CN219999846U - Heat abstractor, computing device and vehicle - Google Patents

Abstract

The utility model discloses a heat dissipation device, a computing device and a vehicle, wherein the heat dissipation device is positioned in a space with a ventilation opening, and the heat dissipation device comprises: the condensation water circulation assembly, the semiconductor refrigeration component, the first air cooling heat dissipation component and the second air cooling heat dissipation component, after the semiconductor refrigeration component is started to work, cold air can be quickly generated, the cold air is released at the refrigeration end, the first air cooling heat dissipation component is located at the refrigeration end close to the semiconductor refrigeration component, and the cold air output by the semiconductor refrigeration component is blown to equipment to be cooled by the first air cooling heat dissipation component, so that the equipment to be cooled can dissipate heat as soon as possible. After the semiconductor refrigeration component is started to work, certain heat can be generated, the heat is released at the heating end, the second air-cooled heat dissipation component dissipates heat towards the ventilation opening of the space where the heat dissipation device is located, the ventilation opening exchanges air flow with the outside of the space where the heat dissipation device is located, and after the outside air flow enters the space through the ventilation opening, part of heat at the heating end of the semiconductor refrigeration component is taken away, so that the heat dissipation effect of the semiconductor refrigeration component is improved.

Description

Heat abstractor, computing device and vehicle

Technical Field

The utility model relates to the technical field of unmanned automobiles, in particular to a heat dissipation device, computing equipment and a vehicle.

Background

The inside of autopilot vehicle includes on-vehicle computer, on-vehicle computer is the brain of autopilot vehicle, on-vehicle computer bears the weight of carrying out the important device that fuses discernment and make a decision with perception data such as laser radar, but the operation work of high strength can let the host computer produce a large amount of heats, the inside compacter environment of vehicle probably leads to the heat unable to distribute away, cause local high temperature, the CPU frequency of host computer can be reduced to high temperature, influence on-vehicle computer's computational performance, simultaneously, the high temperature environment can lead to on-vehicle computer's components and parts and circuit quick ageing, can lead to the unusual of autopilot system for a long time.

Disclosure of Invention

The utility model aims to provide a heat dissipation device which can assist equipment to be cooled to rapidly dissipate heat and avoid the problem that the equipment to be cooled is affected in normal operation due to local high temperature caused by the fact that heat cannot be timely dissipated.

The utility model provides a heat dissipating device, which is positioned in a space with a ventilation opening and comprises: a controller; the condensed water circulation assembly is connected with the controller through a cable; the semiconductor refrigeration component is connected with the controller through a cable and is arranged on the condensate water circulation assembly, and the semiconductor refrigeration component comprises a refrigeration end and a heating end; the first air cooling radiating component is connected with the controller through a cable, is arranged on the condensed water circulating assembly and is positioned close to the refrigerating end of the semiconductor refrigerating component, and cold air output by the refrigerating end of the semiconductor refrigerating component is blown to equipment to be radiated; the second air-cooling heat dissipation component is connected with the controller through a cable, is arranged on the condensate water circulation component, is positioned close to the heating end of the semiconductor refrigeration component, and faces the ventilation opening of the space where the heat dissipation device is located to blow.

In some alternative embodiments, the heat sink further comprises a temperature sensing component, the temperature sensing component being electrically connected to the controller.

In some optional embodiments, the heat dissipating device further includes a heat dissipating component disposed between the condensate circulating assembly and the semiconductor cooling component, and the second air-cooled heat dissipating component faces the heat dissipating component and the ventilation opening of the space where the heat dissipating device is located.

In some alternative embodiments, the first air-cooled heat sink member and the second air-cooled heat sink member are each one of a centrifugal fan, an axial fan, a mixed flow fan, and a cross flow fan.

In some alternative embodiments, the condensate circulating assembly comprises a condensate collecting tank, a circulating pipeline and a liquid pump, wherein a liquid inlet of the liquid pump is connected with a liquid outlet of the condensate collecting tank, a liquid outlet of the liquid pump is connected with a liquid inlet of the circulating pipeline, and the circulating pipeline is coiled outside the equipment to be cooled.

