CN215187962U - Heat transmission support and electronic component system - Google Patents

Abstract

The utility model discloses an electronic parts, for example be used for the no fan part of 5G system, no fan part has an expansion card and an optical transceiver. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver housing is positioned on the printed circuit board. The transceiver housing receives the optical transceiver. The transceiver housing is in thermal contact with the optical transceiver. The system includes a support having a chassis heat sink support having a planar surface in thermal contact with a contact surface of the chassis heat sink. The cradle has a transceiver mount with a planar surface that is in thermal contact with the optical transceiver and supports the expansion card. A connector support is coupled to the chassis heat sink support and the transceiver support. Heat from the optical transceiver is transferred to the chassis heat sink through the transceiver mount, the connector mount, and the chassis heat sink mount.

Description

Heat transmission support and electronic component system

[ technical field ] A method for producing a semiconductor device

The utility model relates to an optical transceiver system. More particularly, to an expansion card holder that allows heat transfer to a system heat sink to assist in thermally cooling an optical transceiver.

[ background of the invention ]

With the advent of cloud computing applications, decentralized network systems have been widely adopted. The network system comprises a number of connected devices including servers, switches and other components for exchanging data. The plurality of devices are generally connected by wire, but a higher speed optical signal cable has been used due to a demand for speed and an increase in data volume. For example, the transmission speed of recent optical systems (optical systems) has exceeded 10Gdps and reached 100Gbps, thereby addressing the need for increased data volume and speed.

Optical signals are transmitted and received by transceivers (transceivers) that include electronic components necessary to relay the optical signals. The optical transceiver transmits and receives optical signals through an optical connector (optical connector) that overlaps optically active elements of a light emitting element and a light receiving element, which are made of semiconductor materials, respectively. The optical transceiver includes electronic components and an optical receptacle (optical receptacle) for receiving an optical connector. One type of optical transceiver is a plug-in optical transceiver. The optical transceiver is insertable or removable from a transceiver cage and is disposed on a printed circuit board in an optical switch device. An optical connector in the housing engages the transceiver with an electrical plug. The use of optical transceivers results in relatively more power dissipation and, therefore, heating of the electronic and optical devices within the optical transceiver. An efficient heat dissipation mechanism is therefore needed.

In the future, computing systems will require higher data transfer rates for different high speed applications. To achieve higher data transmission rates, such systems employ what are commonly referred to as small form-factor pluggable (SFP) fiber optic transceiver modules. There are many different kinds of such small form factor pluggable transceivers available, such as SFP +, QSFP, SFP28, SFP56, QSFP28, QSFP56 …, etc. Fiber optic transceiver modules require insertion into a housing (cage) on a circuit board within a computing system.

Different kinds of fiber optic transceiver modules have different data rates, e.g., 1G to 400G. The high data rates of fiber optic transceiver modules generally require higher power consumption because their higher data rates require higher energy. Thus, the operation of the optical transceiver requires thermal management or thermal solutions. Thermal management is required to ensure that the temperature is below the operating temperature of the optical transceiver module.

Referring to fig. 1A-1C, according to one example, a known optical transceiver assembly provides inefficient and/or insufficient heat transfer from the optical transceiver to the system heat sink. With known fiber optic transceiver modules, heat is typically conducted from the transceiver module to a housing having a heat sink. Fig. 1A is a perspective view of a prior art optical transceiver assembly 10. the optical transceiver assembly 10 includes a housing 12, a heat sink 14, and a clip 16. Fig. 1B shows an exploded view of a known housing and optical transceiver assembly 10. The housing 12 is used to hold or house (hold) optical components, such as an optical transceiver 18. Heat generated by the optical transceiver 18 is dissipated by the heat sink 14. The housing 12 is generally rectangular with open ends. An open end allows the optical connector to be attached to the optical transceiver. In this example, the housing 12 has a top aperture 20, the top aperture 20 allowing the heat sink 14 to directly contact the optical transceiver 18 for heat transfer. The clip 16 is used to ensure that the heat sink 14 is held to the housing and thus maximize the contact of the heat sink 14 with the optical transceiver 18.

