CN216752204U - High-power quick radiating circuit board - Google Patents
High-power quick radiating circuit board Download PDFInfo
- Publication number
- CN216752204U CN216752204U CN202122828993.XU CN202122828993U CN216752204U CN 216752204 U CN216752204 U CN 216752204U CN 202122828993 U CN202122828993 U CN 202122828993U CN 216752204 U CN216752204 U CN 216752204U
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- China
- Prior art keywords
- layer
- circuit board
- circuit
- power
- board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 230000008719 thickening Effects 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 description 48
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a high-power circuit board capable of quickly dissipating heat, which comprises an upper plate, a heat-conducting insulating layer and a lower plate, the upper end of the upper layer board is provided with a first circuit layer, the lower end of the lower layer board is provided with a second circuit layer, the circuit board is provided with an electronic component mounting area, the electronic component mounting area is provided with high-power electronic components, the left side and the right side of the electronic component mounting area are both provided with first thickened copper layers, the first thickened copper layer covers the upper end of the first circuit layer, pins of the high-power electronic component are welded at the upper end of the first thickened copper layer, the edge of the circuit board is provided with a half-cut hole which is arranged in an inclined way, the inner wall of the half-cut hole is provided with a thick copper conducting layer, thick copper conducting layer bottom is connected with the second thickening and leads to the layer, the second thickening leads to the layer cover second circuit layer lower extreme. The circuit board can be suitable for the application of a high-power circuit and has higher heat dissipation efficiency.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-power circuit board capable of quickly dissipating heat.
Background
Circuit boards are providers of electrical connections for electronic components. The circuit board is developed from a single layer to a double-sided board and a multi-layer board, and the development trend of the production and manufacturing technology of the circuit board in the future is to develop the circuit board in the directions of high density, high precision, fine aperture, fine wire, small space, high reliability, multilayering, high-speed transmission, light weight and thin type in performance. In order to meet the requirement of high-power input and output of a part of high-power electronic components arranged on a circuit board, a thick copper layer is generally required to be plated on a circuit layer on the circuit board, and conduction between layers is realized by utilizing a conductive hole. In the circuit board in the prior art, the position of the conductive hole is easy to overheat due to the fact that the heat at the position of the conductive hole is not easy to dissipate due to the fact that the position of the conductive hole carries larger current, and the defect is large.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems, the utility model provides a high-power quick heat dissipation circuit board which can be suitable for the application of a high-power circuit and has higher heat dissipation efficiency.
In order to achieve the purpose, the utility model is solved by the following technical scheme:
the utility model provides a high-power quick radiating circuit board, the circuit board includes top plate, heat insulating layer, lower plywood, the top plate upper end is equipped with first circuit layer, lower plywood lower extreme is equipped with second circuit layer, be equipped with electronic components installing zone on the circuit board, be equipped with high-power electronic components on the electronic components installing zone, the electronic components installing zone left and right sides all is equipped with first thickening copper layer, first thickening copper layer covers first circuit layer upper end, high-power electronic components's pin welding is in first thickening copper layer upper end, the circuit board edge is equipped with the half cut hole that is the slope setting, half cut downthehole wall is equipped with thick copper conducting layer, thick copper conducting layer bottom is connected with second thickening and leads to the layer, second thickening leads to the layer and covers second circuit layer lower extreme.
Specifically, both sides all are equipped with the mount pad about the electronic components installing zone, the mount pad is fixed circuit board upper end.
Specifically, a fan inserting female seat is further arranged on one side of the mounting seat.
Specifically, a plurality of conductive holes are formed in the circuit board, and the conductive holes are connected between the first circuit layer and the first circuit layer.
Specifically, the side of the circuit board is also fixed with a crash pad.
Specifically, the circuit board is provided with a plurality of mounting holes, and elastic gaskets are arranged on the inner sides of the mounting holes.
Specifically, the surface of the thick copper conductive layer is covered with a waterproof film layer.
The utility model has the beneficial effects that:
according to the circuit board, the obliquely-arranged half-cut hole is formed in the edge of the circuit board, the thick copper conducting layer is arranged on the inner wall of the half-cut hole, the conventional conducting hole is replaced, the thick copper conducting layer is located at the edge of the circuit board, and a large opening is formed in one end of the half-cut hole, so that heat at the position can be rapidly dissipated, the heat dissipation efficiency of the thick copper conducting layer is improved, in addition, the half-cut hole is designed to be an oblique structure, and after a fan is installed, airflow can flow along the outer side of the half-cut hole, and the heat dissipation efficiency of the thick copper conducting layer is further improved.
Drawings
Fig. 1 is a top view of a high power fast heat dissipation circuit board according to the present invention.
Fig. 2 is a cross-sectional view taken along the plane a-a in fig. 1.
Fig. 3 is a schematic structural diagram of the circuit board after the fan is installed.
