CN218332499U

CN218332499U - Heat dissipation device and electronic equipment

Info

Publication number: CN218332499U
Application number: CN202221691812.1U
Authority: CN
Inventors: 王翠翠; 黄硕
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2022-06-30
Filing date: 2022-06-30
Publication date: 2023-01-17
Anticipated expiration: 2032-06-30

Abstract

The embodiment of the application discloses a heat dissipation device and electronic equipment. The heat dissipating double-fuselage includes: the first heat dissipation branch is used for dissipating heat of the first heat generation area; the second heat dissipation branch is used for dissipating heat of the second heating area; the supply structure is used for providing a heat dissipation medium with a first temperature for the first heat dissipation branch and/or the second heat dissipation branch and recovering the heat dissipation medium with a second temperature generated by the first heat dissipation branch and/or the second heat dissipation branch, and the first temperature is lower than the second temperature; and the first radiator assembly and the supply structure form a circulating flow path for cooling the heat dissipation medium input by the supply structure from the second temperature range to the first temperature range.

Description

Heat dissipation device and electronic equipment

Technical Field

The application relates to the technical field of heat dissipation equipment, in particular to a heat dissipation device and electronic equipment.

Background

The high temperature can lead to the computer part to move unstably, shorten computer part life, possibly even make some parts burn out, the effect of radiator is exactly to absorb these heats, guarantees that the temperature of computer part is normal, the main radiating mode of radiator includes water-cooling, forced air cooling etc. at present, water-cooling radiator uses the circulation of coolant liquid to take away the heat of heating element, have the characteristics such as stable, the environment dependence of cooling down is little.

In the related art, a plurality of heating elements generally need to be cooled, for example, when a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU) are cooled, the CPU and the GPU are cooled on the same circulation path, cold water in a cold water outlet first takes away heat of the CPU through the CPU, and then the cold water is used as cooling water of the GPU to cool the GPU, so that the water inlet temperature of the GPU is too high, and the heat dissipation effect of the heating elements is severely limited.

SUMMERY OF THE UTILITY MODEL

The technical scheme of the application is realized as follows:

an embodiment of the present application provides a heat dissipation device, including:

the first heat dissipation branch is used for dissipating heat of the first heat generation area;

the second heat dissipation branch is used for dissipating heat of the second heating area;

the supply structure is used for providing a heat dissipation medium with a first temperature for the first heat dissipation branch and/or the second heat dissipation branch and recovering the heat dissipation medium with a second temperature generated by the first heat dissipation branch and/or the second heat dissipation branch, and the first temperature is lower than the second temperature;

and the first radiator assembly and the supply structure form a circulating flow path for cooling the heat dissipation medium input by the supply structure from the second temperature range to the first temperature range.

In some embodiments, the heat dissipation device further comprises:

the third heat dissipation branch is used for dissipating heat of the first heat generation area; and/or the presence of a gas in the atmosphere,

the fourth heat dissipation branch is used for dissipating heat of the second heating area;

the heat dissipation mode of the third heat dissipation branch is different from that of the first/second heat dissipation branches, and the heat dissipation mode of the fourth heat dissipation branch is different from that of the first/second heat dissipation branches.

In some embodiments, the heat dissipation device further comprises:

the second heat radiator assembly is used for guiding heat generated by the third heat radiation branch and/or the fourth heat radiation branch out of the accommodating space where the heat radiation device is positioned;

the second radiator assembly and the first radiator assembly are arranged in the accommodating space at intervals, and the heat leading-out direction of the second radiator assembly is different from the heat leading-out direction of the first radiator assembly.

In some embodiments, the first heat generation region and the second heat generation region belong to different heat generation regions of the same heat generation component, or the first heat generation region and the second heat generation region belong to heat generation regions of different heat generation components.

In some embodiments, the first heat sink assembly includes an inlet and an outlet, and the feed structure includes:

the supply part is connected with an outlet of the first radiator assembly and is connected with a first end of the first radiating branch and/or the second radiating branch;

the recycling part is connected with an inlet of the first radiator assembly and is connected with a second end of the first radiating branch and/or the second radiating branch;

and a partition part disposed between the supply part and the recovery part for preventing the recovery part from transferring heat to the supply part.

In some embodiments, the supply structure further comprises at least one regulating member disposed between the supply portion and the first heat dissipation branch, or between the supply portion and the second heat dissipation branch, for controlling a flow rate in the first heat dissipation branch or the second heat dissipation branch; and/or the presence of a gas in the atmosphere,

and the fan is arranged corresponding to the recovery part and used for dissipating heat of the recovery part.

In some embodiments, the first heat dissipation branch comprises a first heat dissipation cavity in heat conduction connection with the first heat generation region, at least one first nozzle and a first micro-channel structure are stacked in the first heat dissipation cavity, the second heat dissipation branch comprises a second heat dissipation cavity in heat conduction connection with the second heat generation region, and at least one second nozzle and a second micro-channel structure are stacked in the second heat dissipation cavity;

at least one first nozzle for spraying a heat dissipation medium at a first temperature to the first microchannel structure; and/or the presence of a gas in the atmosphere,

at least one second nozzle is used to eject a heat dissipation medium at a first temperature to the second microchannel structure.