In some optional embodiments, the circulation pipeline includes an input pipeline, N annular pipelines, a plurality of conveying pipelines and an output pipeline, where the N annular pipelines are sequentially arranged and sleeved outside the device to be cooled; any two adjacent annular pipelines are connected through the conveying pipeline, the input pipeline is connected with the liquid outlet of the liquid pump and the first annular pipeline, the output pipeline is connected with the Nth annular pipeline, and N is an integer greater than or equal to 3.

In some alternative embodiments, the upper end of the ith-1 th annular pipeline is connected with the upper end of the ith annular pipeline through the conveying pipeline, the lower end of the ith annular pipeline is connected with the lower end of the (i+1) th annular pipeline through the conveying pipeline, and i is an integer greater than 1 and less than N.

In another aspect, the present utility model provides a computing device comprising a heat sink as described in any of the above, the circulation duct of the heat sink being coiled around the computing device.

In some alternative embodiments, the computing device includes a plurality of K second heat dissipating elements spaced apart; the circulating pipeline comprises N annular pipelines and a plurality of conveying pipelines, the second radiating elements and the annular pipelines are arranged in a staggered mode, any two adjacent annular pipelines are connected through the conveying pipelines, and K is an integer greater than or equal to 2.

In yet another aspect, the present utility model provides a vehicle comprising a computing device as described in any one of the above.

In some alternative embodiments, the computing device is disposed in a trunk of the vehicle, the trunk of the vehicle is provided with a vent, and the condensate collection tank, the semiconductor refrigeration component, the first air-cooled heat sink component, and the second air-cooled heat sink component are disposed proximate to the vent.

In some alternative embodiments, the cooling end of the semiconductor cooling component is oriented toward the computing device and the heating end of the semiconductor cooling component is oriented toward the vent.

Compared with the prior art, the utility model has the following technical effects:

1. the utility model provides a heat dissipating device, which is positioned in a space with a ventilation opening, and comprises: the device comprises a controller, a condensate water circulation assembly, a semiconductor refrigeration component, a first air-cooled radiating component, a second air-cooled radiating component and a radiating component. The controller is connected with the semiconductor refrigeration component, the first air-cooled radiating component and the second air-cooled radiating component through cables respectively and is used for sending opening and closing signals so as to control the semiconductor refrigeration component, the first air-cooled radiating component and the second air-cooled radiating component to be opened or to be stopped. After the semiconductor refrigerating component is started to work, cold air can be quickly generated, the cold air is released at the refrigerating end, the first air cooling radiating component is positioned at the refrigerating end close to the semiconductor refrigerating component, and the cold air output by the semiconductor refrigerating component is blown to equipment to be radiated by the first air cooling radiating component, so that the equipment to be radiated is enabled to radiate heat as soon as possible. After the semiconductor refrigeration component is started to work, certain heat can be generated, the heat is released at the heating end, the second air-cooled heat dissipation component dissipates heat towards the ventilation opening of the space where the heat dissipation device is located, the ventilation opening exchanges air flow with the outside of the space where the heat dissipation device is located, and after the outside air flow enters the space through the ventilation opening, part of heat at the heating end of the semiconductor refrigeration component is taken away, so that the heat dissipation effect of the semiconductor refrigeration component is improved. The liquid can circulate in the condensed water circulation assembly, and then take away the heat of semiconductor refrigeration part, first forced air cooling radiating part, second forced air cooling radiating part and waiting for the cooling equipment, avoid because the heat can't distribute away the local high temperature that causes, and then influence semiconductor refrigeration part, first forced air cooling radiating part, second forced air cooling radiating part and wait for the problem of the normal work of cooling equipment.

2. The utility model provides a computing device, which comprises a heat radiating device, wherein a circulating pipeline of the heat radiating device is coiled in the computing device, liquid in a condensed water collecting box can circulate in the circulating pipeline so as to take away heat of the computing device, the heat radiating device rapidly generates cold air through a semiconductor refrigerating component and blows the cold air to the computing device through a first air cooling radiating component, and the cold air is rapidly sent to the computing device, so that the computing device is rapidly cooled, the computing efficiency of the computing device is improved, the problem of ageing of components of the computing device caused by accumulation of heat is reduced, and the service life of the computing device is prolonged.

