CN219437215U - Intelligent heat dissipation multilayer circuit board - Google Patents
Intelligent heat dissipation multilayer circuit board Download PDFInfo
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- CN219437215U CN219437215U CN202223238472.XU CN202223238472U CN219437215U CN 219437215 U CN219437215 U CN 219437215U CN 202223238472 U CN202223238472 U CN 202223238472U CN 219437215 U CN219437215 U CN 219437215U
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- circuit board
- heat dissipation
- intelligent
- heat
- intelligent circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an intelligent heat dissipation multilayer circuit board which comprises a mounting base, wherein a clamping limiting device is commonly arranged on the left part of the lower inner wall and the right part of the lower inner wall of the mounting base, an intelligent circuit board is arranged at the upper end of the clamping limiting device, a heat conducting device is arranged at the lower end of the intelligent circuit board, two screw holes are formed in the left part of the upper end and the right part of the upper end of the mounting base, a heat dissipation protecting device is arranged at the upper end of the mounting base, and a plurality of heat dissipation through holes are formed in the rear end of the mounting base. According to the intelligent heat dissipation multilayer circuit board, the heat dissipation protection device and the heat conduction device are matched for use, so that the heat dissipation effect of the device is improved, the protection plate is arranged at the upper end of the intelligent circuit board, the intelligent circuit board can be protected to a certain extent, the situation that dislocation occurs when a plurality of intelligent circuit boards are adhered is prevented through the clamping limiting device, and the quality of the intelligent circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an intelligent heat dissipation multilayer circuit board.
Background
The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. Particularly, with the development of electronic products nowadays, the requirements on the circuit board are higher and higher, and the performance of the multilayer circuit board is greatly improved compared with that of a single-layer circuit board, so that the multilayer circuit board is widely used.
The prior patent (application number 202023218914.5) discloses an intelligent heat dissipation multilayer circuit, wherein it is proposed that in the using process of some multilayer circuit boards in the current market, a plurality of circuit boards are overlapped and installed in space, however, in the application process of the circuit boards, the heat dissipation capacity is larger, and the internal space of an electronic product is smaller, so that the heat dissipation effect is poor, the local temperature of the circuit boards is possibly too high, and the service life of the circuit boards is possibly influenced; in addition, the multi-layer board is formed by combining a plurality of single-layer boards, however, when the single-layer boards are pressed, if the two boards are not well limited, dislocation easily occurs, and the quality of the multi-layer printed circuit board is further affected. In summary, the conventional multilayer circuit board has the following problems:
1. in the application process of the circuit board, the heat dissipation capacity is large, and the internal space of the electronic product is small, so that the heat dissipation effect is general, and the service life of the circuit board is further influenced; 2. when a plurality of single-layer boards are pressed, if no good limit exists between the two boards, dislocation easily occurs, and the quality of the multilayer printed circuit board is further affected.
Disclosure of Invention
The utility model mainly aims to provide an intelligent heat dissipation multilayer circuit board which can effectively solve the problems that the heat dissipation capacity is large and the internal space of an electronic product is small in the application process of the circuit board, so that the heat dissipation effect is general and the service life of the circuit board is further influenced; when a plurality of single-layer boards are pressed, if no good limit exists between the two boards, the dislocation situation can easily occur, and the quality of the multilayer printed circuit board is affected.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides an intelligent heat dissipation multilayer circuit board, includes the installation base, the chucking stop device is installed jointly to inner wall left part under the installation base and inner wall right part down, intelligent circuit board is installed to chucking stop device upper end, heat conduction device is installed to intelligent circuit board lower extreme, two screw holes have all been opened to installation base upper end left part and upper end right part, heat dissipation protector is installed to installation base upper end, install the base rear end and open there is a plurality of heat dissipation through-hole.
Preferably, the heat dissipation protection device comprises a protection plate, two fixing screws are respectively arranged at the front part of the upper end and the rear part of the upper end of the protection plate, a first fan is respectively arranged at the left part of the upper end and the right part of the upper end of the protection plate, mounting plates are respectively arranged on the left inner wall and the right inner wall of the mounting base, two second fans are respectively arranged at one ends corresponding to the mounting plates, and the protection plate is arranged at the upper end of the mounting base through the fixing screws. The fan is rotated through two fans on the guard plate on the heat radiation protection device and is blown, and then the upper part of the intelligent circuit board is radiated, and then the fan is rotated by two fans on two mounting plates and is blown, and then the lower part of the intelligent circuit board is radiated.