In some embodiments, the second heat sink assembly includes a first inlet and a second inlet;

the third radiating branch comprises a first temperature control module, the first temperature control module comprises a first cold end and a first hot end, the first cold end is in heat conduction connection with the first heating area, and the first hot end is communicated with the first inlet of the second radiator assembly; and/or the presence of a gas in the gas,

the fourth heat dissipation branch comprises a second temperature control module, the second temperature control module comprises a second cold end and a second hot end, and the second cold end is in heat conduction connection with the second heating area; the second hot end is communicated with a second inlet of the second radiator.

In some embodiments, the heat dissipation device further comprises: and the controller is connected with the at least one adjusting piece, the second temperature control module and the first temperature control module and can control working parameters of the at least one adjusting piece, the second temperature control module and the first temperature control module.

The embodiment of the application provides electronic equipment, which comprises a mainboard and a heat dissipation device provided by other embodiments of the application.

The embodiment of the application provides a heat abstractor and electronic equipment, wherein, heat abstractor includes: the first heat dissipation branch is used for dissipating heat of the first heat generation area; the second heat dissipation branch is used for dissipating heat of the second heating area; the supply structure is used for providing a heat dissipation medium with a first temperature for the first heat dissipation branch and/or the second heat dissipation branch and recovering the heat dissipation medium with a second temperature generated by the first heat dissipation branch and/or the second heat dissipation branch, and the first temperature is lower than the second temperature; and the first radiator assembly and the supply structure form a circulating flow path for cooling the heat dissipation medium input by the supply structure from the second temperature range to the first temperature range. Therefore, the heat dissipation medium with the first temperature can be supplied to different heat dissipation branches through the supply structure, the purpose of dissipating heat of different heating areas simultaneously is achieved, and the heat dissipation effect of the heating element is improved.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another heat dissipation apparatus according to an embodiment of the present disclosure;

fig. 3 is a schematic front view of a heat dissipation branch according to an embodiment of the present disclosure;

fig. 4 is a schematic side view of a heat dissipation branch according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described in further detail with reference to the attached drawings, the described embodiments should not be considered as limiting the present application, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, reference is made to "some embodiments", "other embodiments", which describe subsets of all possible embodiments, but it is understood that "some embodiments", "other embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of the present application only and is not intended to be limiting of the application.

The embodiment of the present application provides a heat dissipation apparatus, which can be applied to heat dissipation of electronic components or electronic products such as a CPU, a GPU, and the like, fig. 1 is a schematic diagram of a composition structure of the heat dissipation apparatus in the embodiment of the present application, and as shown in fig. 1, the heat dissipation apparatus 100 includes:

the first heat dissipation branch 101 is used for dissipating heat of the first heat generation area; the second heat dissipation branch 102 is used for dissipating heat of the second heating area; the supply structure 103 is used for supplying a heat dissipation medium with a first temperature to the first heat dissipation branch 101 and/or the second heat dissipation branch 102, and recovering the heat dissipation medium with a second temperature generated by the first heat dissipation branch 101 and/or the second heat dissipation branch 102; the first heat sink assembly 104 forms a circulation flow path with the supply structure 103 for cooling the heat dissipation medium input from the supply structure 103 from the second temperature range to the first temperature range.

The first heat-generating region and the second heat-generating region may be heat-generating regions corresponding to heat-generating components, for example, different heat-generating regions corresponding to the same heat-generating component, or heat-generating regions corresponding to different heat-generating components, where the heat-generating components may be electronic components such as a CPU and a GPU, or electronic products. The heat dissipation medium at the first temperature may be a coolant, a condensate, or the like, and is used to cool the first heating area and the second heating area, and the heat dissipation medium at the second temperature may be warm water or hot water obtained by cooling the first heating area and the second heating area with the heat dissipation medium at the first temperature, where the first temperature is lower than the second temperature.

In some embodiments, the heat dissipation medium at the first temperature corresponds to a first temperature range, the heat dissipation medium at the second temperature corresponds to a second temperature range, and the first temperature range and the second temperature range are different, wherein a maximum temperature value in the first temperature range is smaller than a minimum temperature value in the second temperature range, for example, the first temperature range may be [0,15], and the second temperature range may be [25,36].

In some embodiments, the supply structure 103 may provide the first heat dissipation branch 101 and the second heat dissipation branch 102 with the medium at the first temperature, and recover the heat dissipation medium at the second temperature generated by the first heat dissipation branch 101 and the second heat dissipation branch 102.

In other embodiments, the supply structure 103 may also provide the medium at the first temperature to the first heat dissipation branch 101 only, and recover the heat dissipation medium at the second temperature generated by the first heat dissipation branch 101, and provide the medium at the first temperature to the second heat dissipation branch 102 by the first heat sink assembly 104, and recover the medium at the second temperature provided by the second heat dissipation branch 102.