3. The utility model provides a vehicle, which comprises a computing device with a heat dissipation device, wherein the computing device can quickly dissipate heat, and the working performance of the computing device is stable, so that the running safety of the vehicle is greatly improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present utility model;

FIG. 2 is a schematic view showing a structure of a condensate collecting tank according to an embodiment of the present utility model;

fig. 3 is a schematic connection diagram of a circulation pipe and a device to be cooled at a first view angle according to an embodiment of the present utility model;

fig. 4 is a schematic connection diagram of a circulation pipe and a device to be cooled at a second view angle according to an embodiment of the utility model.

Reference numerals: 1-a controller; 2-a condensate water circulation assembly; 21-a condensed water collection tank; 211-upper cover; 212-a bottom plate; 213-side plates; 214-a through hole; 22-a circulation pipeline; 23-liquid pump; 221-an input pipe; 222-ring conduit; 223-a delivery conduit; 224-output pipe; 3-semiconductor refrigeration components; 4-a first air-cooled heat sink member; 5-a second air-cooled heat sink member; 6-a heat dissipation part; 7-a temperature sensing component; a-equipment to be cooled; a1-a second heat sink member.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model discloses a heat dissipating device, which is positioned in a space with a ventilation opening, as shown in fig. 1, and comprises: a controller 1; the condensed water circulation assembly 2 is connected with the controller 1 through a cable; the semiconductor refrigeration component 3 is connected with the controller 1 through a cable and is arranged on the condensate water circulation assembly 2, and the semiconductor refrigeration component 3 comprises a refrigeration end and a heating end; the first air-cooling heat dissipation component 4 is connected with the controller 1 through a cable, is arranged on the condensate water circulation assembly 2 and is positioned close to the refrigeration end of the semiconductor refrigeration component 3, and the cold air output by the refrigeration end of the semiconductor refrigeration component 3 is blown to the equipment a to be heat-dissipated; the second air-cooled heat dissipation part 5 is connected with the controller 1 through a cable, is arranged on the condensate water circulation assembly 2, is positioned near the heating end of the semiconductor refrigeration part 3, and faces the ventilation opening of the space where the heat dissipation device is positioned for blowing.

Specifically, as shown in fig. 1, the heat dissipating device includes: a controller 1, a condensate water circulation assembly 2, a semiconductor refrigeration component 3, a first air-cooled heat dissipation component 4 and a second air-cooled heat dissipation component 5. The controller 1 is connected with the semiconductor refrigeration component 3, the first air-cooling heat dissipation component 4 and the second air-cooling heat dissipation component 5 through cables respectively, and is used for sending opening and closing signals so as to control the semiconductor refrigeration component 3, the first air-cooling heat dissipation component 4 and the second air-cooling heat dissipation component 5 to be opened or to be stopped. The semiconductor refrigeration part 3 can generate cold air quickly after starting work, the cold air is released at the refrigeration end of the semiconductor refrigeration part 3, the first air-cooled radiating part 4 is positioned close to the refrigeration end of the semiconductor refrigeration part 3, and the first air-cooled radiating part 4 blows the cold air output by the semiconductor refrigeration part 3 to the equipment a to be radiated, so that the equipment a to be radiated radiates heat as soon as possible. After the semiconductor refrigeration component 3 is started to work, certain heat can be generated, the heat is released at the heating end, the second air-cooled heat dissipation component 5 faces the ventilation opening of the space where the heat dissipation device is located to blow air, so that the heat of the heating end of the semiconductor refrigeration component 3 is taken away, and the semiconductor refrigeration component 3 is assisted to dissipate heat as soon as possible. The liquid can circulate in the condensate water circulation assembly 2, and then take away the heat of semiconductor refrigeration part 3, first forced air cooling radiator unit 4, second forced air cooling radiator unit 5 and wait for radiator unit a, avoid because the heat can't distribute away the local high temperature that causes, and then influence semiconductor refrigeration part 3, first forced air cooling radiator unit 4, second forced air cooling radiator unit 5 and wait for radiator unit a normal operating's problem.

