CN210720996U - Cooling module and projection device - Google Patents

Abstract

The utility model provides a heat dissipation module and projection arrangement. The heat dissipation module is used for dissipating heat of at least one heating element of the projection device. The heat dissipation module comprises a first radiator, a second radiator, a pipeline and at least one fan. The second radiator is arranged opposite to the first radiator. The heating element, the first radiator and the second radiator are connected with each other through a pipeline to form a loop. The working fluid is used for being filled in the pipeline, the working fluid flows through the second radiator for heat exchange and then flows into the first radiator, and the working fluid flowing into the first radiator is subjected to heat exchange again through the first radiator and then flows to the heating element for circulating heat dissipation. The fan is arranged between the first radiator and the second radiator. The projection device of the present invention includes the above heat dissipation module, and has a better heat dissipation efficiency.

Description

Cooling module and projection device

technical field

The utility model relates to a heat dissipation module and a projection device, in particular to a heat dissipation module with better heat dissipation effect and a projection device using the heat dissipation module.

Background technique

In solid-state light source projection systems, the light source is usually air-cooled for heat dissipation. At present, the design of air-cooled heat dissipation can achieve a thermal resistance value of about 0.12°C/W. If the heat increases, when the thermal resistance drops below 0.1°C/W, a cooling chip (Thermalelectric Cooling, TEC) or water cooling technology must be used to dissipate heat. The advantages of water-cooled heat dissipation are low thermal resistance and better heat exchange efficiency than air-cooled heat dissipation. When there are space constraints and low thermal resistance requirements, most people choose to use water-cooling for heat dissipation design.

The water-cooled cooling system is composed of three fans, a radiator, pipes containing water cooling liquid, a cold plate, a pump and a holding tank. The fan is located between the radiator and the heat source, and the heat source Direct contact with the cold plate. The circulation of the water-cooled heat dissipation system is that, first, the water-cooled liquid in the holding tank is driven by the pump, and then flows through the heat-dissipating plate, so that the water-cooled liquid and the air exchange heat to reduce the temperature of the water-cooled liquid. Then, after the water temperature drops, the cooler water coolant flows through the heat source. After that, it is pressurized by the pump and then enters the accommodating tank, and then enters the radiator again for heat exchange with the outside air. It can be seen that the temperature of the water cooling liquid before entering the heat source after heat exchange is the lowest, and the temperature after cooling the heat source is the highest. Because the fan draws outside air from the air inlet to cool the radiator, and the air flow from the fan outlet cools the cold plate indirectly, the air flow cannot be used effectively. In addition, when the temperature of the heat source rises, to control and maintain the same temperature of the heat source, in addition to increasing the number of fans and improving the performance of the pump, only the volume of the radiator can be increased. As a result, the volume of the water-cooled cooling system will become larger, and the overall space utilization rate will be poor.

The "Background Art" paragraph is only used to help understand the content of the present invention, so the content disclosed in the "Background Art" paragraph may contain some known technologies that are not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those skilled in the art before the present invention is applied for. .

Utility model content

The utility model is directed to a heat dissipation module, which can have better heat dissipation efficiency.

The present invention is also directed to a projection device, which includes the above-mentioned heat dissipation module, which can increase the heat dissipation area without increasing the number of fans, and can reduce the rotational speed of the fans, thereby reducing system noise.

Other objects and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

In order to achieve one or part or all of the above purposes or other purposes, an embodiment of the present invention provides a heat dissipation module for dissipating heat from at least one heating element of a projection device. The heat dissipation module includes a first heat sink, a second heat sink, a pipe and at least one fan. The second radiator is arranged opposite to the first radiator. The heating element, the first radiator and the second radiator are connected to each other by pipes to form a circuit. The working fluid is used to fill the pipeline, and the working fluid flows through the second radiator for heat exchange and then flows into the first radiator, and the working fluid flowing into the first radiator undergoes heat exchange again through the first radiator and then flows into the first radiator. to the heating element for circulating heat dissipation. The fan is arranged between the first radiator and the second radiator.