Preferably, the clamping limiting device comprises two fixing plates, wherein two fixing plates are arranged, limiting columns are arranged at the front part of the upper end of each fixing plate and the rear part of the upper end of each fixing plate, limiting plates are arranged at the left end and the right end of each intelligent circuit board, mounting screws are arranged at the front part of the upper end of each limiting plate and the rear part of the upper end of each limiting plate, the two limiting plates are respectively arranged at the upper ends of the two fixing plates through the mounting screws, and the two fixing plates are respectively arranged at the left part and the right part of the lower inner wall of the mounting base. Lay intelligent circuit board by the limiting plate of both sides on the spacing post on two fixed plates, put into intelligent circuit board one by one this moment, finally, through installing the screw with a plurality of intelligent circuit board pipeline refastening boards to the condition that can appear misplacement when preventing a plurality of intelligent circuit boards bonding, and then improved intelligent circuit board's quality.
Preferably, the heat conduction device comprises a heat radiation fin, heat conduction silicone grease is arranged at the middle part of the upper end of the heat radiation fin, insulating heat conduction glue is arranged at the left part of the upper end of the heat radiation fin and the right part of the upper end of the heat radiation fin, and the heat radiation fin is arranged at the lower end of the intelligent circuit board. The heat conduction silicone grease on the heat conduction device leads out the heat in the intelligent circuit board from the radiating fin rapidly, and the air circulation speed at the radiating fin is accelerated by matching with the No. two fan, so that the heat dissipation effect of the device is improved.
Preferably, gaps exist between the first fan, the second fan and the intelligent circuit board.
Preferably, the plurality of heat dissipation through holes are arranged at the rear end of the mounting base in a rectangular array.
Compared with the prior art, the utility model has the following beneficial effects:
1. continuous, long-time work at intelligent circuit board, pile up more heat in it, when leading to its overheated, at first rotate through two fans on the guard plate on the heat dissipation protector and blow, and then dispel the heat on intelligent circuit board upper portion, then rotate by two fans on two mounting panels and blow, and then dispel the heat to intelligent circuit board lower part, derive the heat in the intelligent circuit board by the fin fast by the heat conduction silicone grease on the heat conduction device this moment, the air circulation speed of fin department is accelerated to the cooperation No. two fans, and then improved the radiating effect of device, install in intelligent circuit board upper end through the guard plate moreover, and then can carry out certain protection to intelligent circuit board.
2. When a plurality of individual layers of boards need be glued, lay the spacing post on two fixed plates with intelligent circuit board by the limiting plate of both sides at first, put into intelligent circuit board one by one this moment, finally, through installing the screw with a plurality of intelligent circuit board pipeline refastening boards to the condition that can appear misplacement when preventing a plurality of intelligent circuit boards to glue, and then improved intelligent circuit board's quality.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an intelligent heat dissipation multi-layer circuit board according to the present utility model;
fig. 2 is a schematic diagram of the overall structure of a heat dissipation protection device of an intelligent heat dissipation multi-layer circuit board according to the present utility model;
fig. 3 is a schematic diagram of the overall structure of a clamping and limiting device of an intelligent heat dissipation multi-layer circuit board;
fig. 4 is a schematic diagram of the overall structure of a heat conduction device of an intelligent heat dissipation multi-layer circuit board according to the present utility model.