Further, the heat dissipating device further comprises a heat dissipating component 6, wherein the heat dissipating component 6 is arranged on the condensate water circulation assembly 2 and is located between the second air-cooled heat dissipating component 5 and the semiconductor refrigerating component 3, and the second air-cooled heat dissipating component 5 faces the heat dissipating component 6 and the ventilation opening of the space where the heat dissipating device is located to blow. The ventilation opening exchanges air flow with the outside of the space where the heat dissipation device is located, and after the outside air flow enters the space through the ventilation opening, part of heat of the heating end of the semiconductor refrigeration component is taken away, so that the heat dissipation effect of the semiconductor refrigeration component is improved.

Specifically, the heat dissipation part 6 includes a plurality of first heat dissipation elements that are sequentially arranged at the heating end of the semiconductor refrigeration part 3. Optionally, the heat dissipating component 6 is a heat sink, and the first heat dissipating element is a heat sink. The heat dissipation part 6 is arranged between the second air cooling heat dissipation part 5 and the semiconductor refrigeration part 3, the heat dissipation part 6 can quickly assist the semiconductor refrigeration part 3 to conduct heat, the second air cooling heat dissipation part 5 faces the ventilation opening of the space where the heat dissipation part 6 and the heat dissipation device are located to blow, and the heat dissipation part 6 and the semiconductor refrigeration part 3 are assisted to dissipate heat as soon as possible.

Further, as shown in fig. 2, the condensed water collecting tank 21 includes an upper cover 211, a bottom plate 212 and a side plate 213, the bottom plate 212 is rectangular, one end of the side plate 213 is connected to the bottom plate 212, the bottom plate 212 and the side plate 213 form a box-shaped structure having a receiving space, the upper cover 211 is located inside the box-shaped structure and is disposed at an end far from the bottom plate 212, and a groove is formed between the upper cover 211 and the side plate 213. The upper cover 211 and the bottom plate 212 have a certain included angle. Optionally, the included angle is smaller than 90 °, and the upper cover 211 is provided with a through hole 214 at a position closer to the bottom plate 212. The semiconductor refrigeration component 3, the first air-cooled heat dissipation component 4, the second air-cooled heat dissipation component 5 and the heat dissipation component 6 are arranged in grooves formed by the upper cover 211 and the side plates 213. Optionally, the semiconductor refrigeration component 3, the first air-cooled heat dissipation component 4, the second air-cooled heat dissipation component 5 and the heat dissipation component 6 are all arranged on the side plate 213 surrounding the groove through screws. When the semiconductor refrigeration component 3 is started to work, the semiconductor refrigeration component 3 can quickly generate cold air, the temperature difference changes to enable water vapor of ambient air to condense into water drops, the water drops fall into grooves formed by the upper cover 211 and the side plates 213, the upper cover 211 is inclined, the water drops fall into the box-shaped structure formed by the bottom plate 212 and the side plates 213 through the through holes 214 of the upper cover 211, and the condensate water collecting box 21 can collect condensate water of the semiconductor refrigeration component 3.

In some alternative embodiments, the heat sink further comprises a temperature sensing component 7, the temperature sensing component 7 being in cable connection with the controller 1.

Optionally, the temperature sensing component 7 may be a temperature sensor, where the temperature sensor is used to sense a temperature of the device to be cooled, and transmit the sensed temperature to the controller 1, and the controller 1 regulates and controls an on-state or a pause-state of the heat dissipating device according to the temperature of the device to be cooled, so that the heat dissipating device dissipates heat of the device to be cooled in time.

In some alternative embodiments, the first air-cooled heat dissipation part 4 is one of a centrifugal fan, an axial flow fan, a mixed flow fan, and a cross flow fan. The first air-cooled heat dissipation part 4 is located near the refrigeration end of the semiconductor refrigeration part 3, and the first air-cooled heat dissipation part 4 is used for blowing cool air output by the semiconductor refrigeration part 3 to the equipment a to be cooled, so that the equipment a to be cooled dissipates heat as soon as possible.

In some alternative embodiments, the second air-cooled heat dissipation part 5 is one of a centrifugal fan, an axial flow fan, a mixed flow fan, and a cross flow fan. The second air-cooled heat dissipation part 5 faces the heat dissipation part 6 and the ventilation opening of the space where the heat dissipation device is located, and the second air-cooled heat dissipation part 5 is used for assisting the semiconductor refrigeration part 3 to dissipate heat as soon as possible, so that the service life of the semiconductor refrigeration part 3 is prolonged.