Multiple optical transceivers may be arranged to provide multiple optical ports (optical ports). Fig. 1C shows a prior art computer system having an optical switch such as an exemplary transceiver module 10 arrangement of optical transceivers. In this example, the computer system 30 includes a front panel 32, and the front panel 32 includes a connection hole 34. The printed circuit board 36 supports an optical transceiver cage 38. The holder 38 is configured to hold two housings, such as the housing 12, in a stacked arrangement. Thus, there may be two optical transceivers 18 and 40 in two housings. Since only one housing 12 has a heat sink 14, the heat sink 14 must dissipate heat from both housings. Alternatively, the other optical transceivers 18 and 40 may be arranged in a stacked (from to bottom) manner with another heat sink on the bottom of the printed circuit board 36 for better heat dissipation.

Referring to fig. 2A and 2B, according to another example, known fanless systems also provide inefficient and/or insufficient heat transfer for optical transceivers. Fig. 2A shows an assembly diagram of a prior art optical transceiver within a fanless system such as 5G component 50. This component may include a Radio Unit (RU), a Distributed Unit (DU), or an Active Antenna Unit (AAU). Fig. 2B shows an exploded view of components of an optical transceiver, which are within the fanless component 50 of fig. 2A. Known prior art fanless components 50 include a relatively large chassis heat sink 52 and a transceiver assembly 54. The chassis heat sink 52 is made of a conductive material. The relatively large base 60 has a bottom surface that contacts the transceiver component 54. The top surface of the base 60 includes fins 62, the fins 62 providing increased surface area to dissipate heat.

The transceiver assembly 54 includes a printed circuit board 70, the printed circuit board 70 having a series of four optical transceivers 72, the four optical transceivers 72 being mounted in corresponding housings 74. The bottom of the printed circuit board 70 also suspends a series of four optical transceivers 82, the four optical transceivers 82 fitting within corresponding housings 84. Each housing 74 has a corresponding heat sink 76. The heat spreader 76 is in thermal contact with a Thermal Interface Material (TIM) 78. The thermal interface material 78 conducts heat from the transceiver 72 to the base 60 of the chassis heat sink 52. Thus, in a fanless system, heat is dissipated by conduction from the heat sink 76 on the housing 74 to the system chassis heat sink 52.

In 5G fanless components, such as radio units (AU), Distribution Units (DU), or Active Antenna Units (AAU), 5G operators often desire high performance components that may allow additional expansion cards to be installed in the system. This expansion card may affect the thermal design based on the limited internal space of the components. Because fiber optic transceiver modules have higher data rate requirements, this component requires more heat dissipation, which is critical for fanless systems. Unfortunately, known components do not permit additional expansion cards because heat dissipation requires contact with the system heat sink.

Therefore, there is a need for an assembly that allows for efficient heat transfer from the optical transceiver to the system heat sink. Additionally, and/or alternatively, it may be desirable to use a cradle for the expansion card that also has the capability to transfer heat from the optical transceiver. Additionally, and/or alternatively, when the use of expansion cards is allowed, a cradle with high thermal conductivity is also required to dissipate the surrounding heat.

[ Utility model ] content

One disclosed example is a heat transport rack operable to hold expansion cards in an electronic component system having an optical transceiver and a chassis heat sink. The bracket has a chassis heat sink support having a planar surface in thermal contact with the planar surface of the chassis heat sink. The transceiver holder has a flat surface that is in thermal contact with the optical transceiver and supports the expansion card. The connector mount is coupled to the chassis heat sink mount and the transceiver mount. Heat from the optical transceiver is transferred to the chassis heat sink through the transceiver mount, the connector mount, and the chassis heat sink mount.

Another disclosed example is an electronic component system including a chassis heat sink having a contact surface and a printed circuit board. A transceiver housing is positioned on the printed circuit board. The transceiver housing receives the optical transceiver. The transceiver housing is in thermal contact with the optical transceiver. The expansion card support includes a chassis heat sink support having a planar surface in thermal contact with the contact surface of the chassis heat sink. The cradle includes a transceiver mount having a planar surface in thermal contact with the optical transceiver and supporting the expansion card. The bracket includes a connector mount that couples the chassis heat sink mount and the transceiver mount. Heat from the optical transceiver is transferred to the chassis heat sink through the transceiver mount, the connector mount, and the chassis heat sink mount.