In an embodiment of the present invention, the above-mentioned heat dissipation module further includes at least one heat dissipation plate, which contacts the heating element and is connected to the pipe. The working fluid flows into the heat dissipation plate to dissipate heat from the heating element.

In order to achieve one or part or all of the above purposes or other purposes, an embodiment of the present invention provides a projection device including a casing, a projection lens, at least one heating element and a heat dissipation module. The projection lens is joined to the casing. The heating element is arranged in the casing. The heat dissipation module is disposed in the casing, and the heat dissipation module includes a first radiator, a second radiator, a pipe and at least one fan. The second radiator is opposite to the first radiator, and the heating element, the first radiator and the second radiator are connected to each other by pipes to form a circuit. The working fluid is used to fill the pipeline, and the working fluid flows through the second radiator for heat exchange and then flows into the first radiator, and the working fluid flowing into the first radiator undergoes heat exchange again through the first radiator and then flows into the first radiator. to the heating element for circulating heat dissipation. The fan is arranged between the first radiator and the second radiator.

Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the heat dissipation module of the present invention, the second heat sink is disposed opposite the first heat sink, and the fan is disposed between the first heat sink and the second heat sink, that is, the first heat sink, the fan and the second heat sink The configuration of the device forms a sandwich structure. The working fluid in the pipeline flows through the second radiator for heat exchange and then flows into the first radiator, while the working fluid flowing into the first radiator undergoes heat exchange again through the first radiator and then flows to the heating element for circulating heat dissipation . With the two-stage cooling water temperature, the heat dissipation module of the present invention can have better heat dissipation efficiency. In addition, the projection device using the heat dissipation module of the present invention can increase the heat dissipation area without increasing the number of fans, and can reduce the rotational speed of the fans, thereby reducing system noise.

Description of drawings

The accompanying drawings are included to provide a further understanding of the present invention, and are incorporated into and constitute a part of this specification. The drawings illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention.

1 is a schematic diagram of a projection device according to an embodiment of the present invention;

2 is a schematic diagram of a projection device according to another embodiment of the present invention;

3 is a schematic diagram of a projection device according to another embodiment of the present invention;

4 is a schematic diagram of a projection device according to another embodiment of the present invention;

5 is a schematic diagram of a projection device according to another embodiment of the present invention;

6 is a schematic diagram of a heat dissipation module and a heating element according to an embodiment of the present invention;

7 is a schematic diagram of a heat dissipation module and a heating element according to another embodiment of the present invention.

Description of reference numbers:

10a, 10b, 10c, 10d, 10e: projection devices;

100a, 100b, 100c, 100d, 100e: chassis;

102a, 102b, 102c, 102d, 102e: air inlet;

104c, 104d: air outlet;

200: projection lens;

300, 310, 320, 330: heating elements;

400a, 400b, 400c: cooling module;

410: the first radiator;

412: the first wind inlet side;

414: the first air outlet side;

420: the second radiator;

422: the second wind inlet side;

424: the second air outlet side;

430a, 430b: pipes;

440, 442, 444, 446: fans;

450, 452, 454, 456: heat sink;

460: the first driving element;

462: the second driving element;

470, 472: accommodating slot;

510, 520, 530: system fans;

D1, D1', D3, D4: airflow direction;

D2: Projection direction;

F: fluid;

T1: the first temperature;

T2: the second temperature;

T3: the third temperature.

Detailed ways

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only referring to the directions of the drawings. Therefore, the directional terms used are used to illustrate and not to limit the present invention.

FIG. 1 is a schematic diagram of a projection device according to an embodiment of the present invention. Referring to FIG. 1 , in this embodiment, the projection device 10a includes a casing 100a, a projection lens 200, at least one heating element (three heating elements 310, 320, 330 are schematically shown) and a heat dissipation module 400a. The projection lens 200 is joined to the casing 100a, and the heating elements 310, 320, 330 and the heat dissipation module 400a are all disposed in the casing 100a, wherein the heat dissipation module 400a is used to dissipate heat from the heating elements 310, 320, 330. Here, the heating elements 310, 320, and 330 are, for example, laser light sources or light valves, such as, but not limited to, digital micromirror devices (Digital Micromirror Device, DMD) in an optical engine.