In other embodiments, the supply structure 103 may also provide the medium at the first temperature to the second heat dissipation branch 102 only, and recover the heat dissipation medium at the second temperature generated by the second heat dissipation branch 102, and the first heat sink assembly 104 provides the medium at the first temperature to the first heat dissipation branch 101, and recovers the medium at the second temperature provided by the first heat dissipation branch 101.

In some embodiments, the first heat sink assembly 104 includes a first cold row having a heat sink medium stored therein at a first temperature and the circulation flow path formed by the first heat sink assembly 104 and the supply structure 103 includes a first circulation flow path, which may be an inlet conduit for conveying the heat sink medium at the first temperature in the first heat sink assembly 104 to the supply structure 103, and a second circulation flow path, which may be an outlet conduit for conveying the heat sink medium at a second temperature from the supply structure 103 to the first heat sink assembly 104, and the first supply structure 103 may include a first storage tank for storing the heat sink medium at the first temperature and a second storage tank for storing the heat sink medium at the second temperature.

In some embodiments, the first fan may include at least one, and the heat dissipation medium at the second temperature returned from the supply structure 103 to the first cold row may be cooled by the first fan, so that the heat dissipation medium at the second temperature is cooled from the second temperature range to the first temperature range, and the heat dissipation medium at the first temperature is obtained.

It can be understood that the heat dissipation device provided by the embodiments of the present application includes: the first heat dissipation branch 101 is used for dissipating heat of the first heat generation area; the second heat dissipation branch 102 is used for dissipating heat of the second heating area; the supply structure 103 is configured to provide a heat dissipation medium at a first temperature to the first heat dissipation branch 101 and/or the second heat dissipation branch 102, and recover a heat dissipation medium at a second temperature generated by the first heat dissipation branch 101 and/or the second heat dissipation branch 102, where the first temperature is lower than the second temperature; the first heat sink assembly 104 is formed with the supply structure 103 to form a circulation flow path for cooling the heat dissipation medium input from the supply structure 103 from the second temperature range to the first temperature range. Therefore, the heat dissipation medium with the first temperature can be supplied to different heat dissipation branches simultaneously through the supply structure 103, the purpose of dissipating heat of different heating areas simultaneously is achieved, and the heat dissipation effect of the heating element is improved.

In some embodiments of the present application, as shown in fig. 2, the heat dissipation device may further include: a third heat dissipation branch 105 for dissipating heat from the first heat generation region; and a fourth heat dissipation branch 106 for dissipating heat from the second heat generation area. In some embodiments of the present application, the branches for dissipating heat of the first heat-generating region and the second heat-generating region may further include a third heat-dissipating branch 105 and a fourth heat-dissipating branch 106 in addition to the first heat-dissipating branch 101 and the second heat-dissipating device. The heat dissipation manner of the third heat dissipation branch 105 is different from the heat dissipation manners of the first heat dissipation branch 101 and the second heat dissipation branch 102, and the heat dissipation manner of the fourth heat dissipation branch 106 is different from the heat dissipation manners of the first heat dissipation branch 101 and the second heat dissipation branch 102, for example, the heat dissipation manners of the first heat dissipation branch 101 and the second heat dissipation branch 102 may be a water cooling heat dissipation manner, and the heat dissipation manners of the third heat dissipation branch 105 and the fourth heat dissipation branch 106 may be an air cooling heat dissipation manner.

In some embodiments, when the first heat dissipation branch 101 and the third heat dissipation branch 105 are used for dissipating heat from the first heat generation region, and the second heat dissipation branch 102 and the fourth heat dissipation branch 106 are used for dissipating heat from the second heat generation region, the first heat dissipation branch 101 and the third heat dissipation branch 105 may be disposed on two sides of the heat generation component where the first heat generation region is located, and the second heat dissipation branch 102 and the third heat dissipation branch 105 may be disposed on two sides of the heat generation component where the second heat generation region is located.

In some embodiments, the heat dissipation device may further include any one of a third heat dissipation device and a fourth heat dissipation device in addition to the first heat dissipation branch 101 and the second heat dissipation branch 102, for example, when the heat dissipation device includes the first heat dissipation branch 101, the second heat dissipation branch 102 and the third heat dissipation branch 105, the first heat dissipation area may be dissipated by the first heat dissipation branch 101 and the third heat dissipation branch 105 at the same time, and the second heat dissipation branch 102 may be dissipated by the fourth heat dissipation branch 106; when the heat dissipation device includes the first heat dissipation branch 101, the second heat dissipation branch 102, and the fourth heat dissipation branch 106, the first heat generation region may be dissipated by the first heat dissipation branch 101, and the second heat generation region may be dissipated by the second heat dissipation branch 102 and the fourth heat dissipation branch 106.

In some embodiments of the present application, as shown in fig. 2, the heat dissipating device further comprises: when the heat dissipation device includes the third heat dissipation branch 105 and the fourth heat dissipation branch 106, the second heat dissipation component 107 is configured to conduct heat generated by the third heat dissipation branch 105 and the fourth heat dissipation branch 106 out of the accommodating space where the heat dissipation device is located; or, when the heat sink only includes the third heat sink, the second heat sink assembly 107 is configured to conduct heat generated by the third heat dissipation branch 105 out of the accommodating space where the heat sink is located; or, when the heat dissipation device only includes the fourth heat dissipation device, the second heat dissipation component 107 is configured to conduct heat generated by the fourth heat dissipation branch 106 to the outside of the accommodating space where the heat dissipation device is located, where the accommodating space where the heat dissipation device is located may be an electronic device, such as a chassis, that accommodates the heat dissipation device.

