CN216487561U - Coil assembly and electronic expansion valve with same - Google Patents

Abstract

The utility model provides a coil assembly and an electronic expansion valve with the same, which comprises a stator assembly; the pin structure is provided with a first end and a second end which are oppositely arranged, the first end is arranged on the circumferential surface of the stator assembly, and the pin structure is electrically connected with the stator assembly; the encapsulating layer is wrapped on the peripheries of the stator assembly and the first end of the contact pin structure; the circuit board is arranged at the second end of the pin structure and is electrically connected with the pin structure; and the injection molding part is injection molded on the encapsulating layer, and the second end of the contact pin structure, the circuit board and part of the lead are embedded in the injection molding part. Through the technical scheme provided by the utility model, can solve the poor problem of coil pack's among the prior art sealed insulation effect.

Description

Coil assembly and electronic expansion valve with same

Technical Field

The utility model relates to an electronic expansion valve technical field particularly, relates to a coil assembly and have its electronic expansion valve.

Background

Currently, existing coil assemblies include a stator assembly, a pin arrangement, a circuit board, and a housing. Wherein, the one end and the stator module of contact pin structure are connected, and stator module's periphery parcel has the encapsulated layer, and the one end that the contact pin structure is connected with stator module is buried underground in the encapsulated layer, and the other end of contact pin structure exposes in the outside of encapsulated layer and is connected with the circuit board electricity. When assembling the coil component, the shell is covered on the circuit board and is connected with the encapsulating layer, at the moment, a containing cavity is formed between the shell and the encapsulating layer, and the containing cavity is filled with the potting material so as to realize the sealing insulation of the circuit board and the contact pin structure. However, the potting material and the encapsulating layer are in adhesive bonding of glue, and in the actual working process, the potting material can generate a gap with the encapsulating layer due to the change of the external environment, so that the sealing and insulating effects of the coil assembly are influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a coil pack and have its electronic expansion valve to solve the poor problem of coil pack's among the prior art sealed insulation effect.

According to an aspect of the present invention, there is provided a coil assembly, comprising a stator assembly; the pin structure is provided with a first end and a second end which are oppositely arranged, the first end is arranged on the circumferential surface of the stator component, and the pin structure is electrically connected with the stator component; the encapsulating layer is wrapped on the periphery of the stator assembly and the first end of the contact pin structure; the circuit board is arranged at the second end of the pin structure and is electrically connected with the pin structure; and the injection molding part is injection molded on the encapsulating layer, and the second end of the contact pin structure, the circuit board and part of the lead are embedded in the injection molding part.

Use the technical scheme of the utility model, the mode that adopts injection moulding will mould plastics the portion setting on the encapsulated layer, can bury contact pin structure, circuit board and partial wire underground in the portion of moulding plastics to realize the sealed insulating effect to contact pin structure, circuit board and wire. So set up for the portion of moulding plastics is good with the encapsulated layer's excellent in connection effect, and when external environment changed, the structure of the portion of moulding plastics itself can not change, and then can avoid external water to permeate the condition of the inside of the portion of moulding plastics by the surface of the portion of moulding plastics, has promoted coil pack's sealed insulating effect. Simultaneously, above-mentioned setting also can reduce or avoid the portion of moulding plastics and the regional condition that produces the crack of encapsulated layer interconnect, further reduces the condition that water infiltrates this gap and contact with contact pin structure, circuit board, and then can further promote coil pack's sealed effect.

Further, the distance from the outer surface of the injection molding part to the pin structure is more than 0.2 mm; and/or the distance from the outer surface of the injection molding part to the circuit board is more than 0.2 mm; and/or the distance from the outer surface of the injection molding part to one end of the lead connected with the circuit board is larger than 0.2 mm. So set up, can guarantee the insulating effect of the portion of moulding plastics and can guarantee the structural strength of the portion of moulding plastics.

Further, the coil component also comprises an insulating shell which covers the periphery of the injection molding part and is connected with the injection molding part or the encapsulating layer. The insulating effect of coil pack can further be promoted in insulating casing's setting.

Further, the coil assembly further comprises a positioning structure, the positioning structure is arranged on the encapsulating layer, the positioning structure and the pin inserting structure are distributed along the axis direction of the stator assembly, the positioning structure is arranged opposite to the wire, and the positioning structure is used for positioning the wire. So set up, can promote the position accuracy of wire, and can reduce the wire and by the torn condition, guarantee coil pack's working property.