In the figure: 1. a mounting base; 2. a heat dissipation protection device; 3. clamping and limiting device; 4. a heat conduction device; 5. an intelligent circuit board; 6. a heat dissipation through hole; 7. screw holes; 20. a protection plate; 21. a first fan; 22. a set screw; 23. a mounting plate; 24. a second fan; 30. a fixing plate; 31. a limit column; 32. a limiting plate; 33. installing a screw; 40. a heat sink; 41. heat conductive silicone grease; 42. insulating heat-conducting glue.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, an intelligent heat dissipation multilayer circuit board comprises a mounting base 1, wherein a clamping limiting device 3 is commonly installed on the left part of the lower inner wall and the right part of the lower inner wall of the mounting base 1, an intelligent circuit board 5 is installed at the upper end of the clamping limiting device 3, a heat conducting device 4 is installed at the lower end of the intelligent circuit board 5, two screw holes 7 are formed in the left part of the upper end and the right part of the upper end of the mounting base 1, a heat dissipation protection device 2 is installed at the upper end of the mounting base 1, and a plurality of heat dissipation through holes 6 are formed in the rear end of the mounting base 1; the plurality of heat dissipation through holes 6 are arranged at the rear end of the mounting base 1 in a rectangular array.
The heat radiation protection device 2 comprises a protection plate 20, wherein two fixing screws 22 are respectively arranged at the front part of the upper end and the rear part of the upper end of the protection plate 20, a first fan 21 is respectively arranged at the left part of the upper end and the right part of the upper end of the protection plate 20, mounting plates 23 are respectively arranged on the left inner wall and the right inner wall of the mounting base 1, a second fan 24 is respectively arranged at one corresponding end of the two mounting plates 23, and the protection plate 20 is arranged at the upper end of the mounting base 1 through the fixing screws 22; gaps exist between the first fan 21 and the second fan 24 and the intelligent circuit board 5. As a specific embodiment, in this embodiment, the two fans 21 on the protection plate 20 rotate to blow air, so as to radiate the upper part of the intelligent circuit board 5, and then the fans 24 on the two mounting plates 23 rotate to blow air, so as to radiate the lower part of the intelligent circuit board 5.
The clamping limiting device 3 comprises two fixing plates 30, wherein the fixing plates 30 are provided with two limiting columns 31, limiting plates 32 are respectively arranged at the front part of the upper end and the rear part of the upper end of the two fixing plates 30, mounting screws 33 are respectively arranged at the front part of the upper end and the rear part of the upper end of the two limiting plates 32, the two limiting plates 32 are respectively arranged at the upper ends of the two fixing plates 30 through the mounting screws 33, and the two fixing plates 30 are respectively arranged at the left part and the right part of the lower inner wall of the mounting base 1. As a specific implementation manner, in this embodiment, the intelligent circuit boards 5 are placed on the limiting posts 31 on the two fixing boards 30 by the limiting boards 32 on two sides, the intelligent circuit boards 5 are placed one by one at this time, and finally, the fixing boards 30 are re-fixed by installing the plurality of intelligent circuit boards 5 through the mounting screws 33, so that dislocation can be prevented when the plurality of intelligent circuit boards 5 are adhered, and the quality of the intelligent circuit boards 5 is improved.
The heat conduction device 4 comprises a heat dissipation plate 40, heat conduction silicone grease 41 is installed in the middle of the upper end of the heat dissipation plate 40, insulating heat conduction glue 42 is installed on the left part of the upper end of the heat dissipation plate 40 and on the right part of the upper end of the heat dissipation plate 40, and the heat dissipation plate 40 is installed at the lower end of the intelligent circuit board 5. As a specific implementation manner, in this embodiment, heat in the intelligent circuit board 5 is rapidly led out from the heat sink 40 through the heat-conducting silicone grease 41, and the air circulation speed at the heat sink 40 is increased by matching with the second fan 24, so that the heat dissipation effect of the device is improved.
