CN215266212U - Automatic suction nozzle replacing device - Google Patents
Automatic suction nozzle replacing device Download PDFInfo
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- CN215266212U CN215266212U CN202121353427.1U CN202121353427U CN215266212U CN 215266212 U CN215266212 U CN 215266212U CN 202121353427 U CN202121353427 U CN 202121353427U CN 215266212 U CN215266212 U CN 215266212U
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Abstract
The utility model discloses an automatic device of changing of suction nozzle sets up on the platen, including fixing the suction nozzle storehouse subassembly on the platen and the portable suction nozzle head subassembly that sets up on the platen, suction nozzle storehouse subassembly includes the carousel, be equipped with a plurality of installation positions on the carousel, the rotation center pin equipartition of carousel is encircleed to the installation position, be equipped with a suction nozzle in every installation position respectively, the suction nozzle head subassembly includes the portable removal support that sets up of Y axle direction along, be equipped with the suction nozzle head along Z axle direction liftable on the removal support, the suction nozzle head is including the absorption chamber of parcel suction nozzle tip, the suction nozzle head subassembly still includes vacuum generator, vacuum generator's output and absorption chamber intercommunication. The automatic suction nozzle replacing device can automatically complete replacement of the suction nozzle, manual operation is not needed, replacement efficiency is greatly improved, labor intensity of operators is reduced, misoperation caused by manual replacement is avoided, the chip mounter does not need to be stopped in the replacement process, time waste is avoided, and working efficiency of the chip mounter is improved.
Description
Technical Field
The utility model relates to a semiconductor package equipment technical field especially relates to an automatic device of changing of suction nozzle.
Background
With the development of semiconductor technology, the chips used in semiconductor products are more and more diversified, and there are chips with various sizes in the same carrier, so that the suction nozzle of the chip mounting device needs to be replaced when packaging different chip products on the same chip mounting device, so that the specification of the suction nozzle is matched with the type of the carrier or the chip, the chip mounting equipment can smoothly complete the packaging of the product, however, the operation of manually replacing the suction nozzle is complicated, the patch device needs to be stopped for waiting when being replaced, the time is wasted, the device is easy to break down due to the misoperation of an operator, two or more chips need to be mounted on the existing semiconductor product, still need shut down many times and change the suction nozzle at the packaging process, cause the production efficiency of paster equipment to reduce, still increased operator's work load, be unfavorable for semiconductor product's high efficiency, high quality production.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: provides a high-efficiency automatic suction nozzle replacing device.
In order to solve the technical problem, the utility model discloses a technical scheme be: the suction nozzle automatic replacement device is arranged on a table plate and comprises a suction nozzle library component fixed on the table plate and a suction nozzle head component movably arranged on the table plate, wherein the suction nozzle library component comprises a rotary plate, a plurality of installation positions are arranged on the rotary plate, the installation positions are uniformly distributed around a rotating central shaft of the rotary plate, a suction nozzle is arranged in each installation position, the suction nozzle head component comprises a movable support movably arranged along the Y-axis direction, a suction nozzle head capable of ascending and descending along the Z-axis direction is arranged on the movable support, the suction nozzle head comprises a suction cavity wrapping the end part of the suction nozzle, the suction nozzle head component further comprises a vacuum generator, and the output end of the vacuum generator is communicated with the suction cavity.
Furthermore, one end of the suction nozzle is provided with a suction head matched with the suction cavity.
Furthermore, the side wall of the suction head is provided with a convex positioning pin, and a positioning groove matched with the positioning pin is arranged in the suction cavity.
Further, the suction nozzle head is rotatably arranged relative to the moving bracket.
Furthermore, the installation position is close to the edge of the rotary plate, and one end of the installation position is communicated with the outside.
Furthermore, a convex positioning part is arranged on the side wall of the suction nozzle, a groove matched with the positioning part is arranged on the side wall of the rotary disc, and the mounting positions are respectively communicated with the groove.
Furthermore, electromagnets are respectively arranged in the installation positions and are connected with the suction nozzles in the corresponding installation positions in a magnetic attraction manner.