Further, location structure includes first location portion and second location portion, and first location portion distributes along stator module's axis direction with second location portion, and first location portion is close to the contact pin structure setting, and the terminal surface protrusion second location portion's that keeps away from stator module's one end terminal surface sets up, wire and first location portion butt cooperation, and/or wire and second location portion butt cooperation. So set up, can further strengthen the location effect of location structure to the wire.

Further, the wire sets up the one side that is close to the encapsulated layer at the circuit board, and the wire includes interconnect's first section and second section, and first section is connected with the circuit board, has the contained angle between second section and the first section, and the second section extends to the direction of keeping away from the contact pin structure, and first section and the bottom butt of first location portion, the second section and the terminal surface looks butt of second location portion. Above-mentioned setting, structural layout is reasonable, and then can guarantee the compactedness of coil pack's structure.

Furthermore, the positioning structure and the encapsulating layer are of an integrated structure. So set up, the convenient machine-shaping to location structure, and can reduce coil pack's production processes.

Further, the coil component further comprises an installation card, the installation card is provided with a connecting end and a free end which are arranged oppositely, the connecting end is arranged on the circumferential surface of the encapsulating layer and embedded in the injection molding part, an included angle is formed between the free end and the connecting end, and the free end is arranged opposite to one end surface of the encapsulating layer. So set up, can promote installation card and the portion of moulding plastics and with the encapsulated layer between the stability of being connected.

Further, coil pack still includes two joint portions, and two joint portions all set up on the global of encapsulated layer, and two joint portions are located the both sides of installation card respectively, and two joint portions are used for carrying out the joint to the installation card. The simple structure of joint portion, and can play the effect of temporary fixation to the installation card, guarantee the stability of the in-process installation card of moulding plastics.

According to the utility model discloses a further aspect provides an electronic expansion valve, and electronic expansion valve includes the coil pack in the aforesaid.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 shows a schematic structural diagram of a coil assembly provided according to an embodiment of the present invention;

FIG. 2 shows a schematic view of a portion of the structure at A in FIG. 1;

fig. 3 illustrates a top view of a coil assembly provided in accordance with an embodiment of the present invention;

fig. 4 shows a cross-sectional view along the direction B-B in fig. 3.

Wherein the figures include the following reference numerals:

10. a stator assembly;

20. a pin structure;

30. an encapsulation layer; 31. an annular enclosure; 32. a raised enclosure portion;

41. a circuit board; 42. a wire;

50. an injection molding part;

61. a first positioning portion; 62. a second positioning portion;

70. and installing the card.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 4, a coil assembly according to an embodiment of the present invention includes a stator assembly 10, a pin structure 20, an encapsulating layer 30, a circuit board 41, a lead wire 42, and an injection molding part 50. The pin structure 20 has a first end and a second end, the first end is disposed on the circumferential surface of the stator assembly 10, and the pin structure 20 is electrically connected to the stator assembly 10. An encapsulation layer 30 surrounds the stator assembly 10 and the first end of the pin arrangement 20. The circuit board 41 is disposed at the second end of the pin structure 20 and electrically connected to the pin structure 20, and the wires 42 are electrically connected to the circuit board 41. The injection molding portion 50 is injection molded on the encapsulating layer 30, and the second end of the pin structure 20, the circuit board 41 and a portion of the conductive wire 42 are all embedded in the injection molding portion 50.

Use the technical scheme of the utility model, the portion 50 that will mould plastics that adopts injection moulding's mode sets up on encapsulated layer 30, can bury contact pin structure 20, circuit board 41 and partial wire 42 underground in the portion 50 of moulding plastics to the sealed insulating effect of realization to contact pin structure 20, circuit board 41 and wire 42. So set up for portion 50 of moulding plastics is good with encapsulated layer 30's excellent in connection effect, and when external environment changed, portion 50 of moulding plastics's structure itself can not change, and then can avoid external water to permeate the condition of portion 50 of moulding plastics by portion 50's of moulding plastics surface, has promoted coil pack's sealed insulating effect. Meanwhile, the arrangement can also reduce or avoid the condition that the interconnected region of the injection molding part 50 and the encapsulating layer 30 is cracked, further reduce the condition that water permeates into the gap and contacts with the contact pin structure 20 and the circuit board 41, and further improve the sealing effect of the coil assembly. Above-mentioned setting, it is low to encapsulating layer 30's shaping structure requirement, the convenient machine-shaping to portion 50 of moulding plastics, and compare with the mode that adopts insulating housing and encapsulating material to combine together among the scheme in the traditional technology, portion 50 of moulding plastics's cost is lower.