In some alternative embodiments, the condensate circulating assembly 2 comprises a condensate collecting tank 21, a circulating pipeline 22 and a liquid pump 23, wherein a liquid inlet of the liquid pump 23 is connected with a liquid outlet of the condensate collecting tank 21, a liquid outlet of the liquid pump 23 is connected with a liquid inlet of the circulating pipeline 22, and the circulating pipeline 22 is coiled outside the equipment a to be cooled. The liquid pump 23 receives signals from the controller 1 to start operation, so that the liquid in the condensed water circulation assembly 2 realizes automatic circulation, and heat of the semiconductor refrigeration component 3, the first air-cooling heat dissipation component 4, the second air-cooling heat dissipation component 5 and the equipment a to be cooled is taken away.

Alternatively, the semiconductor refrigeration unit 3 is provided to the condensed water collection tank 21. The first air-cooled heat sink member 4 is provided in the condensate water collecting tank 21. The second air-cooled heat sink member 5 is provided in the condensate water collecting tank 21. The heat radiating member 6 is provided in the condensed water collecting tank 21. The liquid can circulate in the condensate water circulation assembly 2, and then take away the heat of semiconductor refrigeration part 3, first forced air cooling radiator unit 4, second forced air cooling radiator unit 5 and wait for radiator unit a, avoid because the heat can't distribute away the local high temperature that causes, and then influence semiconductor refrigeration part 3, first forced air cooling radiator unit 4, second forced air cooling radiator unit 5 and wait for radiator unit a normal operating's problem.

Specifically, as shown in fig. 1 and 3, the circulation pipeline 22 includes an input pipeline 221, a plurality of annular pipelines 222, N conveying pipelines 223, and an output pipeline 224, where the N annular pipelines 222 are sequentially arranged and sleeved outside the device a to be cooled, any two adjacent annular pipelines 222 are connected through the conveying pipeline 223, the input pipeline 221 is connected with the liquid outlet of the liquid pump 23 and the first annular pipeline 222, the output pipeline 224 is connected with the nth annular pipeline 222, and N is an integer greater than or equal to 3. The liquid in the condensed water collecting tank 21 is connected to the first annular pipe 222 through the input pipe 221, the liquid in the first annular pipe 222 is connected to the second annular pipe 222 through the delivery pipe 223, the liquid in the second annular pipe 222 is connected to the third annular pipe 222 through the delivery pipe 223, and so on until the liquid is connected to the nth annular pipe 222, and the liquid in the nth annular pipe 222 is discharged through the output pipe 224. Optionally, the heat dissipating device is located in a closed space, and the closed space is provided with a vent, and the output pipeline 224 penetrates through the vent, so that the liquid is discharged out of the closed space. The liquid takes away a large amount of heat of the equipment a to be cooled in the circulating process of the Nth annular pipeline 222, so that the cooling efficiency of the equipment a to be cooled is further improved.

Optionally, the heat dissipating device is disposed in a trunk of the autonomous vehicle, where the trunk of the autonomous vehicle is a closed space provided with a vent, and the output pipe 224 penetrates the vent of the trunk, so that the liquid in the condensed water collecting tank 21 is discharged out of the vehicle through the output pipe 224.

In some alternative embodiments, the upper end of the i-1 th annular pipe 222 is connected to the upper end of the i-1 th annular pipe 222 through a conveying pipe 223, the lower end of the i-1 th annular pipe 222 is connected to the lower end of the i-1 th annular pipe 222 through the conveying pipe 223, i is an integer greater than 1 and less than N, so that condensate can be guaranteed to enter the next annular pipe 222 after circulating in the whole annular pipe 222, and the heat dissipation effect of the plurality of annular pipes 222 on the heat dissipation device a is better.

In some alternative embodiments, the semiconductor refrigeration component 3 is a semiconductor refrigeration tablet. The semiconductor refrigerating plate has high refrigerating speed and high efficiency. The semiconductor refrigerating sheet has the characteristics of no noise, no vibration, no refrigerant, small volume, light weight and the like, and has the advantages of reliable work, simple and convenient operation and convenient adjustment of cold quantity. When the heat dissipating device is positioned in the closed space, the semiconductor refrigerating sheet has no noise in the refrigerating process, so that the surrounding working environment is quite, and the experience is higher.