The reference signs are: the circuit board comprises a circuit board 1, an upper plate 11, a heat conduction insulating layer 12, a lower plate 13, a first circuit layer 14, a second circuit layer 15, a first thickened copper layer 16, a half-cut hole 17, a thick copper conducting layer 18, a second thickened through layer 19, a conducting hole 110, a mounting hole 111, a waterproof film layer 112, a high-power electronic component 2, a mounting seat 3, a fan inserting female seat 4, an anti-collision cushion block 5, an elastic gasket 6 and a fan 7.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
As shown in fig. 1-3:
the utility model provides a high-power quick radiating circuit board 1, circuit board 1 includes upper plate 11, heat conduction insulation layer 12, lower plate 13, 11 upper ends of upper plate are equipped with first circuit layer 14, lower plate 13 lower extreme is equipped with second circuit layer 15, be equipped with the electronic components installing zone on circuit board 1, be equipped with high-power electronic components 2 on the electronic components installing zone, the electronic components installing zone left and right sides all is equipped with first thickening copper layer 16, first thickening copper layer 16 covers in first circuit layer 14 upper end, the pin welding of high-power electronic components 2 is in first thickening copper layer 16 upper end, 1 edge of circuit board is equipped with the half cut hole 17 that is the slope setting, half cut hole 17 inner wall is equipped with thick copper conducting layer 18, thick copper conducting layer 18 bottom is connected with second thickening leads to layer 19, second thickening leads to layer 19 covers at 15 lower extremes of second circuit layer.
Preferably, both sides all are equipped with mount pad 3 about the electronic components installing zone, and mount pad 3 is fixed in 1 upper end of circuit board, can fix fan 7 on mount pad 3, and mount pad 3 one side still is equipped with female seat 4 of fan grafting, inserts fan 7's plug on female seat of fan grafting, and fan 7 during operation, the air current can be followed half-cut hole 17 outside and upwards flow, has further promoted the radiating efficiency of thick copper conducting layer 18.
Preferably, the circuit board 1 is provided with a plurality of conductive vias 110, and the conductive vias 110 are connected between the first circuit layer 14 and the first circuit layer 14.
Preferably, in order to improve the edge collision-proof capability of the circuit board 1, a collision-proof cushion block 5 is further fixed on the side surface of the circuit board 1.
Preferably, the circuit board 1 is provided with a plurality of mounting holes 111, the inner sides of the mounting holes 111 are provided with elastic washers 6, and the elastic washers 6 are fixed in the equipment after penetrating through the elastic washers 6 by screws, so that the anti-seismic buffering capacity of the circuit board 1 is improved due to the fact that the elastic washers 6 have certain elastic buffering capacity.
Preferably, the surface of the thick copper conductive layer 18 is covered with a waterproof film layer 112.
The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. A high-power circuit board capable of dissipating heat quickly, wherein the circuit board (1) comprises an upper board (11), a heat conducting insulating layer (12) and a lower board (13), a first circuit layer (14) is arranged at the upper end of the upper board (11), a second circuit layer (15) is arranged at the lower end of the lower board (13), the high-power circuit board is characterized in that an electronic component mounting area is arranged on the circuit board (1), high-power electronic components (2) are arranged on the electronic component mounting area, first thickened copper layers (16) are arranged on the left side and the right side of the electronic component mounting area respectively, the first thickened copper layers (16) cover the upper end of the first circuit layer (14), pins of the high-power electronic components (2) are welded at the upper ends of the first thickened copper layers (16), half-cutting holes (17) which are arranged obliquely are formed in the edge of the circuit board (1), and thick copper conducting layers (18) are arranged on the inner walls of the half-cutting holes (17), thick copper conducting layer (18) bottom is connected with second thickening and leads to layer (19), second thickening leads to layer (19) to cover second circuit layer (15) lower extreme.
2. The circuit board for high power and rapid heat dissipation according to claim 1, wherein the upper side and the lower side of the electronic component mounting area are provided with mounting seats (3), and the mounting seats (3) are fixed on the upper end of the circuit board (1).
3. The circuit board for high power and rapid heat dissipation according to claim 2, wherein a fan socket female (4) is further disposed on one side of the mounting base (3).
4. The circuit board for high power and rapid heat dissipation according to claim 1, wherein a plurality of conductive holes (110) are formed in the circuit board (1), and the conductive holes (110) are connected between the first circuit layer (14) and the first circuit layer (14).
5. The circuit board with high power and rapid heat dissipation according to claim 1, wherein a crash pad (5) is further fixed on the side surface of the circuit board (1).
6. The circuit board for high power and rapid heat dissipation according to claim 1, wherein a plurality of mounting holes (111) are formed in the circuit board (1), and the inner sides of the mounting holes (111) are provided with elastic gaskets (6).
7. The high-power circuit board with rapid heat dissipation function as claimed in claim 1, wherein the surface of the thick copper conducting layer (18) is further covered with a waterproof film layer (112).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122828993.XU CN216752204U (en) | 2021-11-18 | 2021-11-18 | High-power quick radiating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122828993.XU CN216752204U (en) | 2021-11-18 | 2021-11-18 | High-power quick radiating circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216752204U true CN216752204U (en) | 2022-06-14 |
Family
ID=81929332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122828993.XU Expired - Fee Related CN216752204U (en) | 2021-11-18 | 2021-11-18 | High-power quick radiating circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216752204U (en) |
-
2021
- 2021-11-18 CN CN202122828993.XU patent/CN216752204U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220614 |