In detail, the heat dissipation module 400a of this embodiment includes a first radiator 410, a second radiator 420, a duct 430a and at least one fan (three fans 442, 444, 446 are schematically shown). The second radiator 420 is disposed opposite to the first radiator 410 , and the fans 442 , 444 and 446 are disposed between the first radiator 410 and the second radiator 420 . That is, as shown in FIG. 1 , the arrangement of the first heat sink 410 , the fans 442 , 444 , 446 and the second heat sink 420 forms a sandwich structure. The heating elements 310 , 320 , and 330 , the first radiator 410 and the second radiator 420 are connected to each other by a pipe 430 a to form a circuit. The working fluid F is used to fill the pipe 430a and flow in the pipe 430a, and after the working fluid F absorbs the heat of at least one heating element 310, 320, 330, it first flows through the second radiator 420 for heat exchange, and then flows into the The first radiator 410, and the working fluid F flowing into the first radiator 410 undergoes heat exchange again through the first radiator 410, and then flows to the heating elements 310, 320, and 330 for circulating heat dissipation. That is, the temperature of the working fluid F flowing into the second radiator 420 is greater than the temperature of the working fluid F flowing out of the first radiator 410 . Here, the working fluid F is, for example, water, but is not limited thereto.

Furthermore, the casing 100a of this embodiment has an air inlet 102a on the right side, that is, the air inlet 102a is located on the right side of the casing 100a relative to the projection lens 200, and the first heat sink 410 of the heat dissipation module 400a corresponds to the air inlet 102a Settings. The airflow generated by the fans 442 , 444 , and 446 enters the casing 100 a from the air inlet 102 a and blows away from the first radiator 410 toward the second radiator 420 . Here, the airflow direction D1 of the air inlet 102 a is perpendicular to the projection direction D2 of the projection lens 200 . More specifically, the first radiator 410 in this embodiment includes a first air inlet side 412 and a first air outlet side 414 opposite to each other. The airflows generated by the fans 442 , 444 , and 446 enter from the first air inlet side 412 of the first radiator 410 and leave from the first air outlet side 414 , and the air flows between the first air inlet side 412 and the first air outlet side 414 has a first pressure difference. The second radiator 420 includes a second air inlet side 422 and a second air outlet side 424 opposite to each other. The air flow generated by the fans 442 , 444 , and 446 enters from the second air inlet side 422 of the second radiator 420 and leaves from the second air outlet side 424 , and the air flows between the second air inlet side 422 and the second air outlet side 424 has a second pressure differential. Here, the second pressure difference is smaller than the first pressure difference, that is, the pressure drop of the second radiator 420 is lower than the pressure drop of the first radiator 410 , thereby reducing the resistance of the fans 442 , 444 , and 446 . It is generally known that the greater the flow resistance, the greater the pressure drop, and the factors affecting the pressure drop may also include the density, spacing or shape of the cooling fins in the heat sink.

In order to improve heat dissipation efficiency, the heat dissipation module 400a of this embodiment further includes at least one heat dissipation plate (three heat dissipation plates 452, 454, 456 are schematically shown), respectively contacting the heating elements 310, 320, 330 and connected to the pipe 430a. Here, the heat dissipation plates 452, 454, 456 directly contact the heating elements 310, 320, 330, respectively, to conduct the heat generated by the heating elements 310, 320, 330, and the working fluid F flows into the heat dissipation plates 452, 454, 456. The heating elements 310, 320, and 330 dissipate heat. The heat dissipation plates 452 , 454 and 456 are, for example, cold plates with heat dissipation fins inside, but are not limited thereto.

In addition, the heat dissipation module 400a of this embodiment further includes a first driving element 460, which is disposed between the second heat sink 420 and the heating elements 310, 320, and 330 and connected to the pipe 430a. Here, the first driving element 460 is, for example, a pump, but not limited thereto. In addition, the heat dissipation module 400a of this embodiment further includes an accommodating groove 470, which is disposed between the second radiator 420 and the first driving element 460 and is connected to the pipe 430a to accommodate the working fluid F. Here, the working fluid F in the accommodating groove 470 is circulated in the pipe 430a through the first driving element 460 .