In some embodiments, for example, if the heat dissipation device includes the third heat dissipation branch 105 but not the fourth heat dissipation branch 106, and the heat dissipation manner of the third heat dissipation branch 105 is a water cooling heat dissipation manner, the second heat dissipation assembly 107 may include a second cold row and a second fan, and the second fan may include at least one, the cooling liquid, the cold water, etc. may take away heat generated by the third heat dissipation branch 105 or the fourth heat dissipation branch 106, and generate warm water or hot water, and the warm water or the hot water may be transmitted to the second heat dissipation assembly 107 through a flow pipe between the third heat dissipation branch 105 and the second heat dissipation assembly 107, for example, the warm water or the hot water is transmitted to the second cold row, and the warm water or the cold water is cooled by the second fan, so as to guide heat generated by the third heat dissipation branch 105 out of the accommodation space where the heat dissipation device is located

In some embodiments, for example, if the heat dissipation device includes the third heat dissipation branch 105 but not the fourth heat dissipation branch 106, and the heat dissipation manner of the third heat dissipation branch 105 or the fourth heat dissipation branch 106 is an air cooling heat dissipation manner, the second heat sink assembly 107 may include only a second fan, and the second fan guides the heat generated by the third heat dissipation branch 105 or the fourth heat dissipation branch 106 out of the accommodating space where the heat dissipation device is located.

In some embodiments, the second heat sink assembly 107 is disposed in the accommodating space at a distance from the first heat sink assembly 104, and the heat leading-out direction of the second heat sink assembly 107 is different from the heat leading-out direction of the first heat sink assembly 104. For example, when the accommodating space where the heat dissipation device is located is a chassis, the first heat sink assembly 104 may be disposed at the top of the chassis, the second heat sink assembly 107 may be disposed at the side of the chassis, and the first heat sink assembly 104 and the second heat sink assembly 107 are spaced from each other, in this case, heat conducted out by the first heat sink assembly 104 may be conducted out from the top of the inside of the chassis, and heat conducted out by the second heat sink assembly 107 may be conducted out from the side of the inside of the chassis.

In some embodiments of the present application, the first heat sink assembly 104 includes an inlet and an outlet, which may be the inlet and outlet of the first cold row, and in some embodiments, the feed structure 103 includes: a supply section, a recovery section, and a partition.

In some embodiments, the supply part may be a water storage tank storing a heat dissipation medium of a first temperature, the recovery part may be a water storage tank storing a heat dissipation medium of a second temperature, and the partition may be a heat insulation film, a heat insulation net, a heat insulation mat, or the like.

In some embodiments, the supply part may be connected to the outlet of the first heat sink assembly 104, and connected to the first end of the first heat dissipation branch 101 and the first end of the second heat dissipation branch 102, respectively, for receiving the heat dissipation medium at the first temperature provided by the first heat sink assembly 104, and providing the heat dissipation medium at the first temperature to the first heat dissipation branch 101 and the second heat dissipation branch 102; the recycling portion may be connected to an inlet of the first heat sink assembly 104, and connected to a second end of the first heat dissipation branch 101 and a second end of the second heat dissipation branch 102, respectively, for recycling the heat dissipation medium at the second temperature generated by the first heat dissipation branch 101 and the second heat dissipation branch 102.

In other embodiments, the supply part may be connected to the outlet of the first heat sink assembly 104 and connected to the first end of the first heat dissipation branch 101, and is configured to receive the heat dissipation medium at the first temperature provided by the first heat sink assembly 104 and provide the heat dissipation medium at the first temperature to the first heat dissipation branch 101, and the second heat dissipation branch 102 may be connected to the outlet of the first heat sink to directly receive the heat dissipation medium at the first temperature provided by the first heat sink assembly 104; the recycling portion may be connected to the inlet of the first heat sink assembly 104 and connected to the second end of the first heat dissipation branch 101, respectively, for recycling the heat dissipation medium of the second temperature generated by the first heat dissipation branch 101,

in other embodiments, the supply portion may be connected to the outlet of the first heat sink assembly 104 and connected to the first end of the second heat dissipation branch 102, and is configured to receive the heat dissipation medium at the first temperature provided by the first heat sink assembly 104 and provide the heat dissipation medium at the first temperature to the second heat dissipation branch 102, and the second heat dissipation branch 102 may be connected to the outlet of the first heat sink to directly receive the heat dissipation medium at the first temperature provided by the first heat sink assembly 104.

In an embodiment, a partition may be provided between the supply section and the recovery section for preventing the recovery section from transferring heat to the supply section so that the heat-dissipating medium in the supply section and the heat-dissipating medium in the recovery section do not transfer heat. In some embodiments, the partition may maintain the temperature of the heat dissipation medium of the supply portion such that the temperature of the heat dissipation medium of the supply portion does not rise due to the influence of the heat dissipation medium of the recovery portion for dissipating heat from the first heat dissipation area and the second heat dissipation area.

