CN113206057B - Chip package frame, chip assembly and method for manufacturing chip assembly - Google Patents
Chip package frame, chip assembly and method for manufacturing chip assembly Download PDFInfo
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- CN113206057B CN113206057B CN202110483644.0A CN202110483644A CN113206057B CN 113206057 B CN113206057 B CN 113206057B CN 202110483644 A CN202110483644 A CN 202110483644A CN 113206057 B CN113206057 B CN 113206057B
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- chip
- connecting pieces
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- copper wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Burglar Alarm Systems (AREA)
Abstract
The invention provides a chip packaging frame, a chip assembly and a method for manufacturing the chip assembly, and belongs to the field of chip assemblies. Comprises a body and two connecting pieces; the body is provided with a first avoidance position for accommodating the chip and a second avoidance position for accommodating the induction device; the chip is electrically connected with the induction device through two connecting pieces, one ends of the two connecting pieces are connected with the chip, the other ends of the two connecting pieces are connected with the induction device, and the other ends of the two connecting pieces are located on the upper surface of the body. The connecting points of the connecting pieces and the induction device are arranged to protrude out of the upper surface of the body, so that enough space is reserved between the adjacent chip packaging frames to enable equipment for connecting the connecting pieces and the induction device to work, the chip packaging frames connected together do not need to be separated, the connecting process of the connecting pieces and the induction device can be carried out on the plurality of chip packaging frames connected together simultaneously, time is saved, and production efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of automobile anti-theft chips, and particularly relates to a chip packaging frame, a chip assembly and a manufacturing method of the chip assembly.
Background
The automobile anti-theft chip is one kind of safety anti-theft part installed in automobile key. When the key is turned on, the engine control unit sends a group of encrypted electronic code signals to the chip in the key, and only when the electronic control unit can read and feedback to receive correct anti-theft code signals, the vehicle is allowed to start. Therefore, even a simple automobile key without any button can start and open the anti-theft system of the automobile through the internal chip code.
The automobile anti-theft chip generally comprises an induction antenna part, a chip part and a framework part, wherein an induction device surrounding an ignition lock is used as a transmitting/receiving antenna for controlling the starting of an automobile, and the induction antenna part in the automobile anti-theft chip is coupled to realize the exchange of energy and information with the chip part. The sensing antenna part and the chip part are arranged on the framework and connected with each other, when the sensing antenna part and the chip part for connecting the automobile anti-theft chip are processed and manufactured, as the connection points of the two parts are positioned on the side surface of the framework, the distance between the adjacent frameworks is small, and no enough space is available for the equipment for connecting the two parts to work, the frameworks connected together need to be firstly separated into a single part, and then the sensing antenna part and the chip part on the single framework are respectively connected, so that the production efficiency of the process flow is low.
Disclosure of Invention
The invention aims to provide a chip packaging frame, a chip assembly and a method for manufacturing the chip assembly, and aims to solve the technical problem that the production efficiency of producing the chip assembly in the prior art is low.
In order to achieve the purpose, the invention adopts the technical scheme that: in one aspect, there is provided a chip package frame, including:
the body and the two connecting pieces; the body is provided with a first avoidance position for accommodating the chip and a second avoidance position for accommodating the induction device; the chip and the induction device are electrically connected through the two connecting pieces, one end of each connecting piece is connected with the chip, the other end of each connecting piece is connected with the induction device, and the other end of each connecting piece is located on the upper surface of the body.
Further, the induction device comprises a magnetic bar and a copper wire; the magnetic bar part is inserted in the second avoidance position, the copper wire is wound on the magnetic bar, one end of the copper wire is connected with the other end of one of the connecting pieces, and the other end of the copper wire is connected with the other end of the connecting piece.
Further, the magnetic rod is inserted into the position of the second avoidance position and is arranged on the side of the body, an opening is formed in the upper portion of the second avoidance position, and the diameter of the opening is smaller than that of the magnetic rod.
Furthermore, the upper surface of body is equipped with the location boss, the lower surface of body is equipped with the location bump.
Further, the material of the body is bakelite.
In a second aspect, the present invention provides a chip assembly, including the above chip package frame, an inductive device, and a chip; the induction device and the chip are arranged on the chip packaging frame, and the induction device is electrically connected to the chip.
Further, the chip assembly further comprises a shell, and the chip packaging frame, the induction device and the chip are sealed in the shell.