In another aspect, the present utility model also provides a computing device including a heat dissipating device as described in any of the above, wherein the circulation pipe 22 of the heat dissipating device is coiled around the computing device.

In particular, the computing device is the device a to be heat-dissipated mentioned in any of the above. Optionally, the computing device is a computing device of an autonomous vehicle, the computing device is arranged in a trunk of the autonomous vehicle, the computing device comprises a heat dissipating device, a circulating pipeline 22 of the heat dissipating device is coiled in the computing device, and liquid in the condensed water collecting tank 21 can circulate in the circulating pipeline 22 so as to take away heat of the computing device. The semiconductor refrigeration component 3 rapidly generates cold air, and the first air-cooled heat dissipation component 4 blows air towards the computing equipment, so that the cold air is rapidly sent to the computing equipment, the computing equipment is rapidly cooled, the heat dissipation device can effectively solve the problem of heat dissipation of the trunk of the automatic driving vehicle, the computing efficiency of the computing equipment is improved, the problem of ageing of components of the computing equipment due to heat accumulation is reduced, and the service life of the computing equipment is prolonged.

In some alternative embodiments, the computing device includes a plurality of second heat dissipating elements spaced apart; the circulation pipe 22 includes a plurality of annular pipes 222 and a plurality of conveying pipes 223, the second heat dissipation elements and the annular pipes 222 are arranged in a staggered manner, and any two adjacent annular pipes 222 are connected through the conveying pipes 223.

Specifically, the computing device includes a housing, the housing has an upper surface and a lower surface in a height direction thereof, the upper surface of the housing is provided with a plurality of second heat dissipation elements a1, the plurality of second heat dissipation elements a1 are sequentially arranged in a length direction of the housing, a space is provided between any two adjacent second heat dissipation elements a1, an annular pipeline 222 is provided between any two adjacent second heat dissipation elements a1, and each annular pipeline 222 is sleeved on an outer surface of the housing. The circulation pipe 22 further includes an input pipe 221, a plurality of delivery pipes 223, and an output pipe 224, one end of the input pipe 221 is connected to the condensate collecting tank 21, the other end of the input pipe 221 is connected to the first annular pipe 222, the first annular pipe 222 is connected to the second annular pipe 222 through the delivery pipe 223, the second annular pipe 222 is connected to the third annular pipe 222 through the delivery pipe 223, and the like, the N-1 th annular pipe 222 is connected to the N-th annular pipe 222 through the delivery pipe 223, the N-th annular pipe 222 is connected to the output pipe 224, and the liquid is discharged from the vehicle trunk through the output pipe 224. Further, the vehicle trunk is provided with a plurality of vents, and the output pipe 224 penetrates one of the vents, thereby discharging the liquid out of the trunk. The liquid takes away a large amount of heat from the computing device during the circulation of the plurality of annular conduits 222, further increasing the heat dissipation efficiency of the computing device.

In one aspect, the utility model also provides a vehicle comprising a computing device as mentioned in any of the above.

Optionally, the vehicle is an autonomous vehicle. The vehicle includes a computing device with a heat sink, the computing device disposed in a trunk of the vehicle. The computing equipment can quickly dissipate heat, and the working performance of the computing equipment is stable, so that the driving safety of the vehicle is greatly improved.

Further, the vehicle trunk is provided with a plurality of vents communicated with the outside, the condensed water collecting box 21, the semiconductor refrigerating component 3, the first air cooling heat dissipation component 4 and the second air cooling heat dissipation component 5 are arranged at positions close to the vents, the second air cooling heat dissipation component 5 blows air towards the vents of the vehicle trunk, the heating end of the semiconductor refrigerating component 3 is close to the vents, the vehicle trunk exchanges air flow with the outside of the vehicle through the vents, and after the outside air flow enters the trunk through the vents, part of heat of the heating end of the semiconductor refrigerating component 3 is taken away, so that the heat dissipation effect of the semiconductor refrigerating component 3 is improved. The refrigerating end of the semiconductor refrigerating component 3 faces the computing equipment, so that cold air produced by the semiconductor refrigerating component 3 is quickly transferred to the computing equipment, and the heat dissipation efficiency of the computing equipment is improved. The liquid in the condensed water collecting box 21 sequentially passes through the plurality of annular pipelines 222 and finally flows out of the vehicle through the output pipeline 224, and a large amount of heat of the computing equipment is taken away by the liquid in the process of circulating the plurality of annular pipelines 222, so that the heat dissipation efficiency of the computing equipment is further improved.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (11)