In some embodiments of the present application, the supply structure 103 further comprises at least one adjustment member, each adjustment member being disposed between the supply portion and the first heat dissipation branch 101. The adjusting member may be a water pump, a control valve, etc., and may be disposed at any position in the circulation pipe between the supply portion and the first heat dissipation branch 101, so as to control the flow rate in the first heat dissipation branch 101, where the flow rate in the first heat dissipation branch 101 may be the flow rate or the flow velocity of the heat dissipation medium at the first temperature entering the first heat dissipation branch 101, in some embodiments, the circulation pipe between the supply portion and the first heat dissipation branch 101 may include one or more adjusting members, and the adjusting member disposed in each circulation pipe may also include one or more adjusting members, and when the adjusting member is a water pump, the flow rate or the flow velocity of the heat dissipation medium at the first temperature entering the first heat dissipation branch 101 may be controlled by controlling the rotation speed of the water pump.

In some embodiments, at least one adjusting component may be further disposed between the supply portion and the second radiating branch 102, for example, at least one adjusting component may be disposed at any position in the flow conduit between the supply portion and the second radiating branch 102 for controlling the flow rate in the second radiating branch 102, and the flow rate in the second radiating branch 102 may be the flow rate or the flow velocity of the radiating medium with the first temperature entering the second radiating branch 102.

In some embodiments, the supply structure 103 may further include a fan disposed corresponding to the recovery portion for dissipating heat from the recovery portion, for example, when the recovery portion is a water storage tank storing a heat dissipation medium at a second temperature, the fan may be disposed outside the water storage tank, and the heat dissipation medium at the second temperature may be cooled by the fan.

In some embodiments, the supply structure 103 may include both at least one conditioning piece and a fan; in other embodiments, the supply structure 103 may include only at least one conditioning piece, and not a fan; in other embodiments, the supply structure 103 may include only a fan, and no adjustment.

In some embodiments of the present application, as shown in fig. 3, which is a schematic front view structure diagram of a heat dissipation branch provided in the embodiments of the present application, the heat dissipation branch may be a first heat dissipation branch 101 or a second heat dissipation branch 102. In some embodiments, the first heat dissipation branch 101 includes a first heat dissipation cavity 1011 thermally connected to the first heat generation region, at least one first nozzle 1012 and a first microchannel structure 1013 are stacked in the first heat dissipation cavity 1011, the first heat dissipation cavity 1011 may contact the first heat generation region of the heat generation element and perform heat transfer to cool the first heat generation region, at least one first nozzle 1012 is disposed in the first heat dissipation cavity 1011, each first nozzle 1012 may be stacked on an inner surface of the first heat dissipation cavity 1011, and the inner surface where the first nozzle 1012 is located is opposite to a surface where the first heat generation region contacts. In some embodiments, the first nozzle 1012 is connected to a first end of the water inlet of the first heat dissipation chamber 1011, the first water inlet pipe is connected to a second end of the water inlet of the first heat dissipation chamber 1011 through a water flow pipe when the supply part is communicated with the first heat dissipation chamber 1011 through the first water inlet pipe, the first microchannel structure 1013 is located on an inner surface opposite to the first nozzle 1012, and at least one first nozzle 1012 is used for spraying a heat dissipation medium at a first temperature to the first microchannel structure 1013 to perform heat exchange, wherein the heat dissipation medium at the first temperature can be provided by the supply part.

In some embodiments, the second heat dissipation branch 102 includes a second heat dissipation cavity in heat conduction connection with the second heat generation region, at least one second nozzle and a second micro-channel structure are stacked in the second heat dissipation cavity, the second heat dissipation cavity may contact with the second heat generation region of the heat generation assembly and perform heat transfer to cool the second heat generation region, at least one second nozzle is disposed in the second heat dissipation cavity, each second nozzle may be stacked on an inner surface of the second heat dissipation cavity, and the inner surface where the second nozzle is located is opposite to a surface of the second heat generation region in contact. In some embodiments, a second nozzle is coupled to a first end of the water inlet of the second heat dissipation chamber, the second water inlet conduit is coupled to a second end of the water inlet of the second heat dissipation chamber when the supply section is in communication with the second heat dissipation chamber through the second water inlet conduit, the second microchannel structure is positioned on an inner surface opposite the second nozzle, and the at least one second nozzle is configured to spray a heat dissipation medium at a first temperature into the second microchannel structure to effect heat exchange.

In some embodiments, the first heat dissipation branch 101 is connected to the supply portion through a first water inlet pipe, and the second heat dissipation branch 102 is directly connected to the first heat sink assembly 104, but not connected to the supply portion; in other embodiments, the first heat dissipation branch 101 is connected to the first heat sink assembly 104 and is not connected to the supply portion, and the second heat dissipation branch 102 is connected to the supply portion through a second water inlet pipe.

