CN217822714U

CN217822714U - Chip stripping device for semiconductor automation product

Info

Publication number: CN217822714U
Application number: CN202122065132.0U
Authority: CN
Inventors: 沈智慧; 张正辉; 黄军明; 单良平; 徐小雨
Original assignee: Shenzhen In Cube Automation Co Ltd
Current assignee: Shenzhen In Cube Automation Co Ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-11-15
Anticipated expiration: 2031-08-30

Abstract

The utility model provides a chip stripping off device for semiconductor automation product, include: the ejector pin peeling device comprises an ejector pin driving assembly, a peeling assembly and an adsorption assembly, wherein the adsorption assembly is arranged above the ejector pin driving assembly through the peeling assembly; the top of adsorption component is provided with inhales the platform, it is provided with the thimble hole to inhale the middle of the adsorption plane of platform, the both sides of thimble hole are provided with the absorption hole. The utility model discloses an automatic chip is peeled off, and, adsorption component's top is provided with inhales the platform, be provided with the thimble hole in the middle of inhaling the adsorption plane of platform, the both sides of thimble hole are provided with the absorption hole, can also pass through when the chip is peeled off to the thimble absorption hole holds the mucosa, prevents to remove together with the chip at the in-process mucosa of peeling off, has effectively avoided peeling off unsuccessful drawback, the utility model discloses production efficiency has been improved greatly, the human cost has been reduced to improve its stability ability and controllability.

Description

Chip stripping device for semiconductor automation product

Technical Field

The utility model relates to a chip stripping off device especially relates to a chip stripping off device for semiconductor automation product.

Background

At present, in the semiconductor automation product chip peeling industry in the manufacturing industry in China, with the continuous development of the intelligent industry, the market demand is continuously increased. The manual stripping mode basically comprises the following steps: manually placing the wafer tray on the operating platform, manually sliding the back of the adhesive film with fingers to peel off the chip from the adhesive film, and then manually placing the chip at a corresponding position by adsorbing the chip with the suction nozzle.

Moreover, because the accuracy of the chip is controlled more and more at present, the manual peeling needs to reach the specified accuracy and yield, the skill requirement on the operator is higher, and the cost is further increased. Therefore, the peeling process of the traditional manual assembly line mode urgently needs to introduce novel automatic equipment, manual operation is replaced by machine production, cost is reduced, efficiency is improved, control precision is improved, and the trend is that blocking is not necessary.

Disclosure of Invention

The utility model aims to solve the technical problem that a chip stripping off device for semiconductor automation product that can realize that automatic chip peels off, improves work efficiency and controllable degree needs to be provided.

To this end, the utility model provides a chip stripping off device for semiconductor automation product, include: the ejector pin stripping mechanism comprises an ejector pin driving assembly, a stripping assembly and an adsorption assembly, wherein the adsorption assembly is arranged above the ejector pin driving assembly through the stripping assembly; the top of adsorption component is provided with inhales the platform, it is provided with the thimble hole to inhale the middle of the adsorption plane of platform, the both sides of thimble hole are provided with the absorption hole.

The utility model discloses a further improvement lies in, thimble drive assembly includes motor drive module and XY slip table, the motor drive module with the XY slip table is connected.

The utility model discloses a further improvement lies in, peel off subassembly includes cam, guiding mechanism, straining device and thimble subassembly, thimble drive assembly is connected to guiding mechanism through the cam, straining device sets up in between the mounting seat of guiding mechanism and adsorption component; the ejector pin assembly is arranged above the guide mechanism.

The utility model discloses a further improvement lies in, the servo motor of motor drive module drives the cam is rotatory.

The utility model discloses a further improvement lies in, guiding mechanism includes bearing, gyro wheel installation piece and spline, the cam passes through the bearing drives gyro wheel installation piece and spline, the spline set up in the top of gyro wheel installation piece.

The utility model discloses a further improvement lies in, straining device includes first spring hook, extension spring and second spring hook, the one end of extension spring with first spring hook is connected, the other end of extension spring with second spring hook is connected, first spring hook set up in on adsorbing component's the mount pad, second spring hook set up in on the gyro wheel installation piece.

The utility model discloses a further improvement lies in, thimble subassembly includes connecting plate, needle file and thimble, the thimble passes through the needle file is installed on the connecting plate, the connecting plate with the spline is connected.

The utility model discloses a further improvement lies in, the needle file includes double needle file or single needle file.

The utility model discloses a further improvement lies in, adsorption component still includes air pipe joint, riser and bottom, the riser sets up on the mount pad, air pipe joint set up in on the riser, inhale the platform pass through the bottom set up in on the riser.