The above summary is not intended to represent each embodiment or every aspect of the present invention. Rather, the foregoing summary merely provides an exemplification of some of the novel aspects and features described herein. The above features and advantages, and other features and advantages of the present invention will be readily apparent from the following description of representative embodiments and modes for carrying out the invention when taken in connection with the accompanying drawings and appended claims.

[ description of the drawings ]

The invention may be better understood by referring to the following description of exemplary embodiments with reference to the accompanying drawings, in which:

FIG. 1A is a perspective view of a prior art optical transceiver assembly;

FIG. 1B is an exploded view of components of the prior art optical transceiver assembly of FIG. 1A;

FIG. 1C is a perspective view of an exemplary prior art optical transceiver arrangement such as the transceiver assembly of FIG. 1A;

fig. 2A shows an assembly diagram of a housing assembly and a transceiver of a housing in a fanless system of the prior art.

FIG. 2B illustrates an exploded view of the components of the prior art optical transceiver assembly of FIG. 2A;

FIG. 3A is a perspective view of a fanless communication component having an optical transceiver, the component including an exemplary expansion card holder;

FIG. 3B is an enlarged-up perspective view of an example rack for use in connecting a thermal cooling system in the example component of FIG. 3A;

FIG. 3C is a perspective view of the exemplary expansion card bracket of FIG. 3B;

FIG. 3D is an exploded perspective view of the components of the thermal cooling system of FIG. 3B;

FIG. 3E is a perspective view of the example expansion card bracket mounted on a circuit board and the housing of the example assembly of FIG. 3A;

FIG. 4A is a front cross-sectional view of the components of the thermal cooling system of FIG. 3B, portions of the thermal cooling system including an expansion card bracket;

FIG. 4B is a front cross-sectional view of a backup component of the thermal cooling system of FIG. 4A;

FIG. 4C is a front cross-sectional view of an additional conductive patch added to the expansion card bracket of FIG. 4A;

FIG. 5A is a front cross-sectional view of another example rack, the example rack being in a fanless communication section;

FIG. 5B is a perspective view of the example bracket of FIG. 5A;

FIG. 6A is a perspective view of a fanless communication component having an optical transceiver with an exemplary expansion card holder having a heat pipe; and

fig. 6B is a perspective view of the example bracket of fig. 6A.

The invention is susceptible to various modifications and alternative forms, and certain representative embodiments have been shown by way of example in the drawings and will be described in detail herein. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.

[ notation ] to show

10 optical transceiver assembly

12: shell

14 heat sink

16: clamp

18,40 optical transceiver

20 top hole

30 computer system

32 front panel

34 connecting hole

36 printed circuit board

38 optical transceiver bracket

50:5G part/No Fan part

52 case radiator

54 transceiver assembly

60: base

62 heat sink

70 printed circuit board

72,82 optical transceiver

74,84 casing

76 heat sink

78 thermal interface material

100 fanless assembly/component/distribution unit

110,510,610,642 casing

112,512,612 printed circuit board

114,514,614 radiator of chassis

120: connector

130,530,630 expansion slot

132,532 adapter plate

140,540,640 optical transceiver

142,542 transceiver case

150,550,650 expansion card support/expansion support

152,552,652 expansion card

154,554,654 radiator support of chassis

156,556,656 transceiver support

158,558,658 connector support

170 base

172 bottom surface

174 top surface

176 vertical radiating fin

180,194 conductive material

190: heat sink

192 conductive material sheet/conductive sheet

310 vertical card panel

312,322 vertical arm

314,324 vertical tabs

450 heat transfer material sheet/conductive sheet/sheet

Fanless communication component/part

516 vertical blade

534 socket

560,562,670,672 layer of conductive material

600 fanless communication component

616 vertical blade

632 vertical adapter plate

634 socket

660 heat pipe

664,666,668 section (1)