In particular, the working fluid F has a first temperature T1 between the first driving element 460 and the second radiator 420 . The working fluid F has a second temperature T2 between the second radiator 420 and the first radiator 410 . The working fluid F has a third temperature T3 between the first heat sink 410 and the heating element 310 . Preferably, the third temperature T3 is lower than the second temperature T2, and the second temperature T2 is lower than the first temperature T1. In other words, the place where the temperature of the working fluid F is the highest is in the pipe 430a between the first driving element 460 and the second radiator 420, and the place where the temperature of the working fluid F is the lowest is in the pipe between the first radiator 410 and the heating element 310 Therefore, the lower temperature working fluid F can dissipate heat from the heating elements 310 , 320 , and 330 .

The airflow generated by the fans 442 , 444 , and 446 in this embodiment enters the casing 100 a from the air inlet 102 a of the casing 100 a and blows away from the first radiator 410 to the second radiator 420 . Therefore, the airflow generated by the fans 442 , 444 , and 446 first cools the working fluid F located in the first radiator 410 and having the second temperature T2 , and performs a heat exchange through the first radiator 410 to obtain a lower temperature than the second temperature T2 . The working fluid F at the temperature T2 (ie, the working fluid F having the third temperature T3 between the first radiator 410 and the heating element 310 ). Then, the working fluid F with the lowest temperature (ie the third temperature T3 ) flows into the heat dissipation plates 452 , 454 , 456 to dissipate heat from the heating elements 310 , 320 , 330 , so as to obtain the work with the highest temperature (ie the first temperature T1 ) Fluid F, the working fluid F with the first temperature T1 enters the second radiator 420 and the air flow through the first radiator 410 cools the working fluid F with the first temperature T1 at the second radiator 420, while the working fluid F at the second radiator 420 is The working fluid F of the radiator 420 performs heat exchange again to obtain the working fluid F having the second temperature T2 (ie, the working fluid F located between the second radiator 420 and the first radiator 410 ). Therefore, the present embodiment uses the two-stage cooling working fluid F, which can effectively increase the heat dissipation area of the heat dissipation module 400a without increasing the number of fans, thereby reducing the rotational speed of the fans 442, 444, and 446 and reducing the projection device. The system noise in 10a and the wind flow of fans 442, 444, 446 are applied efficiently.

In short, the projection device 10a of this embodiment adopts a water-cooled heat dissipation system. In the design of the heat dissipation module 400a in this embodiment, the configuration of the first heat sink 410, the fans 442, 444, 446 and the second heat sink 420 forms a sandwich structure, and the working fluid F in the pipe 430a flows through the second heat sink 420 flows into the first radiator 410 after heat exchange, and the working fluid F flowing into the first radiator 410 undergoes heat exchange again through the first radiator 410 and flows to the heating elements 310 , 320 , and 330 for circulating heat dissipation. Due to the two-stage cooling water temperature, the heat dissipation module 400a of this embodiment can have better heat dissipation efficiency, and the projection device 10a using the heat dissipation module 400a of this embodiment can be used without increasing the number of fans. Increase the heat dissipation area and reduce the fan speed, thereby reducing system noise.

It must be noted here that the following embodiments use the element numbers and part of the contents of the previous embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical contents is omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and repeated descriptions in the following embodiments will not be repeated.

FIG. 2 is a schematic diagram of a projection device according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 2 at the same time, the projection device 10b of the present embodiment is similar to the projection device 10a of FIG. 1, the difference between the two is that the cabinet 100b of the present embodiment has an air inlet 102b on the left side, namely the air inlet 102b is located at the left side of the housing 100b relative to the projection lens 200, and the first heat sink 410 of the heat dissipation module 400a is disposed corresponding to the air inlet 102b. The air flow generated by the fans 442 , 444 , and 446 enters the casing 100 b from the air inlet 102 b and blows away from the first radiator 410 toward the second radiator 420 . Here, the airflow direction D1' of the air inlet 102b is perpendicular to the projection direction D2 of the projection lens 200.