In a third aspect, the present invention also provides a method for manufacturing the above chip assembly, comprising the steps of:
stamping and bending the hardware to form a hardware frame comprising a plurality of connecting pieces;
the hardware frame is provided with a plurality of bodies formed by injection molding of electric wood;
inserting and fixing a magnetic bar on the body;
winding the copper wire on the magnetic rod, and connecting two ends of the copper wire to the end parts of the connecting pieces;
mounting said chip on said body to form a plurality of said chip assemblies connected together;
the chip packaging frame, the chip assembly and the method for manufacturing the chip assembly have the advantages that: the connecting points of the connecting pieces and the induction device are arranged to protrude out of the upper surface of the body, so that enough space is reserved between the adjacent chip packaging frames to enable equipment for connecting the connecting pieces and the induction device to work, the chip packaging frames connected together do not need to be separated, the connecting process of the connecting pieces and the induction device can be carried out on the plurality of chip packaging frames connected together simultaneously, time is saved, and production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic axial side structure diagram of a chip package frame according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an axial side structure of a chip assembly according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a plurality of chip assemblies on hardware according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a chip assembly with a casing according to an embodiment of the present invention;
in the figure: 1. a body; 2. a connecting member; 3. an induction device; 4. a chip; 5. hardware; 6. a housing; 11. a first avoidance position; 10. a second avoidance position; 12. positioning the boss; 21. a first end; 22. a second end; 31. a magnetic bar; 32. copper wire.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must be in a particular orientation, constructed or operated in a particular orientation, and is not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 4, the present invention provides a chip package frame, which includes a body 1 and 2 connecting members 2, wherein the number of the connecting members 2 is 2. Wherein, the body 1 has a first avoidance position 11 for accommodating the chip 4 and a second avoidance position 10 for accommodating the sensing device 3, and the chip 4 and the sensing device 3 are arranged on the body 1. Two connecting pieces 2 are buried in the body 1, one ends of the two connecting pieces 2 are connected with the induction device 3, the other ends of the two connecting pieces are connected with the chip 4, and the chip 4 and the induction device 3 are electrically connected through the two connecting pieces 2. For convenience of description, one end of the two connection members 2 connected to the sensing device 3 is referred to as a first end portion 21, the first end portion 21 is located on the upper surface of the body 1, the other end of the two connection members 2 connected to the chip 4 is referred to as a second end portion 22, and the second end portion 22 is located in the second avoidance position. The connecting element 2 is an electrically conductive material, for example copper. The connecting points of the connecting pieces 2 and the induction devices 3 are arranged on the upper surface of the body 1, so that when a chip assembly is produced, enough space is reserved between adjacent chip packaging frames, the equipment for connecting the connecting pieces 2 and the induction devices 3 works, the chip packaging frames connected together are not required to be separated, the connecting pieces 2 of a plurality of chip packaging frames can be connected with the induction devices 3 simultaneously, time is saved, and production efficiency is improved.
For a further understanding of the present invention, please refer to FIG. 3 in detail. In this embodiment, the induction device 3 includes a magnetic rod 31 and a copper wire 32, the magnetic rod 31 is partially inserted into the second avoiding portion 10, the copper wire 32 is wound around the magnetic rod 31 to form an inductor, two ends of the copper wire 32 are respectively connected to the first end portions 21 of the two connection members 2 in a one-to-one correspondence manner, that is, one end of the copper wire 32 is connected to the first end portion 21 of one of the connection members 2, and the other end of the copper wire 32 is connected to the first end portion 21 of the other connection member 2. When the chip package frame is produced, a large hardware 5 is punched, then a plurality of bodies 1 are formed on the punched hardware 5 by injection molding, and then the chip 4 and the sensing device 3 are assembled to finally form a plurality of chip package frames. However, in the current production process, the connection point of the copper wire 32 and the connecting member 2 is disposed at the side of the body 1, as shown in fig. 3, since the side distance between two adjacent bodies 1 is small, the winding nozzle for winding the copper wire 32 on the connecting member 2 cannot work normally, so the current process for producing the chip package frame has to separate the plurality of bodies 1 connected together into a single body 1 before the process of winding the copper wire 32 on the connecting member 2, and then perform the winding process. However, in the present invention, the connection point of the copper wire 32 and the connecting member 2 is located on the upper surface of the main body 1, and there is enough space between adjacent main bodies 1 for winding wire around the nozzle, so that there is no need to separate the plurality of main bodies 1 connected together into a single main body 1, and the winding process can be performed on the plurality of main bodies 1 connected together at the same time, which saves time and improves production efficiency.
