a first groove (11) recessed away from the second plate body (2), the second plate body (2) includes a second groove (12) recessed away from the first plate body (1), and the first groove (11) and the second groove (12) are sealingly joined to form the working chamber (3).
6. A temperature-uniforming plate according to claim 1, wherein the first plate body (1) and the second plate body (2) are edge-sealed by welding.
7. A vapor-distribution plate according to claim 1, characterized in that said capillary structure layer (4) comprises: the device comprises a main frame (31) and a plurality of branches (32) which are arranged at intervals and extend from the main frame (31).
8. The temperature-uniforming plate of claim 7, wherein the main frame (31) comprises a first trunk (311), a second trunk (312) connected to the first trunk (311), and a third trunk (313) connected to the first trunk (311) and spaced parallel to the second trunk (312), the second trunk (312) and the third trunk (313) being located at one side of the first trunk (311);
the area which is located on one side of the first trunk (311) and on one side of the second trunk (312) far away from the third trunk (313) is a first area, the area which is located on one side of the first trunk (311) and on one side of the third trunk (313) far away from the second trunk (312) is a second area, and the area which is located on the other side of the first trunk (311) is a third area;
the branch (32) comprises a plurality of first branch bars (321) which are arranged in parallel at intervals and connected with the first main bar (311) or the second main bar (312) and are positioned in a first area, a plurality of second branch bars (322) which are arranged in parallel at intervals and connected with the first main bar (311) or the third main bar (313) and are positioned in a second area, and a plurality of third branch bars (323) which are arranged in parallel at intervals and connected with the first main bar (311) and are positioned in a third area.
9. The vapor-deposition plate of claim 1, wherein the thickness is less than or equal to 0.25 mm.
10. An electronic device comprising the vapor chamber according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021464749.9U CN213044012U (en) | 2020-07-22 | 2020-07-22 | Temperature equalization plate and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021464749.9U CN213044012U (en) | 2020-07-22 | 2020-07-22 | Temperature equalization plate and electronic equipment |
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| Publication Number | Publication Date |
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| CN213044012U true CN213044012U (en) | 2021-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021464749.9U Active CN213044012U (en) | 2020-07-22 | 2020-07-22 | Temperature equalization plate and electronic equipment |
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| CN (1) | CN213044012U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113453494A (en) * | 2021-05-18 | 2021-09-28 | 江西展耀微电子有限公司 | Preparation method of vapor chamber, vapor chamber and electronic equipment |
| CN113453500A (en) * | 2021-06-08 | 2021-09-28 | 江西展耀微电子有限公司 | Vapor chamber and electronic equipment |
-
2020
- 2020-07-22 CN CN202021464749.9U patent/CN213044012U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113453494A (en) * | 2021-05-18 | 2021-09-28 | 江西展耀微电子有限公司 | Preparation method of vapor chamber, vapor chamber and electronic equipment |
| CN113453494B (en) * | 2021-05-18 | 2023-08-15 | 江西新菲新材料有限公司 | Vapor chamber preparation method, vapor chamber and electronic equipment |
| CN113453500A (en) * | 2021-06-08 | 2021-09-28 | 江西展耀微电子有限公司 | Vapor chamber and electronic equipment |
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Address after: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Leishi Thermal Management Technology Co.,Ltd. Address before: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES Ltd. |
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