FIG. 3 is a schematic diagram of a projection device according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 3 at the same time. The projection device 10c of this embodiment is similar to the projection device 10a of FIG. 1, and the difference between the two is that the casing 100c of this embodiment has an air inlet 102c on the right side, There is also an air outlet 104c at the rear, that is, the air outlet 104c and the projection lens 200 are located on opposite sides of the casing 100c, respectively. Here, the airflow direction D3 of the air outlet 104c is parallel to and opposite to the projection direction D2 of the projection lens 200, but not limited thereto. In another not-shown embodiment, the airflow direction of the air outlet can also be parallel to the airflow direction of the air inlet, which still belongs to the scope of protection of the present invention. In addition, the projection device 10c of the present embodiment may further include at least one system fan (three system fans 510, 520, 530 are schematically shown) disposed in the casing 100c and corresponding to the air outlet 104c, so as to connect the projection device 10c Inside the waste tropics to the outside.

FIG. 4 is a schematic diagram of a projection device according to another embodiment of the present invention. Please refer to FIG. 2 and FIG. 4 at the same time, the projection device 10d of this embodiment is similar to the projection device 10b of FIG. 2, the difference between the two is that the casing 100d of this embodiment has an air inlet 102d on the left side, There is also an air outlet 104d at the rear, that is, the air outlet 104d and the projection lens 200 are located on opposite sides of the casing 100d, respectively. Here, the airflow direction D3 of the air outlet 104d is parallel to and opposite to the projection direction D2 of the projection lens 200, but is not limited thereto. In addition, the projection device 10d of the present embodiment may further include at least one system fan (three system fans 510, 520, 530 are schematically shown) disposed in the casing 100d and corresponding to the air outlet 104d, so as to connect the projection device 10d Inside the waste tropics to the outside. In another not-shown embodiment, the airflow direction of the air outlet can also be parallel to the airflow direction of the air inlet, which still belongs to the scope of protection of the present invention.

It is worth mentioning that the design of the air inlets 102c, 102d and the air outlets 104c, 104d in FIG. 3 and FIG. 4 makes the projection devices 10c and 10d suitable for horizontally splicing one or more projection devices, which can effectively The application range of the projection devices 10c and 10d is expanded.

FIG. 5 is a schematic diagram of a projection device according to another embodiment of the present invention. Please refer to FIG. 1 and FIG. 5 at the same time, the projection apparatus 10e of this embodiment is similar to the projection apparatus 10a of FIG. 1, the difference between the two is that the cabinet 100e of this embodiment has an air inlet 102e at the front, that is, the air inlet 102e The projection lens 200 is located on the same side of the casing 100e , and the airflow direction D4 of the air inlet 102e is parallel to and opposite to the projection direction D2 of the projection lens 200 . In another embodiment not shown, the air inlet can also be disposed at the rear of the casing, which still belongs to the scope of the present invention.

6 is a schematic diagram of a heat dissipation module and a heating element according to an embodiment of the present invention. Please refer to FIG. 1 and FIG. 6 at the same time, the heat dissipation module 400b of this embodiment is similar to the heat dissipation module 400a of FIG. 1 , and the difference between the two is that the heat dissipation module 400b of this embodiment only covers one heating element 300 that directly contacts the heat dissipation plate 450 . to dissipate heat. After the working fluid F absorbs the heat of the heating element 300, it first flows through the second radiator 420 for heat exchange, and then flows into the first radiator 410. The working fluid F flowing into the first radiator 410 passes through the first radiator. 410 performs heat exchange again and then flows to the heating element 300 for circulating heat dissipation. Furthermore, in the heat dissipation module 400b of this embodiment, only one fan 440 is disposed between the first heat sink 410 and the second heat sink 420 . In addition, in this embodiment, no accommodating groove is provided, and the working fluid F is circulated in the pipe 430b by the driving of the first driving element 460 .