As shown in fig. 1, the distance from the outer surface of the injection molding part 50 to the pin structure 20 is greater than 0.2 mm; and/or the distance between the outer surface of the injection part 50 and the circuit board 41 is more than 0.2 mm; and/or the distance from the outer surface of the injection molding part 50 to one end of the lead 42 connected with the circuit board 41 is more than 0.2 mm. The outer surface of the injection molding part 50 may be set to a curved surface structure, a planar structure or a special-shaped structure according to an application scenario of the coil assembly. In this embodiment, after the injection molding part 50 is injection molded on the encapsulating layer 30, the injection molding part 50 and the part of the encapsulating layer 30 form a cubic structure, and the distance from the outer surface of the injection molding part 50 to the pin structure 20, the distance from the outer surface of the injection molding part 50 to the circuit board 41, and the distance from the outer surface of the injection molding part 50 to one end of the wire 42 connected to the circuit board 41 are all greater than 0.2mm, and the three distances may be the same or different. With such an arrangement, the pin structure 20, the circuit board 41 and the lead 42 embedded in the encapsulating layer 30 can be insulated from the air, so that the insulating effect of the coil assembly is further improved. In addition, the injection part 50 has certain wear resistance and structural strength, the condition that the injection part 50 is worn or cracked is reduced, and the service life of the injection part 50 is prolonged. Specifically, the above three distances may be set to any one of 0.25mm, 0.3mm, 0.4mm, or 1 mm. In this embodiment, the three distances are set to be 0.3 mm.

Further, the coil assembly further includes an insulating case covering the outer circumference of the injection molded part 50 and connected to the injection molded part 50 or the encapsulating layer 30. The coil assembly further includes a fastener, and the insulating case is connected to the encapsulating layer 30 by the fastener, or the insulating case is connected to the injection molding part 50 by the fastener. In this embodiment, the insulating housing is fastened to the injection molding portion 50 and a portion of the outer periphery of the encapsulating layer 30, extends to the peripheral surface of the encapsulating layer 30, and is connected to the peripheral surface of the encapsulating layer 30 through a fastening member. Above-mentioned setting for whole portion 50 of moulding plastics and the encapsulated layer 30 that corresponds with portion 50 of moulding plastics are all located insulating casing, and then can further promote coil pack's sealed insulating effect. And the setting of fastener can conveniently install and dismantle insulating casing.

Further, the coil assembly further includes a positioning structure disposed on the encapsulating layer 30, the positioning structure and the pin structure 20 are distributed along an axial direction of the stator assembly 10, the positioning structure is disposed opposite to the conducting wire 42, and the positioning structure is used for positioning the conducting wire 42. Specifically, the injection part 50 is formed by injection molding of a molding compound, in the process of molding the injection part 50, the stator assembly 10 with the circuit board 41 mounted thereon is placed in an injection mold, the injection mold is filled with the molding compound, and the injection part 50 is formed after the molding compound is hardened. The deformability of the lead 42 is strong, the molding compound has a certain fluidity, and when the molding compound is filled, the lead 42 may deform or displace under the action of the impact force of the molding compound, and then after the molding compound is hardened, the installation accuracy of the lead 42 may be poor, and even the lead 42 is torn, which affects the working performance of the coil assembly. The setting of location structure can play certain positioning action to wire 42, reduces the condition that the in-process wire 42 of moulding plastics takes place to warp or take place the displacement, guarantees wire 42's installation accuracy, avoids or reduces wire 42 by the torn condition, and then can guarantee coil assembly's working property.

As shown in fig. 1 and 2, the positioning structure includes a first positioning portion 61 and a second positioning portion 62, the first positioning portion 61 and the second positioning portion 62 are distributed along an axial direction of the stator assembly 10, the first positioning portion 61 is disposed near the pin structure 20, an end surface of one end of the first positioning portion 61, which is far away from the stator assembly 10, protrudes out of an end surface of one end of the second positioning portion 62, which is far away from the stator assembly 10, the conducting wire 42 is in abutting engagement with the first positioning portion 61, and/or the conducting wire 42 is in abutting engagement with the second positioning portion 62. In this embodiment, the lead wire 42 is in abutting engagement with the first positioning portion 61, and the lead wire 42 is in abutting engagement with the second positioning portion 62. After the circuit board 41 is matched with the pin structure 20, the lead 42 is matched with the first positioning part 61 and the second positioning part 62 in a butting mode, so that the positioning effect of the positioning structure on the lead 42 can be enhanced, and the stability of the lead 42 in the injection molding process is further improved.