1. A heat sink positioned in a space having a vent, comprising:

a controller (1);

the condensed water circulation assembly (2) is connected with the controller (1) through a cable;

the semiconductor refrigeration component (3) is connected with the controller (1) through a cable and is arranged on the condensate water circulation assembly (2), and the semiconductor refrigeration component (3) comprises a refrigeration end and a heating end;

the first air-cooling heat dissipation component (4) is connected with the controller (1) through a cable, is arranged on the condensed water circulation assembly (2) and is positioned close to the refrigerating end of the semiconductor refrigerating component (3), and cold air output by the refrigerating end of the semiconductor refrigerating component (3) is blown to equipment (a) to be cooled;

and the second air-cooling radiating component (5) is connected with the controller (1) through a cable, is arranged in the condensed water circulating assembly (2), is positioned close to the heating end of the semiconductor refrigerating component (3), and faces to a ventilation opening of the space where the radiating device is positioned for blowing air.

2. The heat sink according to claim 1, further comprising a temperature sensing member (7), the temperature sensing member (7) being cable-connected to the controller (1).

3. The heat dissipating device according to claim 1, further comprising a heat dissipating member (6) disposed between the condensed water circulation assembly (2) and the semiconductor cooling member (3), wherein the second air-cooled heat dissipating member (5) faces the heat dissipating member (6) and a vent of a space where the heat dissipating device is located.

4. The heat dissipating device according to claim 1, wherein the first air-cooled heat dissipating component (4) and the second air-cooled heat dissipating component (5) are each one of a centrifugal fan, an axial fan, a mixed flow fan, and a cross flow fan.

5. The heat dissipating device according to any one of claims 1-4, wherein the condensate circulating assembly (2) comprises a condensate collecting tank (21), a circulating pipe (22) and a liquid pump (23), a liquid inlet of the liquid pump (23) is connected with a liquid outlet of the condensate collecting tank (21), a liquid outlet of the liquid pump (23) is connected with a liquid inlet of the circulating pipe (22), and the circulating pipe (22) is coiled outside the heat dissipating device (a).

6. The heat dissipating device according to claim 5, wherein the circulation pipe (22) comprises an input pipe (221), N annular pipes (222), a plurality of conveying pipes (223) and an output pipe (224), and the N annular pipes (222) are sequentially arranged and sleeved outside the to-be-cooled device (a);

any two adjacent annular pipelines (222) are connected through the conveying pipeline (223), the input pipeline (221) is connected with a liquid outlet of the liquid pump (23) and the first annular pipeline (222), the output pipeline (224) is connected with the Nth annular pipeline (222), and N is an integer greater than or equal to 3.

7. The heat dissipating device according to claim 6, wherein the upper end of the i-1 th annular pipe (222) is connected to the upper end of the i-th annular pipe (222) through the conveying pipe (223), and the lower end of the i-th annular pipe (222) is connected to the lower end of the i+1-th annular pipe (222) through the conveying pipe (223), wherein i is an integer greater than 1 and less than N.

8. A computing device comprising the heat sink of any of claims 1-7, the circulation duct (22) of the heat sink being coiled around the computing device.

9. The computing device of claim 8, wherein the computing device comprises K second heat-dissipating elements spaced apart; the circulating pipeline (22) comprises N annular pipelines (222), and the second radiating elements and the annular pipelines (222) are arranged in a staggered mode.

10. A vehicle comprising the computing device of claim 9, the computing device being disposed in a trunk of the vehicle, the trunk of the vehicle being provided with a vent, the condensate collection tank (21), the semiconductor refrigeration component (3), the first air-cooled heat sink (4), and the second air-cooled heat sink (5) being disposed proximate to the vent.

11. The vehicle of claim 10, characterized in that the cooling end of the semiconductor cooling component (3) is facing the computing device, and the heating end of the semiconductor cooling component (3) is facing the vent.