Furthermore, the suction nozzle warehouse assembly further comprises an installation support fixedly connected with the bedplate, a first driving piece is arranged on the installation support, and the output end of the first driving piece is fixedly connected with the rotation center of the turntable.
Furthermore, the nozzle head assembly further comprises a slide rail, the slide rail is arranged on the bedplate along the Y-axis direction, and the movable support is movably arranged on the slide rail.
Furthermore, the nozzle head assembly further comprises a second driving piece, and the second driving piece drives the movable support to move on the sliding rail along the Y-axis direction.
The beneficial effects of the utility model reside in that: the automatic suction nozzle replacing device provided by the utility model realizes full-automatic replacement of suction nozzles through the matching of the suction nozzle head component and the suction nozzle library component, the suction nozzle library component comprises a rotatable turntable, a plurality of mounting positions are arranged on the turntable so that the turntable can simultaneously accommodate a plurality of suction nozzles, the suction nozzle head component comprises a suction nozzle head, the suction nozzle head picks up or releases the suction nozzle through a suction cavity at the end part of the suction nozzle head, the empty mounting position is moved to the preset position through the rotation of the turntable so that the suction nozzle head puts the suction nozzle currently installed on the suction nozzle head into the empty mounting position, then the turntable continues to rotate to move the suction nozzle to the preset position for picking up the suction nozzle head, the replacement of the suction nozzle can be automatically completed, the manual operation is not needed in the replacement process, the replacement efficiency of the suction nozzle is greatly improved, the labor intensity of operators is reduced, the misoperation of manually replacing the suction nozzle is avoided, and the chip mounter does not need to stop in the replacement process, the time waste caused by the shutdown and the restart of the chip mounter is avoided, and the working efficiency of the chip mounter is improved.
Drawings
Fig. 1 is a schematic structural view of a chip mounter having an automatic suction nozzle replacement device according to a first embodiment of the present invention;
fig. 2 is a plan view of a chip mounter having an automatic nozzle replacement device according to a first embodiment of the present invention;
fig. 3 is a schematic structural view of a work box in a chip mounter having an automatic suction nozzle replacement device according to a first embodiment of the present invention;
fig. 4 is a schematic structural view of a feeding assembly in a chip mounter having an automatic suction nozzle replacement device according to a first embodiment of the present invention;
fig. 5 is a schematic structural view of a dispensing component in a chip mounter with an automatic suction nozzle replacement device according to a first embodiment of the present invention;
fig. 6 is a schematic structural view of a nozzle head assembly in a chip mounter having an automatic nozzle replacement device according to a first embodiment of the present invention;
fig. 7 is a side view of a nozzle head assembly of a chip mounter having an automatic nozzle replacement device according to a first embodiment of the present invention;
fig. 8 is a cross-sectional view of a nozzle head in a chip mounter having an automatic nozzle replacement device according to a first embodiment of the present invention;
fig. 9 is a schematic structural view of a suction nozzle magazine assembly in a chip mounter having an automatic suction nozzle replacement device according to a first embodiment of the present invention;
FIG. 10 is an enlarged view taken at A in FIG. 9;
fig. 11 is a schematic structural view of a calibration component in a chip mounter having an automatic suction nozzle replacement device according to a first embodiment of the present invention;
fig. 12 is a schematic structural view of a feeding assembly in a chip mounter having an automatic suction nozzle replacement device according to a first embodiment of the present invention;
fig. 13 is a schematic structural view of an ejector pin assembly in a chip mounter having a first device for automatically replacing suction nozzles according to the present invention.