Specifically, the conducting wire 42 is disposed on one side of the circuit board 41 close to the encapsulating layer 30, the conducting wire 42 includes a first section and a second section that are connected to each other, the first section is connected to the circuit board 41, an included angle is formed between the second section and the first section, the second section extends in a direction away from the pin structure 20, the first section abuts against the bottom of the first positioning portion 61, and the second section abuts against the end face of the second positioning portion 62. In this embodiment, an included angle between the first segment of the conductive wire 42 and the second segment of the conductive wire 42 is close to a right angle, a connecting position of the first segment and the second segment of the conductive wire 42 is an arc-shaped structure, and the first positioning portion 61 and the second positioning portion 62 form a stepped structure. With the above arrangement, the first positioning portion 61 can position the first section of the lead 42, the second positioning portion 62 can position the second section of the lead 42, and the connecting portion of the first section and the second section of the lead 42 is matched with the corner formed by the first positioning portion 61 and the second positioning portion 62. Also can set up the constant head tank on first location portion 61 and second location portion 62 to make wire 42 be located the constant head tank, can further promote like this at the stability of the in-process wire 42 of moulding plastics, promote the location effect to wire 42.

Further, the encapsulating layer 30 includes an annular encapsulating portion 31 and a convex encapsulating portion 32 connected to each other, and the annular encapsulating portion 31 and the convex encapsulating portion 32 are of an integrally molded structure. Wherein, the annular wrapping part 31 is wrapped on the periphery of the stator assembly 10, the convex wrapping part 32 is arranged on the periphery of the annular wrapping part 31 and wrapped on the periphery of the first end of the pin structure 20, and the positioning structure is arranged on the annular wrapping part 31. In this embodiment, the second end of the pin structure 20 protrudes out of one end of the protruding encapsulating portion 32 away from the annular encapsulating portion 31, an end surface of one end of the protruding encapsulating portion 32 away from the annular encapsulating portion 31 protrudes out of an end surface of one end of the first positioning portion 61 away from the annular encapsulating portion 31, and the circuit board 41 and the protruding encapsulating portion 32 are attached to each other. So set up for holistic structural layout is reasonable, compact structure.

Further, the positioning structure and the encapsulating layer 30 are an integrated structure. Specifically, the first positioning portion 61 and the second positioning portion 62 are both integrally formed with the encapsulating layer 30. So set up, can promote the stability that location structure and encapsulated layer 30 are connected to, the convenient machine-shaping to location structure.

Further, the coil assembly further includes a mounting card 70, the mounting card 70 has a connecting end and a free end which are arranged oppositely, the connecting end is arranged on the circumferential surface of the encapsulating layer 30 and embedded in the injection molding part 50, an included angle is formed between the free end and the connecting end, and the free end is arranged oppositely to one end surface of the encapsulating layer 30. Specifically, the mounting tab 70 is disposed on a side of the positioning structure away from the pin structure 20, the connecting end extends along an axial direction of the stator assembly 10, the free end extends along a radial direction of the stator assembly 10, and the connecting end is embedded in the injection molding part 50. So set up, can promote the stability of installing card 70 and encapsulating layer 30 and being connected with portion 50 of moulding plastics, and do not need extra fixed knot to construct fixed mounting card 70, simplified coil pack's manufacturing procedure.

Further, coil pack still includes two joint portions, and two joint portions all set up on encapsulating layer 30 global, and two joint portions are located the both sides of installation card 70 respectively, and two joint portions are used for carrying out the joint to installation card 70. Before moulding plastics, will install card 70 joint between two joint portions can to make joint portion play the fixed effect of the interim joint of installation card 70, reduce the condition that the in-process installation card 70 of moulding plastics takes place the displacement, promote the position accuracy of installation card 70. Specifically, the clamping portion and the encapsulating layer 30 are integrally formed. So set up, the convenient machine-shaping to joint portion has simplified coil pack's manufacturing procedure.

Wherein, when installing coil pack, including following installation step:

step 1: assembling the stator assembly 10 and the pin arrangement 20;

step 2: performing one-time injection molding on the assembled stator assembly 10 and the pin structure 20 to form an encapsulating layer 30;

and step 3: assembling the circuit board 41 connected with the leads 42 with the pin structure 20;

and 4, step 4: the mounting card 70 is clamped between the two clamping parts;

and 5: the secondary injection molding is performed on the encapsulating layer 30 at the positions of the circuit board 41 and the pin structures 20 to form the injection molding part 50, so that the connection ends of the circuit board 41 and the pin structures 20 and the mounting card 70 are embedded in the injection molding part 50.