In this embodiment, the connecting member 2 is a part of the hardware 5, the connecting member 2 is integrally connected with other parts of the hardware 5 before the chip 4 and the sensing device 3 are assembled into the body 1, and after the chip 4 and the sensing device 3 are assembled, the other parts of the hardware 5 are cut out. The body 1 is formed by injection moulding on the connecting piece 2.
In this embodiment, a position where the magnetic rod 31 is inserted into the second avoidance space 10 is provided at a side portion of the body 1, an upper portion of the second avoidance space 10 is opened, and a diameter of the opening is smaller than a diameter of the magnetic rod 31. After inserting bar magnet 31 into second avoidance position 10, need fix bar magnet 31, adopt the fixed bar magnet 31 of the mode of some epoxy glue usually, set up the upper portion of second avoidance position 10 to be uncovered, for dripping into the headspace from the top with epoxy glue. The diameter of the opening is smaller than that of the magnetic rod 31 in order to prevent the magnetic rod 31 from slipping out of the second escape position 10.
In this embodiment, the upper surface of the body 1 is provided with a positioning boss 12, and the lower surface of the body 1 is provided with a positioning bump. The positioning boss 12 is located between the first avoidance portion 11 and the second avoidance portion 10, and has a trapezoidal cross-sectional shape. The lower surface of the body 1 is square, and the positioning salient points are positioned at four corners of the lower surface. When the chip assembly is produced, the chip packaging frame needs to be sealed in the shell 6, the shell 6 is formed by adopting an injection molding process, and the positioning boss 12 and the positioning salient points can be fixed in an injection mold to provide a positioning effect when the shell 6 is formed by injection molding.
In the present embodiment, the material of the body 1 is preferably bakelite. The bakelite has higher mechanical strength and good insulativity, and can be well adapted to the use scene of the chip packaging frame.
The invention also provides a chip assembly which is applied to the field of automobile theft prevention and comprises the chip packaging frame, the sensing device 3 and the chip 4, wherein the sensing device 3 and the chip 4 are arranged on the chip packaging frame, and the sensing device 3 is electrically connected to the chip 4.
Above-mentioned chip assembly, through the tie point setting at body 1 with connecting piece 2 and induction element 3, make to possess sufficient space between the adjacent chip packaging frame and make the equipment work of connecting piece 2 and induction element 3, consequently need not to carry out the separation of the chip packaging frame that links together, can carry out the connection process of connecting piece 2 and induction element 3 to a plurality of chip packaging frames that link together simultaneously, saved the time, improved production efficiency.
Further, as shown in fig. 4, the chip assembly further includes a casing 6, the chip package frame, the sensing device 3 and the chip 4 are all sealed in the casing 6, and the casing 6 is used for protecting the sensing device 3 and the chip therein and facilitating the installation of the chip assembly in a suitable environment thereof, for example, the chip assembly is installed in a car key. The material of the shell 6 is plastic or rubber.
In another aspect, as shown in fig. 2, the present invention provides a method of manufacturing the above chip assembly, including the steps of:
stamping and bending the hardware 5 to form a hardware frame comprising a plurality of connecting pieces 2;
injection molding bakelite on a hardware frame to form a plurality of bodies 1;
inserting and fixing a magnetic bar 31 on the body 1;
winding a copper wire 32 on the magnetic rod 31 and connecting both ends of the copper wire 32 to the ends of the connecting member 2;
the chip 4 is mounted on the body 1 to form a plurality of connected chip assemblies.
It should be noted that, bending the hardware 5 means that a part of the structure of the hardware 5, which includes the first end portion 21 of the connecting member 2, is bent to be perpendicular to the rest of the structure of the hardware, so that the structure in which the first end portion 21 is located on the upper surface of the main body 1 can be formed only when the bakelite is injection-molded on the hardware frame to form a plurality of main bodies 1 in the next step.
Illustratively, after the chip 4 is mounted on the body 1 to form a plurality of connected chip assemblies, the method further comprises the steps of injection molding a housing 6 on the chip assemblies, encapsulating the chip assemblies inside the housing 6, and after the housing 6 is formed by injection molding, cutting off the process edges of the hardware frame to separate the plurality of connected chip assemblies to form a plurality of single chip assemblies.