Description of reference numerals:
1. a platen; 11. a thimble assembly; 12. a thimble base; 13. ejecting a needle head; 2. a feeding assembly; 21. a magazine; 22. a material pushing assembly; 23. a containing groove; 24. a material pushing plate; 25. a third driving member; 3. a working box; 31. a box body; 32. a cover plate; 33. a top plate; 34. an accommodating cavity; 4. dispensing components; 41. a rubber plate; 42. dispensing an adhesive arm; 43. a scraper; 44. a fourth drive; 5. a material moving component; 51. a first patch assembly; 52. a second patch assembly; 6. a correction component; 61. a correction table; 62. correcting bits; 63. a correction lens barrel; 7. a supply assembly; 71. a turntable; 72. a loading position; 73. a fifth driving member; 8. a suction nozzle head assembly; 81. a suction nozzle head; 82. a patch lens barrel; 83. moving the support; 84. a suction lumen; 85. positioning a groove; 86. a slide rail; 87. a second driving member; 9. a suction nozzle magazine assembly; 91. a suction nozzle; 911. a suction head; 912. positioning pins; 913. a positioning part; 92. a turntable; 93. an installation position; 94. a groove; 95. mounting a bracket; 96. a first driving member.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 13, an automatic suction nozzle replacement device is arranged on a platen 1, and includes a suction nozzle library assembly 9 fixed on the platen 1 and a suction nozzle head assembly 8 movably arranged on the platen 1, where the suction nozzle library assembly 9 includes a turntable 92, the turntable 92 is provided with a plurality of mounting locations 93, the mounting locations 93 are uniformly distributed around a rotation center axis of the turntable 92, each mounting location 93 is provided with a suction nozzle 91, the suction nozzle head assembly 8 includes a movable support 83 movably arranged along a Y-axis direction, the movable support 83 is provided with a suction nozzle head 81 capable of being lifted along a Z-axis direction, the suction nozzle head 81 includes a suction cavity 84 wrapping an end of the suction nozzle 91, the suction nozzle head assembly 8 further includes a vacuum generator, and an output end of the vacuum generator is communicated with the suction cavity 84.
From the above description, the beneficial effects of the present invention are: the utility model provides an automatic change device of suction nozzle can accomplish the change of suction nozzle 91 automatically, changes the in-process and need not manual operation, has improved the change efficiency of suction nozzle 91 greatly, reduces operator's intensity of labour, has avoided the manual work to change the maloperation that suction nozzle 91 probably appears to change the in-process chip mounter and need not to shut down, avoided the chip mounter to shut down and restart the waste time, improve the work efficiency of chip mounter.
Further, one end of the suction nozzle 91 has a suction head 911 engaged with the suction cavity 84.
As is apparent from the above description, the suction head 911 is provided at the end of the suction nozzle 91 to facilitate the nozzle head 81 to pick up the suction nozzle 91 and to stabilize the connection of the nozzle head 81 with the suction nozzle 91.
Further, a protruding positioning pin 912 is arranged on the side wall of the suction head 911, and a positioning groove 85 matched with the positioning pin 912 is arranged in the suction cavity 84.
Further, the nozzle head 81 is rotatably disposed with respect to the moving bracket 83.
As can be seen from the above description, when the nozzle head 81 picks up the suction nozzle 91, the nozzle head 81 rotates to align the positioning groove 85 with the positioning pin 912 and then moves downward to wrap the suction cavity 84 around the suction head 911, so that the direction of the suction nozzle 91 is maintained after the suction nozzle 91 is matched with the suction head 911, and the suction nozzle 91 currently matched with the nozzle head 81 can work normally.
Further, the mounting position 93 is disposed near the edge of the rotating disc 92, and one end of the mounting position 93 is communicated with the outside.
Further, a protruding positioning portion 913 is disposed on a side wall of the suction nozzle 91, a groove 94 matched with the positioning portion 913 is disposed on a side wall of the rotary disc 92, and the mounting positions 93 are respectively communicated with the groove 94.
As can be seen from the above description, the suction nozzle 91 can move into and out of the mounting position 93 by the suction nozzle head 81 driving the suction nozzle 91 to move along the direction perpendicular to the side surface of the turntable 92, and the suction nozzle 91 is fixed in the turntable 92 by the positioning portion 913 on the side wall of the suction nozzle 91 and the groove 94 on the turntable 92.
Furthermore, electromagnets are respectively arranged in the mounting positions 93, and the electromagnets are magnetically connected with the corresponding suction nozzles 91 in the mounting positions 93.