Specifically, the encapsulating layer 30 is wrapped around the first ends of the stator assembly 10 and the pin structure 20 by injection molding, and the plastic molding material used for the injection molding part 50 may be the same as or different from the plastic molding material used for the encapsulating layer 30. In this embodiment, the plastic molding material used by the injection molding portion 50 is the same as the plastic molding material used by the encapsulating layer 30, the injection molding temperature of the injection molding portion 50 is the same as the injection molding temperature of the encapsulating layer 30, and the injection molding temperature is 50 ℃ higher than the melting point of the plastic molding material. The arrangement is that in the process of molding the injection molding part 50, the surface part of the encapsulating layer 30 contacted with the injection molding part 50 is melted and is melted with the injection molding part 50 into a whole, so that the sealing effect at the connecting position of the injection molding part 50 and the encapsulating layer 30 is ensured.

According to another embodiment of the present invention, an electronic expansion valve is provided, which includes the coil assembly of the above.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A coil assembly, comprising:

a stator assembly (10);

the pin structure (20) is provided with a first end and a second end which are oppositely arranged, the first end is arranged on the peripheral surface of the stator assembly (10), and the pin structure (20) is electrically connected with the stator assembly (10);

an encapsulation layer (30) wrapped around the stator assembly (10) and the first end of the pin arrangement (20);

a circuit board (41) and a lead (42), wherein the lead (42) is electrically connected with the circuit board (41), and the circuit board (41) is arranged at the second end of the pin structure (20) and is electrically connected with the pin structure (20);

and the injection molding part (50) is injection molded on the encapsulating layer (30), and the second end of the pin structure (20), the circuit board (41) and part of the lead (42) are embedded in the injection molding part (50).

2. The coil assembly of claim 1,

the distance from the outer surface of the injection molding part (50) to the pin structure (20) is more than 0.2 mm; and/or the presence of a gas in the gas,

the distance between the outer surface of the injection molding part (50) and the circuit board (41) is more than 0.2 mm; and/or the presence of a gas in the gas,

the distance from the outer surface of the injection molding part (50) to one end of the lead (42) connected with the circuit board (41) is larger than 0.2 mm.

3. Coil assembly according to claim 1, further comprising an insulating housing covering the outer periphery of the injection molded part (50) and connected to the injection molded part (50) or the encapsulation layer (30).

4. The coil assembly according to claim 1, further comprising a positioning structure disposed on the encapsulation layer (30), the positioning structure and the pin structure (20) being distributed along an axial direction of the stator assembly (10), the positioning structure being disposed opposite to the conductive wire (42), and the positioning structure being used for positioning the conductive wire (42).

5. The coil assembly according to claim 4, wherein the positioning structure comprises a first positioning portion (61) and a second positioning portion (62), the first positioning portion (61) and the second positioning portion (62) are distributed along an axial direction of the stator assembly (10), the first positioning portion (61) is disposed near the pin structure (20), an end surface of one end of the first positioning portion (61) far away from the stator assembly (10) protrudes an end surface of one end of the second positioning portion (62) far away from the stator assembly (10), the conducting wire (42) is in abutting fit with the first positioning portion (61), and/or the conducting wire (42) is in abutting fit with the second positioning portion (62).

6. The coil assembly according to claim 5, wherein the conducting wire (42) is disposed on a side of the circuit board (41) close to the encapsulating layer (30), the conducting wire (42) includes a first section and a second section which are connected with each other, the first section is connected with the circuit board (41), the second section has an included angle with the first section, the second section extends in a direction away from the pin structure (20), the first section abuts against a bottom of the first positioning portion (61), and the second section abuts against an end face of the second positioning portion (62).

7. Coil assembly according to claim 4, wherein the positioning structure is an integrally formed structure with the envelope layer (30).

8. The coil assembly according to claim 1, further comprising a mounting card (70), wherein the mounting card (70) has a connecting end and a free end, the connecting end is disposed on the circumferential surface of the encapsulating layer (30) and embedded in the injection molding part (50), the free end and the connecting end have an included angle therebetween, and the free end is disposed opposite to one end surface of the encapsulating layer (30).

9. The coil assembly according to claim 8, further comprising two clamping portions, wherein the two clamping portions are disposed on the circumferential surface of the encapsulating layer (30) and located on two sides of the mounting card (70), respectively, and the two clamping portions are used for clamping the mounting card (70).

10. An electronic expansion valve, characterized in that it comprises a coil assembly according to any of claims 1 to 9.

Images