In the method for manufacturing the chip assembly, the connection point of the connecting piece 2 and the copper wire 32 is arranged on the upper surface of the body 1, so that a sufficient space is provided between adjacent chip packaging frames to enable a device for connecting the connecting piece 2 and the copper wire 32 to work. According to the method for manufacturing the chip assembly, the connected chip packaging frames are not required to be separated, the connecting process of the connecting piece 2 and the copper wire 32 can be simultaneously carried out on the connected chip packaging frames, the time is saved, and the production efficiency is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A chip packaging frame is characterized by comprising a body and two connecting pieces; the body is provided with a first avoidance position for accommodating the chip and a second avoidance position for accommodating the induction device; the chip and the induction device are electrically connected through the two connecting pieces, one ends of the two connecting pieces are connected with the chip, the other ends of the two connecting pieces are connected with the induction device, the two connecting pieces are buried in the body, one ends of the two connecting pieces are located in the first avoidance position, the other ends of the two connecting pieces are located on the upper surface of the body, and the induction device comprises a magnetic rod and a copper wire; the magnetic bar part is inserted in the second avoidance position, and the second avoidance position is arranged on the side part of the body.
2. The chip package frame according to claim 1, wherein the copper wire is wound around the magnetic bar, one end of the copper wire is connected to the other end of one of the connectors, and the other end of the copper wire is connected to the other end of the other connector.
3. The chip package frame according to claim 2, wherein an opening is formed at an upper portion of the second avoiding portion, and a diameter of the opening is smaller than a diameter of the magnetic bar.
4. The chip package frame according to claim 1, wherein the upper surface of the body is provided with a positioning boss, and the lower surface of the body is provided with a positioning bump.
5. The chip package frame according to any one of claims 1 to 4, wherein the material of the body is bakelite.
6. A chip assembly comprising the chip package frame of claim 1, an inductive device, and a chip; the induction device and the chip are arranged on the chip packaging frame, and the induction device is electrically connected to the chip through the two connecting pieces.
7. The chip assembly of claim 6, further comprising a housing, wherein the chip package frame, the inductive device, and the chip are all sealed within the housing.
8. A method of manufacturing the chip assembly of claim 6, comprising:
stamping and bending the hardware to form a hardware frame comprising a plurality of connecting pieces;
the electric wood is injected on the hardware frame to form a plurality of bodies;
fixing a magnetic bar in the second avoidance position on the body;
winding the copper wire on the magnetic rod, and connecting two ends of the copper wire to the end parts of the connecting pieces;
and installing the chip in the first avoidance position on the body to form a plurality of connected chip components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110483644.0A CN113206057B (en) | 2021-04-30 | 2021-04-30 | Chip package frame, chip assembly and method for manufacturing chip assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110483644.0A CN113206057B (en) | 2021-04-30 | 2021-04-30 | Chip package frame, chip assembly and method for manufacturing chip assembly |
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| CN113206057A CN113206057A (en) | 2021-08-03 |
| CN113206057B true CN113206057B (en) | 2022-09-06 |
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| CN202110483644.0A Active CN113206057B (en) | 2021-04-30 | 2021-04-30 | Chip package frame, chip assembly and method for manufacturing chip assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114121822A (en) * | 2021-11-18 | 2022-03-01 | 深圳市宏钢机械设备有限公司 | Metal packaging shell and preparation process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303479A (en) * | 2005-03-25 | 2006-11-02 | Dentsu Kiko Kk | Semiconductor-chip embedded resin package, manufacturing method thereof, and magnetic sensor using the same |
| CN206616962U (en) * | 2016-11-04 | 2017-11-07 | 上海九系实业有限公司 | A kind of autonomous learning formula radio frequency electric theftproof lock for intelligent anti-theft door lock |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007235004A (en) * | 2006-03-03 | 2007-09-13 | Mitsubishi Electric Corp | Semiconductor device |
| DE102010006010B4 (en) * | 2010-01-27 | 2014-08-14 | Atmel Corp. | IC package |
| JP5163776B2 (en) * | 2010-07-13 | 2013-03-13 | 株式会社デンソー | Card key |
| DE102013114155B4 (en) * | 2013-12-16 | 2015-10-22 | Infineon Technologies Ag | Method for producing a chip arrangement and chip arrangements |
| US11676756B2 (en) * | 2019-01-07 | 2023-06-13 | Delta Electronics (Shanghai) Co., Ltd. | Coupled inductor and power supply module |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303479A (en) * | 2005-03-25 | 2006-11-02 | Dentsu Kiko Kk | Semiconductor-chip embedded resin package, manufacturing method thereof, and magnetic sensor using the same |
| CN206616962U (en) * | 2016-11-04 | 2017-11-07 | 上海九系实业有限公司 | A kind of autonomous learning formula radio frequency electric theftproof lock for intelligent anti-theft door lock |
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