As is apparent from the above description, an electromagnet is provided in the mounting position 93 to stably connect the suction nozzle 91 with the mounting position 93, and the electromagnet releases the suction nozzle 91 when the suction nozzle 91 is taken out of the mounting position 93 by the nozzle head 81.
Further, the nozzle magazine assembly 9 further includes a mounting bracket 95 fixedly connected to the platen 1, a first driving member 96 is disposed on the mounting bracket 95, and an output end of the first driving member 96 is fixedly connected to a rotation center of the turntable 92.
As will be understood from the above description, the nozzle magazine assembly 9 is held on the platen 1 by the fixed connection of the mounting bracket 95 to the platen 1, and the turntable 92 is driven to rotate by the first driving member 96 provided on the mounting bracket 95.
Further, the nozzle head assembly 8 further includes a slide rail 86, the slide rail 86 is disposed on the platen 1 along the Y-axis direction, and the moving bracket 83 is movably disposed on the slide rail 86.
Further, the nozzle head assembly 8 further includes a second driving member 87, and the second driving member 87 drives the moving bracket 83 to move on the slide rail 86 along the Y-axis direction.
As can be seen from the above description, the second driving member 87 drives the moving bracket 83 to slide on the platen 1, so as to drive the nozzle head 81 to move along the Y-axis direction, so as to align the nozzle head 81 with the corresponding suction nozzle 91.
Example one
Referring to fig. 1 to 13, a first embodiment of the present invention is: a chip mounter is used for mounting chips emitting light of various colors or chips emitting light of different wave bands on carriers of semiconductor products such as a semiconductor bracket, a photoetching plate and a PCBA plate so as to obtain the semiconductor products with good display effect.
As shown in fig. 1 and 2, the chip mounter includes a platen 1, the platen 1 is provided with a feeding assembly 2, a work box 3, a dispensing assembly 4, a material transferring assembly 5, a correcting assembly 6, and a material supplying assembly 7, the feeding assembly 2 includes a material box 21 for storing carriers and a material pushing assembly 22 for sending the carriers in the material box 21 into the work box 3, the work box 3 is movably disposed on the platen 1 along an X-axis direction and a Y-axis direction so that a feeding end of the work box 3 is aligned with the material box 21 to enable the carriers to smoothly enter the material box 21, the dispensing assembly 4 includes a glue tray 41 for containing glue and a dispensing arm 42 for dipping the glue from the glue tray 41 and dispensing the glue on the carriers in the material box 21, the material supplying assembly 7 contains a plurality of wafer rings, the material transferring assembly 5 includes a first chip assembly 51 and a second chip assembly 52, the first chip assembly 51 is used to move the chip on the wafer ring in the supply assembly 7 to the calibration assembly 6 for angular and positional calibration, the second chip assembly 52 is used for mounting the chips corrected on the chip assembly onto the carrier in the magazine 21, and the first chip module 51 and the second chip module 52 each comprise a suction nozzle automatic replacing device, the automatic suction nozzle replacing device comprises a suction nozzle head component 8 and a suction nozzle storehouse component 9, a detachable suction nozzle 91 is arranged at the end part of the suction nozzle head component 8, a nozzle library component 9 containing a plurality of nozzles 91 is arranged on the bedplate 1, the nozzle head component 8 can move to the upper part of the nozzle library component 9 to put the nozzles 91 at the end part of the nozzle head 81 back into the nozzle library component 9, and the suction nozzles 91 of other models are taken out from the suction nozzle magazine assembly 9 and mounted on the suction nozzle head 81.
As shown in fig. 3, the work box 3 assembly includes a box body 31, and a cover plate 32 and a top plate 33 which are arranged on the box body 31, the top plate 33 is arranged on the box body 31 in a lifting manner, a plurality of vacuum holes are arranged on the top plate 33, and the box body 31, the cover plate 32 and the top plate 33 enclose an accommodating cavity 34 for accommodating a carrier. After the carrier is sent into the accommodating cavity 34 of the work box 3 by the pushing assembly 22, the top plate 33 rises to clamp the carrier between the cover plate 32 and the top plate 33, and meanwhile, the vacuum holes on the top plate 33 are vacuumized to adsorb the carrier on the top plate 33, so that the carrier is fixed in the work box 3, and the situation that the chip is attached to a wrong position due to unexpected displacement of the carrier in the attaching process is prevented.