It should be noted that, the present utility model is an intelligent heat dissipation multi-layer circuit board, when a plurality of single-layer boards need to be adhered, firstly, the intelligent circuit board 5 is placed on the limit posts 31 on the two fixing boards 30 by the limit boards 32 on the two sides, at this time, the intelligent circuit board 5 is placed one by one, finally, the plurality of intelligent circuit boards 5 are led to be fixed to the boards 30 again through the mounting screws 33, so that the situation that dislocation can occur when the plurality of intelligent circuit boards 5 are adhered is prevented, and the quality of the intelligent circuit boards 5 is further improved, the intelligent circuit boards 5 continuously work for a long time, more heat is accumulated in the intelligent circuit boards, when the intelligent circuit boards are overheated, firstly, the two fans 21 on the protection board 20 on the heat dissipation protection device 2 rotate to blow, and then the upper part of the intelligent circuit boards 5 are dissipated, then the fans 24 on the two mounting boards 23 rotate to blow, and then the lower part of the intelligent circuit boards 5 dissipate heat, and at this time, the heat in the intelligent circuit boards 5 is rapidly led out by the heat dissipation fins 40 through the heat conduction silicone grease 41 on the mounting boards 4, the heat dissipation device 40 is further, the air is accelerated by the fans 40, and the heat dissipation effect is improved, and the intelligent circuit boards can be further protected through the protection board 20.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides an intelligence heat dissipation multilayer circuit board, includes installation base (1), its characterized in that: the intelligent circuit board is characterized in that a clamping limiting device (3) is jointly installed on the left part of the lower inner wall of the installation base (1) and the right part of the lower inner wall of the installation base, an intelligent circuit board (5) is installed at the upper end of the clamping limiting device (3), a heat conducting device (4) is installed at the lower end of the intelligent circuit board (5), two screw holes (7) are formed in the left part of the upper end of the installation base (1) and the right part of the upper end of the installation base, a heat dissipation protecting device (2) is installed at the upper end of the installation base (1), and a plurality of heat dissipation through holes (6) are formed in the rear end of the installation base (1).
2. The intelligent heat dissipation multilayer circuit board of claim 1, wherein: the heat dissipation protection device (2) comprises a protection plate (20), two fixing screws (22) are respectively arranged at the front part of the upper end and the rear part of the upper end of the protection plate (20), a first fan (21) is respectively arranged at the left part of the upper end and the right part of the upper end of the protection plate (20), mounting plates (23) are respectively arranged on the left inner wall and the right inner wall of the mounting base (1), two second fans (24) are respectively arranged at one ends corresponding to the mounting plates (23), and the protection plate (20) is arranged at the upper end of the mounting base (1) through the fixing screws (22).
3. The intelligent heat dissipation multilayer circuit board of claim 1, wherein: clamping stop device (3) are including fixed plate (30), fixed plate (30) are provided with two, two spacing post (31) are all installed at fixed plate (30) upper end front portion and upper end rear portion, limiting plate (32) are all installed to intelligent circuit board (5) left end and right-hand member, two mounting screw (33) are all installed at limiting plate (32) upper end front portion and upper end rear portion, two limiting plate (32) are installed respectively in two fixed plate (30) upper ends through mounting screw (33), two fixed plate (30) are installed respectively in inner wall left part and lower inner wall right part under installation base (1).
4. The intelligent heat dissipation multilayer circuit board of claim 1, wherein: the heat conduction device (4) comprises a heat radiation fin (40), heat conduction silicone grease (41) is installed at the middle of the upper end of the heat radiation fin (40), insulating heat conduction glue (42) is installed at the left part of the upper end of the heat radiation fin (40) and the right part of the upper end of the heat radiation fin, and the heat radiation fin (40) is installed at the lower end of the intelligent circuit board (5).
5. The intelligent heat dissipation multilayer circuit board of claim 2, wherein: gaps exist between the first fan (21) and the second fan (24) and the intelligent circuit board (5).
6. The intelligent heat dissipation multilayer circuit board of claim 1, wherein: the plurality of heat dissipation through holes (6) are arranged at the rear end of the mounting base (1) in a rectangular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223238472.XU CN219437215U (en) | 2022-12-01 | 2022-12-01 | Intelligent heat dissipation multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223238472.XU CN219437215U (en) | 2022-12-01 | 2022-12-01 | Intelligent heat dissipation multilayer circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN219437215U true CN219437215U (en) | 2023-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223238472.XU Active CN219437215U (en) | 2022-12-01 | 2022-12-01 | Intelligent heat dissipation multilayer circuit board |
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| CN (1) | CN219437215U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
-
2022
- 2022-12-01 CN CN202223238472.XU patent/CN219437215U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117460149A (en) * | 2023-10-31 | 2024-01-26 | 同扬光电（江苏）有限公司 | High-efficient integrated flexible line way board of multilayer structure |
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