In some embodiments, as shown in fig. 4, a schematic side view of a heat dissipation branch provided in this embodiment of the present application is shown, where the heat dissipation branch may be a first heat dissipation branch 101 or a second heat dissipation branch 102. In some embodiments, the first heat dissipation branch 101 may include at least two first outlets, and the first micro-channel structure 1013 includes a plurality of plate-shaped units, the plurality of plate-shaped units are arranged in sequence, a first water flow channel is formed between adjacent plate-shaped units, and the heat dissipation medium at the second temperature passes through the first water flow channel and flows out from two sides of the water flow channel, and finally flows back to the recycling portion or the first heat sink assembly 104 through each first outlet. In some embodiments, the second heat dissipation branch 102 may include at least two second outlets, and the second micro-channel structure includes a plurality of plate units, the plurality of plate units are arranged in sequence, a second water flow channel is formed between adjacent plate units, and the heat dissipation medium at the second temperature flows through the second water flow channel and flows out from two sides of the water flow channel, and finally flows back to the recycling portion or the first heat sink assembly 104 through each second outlet.

It can be understood that, in the embodiment of the present application, the first nozzle 1012 and the second nozzle may be both tapered nozzles, and the heat dissipation effect of the first heat dissipation branch 101 and the second heat dissipation branch 102 can be enhanced by disposing the first nozzle 1012, the first micro-channel structure 1013, the second nozzle, and the second micro-channel structure, so as to effectively reduce the temperature of the surface of the heat generating component or the heat generating component.

In some embodiments of the present application, the second heat sink assembly 107 includes a first inlet and a second inlet, when the second heat sink assembly 107 includes a second cold row and a second fan, the second cold row may include two cold rows, the first inlet and the second inlet may be inlets corresponding to the two cold rows respectively, and the two cold rows may recover the heat dissipation medium at the second temperature generated after the first heat generation area and the second heat generation area are cooled respectively, and cool the heat dissipation medium at the second temperature by the second fan.

In some embodiments, when the heat dissipation device includes both the third heat dissipation branch 105 and the fourth heat dissipation branch 106, the third heat dissipation branch 105 includes a first temperature control module, the first temperature control module includes a first cold end and a first hot end, the first cold end is in heat conduction connection with the first heat generation area, the first cold end may contact the first heat generation area, and when the temperature of the first heat generation area changes sharply and exceeds a temperature threshold, the first cold end may absorb heat of the first heat generation area and transmit the heat to the first hot end. The first hot end is communicated with the first inlet of the second heat sink assembly 107, for example, the first hot end can exchange heat through a structure similar to the first heat dissipation branch 101 or the second heat dissipation branch 102, and the output heat dissipation medium is connected with the first inlet of the second cold row through a water flow pipeline, so as to realize the transmission of the heat in the first heat generation area to the second cold row. In some embodiments, the third heat dissipation branch 105 may further include a first temperature sensor, and the first temperature sensor is disposed at a position corresponding to the first heat generation area, and is configured to collect temperature information of the first heat generation area.

In some embodiments, the fourth heat dissipation branch 106 includes a second temperature control module, the second temperature control module includes a second cold end and a second hot end, the second cold end is in heat conduction connection with the second heat generation region, the second cold end may contact the second heat generation region, and when the temperature of the second heat generation region changes sharply and the temperature of the second heat generation region exceeds a temperature threshold, the second cold end may absorb the heat of the second heat generation region and transmit the heat to the second hot end. The second hot end is communicated with the second inlet of the second heat sink assembly 107, for example, the second hot end may exchange heat through a structure similar to the first heat dissipation branch 101 or the second heat dissipation branch 102, and the output heat dissipation medium is connected to the second inlet of the second cold row through a water flow pipeline, so as to transfer heat of the second heat generation area to the second cold row. In some embodiments, the fourth heat dissipation branch 106 may further include a second temperature sensor, and the second temperature sensor is disposed at a position corresponding to the second heat generation area, and is used for collecting temperature information of the second heat generation area.

In some embodiments of the present application, when the heat dissipation device includes the third heat dissipation branch 105 but not the fourth heat dissipation branch 106, the third heat dissipation branch 105 includes a first temperature control module and a first temperature sensor, the first cold end of the first temperature control module may contact with the first heat generation area, and absorb the temperature of the first heat generation area when the temperature of the first heat generation area rises sharply, the first hot end of the first temperature control module is communicated with the first inlet of the second heat sink assembly 107 through a water inlet pipe, and the first temperature sensor is disposed at a position corresponding to the first heat generation area.

In other embodiments, when the heat dissipation device includes the fourth heat dissipation branch 106 and does not include the third heat dissipation branch 105, the fourth heat dissipation branch 106 includes a second temperature control module and a second temperature sensor, a second cold end of the second temperature control module may contact with the second heat generation area, when the temperature of the second heat generation area rises sharply, the temperature of the second heat generation area is absorbed, a second hot end of the second temperature control module is communicated with the second inlet of the second heat sink assembly 107 through a water inlet pipe, and the second temperature sensor is disposed at a position corresponding to the second heat generation area.