7 is a schematic diagram of a heat dissipation module and a heating element according to another embodiment of the present invention. Please refer to FIG. 6 and FIG. 7 at the same time. The heat dissipation module 400c of the present embodiment is similar to the heat dissipation module 400b of FIG. , wherein the second driving element 462 and the accommodating groove 472 are disposed between the first radiator 410 and the heating element 300 and are connected to the pipe 430b. The accommodating groove 472 accommodates the working fluid F, and the working fluid F circulates in the pipe 430b through the second driving element 462 . After the working fluid F absorbs the heat of the heating element 300, it first flows through the second radiator 420 for heat exchange, and then flows into the first radiator 410. The working fluid F flowing into the first radiator 410 passes through the first radiator. 410 performs heat exchange again and then flows to the heating element 300 for circulating heat dissipation.

To sum up, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the heat dissipation module of the present invention, the second heat sink is disposed opposite the first heat sink, and the fan is disposed between the first heat sink and the second heat sink, that is, the first heat sink, the fan and the second heat sink The configuration of the device forms a sandwich structure (sandwich structure). The working fluid in the pipeline flows through the second radiator for heat exchange and then flows into the first radiator, while the working fluid flowing into the first radiator undergoes heat exchange again through the first radiator and then flows to the heating element for circulating heat dissipation . With the two-stage cooling water temperature, the heat dissipation module of the present invention can have better heat dissipation efficiency. In addition, the projection device using the heat dissipation module of the present invention can increase the heat dissipation area without increasing the number of fans, and can reduce the rotational speed of the fans, thereby reducing system noise.

Only the above are only preferred embodiments of the present utility model, and should not limit the scope of implementation of the present utility model, that is, any simple equivalent changes made according to the claims of the present utility model and the contents of the utility model All modifications and modifications are still within the scope of the present invention patent. In addition, any embodiment or claim of the present invention is not required to achieve all of the objects, advantages or features disclosed in the present invention. In addition, the abstract and the title of the utility model are only used to assist in the retrieval of patent documents, and are not intended to limit the scope of rights of the present utility model. In addition, the terms such as "first" and "second" mentioned in this specification or the claims are only used to name the elements or to distinguish different embodiments or ranges, and are not used to limit the number of elements. upper or lower limit.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, but not to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that : it can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the various embodiments of the present utility model Scope of technical solutions.

Claims (20)

1. A heat dissipation module for dissipating heat from at least one heat generating element of a projection apparatus, the heat dissipation module comprising a first heat sink, a second heat sink, a duct, and at least one fan, wherein:

the second radiator and the first radiator are arranged oppositely, the at least one heating element, the first radiator and the second radiator are connected with each other through the pipeline to form a loop, working fluid is filled in the pipeline, the working fluid flows through the second radiator for heat exchange and then flows into the first radiator, and the working fluid flowing into the first radiator for heat exchange again flows to the at least one heating element for circulating heat dissipation through the first radiator; and

the at least one fan is arranged between the first radiator and the second radiator.

2. The thermal module of claim 1, wherein the airflow of the at least one fan is blown from the first heat sink toward the second heat sink.

3. The heat dissipation module of claim 1, wherein the first heat sink includes a first air inlet side and a first air outlet side opposite to each other, the airflow generated by the at least one fan enters from the first air inlet side and exits from the first air outlet side with a first pressure difference therebetween, the second heat sink includes a second air inlet side and a second air outlet side opposite to each other, the airflow generated by the at least one fan enters from the second air inlet side and exits from the second air outlet side with a second pressure difference therebetween, and the second pressure difference is smaller than the first pressure difference.

4. The heat dissipation module of claim 1, further comprising:

a first driving element disposed between the second heat sink and the at least one heating element and connected to the duct.

5. The heat dissipation module of claim 4, further comprising:

and a receiving groove disposed between the second heat sink and the first driving element and connected to the pipe to receive the working fluid, wherein the working fluid in the receiving groove circulates in the pipe through the first driving element.