Referring to fig. 4, the magazine 21 is arranged on the platen 1 in a lifting manner, a plurality of accommodating grooves 23 are formed in the magazine 21 at intervals in the Z-axis direction, a carrier can be placed in each accommodating groove 23, and the carriers in different accommodating grooves 23 are aligned to the pushing assembly 22 by lifting the magazine 21 in the Z-axis direction. The pushing assembly 22 includes a pushing plate 24 movably disposed along the X-axis direction and a third driving member 25 for driving the pushing plate 24 to move, and the pushing plate 24 is aligned with one of the receiving slots 23. When the material box 21 moves to the material pushing plate 24 aligned with the carrier to be pushed out, the material box 21 remains still and the third driving member 25 drives the material pushing plate 24 to move in the positive direction of the X axis, so that the material pushing plate 24 extends into the accommodating groove 23 and pushes the carrier in the accommodating groove 23 into the work box 3, automatic feeding is realized, and different types of carriers are fed into the work box 3 according to the process rules.
As shown in fig. 5, the dispensing assembly 4 includes the glue tray 41 in a rotating state, the glue tray 41 contains glue, the dispensing assembly 4 further includes a fourth driving member 44 for driving the dispensing arm 42 to move along the Y-axis direction and lift along the Z-axis direction, and the dispensing arm 42 is driven by the fourth driving member 44 to dip glue from the glue tray 41 and move to the upper direction of the work box 3 for dispensing glue on the carrier for bonding the chip to the carrier. Preferably, the dispensing assembly 4 further includes a scraper 43, the scraper 43 is disposed right above the glue tray 41, and the scraper 43 can scrape off the glue exceeding a certain height in the glue tray 41, so as to prevent the glue in the glue tray 41 from overflowing out of the glue tray 41, and prevent the surface of the chip mounter from being contaminated due to the overflow of the glue from the glue tray 41.
Referring to fig. 1, 6, 7 and 8, the nozzle head assembly 8 further includes a slide rail 86 disposed on the platen 1, a movable support 83 movably disposed on the slide rail 86, and a first driving member 96 for driving the movable support 83 to move on the slide rail 86, the slide rail 86 is disposed along the Y-axis direction, the nozzle head 81 is liftable on the movable support 83 along the Z-axis direction and is rotatable with respect to the movable support 83, a suction cavity 84 for wrapping an end of a suction nozzle 91 is disposed on the nozzle head 81, the nozzle head assembly 8 further includes a vacuum generator, the vacuum generator is communicated with the suction cavity 84, and when the suction cavity 84 wraps the suction nozzle 91, the vacuum generator operates to enable the suction nozzle 91 to be adsorbed on the nozzle head 81, and when the nozzle head 81 puts the suction nozzle 91 back to the nozzle library assembly 9, the vacuum generator stops operating to disengage the suction nozzle 91 from the nozzle head 81.
Specifically, a patch lens barrel 82 capable of ascending and descending in the Z-axis direction is arranged on the movable support 83, the patch lens barrel 82 is used for shooting the carrier in the work box 3 so as to determine the position of a chip to be mounted on the carrier or shoot a crystal ring in the feeding assembly 7 so as to determine the position of the chip to be picked up, and then the movable support 83 drives the suction nozzle 81 to move to a corresponding position and mount or absorb the chip through the suction nozzle 91 arranged at the end part of the suction nozzle 81, so that the mounting precision of the chip mounter is improved.