In some embodiments of the present application, the heat dissipation device may further include a controller, and the controller is connected to the at least one adjusting member, the second temperature control module, and the first temperature control module, and is capable of controlling operating parameters of the at least one adjusting member, the second temperature control module, and the first temperature control module.

In some embodiments, the controller may be further electrically connected to the first temperature sensor, and configured to receive first temperature information corresponding to the first temperature sensor and control an operating parameter of the at least one regulating element and the first temperature control module based on the first temperature information; in other embodiments, the controller may be further electrically connected to the second temperature sensor, and configured to receive second temperature information corresponding to the second temperature sensor, and control the operating parameters of the at least one adjusting element and the second temperature control module based on the first temperature information.

In some embodiments, when the first heat generation region dissipates heat through the first heat dissipation branch 101 and the third heat dissipation branch 105, the second heat generation region dissipates heat only through the second heat dissipation branch 102, and both the first heat dissipation branch 101 and the second heat dissipation branch 102 provide the heat dissipation medium at the first temperature by the supply structure 103, if the adjusting element that can be disposed in the circulation pipe between the first heat dissipation branch 101 and the supply structure 103 is the first adjusting element, and the adjusting element that is disposed in the circulation pipe between the second heat dissipation branch 102 and the supply structure 103 is the second adjusting element, the controller may be electrically connected to the at least one first adjusting element, the at least one second adjusting element, the first temperature sensor, the second temperature sensor, and the first temperature control module, and the controller may receive first temperature information corresponding to the first temperature sensor, control the operating parameters of the at least one first adjusting element and the first temperature control module based on the first temperature information, and control the operating parameters of the first adjusting element may be, for example, when the first adjusting element is a water pump, the operating parameters of the first temperature control module may be a rotation speed of the first heat generation region control module, and when the first heat generation region exceeds a preset temperature control threshold. The controller can also receive second temperature information corresponding to the second temperature sensor and control the working parameters of the second regulating part based on the second temperature information.

In some embodiments, when the first heat generation region is only cooled by the first heat dissipation branch 101, the second heat generation region is cooled by the second heat dissipation branch 102 and the fourth heat dissipation branch 106, and both the first heat dissipation branch 101 and the second heat dissipation branch 102 provide the heat dissipation medium with the first temperature by the supply structure 103, the controller may be electrically connected to the at least one first adjusting member, the at least one second adjusting member, the first temperature sensor, the second temperature sensor, and the second temperature control module, respectively, and may receive second temperature information corresponding to the second temperature sensor, and control an operating parameter of the at least one second adjusting member and the second temperature control module based on the second temperature information, and control an operating parameter of the second adjusting member may be, for example, when the second adjusting member is a water pump, the rotation speed of the water pump is adjusted based on the temperature of the second heat generation region, and control an operating parameter of the second temperature control module may be control the second temperature control module to absorb heat of the second heat generation region when the temperature of the second heat generation region exceeds a preset threshold. Meanwhile, the controller can also receive first temperature information corresponding to the first temperature sensor and control the working parameters of the first adjusting piece based on the first temperature information.

In other embodiments, when the first heat generation region dissipates heat through the first heat dissipation branch 101 and the third heat dissipation branch 105, the second heat generation region dissipates heat through the second heat dissipation branch 102 and the fourth heat dissipation branch 106, and both the first heat dissipation branch 101 and the second heat dissipation branch 102 provide a heat dissipation medium at a first temperature through the supply structure 103, the controller may be electrically connected to the at least one first adjusting part, the at least one second adjusting part, the first temperature sensor, the second temperature sensor, the first temperature control module, and the second temperature control module, and may receive first temperature information corresponding to the first temperature sensor, and control operating parameters of the at least one first adjusting part and the first temperature control module based on the first temperature information, and meanwhile, the controller may also receive second temperature information corresponding to the second temperature sensor, and control operating parameters of the at least one second adjusting part and the second temperature control module based on the second temperature information.

In some embodiments, the first temperature control module and the second temperature control module may be both semiconductor cooling fins (TEC), and the TEC may be disposed at a position of a heating region (e.g., a first heating region and a second heating region) corresponding to the heating element, and when a temperature of the heating region changes sharply, the TEC may absorb heat of the heating element, thereby achieving a purpose of protecting the heating element.

Exemplarily, when the first adjusting part and the second adjusting part are both water pumps, if the temperature values corresponding to the first temperature information and the second temperature information are both less than or equal to 60 ℃, controlling the rotating speeds of the first adjusting part and the second adjusting part to be both 2000 rpm; if the temperature value corresponding to the first temperature information is greater than 60 ℃ and the temperature value corresponding to the second temperature information is less than or equal to 60 ℃, controlling the rotating speed of the first regulating part to be 3000 r/min and controlling the rotating speed of the second regulating part to be 2000 r/min; if the temperature value corresponding to the first temperature information is less than or equal to 60 ℃, and the temperature value corresponding to the second temperature information is greater than 60 ℃, controlling the rotating speed of the first regulating part to be 2000 rpm, and controlling the rotating speed of the second regulating part to be 3000 rpm; and if the temperature values corresponding to the first temperature information and the second temperature information are both greater than 60 ℃, controlling the rotating speeds of the first regulating part and the second regulating part to be 3000 r/min.