6. The thermal module of claim 4, wherein the working fluid has a first temperature between the first driving element and the second heat sink, and a second temperature between the second heat sink and the first heat sink, and a third temperature between the first heat sink and the at least one heat generating element, the third temperature being less than the second temperature, and the second temperature being less than the first temperature.

7. The heat dissipation module of claim 4, further comprising:

the second driving element and the containing groove are arranged between the first radiator and the at least one heating element and are connected to the pipeline, wherein the containing groove contains the working fluid, and the working fluid circulates in the pipeline through the second driving element.

8. The heat dissipation module of claim 1, further comprising:

and the at least one heat dissipation plate is in contact with the at least one heating element and is connected to the pipeline, wherein the working fluid flows into the at least one heat dissipation plate to dissipate heat of the at least one heating element.

9. A projection device is characterized by comprising a machine shell, a projection lens, at least one heating element and a heat dissipation module, wherein:

the projection lens is jointed with the shell;

the at least one heating element is arranged in the shell; and

the heat dissipation module is disposed in the casing, and the heat dissipation module includes a first heat sink, a second heat sink, a duct, and at least one fan, wherein:

the second radiator and the first radiator are arranged oppositely, the at least one heating element, the first radiator and the second radiator are connected with each other through the pipeline to form a loop, working fluid is filled in the pipeline, the working fluid flows through the second radiator for heat exchange and then flows into the first radiator, and the working fluid flowing into the first radiator for heat exchange again flows to the at least one heating element for circulating heat dissipation through the first radiator; and

the at least one fan is arranged between the first radiator and the second radiator.

10. The projection apparatus as claimed in claim 9, wherein the housing has an air inlet, and the first heat sink of the heat dissipation module is disposed corresponding to the air inlet, and the air generated by the at least one fan enters the housing through the air inlet and blows away from the first heat sink toward the second heat sink.

11. The projection apparatus of claim 10, wherein the air inlet has an air flow direction perpendicular to the projection direction of the projection lens.

12. The projection apparatus as claimed in claim 11, wherein the housing further has an air outlet, and an air flow direction of the air outlet is parallel to an air flow direction of the air inlet or parallel to the projection direction of the projection lens.

13. The projection device of claim 12, further comprising:

at least one system fan, it disposes in the said casing and corresponds to the said air outlet arrangement.

14. The projection apparatus of claim 10, wherein the air inlet has an air flow direction parallel to the projection direction of the projection lens.

15. The projection device of claim 9, wherein the heat dissipation module further comprises:

and the at least one heat dissipation plate is in contact with the at least one heating element and is connected to the pipeline, wherein the working fluid flows into the at least one heat dissipation plate to dissipate heat of the at least one heating element.

16. The projection apparatus of claim 9, wherein the first heat sink includes a first air inlet side and a first air outlet side opposite to each other, the airflow generated by the at least one fan enters from the first air inlet side and exits from the first air outlet side with a first pressure difference therebetween, and the second heat sink includes a second air inlet side and a second air outlet side opposite to each other, the airflow generated by the at least one fan enters from the second air inlet side and exits from the second air outlet side with a second pressure difference therebetween, and the second pressure difference is smaller than the first pressure difference.

17. The projection device of claim 9, wherein the heat dissipation module further comprises:

the first driving element is arranged between the second radiator and the at least one heating element and is connected with the pipeline.

18. The projection device of claim 17, wherein the heat dissipation module further comprises:

and the accommodating groove is arranged between the second radiator and the first driving element and is connected with the pipeline so as to accommodate the working fluid, wherein the working fluid in the accommodating groove is circulated in the pipeline through the first driving element.

19. The projection apparatus according to claim 17, wherein the working fluid has a first temperature between the first driving element and the second heat sink, and a second temperature between the second heat sink and the first heat sink, and a third temperature between the first heat sink and the at least one heat generating element, the third temperature being less than the second temperature, and the second temperature being less than the first temperature.

20. The projection device of claim 17, wherein the heat dissipation module further comprises:

the second driving element and the containing groove are arranged between the first radiator and the at least one heating element and connected to the pipeline, wherein the containing groove contains the working fluid, and the working fluid circulates in the pipeline through the second driving element.

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