As shown in fig. 9, the suction nozzle 91 library includes a mounting bracket 95 fixedly connected to the platen 1, a turntable 92 rotatably disposed on the mounting bracket 95, and a second driving member 87 for driving the turntable 92 to rotate, the turntable 92 is provided with a plurality of mounting locations 93, each mounting location 93 accommodates one suction nozzle 91, the mounting locations 93 are uniformly disposed around a rotation central axis of the turntable 92, and electromagnets are respectively disposed in the mounting locations 93 for fixing the suction nozzles 91 in the mounting locations 93. When the suction nozzle head 81 puts the suction nozzle 91 back into the mounting position 93, the electromagnet is started and the vacuum generator is closed, and the suction nozzle 91 is retained in the mounting position 93; when the nozzle head 81 takes out the suction nozzle 91 from the mounting position 93, the nozzle head 81 wraps the end of the suction nozzle 91, then the vacuum generator is started and the electromagnet is closed, and at the moment, the nozzle head 81 can move the suction nozzle 91 out of the mounting position 93.
In detail, the end of the suction nozzle 91 is provided with a circular truncated cone-shaped suction head 911, and the shape of the suction head 911 is matched with the shape of the suction cavity 84, so that the suction nozzle 81 is stably matched with the suction nozzle 91, and the situation that the vacuum generator cannot adsorb the suction nozzle 91 on the suction nozzle 81 due to a gap between the suction nozzle 81 and the suction nozzle 91 is prevented. Be equipped with outstanding locating pin 912 on the lateral wall of suction head 911, be equipped with in the suction cavity 84 with locating pin 912 matched with constant head tank 85, the suction nozzle head 81 picks up it makes to rotate certain angle earlier before the suction nozzle 91 the constant head tank 85 is aimed at the locating pin 912, and then ensures the suction nozzle 91 with behind the suction nozzle head 81 cooperation the orientation that the suction nozzle 91 is used for adsorbing the one end of chip is unanimous with the direction of predetermineeing, so that the suction nozzle 91 can normally absorb and paste dress chip, avoids the suction nozzle head 81 picks up during the suction nozzle 91 the suction nozzle 91 skew leads to the chip mounter can't normally operate.
As shown in fig. 10, preferably, the mounting position 93 is disposed near an edge of the rotating disc 92, one end of the mounting position 93 is communicated with the outside, the suction nozzle 91 can move horizontally into and out of the mounting position 93, a protruding positioning portion 913 is further disposed on a side wall of the suction nozzle 91, a concave groove 94 is disposed on a side surface of the rotating disc 92, when the suction nozzle 91 returns to the mounting position 93, the positioning portion 913 extends into the groove 94, so that the suction nozzle 91 is maintained at a certain height in the mounting position 93 for the pickup of the suction nozzle head 81, and the suction nozzle 91 is prevented from falling off from the mounting position 93, so that the suction nozzle 91 is stably maintained in the mounting position 93.
As shown in fig. 11, the correcting assembly 6 includes a correcting table 61, a rotatable correcting position 62 is provided on the correcting table 61, a correcting lens barrel 63 is further provided on the moving support 83 in the first chip assembly 51, after the first chip assembly 51 places the chip on the correcting position 62, the correcting lens barrel 63 takes a picture of the chip on the correcting position 62 and determines whether the position of the chip deviates from a preset position and a deviation angle, the correcting position 62 rotates a corresponding angle according to the determination result to correct the position of the chip, and the second chip assembly 52 picks up the chip with the corrected position from the correcting position 62 and attaches the chip to the carrier, so as to further improve the attaching accuracy of the chip mounter.
Referring to fig. 12, the feeding assembly 7 includes a turntable 71 and a fifth driving member 73 for driving the turntable 71 to rotate, three material loading positions 72 for placing the crystal rings are provided on the turntable 71, the three material loading positions 72 are uniformly arranged around a rotation axis of the turntable 71, the turntable 71 is driven to rotate by the fifth driving member 73, so that the corresponding crystal rings are close to the first chip assembly 51, and the three material loading positions 72 can be used for placing the crystal rings with different chips attached thereon for the first chip assembly 51 to pick up, so as to meet the requirement of mounting various different chips on a single carrier, and further, the chip mounter can produce complex products.