The utility model discloses a further improvement lies in, adsorption hole evenly distributed in around the thimble hole.

Compared with the prior art, the beneficial effects of the utility model reside in that: the adsorption component passes through peel off the subassembly set up in thimble drive assembly's top, and then realized that automatic chip peels off, and, adsorption component's top is provided with inhales the platform, be provided with the thimble hole in the middle of inhaling the adsorption plane of platform, the both sides of thimble hole are provided with the absorption hole, can also pass through when the chip is peeled off to the thimble the mucosa is inhaled to the absorption hole, prevents to remove with the chip at the in-process mucosa that peels off together, the utility model discloses effectively avoided peeling off unsuccessful drawback, improved production efficiency greatly, reduced the human cost to improve its stability ability and controllability.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic structural view of a suction table of the adsorption module according to an embodiment of the present invention;

FIG. 3 is a schematic view of a stripping assembly according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a thimble assembly according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of an adsorption assembly according to an embodiment of the present invention.

Detailed Description

Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 5, the present example provides a chip peeling apparatus for semiconductor automation products, including: the device comprises a thimble driving component 1, a stripping component 2 and an adsorption component 3, wherein the adsorption component 3 is arranged above the thimble driving component 1 through the stripping component 2; the top of adsorption component 3 is provided with inhales platform 31, it is provided with thimble hole 311 in the middle of the adsorption plane of platform 31 to inhale, the both sides of thimble hole 311 are provided with and adsorb hole 312.

The thimble driving component 1 is a component for realizing driving through a motor and realizing sliding and supporting of XY axes, the thimble driving component 1 preferably comprises a motor driving module 11 and an XY sliding table 12, and the motor driving module 11 is connected with the XY sliding table 12; motor drive module 11 also calls the KK module, drives the robot module promptly, XY slip table 12 can be the manual slip table of XY, also can be the automatic slip table of XY, motor drive module 11 (KK module) has the servo motor 111 control of area brake XY slip table 12 realizes that thimble platform goes up and down, and when wafer dish on the chip directly over thimble assembly, servo motor 111 control motor drive module 11 (KK module) rises thimble platform, adsorption component 3 is attached under the chip, thimble assembly stop motion.

As shown in fig. 1 to 5, the adsorption assembly 3 is disposed above the thimble driving assembly 1 through the peeling assembly 2, so that automatic chip peeling is realized, the top of the adsorption assembly 3 is provided with the suction table 31, the middle of the suction surface of the suction table 31 is provided with the thimble hole 311, the two sides of the thimble hole 311 are provided with the suction holes 312, the thimble 210 can peel off the chip and suck the mucosa through the suction holes 312, the mucosa is prevented from moving together with the chip in the peeling process, the defect of unsuccessful peeling is effectively avoided, the production efficiency is greatly improved, the labor cost is reduced, and the stability and controllability of the thimble are improved. Preferably, the absorption holes 312 are uniformly distributed around the thimble holes 311, so that the distribution of the jacking force and the absorption force is more uniform and reliable.

As shown in fig. 3, the peeling assembly 2 in this embodiment includes a cam 21, a guiding mechanism, a tensioning mechanism and an ejector pin assembly, the ejector pin driving assembly 1 is connected to the guiding mechanism through the cam 21, and the tensioning mechanism is disposed between the guiding mechanism and the mounting seat 35 of the adsorption assembly 3; the ejector pin assembly is arranged above the guide mechanism; the servo motor 111 of the motor driving module 11 drives the cam 21 to rotate.

More specifically, the guide mechanism in this example includes a bearing 22, a roller mounting block 23 and a spline 24, the cam 21 drives the roller mounting block 23 and the spline 24 through the bearing 22, the spline 24 is disposed above the roller mounting block 23, and the roller mounting block 23 is also called a bearing mounting block. The tensioning mechanism comprises a first spring hook 25, a tension spring 26 and a second spring hook 27, one end of the tension spring 26 is connected with the first spring hook 25, the other end of the tension spring 26 is connected with the second spring hook 27, the first spring hook 25 is arranged on the mounting seat 35 of the adsorption component 3, and the second spring hook 27 is arranged on the roller mounting block 23. The thimble assembly comprises a connecting plate 28, a needle seat 29 and a thimble 210, the thimble 210 is mounted on the connecting plate 28 through the needle seat 29, and the connecting plate 28 is connected with the spline 24.