It can be understood that, in the embodiment of the present application, the controller may control the working parameters of the adjusting part, the first temperature control module, and the second temperature control module according to the actual temperatures of the first heat generation area and the second heat generation area, so as to improve the heat dissipation effect of the first heat generation area and the second heat generation area.

In some embodiments of the present application, if the first heat sink assembly 104 includes a first fan and the second heat sink assembly 107 includes a second fan, the controller may further be electrically connected to the first fan and the second fan, respectively, and control the rotation speed of the first fan based on the first temperature information and control the rotation speed of the second fan based on the second temperature information, so as to achieve the purpose of rapidly cooling the first heat-generating area and the second heat-generating area.

The embodiment of the present application further provides an electronic device, where the electronic device includes a motherboard and the heat dissipation apparatus in the foregoing embodiment, and the first heat generation area and the second heat generation area are located on the motherboard, for example, the first heat generation area and the second heat generation area may be two different heat generation areas of a same heat generation component disposed on the motherboard, or may be heat generation areas corresponding to different heat generation components disposed on the motherboard.

In some embodiments, the motherboard is spaced apart from the first heat sink assembly 104 in the electronic device receiving space and spaced apart from the second heat sink assembly 107 in the electronic device receiving space. For example, when the accommodating space of the electronic device is a chassis, the first heat sink assembly 104 may be disposed on an inner sidewall of the chassis, behind the motherboard, and spaced a predetermined distance from the motherboard, and the second heat sink assembly 107 may be disposed on a top of the inner sidewall of the chassis, above the motherboard, and spaced a predetermined distance from the motherboard.

It should be appreciated that reference throughout this specification to "some embodiments" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in some embodiments" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a component of' 8230; \8230;" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or in other forms.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units; can be located in one place or distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, all functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may be separately regarded as one unit, or two or more units may be integrated into one unit; the integrated unit may be implemented in the form of hardware, or in the form of hardware plus a software functional unit.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A heat dissipating device, comprising:

and the first radiator assembly and the supply structure form a circulating flow path and are used for cooling the heat dissipation medium input by the supply structure from a second temperature range to a first temperature range.

2. The heat dissipating device of claim 1, further comprising:

the heat dissipation mode of the third heat dissipation branch is different from that of the first/second heat dissipation branch, and the heat dissipation mode of the fourth heat dissipation branch is different from that of the first/second heat dissipation branch.

3. The heat dissipating device of claim 2, further comprising:

the second heat radiator assembly is used for guiding heat generated by the third heat dissipation branch and/or the fourth heat dissipation branch out of the accommodating space where the heat dissipation device is located;

4. The heat dissipating device according to claim 1, wherein the first heat generating region and the second heat generating region belong to different heat generating regions of a same heat generating component, or the first heat generating region and the second heat generating region belong to heat generating regions of different heat generating components.

5. The heat dissipating device of claim 3, wherein said first heat sink assembly comprises an inlet and an outlet, said feed structure comprising:

a partition disposed between the supply part and the recovery part for preventing the recovery part from transferring heat to the supply part.

6. The heat dissipating device of claim 5, wherein the supply structure further comprises at least one regulating member disposed between the supply portion and the first heat dissipating branch or between the supply portion and the second heat dissipating branch for controlling the flow rate in the first heat dissipating branch or the second heat dissipating branch; and/or the presence of a gas in the gas,

7. The heat dissipation device according to claim 5, wherein the first heat dissipation branch comprises a first heat dissipation chamber in heat-conducting connection with the first heat generation region, at least one first nozzle and a first micro-channel structure are stacked in the first heat dissipation chamber, the second heat dissipation branch comprises a second heat dissipation chamber in heat-conducting connection with the second heat generation region, and at least one second nozzle and a second micro-channel structure are stacked in the second heat dissipation chamber;

the at least one first nozzle is used for spraying the heat dissipation medium with the first temperature to the first microchannel structure; and/or the presence of a gas in the gas,

the at least one second nozzle is configured to eject the heat dissipation medium at the first temperature to the second microchannel structure.

8. The heat dissipating device of claim 6, wherein said second heat sink assembly comprises a first inlet and a second inlet;

the third radiating branch comprises a first temperature control module, the first temperature control module comprises a first cold end and a first hot end, the first cold end is in heat conduction connection with the first heating area, and the first hot end is communicated with the first inlet of the second radiator component; and/or the presence of a gas in the gas,

9. The heat dissipating device of claim 8, further comprising: and the controller is connected with the at least one adjusting piece, the second temperature control module and the first temperature control module and can control working parameters of the at least one adjusting piece, the second temperature control module and the first temperature control module.

10. An electronic device, comprising: the heat dissipating device and the main board as claimed in any one of claims 1 to 9, the first heat generating region and the second heat generating region being located on the main board; the mainboard and the first radiator assembly are arranged in the accommodating space of the electronic equipment at intervals, and the mainboard and the second radiator assembly are arranged in the accommodating space of the electronic equipment at intervals.