As shown in fig. 13, a thimble assembly 11 is further disposed on the platen 1, the thimble assembly 11 includes a thimble base 12 movable along an X-axis direction and a Y-axis direction, a thimble head 13 capable of ascending and descending along a Z-axis direction is disposed on the thimble base 12, the thimble head 13 is located right below one of the material loading positions 72, and the first chip assembly 51 picks up a chip from above the material loading position 72. When the first chip assembly 51 picks up a chip from the wafer ring, the lens barrel 82 shoots and positions the position of the chip to be picked up, the ejector pin base 12 moves and enables the ejector pin head 13 to move to the position under the chip, the ejector pin head 13 rises and abuts against the chip to enable the chip to be separated from the blue film of the wafer ring, and at the moment, the suction nozzle 91 installed in the first chip assembly 51 picks up the chip from the upper side of the chip, so that the situation that the suction nozzle 91 cannot pick up a target chip due to the fact that the chip is difficult to separate from the blue film of the wafer ring is avoided.
As shown in fig. 1, the working process of the chip mounter provided in this embodiment is as follows: the first chip component 51 and the second chip component 52 respectively replace the adaptive suction nozzle 91 from the suction nozzle library component 9 according to the type of the currently produced semiconductor product, the feeding component 2 pushes the corresponding carrier into the work box 3, the turntable 71 of the feeding component 7 rotates to send the corresponding wafer ring to the designated position, the work box 3 fixes the position of the carrier, the thimble component 11 jacks up the chip to be mounted to separate the chip from the blue film of the wafer ring, the first chip component 51 picks up the chip and moves the chip to the correction component 6 for angle correction, the dispensing component 4 dispenses the chips onto the carrier in the work box 3, the second chip component 52 picks up the corrected chip from the correction component 6 and mounts the chip to the dispensing position on the carrier, so as to realize the connection between the chip and the carrier, and then the chip mounter mounts the chips onto the carrier in sequence according to the process rules, if different types of chips need to be mounted, the first chip mounter component 51 and the second chip mounter component 52 respectively replace the used suction nozzles 91 into the suction nozzle library component 9, and the adaptive suction nozzles 91 are replaced from the suction nozzle library component 9, so as to meet the production requirements of complex products.
To sum up, the automatic suction nozzle replacement device provided by the utility model realizes automatic replacement of suction nozzles through the cooperation between the movable suction nozzle head component and the fixed suction nozzle library component, reduces the probability of chip mounter faults caused by manual misoperation while reducing the labor intensity of operators, and does not need to shut down in the process of replacing the suction nozzles, thereby effectively saving the time wasted in shutdown and restart of the chip mounter and improving the working efficiency of the chip mounter; the suction nozzle head in the automatic suction nozzle replacing device is connected with the suction nozzle head and the suction nozzle through the matching of the suction cavity and the suction head at the end part of the suction nozzle and the action of the vacuum generator, and the suction head is provided with a positioning pin which is matched with a positioning groove in the suction cavity, so that the suction nozzle is connected with the suction nozzle head in the correct direction, and the chip mounter provided with the automatic suction nozzle replacing device can normally run; the suction nozzle storehouse in the automatic suction nozzle replacing device adopts a rotatable stable turntable, the turntable and the suction nozzle are connected or separated through an electromagnet arranged in a mounting position, and the turntable is also provided with a positioning groove matched with a positioning part on the side surface of the suction nozzle, so that the suction nozzle is stably kept at a fixed position of the turntable and is convenient for the pickup of a suction nozzle head.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides an automatic change device of suction nozzle, sets up on the platen, its characterized in that: the suction nozzle assembly comprises a suction nozzle library assembly fixed on a table plate and a suction nozzle head assembly movably arranged on the table plate, wherein the suction nozzle library assembly comprises a rotary plate, a plurality of mounting positions are arranged on the rotary plate, the mounting positions surround a rotating central shaft of the rotary plate, a suction nozzle is respectively arranged in each mounting position, the suction nozzle head assembly comprises a movable support movably arranged along the Y-axis direction, a suction nozzle head capable of ascending and descending along the Z-axis direction is arranged on the movable support, the suction nozzle head comprises a suction cavity wrapping the end part of the suction nozzle, the suction nozzle head assembly further comprises a vacuum generator, and the output end of the vacuum generator is communicated with the suction cavity.