In this embodiment, the servo motor 111 drives the cam 21 to rotate, and the cam 21 contacts the bearing 22 and drives the roller mounting block 23 and the spline 24 in the guide mechanism to move up and down to build the Z-axis module. In this embodiment, the thimble assembly preferably adopts a plurality of needle seats 29, the thimble assembly moves up and down along with the spline 24, and the tip portion of the thimble 210 (preferably a tungsten steel thimble) abuts against the chip to separate the chip from the mucosa, so as to complete the peeling operation. In the tensioning mechanism of the embodiment, the upper and lower first spring hooks 25 and second spring hooks 27 are hooked by the tension spring 26, so that the bearing 22 is tightly attached to the cam 21, the jump error in the Z-axis direction is eliminated, and the stability and reliability of the chip stripping process are improved. Preferably, as shown in fig. 2 to 4, the needle holder 29 in this embodiment includes a double-row needle holder or a single-row needle holder, so as to facilitate the adaptive installation of the double-row or single-row needles 210, so as to achieve different stripping requirements.

As shown in fig. 5, the adsorption assembly 3 further includes an air pipe joint 32, a vertical plate 33 and a bottom cover 34, the vertical plate 33 is disposed on an installation seat 35, the air pipe joint 32 is disposed on the vertical plate 33, and the adsorption platform 31 is disposed on the vertical plate 33 through the bottom cover 34. In this embodiment, during operation, the vacuum source is connected through the air pipe connector 32, and reaches the suction surface through the vertical plate 33, the bottom cover 35 and the suction table 31. The middle of the adsorption surface is provided with an ejector pin hole 311 for realizing ejection of the ejector pin 210, the periphery of the adsorption surface is in adsorption design, and the ejector pin 210 is used for stripping the chip and simultaneously sucking the mucosa, so that the mucosa is prevented from moving along with the chip, and unsuccessful stripping is avoided. In this embodiment, the spline 24 preferably penetrates through the upper portion of the vertical plate 33, so as to facilitate the control of the jacking of the ejector pin assembly.

The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.

Claims

1. A chip peeling apparatus for semiconductor automation products, comprising: the ejector pin peeling device comprises an ejector pin driving assembly, a peeling assembly and an adsorption assembly, wherein the adsorption assembly is arranged above the ejector pin driving assembly through the peeling assembly; the top of adsorption component is provided with inhales the platform, it is provided with the thimble hole to inhale the middle of the adsorption plane of platform, the both sides of thimble hole are provided with the absorption hole.

2. The chip peeling apparatus for semiconductor automation products as claimed in claim 1, wherein the ejector pin driving assembly includes a motor driving module and an XY slide table, the motor driving module being connected to the XY slide table.

3. The chip peeling apparatus for semiconductor automation products as claimed in claim 2, wherein the peeling assembly includes a cam, a guide mechanism, a tensioning mechanism and a pin assembly, the pin driving assembly is connected to the guide mechanism through the cam, the tensioning mechanism is disposed between the guide mechanism and the mounting seat of the suction assembly; the ejector pin assembly is arranged above the guide mechanism.

4. The chip peeling apparatus for semiconductor automation products as claimed in claim 3, wherein the cam is rotated by a servo motor of the motor driving module.

5. The chip peeling apparatus for semiconductor automation products as claimed in claim 3, wherein the guide mechanism comprises a bearing, a roller mounting block and a spline, the cam drives the roller mounting block and the spline through the bearing, and the spline is disposed above the roller mounting block.

6. The chip peeling apparatus for semiconductor automation products as claimed in claim 5, wherein the tensioning mechanism comprises a first spring hook, a tension spring and a second spring hook, one end of the tension spring is connected with the first spring hook, the other end of the tension spring is connected with the second spring hook, the first spring hook is disposed on the mounting seat of the adsorption component, and the second spring hook is disposed on the roller mounting block.

7. The chip peeling apparatus for semiconductor automation products as claimed in claim 5, wherein the ejector pin assembly includes a connecting plate, a needle holder and an ejector pin, the ejector pin is mounted on the connecting plate through the needle holder, and the connecting plate is connected with the spline.

8. The chip detachment apparatus for semiconductor automation products as claimed in claim 7, wherein the wafer seat comprises a double row wafer seat or a single row wafer seat.

9. The chip peeling apparatus for semiconductor automation products as claimed in any one of claims 1 to 8, wherein the suction assembly further comprises a gas pipe joint, a vertical plate and a bottom cover, the vertical plate is disposed on the mounting seat, the gas pipe joint is disposed on the vertical plate, and the suction table is disposed on the vertical plate through the bottom cover.

10. The chip detachment apparatus for semiconductor automation products as claimed in any one of claims 1 to 8, wherein the suction holes are uniformly distributed around the pin holes.