2. The automatic nozzle exchange device according to claim 1, wherein: one end of the suction nozzle is provided with a suction head matched with the suction cavity.
3. The automatic nozzle exchange device according to claim 2, wherein: the side wall of the suction head is provided with a convex positioning pin, and a positioning groove matched with the positioning pin is arranged in the suction cavity.
4. The automatic nozzle exchange device according to claim 3, wherein: the suction nozzle head is rotatably arranged relative to the movable support.
5. The automatic nozzle exchange device according to claim 1, wherein: the installation position is close to the edge of the rotary plate and one end of the installation position is communicated with the outside.
6. The automatic nozzle exchange device according to claim 5, wherein: the side wall of the suction nozzle is provided with a convex positioning part, the side wall of the rotary disc is provided with a groove matched with the positioning part, and the mounting positions are respectively communicated with the groove.
7. The automatic nozzle exchange device according to claim 1, wherein: the installation positions are respectively provided with electromagnets, and the electromagnets are connected with the suction nozzles in the corresponding installation positions in a magnetic attraction manner.
8. The automatic nozzle exchange device according to claim 1, wherein: the suction nozzle warehouse assembly further comprises a mounting support fixedly connected with the bedplate, a first driving piece is arranged on the mounting support, and the output end of the first driving piece is fixedly connected with the rotating center of the rotating disc.
9. The automatic nozzle exchange device according to claim 1, wherein: the suction nozzle head assembly further comprises a sliding rail, the sliding rail is arranged on the bedplate along the Y-axis direction, and the movable support is movably arranged on the sliding rail.
10. The automatic nozzle exchange device according to claim 9, wherein: the nozzle head assembly further comprises a second driving piece, and the second driving piece drives the movable support to move on the sliding rail along the Y-axis direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121353427.1U CN215266212U (en) | 2021-06-17 | 2021-06-17 | Automatic suction nozzle replacing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121353427.1U CN215266212U (en) | 2021-06-17 | 2021-06-17 | Automatic suction nozzle replacing device |
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| Publication Number | Publication Date |
|---|---|
| CN215266212U true CN215266212U (en) | 2021-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121353427.1U Active CN215266212U (en) | 2021-06-17 | 2021-06-17 | Automatic suction nozzle replacing device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115763355A (en) * | 2023-01-10 | 2023-03-07 | 深圳市卓兴半导体科技有限公司 | Automatic suction nozzle replacing device for die bonder |
| CN117080150A (en) * | 2023-09-26 | 2023-11-17 | 广州诺顶智能科技有限公司 | Mounting head structure with replaceable suction nozzle and die bonder |
| CN117373983A (en) * | 2023-10-13 | 2024-01-09 | 广州诺顶智能科技有限公司 | Structure convenient for replacing suction nozzle |
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2021
- 2021-06-17 CN CN202121353427.1U patent/CN215266212U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115763355A (en) * | 2023-01-10 | 2023-03-07 | 深圳市卓兴半导体科技有限公司 | Automatic suction nozzle replacing device for die bonder |
| CN115763355B (en) * | 2023-01-10 | 2023-04-07 | 深圳市卓兴半导体科技有限公司 | Automatic suction nozzle replacing device for die bonder |
| CN117080150A (en) * | 2023-09-26 | 2023-11-17 | 广州诺顶智能科技有限公司 | Mounting head structure with replaceable suction nozzle and die bonder |
| CN117080150B (en) * | 2023-09-26 | 2024-01-23 | 广州诺顶智能科技有限公司 | Mounting head structure with replaceable suction nozzle and die bonder |
| CN117373983A (en) * | 2023-10-13 | 2024-01-09 | 广州诺顶智能科技有限公司 | Structure convenient for replacing suction nozzle |
| CN117373983B (en) * | 2023-10-13 | 2024-03-22 | 广州诺顶智能科技有限公司 | Structure convenient for replacing suction nozzle |
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