[ detailed description ] embodiments

The present invention may be embodied in many different forms and representative embodiments are presented in the drawings and will be described in detail herein. The present invention is an exemplification or illustration of the principles of the invention, and is not intended to limit the broad aspects of the invention to the illustrated embodiments. To the extent that elements and limitations are disclosed in the abstract, summary, and specification, but not explicitly recited in the claims, such elements and limitations are not explicitly recited in the claims, they are intended to be encompassed by the claims, either individually or collectively. For purposes of this detailed description, the singular encompasses the plural and vice versa unless specifically stated otherwise. The words "including" mean "including but not limited to". Moreover, words of approximation such as "about (about)," "almost (almost)," "substantially (substantailly)," "approximately (approximate),", etc., may mean "at," "near," or "near at," or "within 3 to 5 percent," or "within acceptable manufacturing tolerances," or any reasonable combination thereof.

The present invention relates to a card cradle (card cradle) that allows installation of an expansion card and facilitates heat dissipation in thermal management for a fanless assembly. The exemplary cradle may thus be applied to a fanless product such as a Radio Unit (RU), a Distributed Unit (DU), or an Active Antenna Unit (AAU) with a chassis heat sink for heat management. The cooling assembly uses the external card holder to transfer heat from the transceiver module to the external chassis heat sink and dissipate the heat to the ambient environment. Exemplary external card holders may also use high thermal conductivity materials to enhance thermal performance, such as metal plates embedded in heat pipes, aluminum, copper, or graphite, or copper foil, graphite sheets, graphene sheets attached to the surface of the external card holder.

Referring to fig. 3A-3D, the fanless assembly 100 (shown in fig. 3A and 3B) includes an optical transceiver and an exemplary expansion card holder. With particular reference to fig. 3A, an example component 100 is a 5G component (e.g., a Distributed Unit (DU), Radio Unit (RU), or Active Antenna Unit (AAU)) that relies on a fanless system to cool its electronic components. In this example, component 100 is a Distribution Unit (DU) that includes a chassis heat sink 114 and housing 110, housing 110 holding a printed circuit board 112. The distribution unit is part of a 5G communication system, which is characterized by 5G having high speed, low latency, large bandwidth and more connections, allowing more and more data to be processed. In this example, the distribution unit 100 generally includes a motherboard and a PCle card. The PCle card generally includes a smart Network Interface Card (NIC) with time synchronization and an accelerator card for networking. A chassis heat sink 114 is attached to the top of the housing 110 to allow heat generation of the component 100 to be transferred to the surrounding external environment. The printed circuit board 112 supports various electronic components that perform a 5G communication function. Thus, the printed circuit board 112 generally includes a Central Processing Unit (CPU), a Double Data Rate (DDR) memory, physical layer key generation circuits (physical layer key generation circuits), and small form-factor pluggable (SFP) optical components and RJ45 type connectors.

As described below, the housing 110 includes various connectors 120, and the various connectors 120 are used to receive signals from external devices and transmit the signals to components on the circuit board 112. The circuit board 112 includes a series of transceiver housings 142, the transceiver housings 142 holding the optical transceivers. The circuit board 112 also includes an expansion slot 130, the expansion slot 130 for receiving a connector of a vertical patch panel 132. The vertical riser 132 supports expansion cards, as described below.

Referring to fig. 3B, according to the illustrated example, the printed circuit board 112 has an optical transceiver 140, and the optical transceiver 140 is assembled in a transceiver housing 142 and the printed circuit board 112 is attached. In this example, the housing 142 is substantially rectangular. In this example, there are two optical transceivers 140, but any number of optical transceivers may be used. The optical transceiver 140 includes a socket for connecting an optical connector, which is located outside the housing 110. The optical signals carried by the optical connectors are transmitted and received by components of the printed circuit board 112.

The expansion card bracket 150 is attached to the printed circuit board 112. The expansion card bracket 150 allows heat generated by the optical transceiver 140 to be transferred to the chassis heat sink 114. The expansion card holder 150 holds an expansion card 152, and the expansion card 152 has a connector, such as a PCle-type connector, that allows the expansion card 152 to connect to a receptacle on the interposer 132 shown in FIG. 3A. The patch panel 132 allows communication with the expansion card 152 through the expansion slot 130 (FIG. 3A) on the printed circuit board 112.

In this example, the expansion card 152 is a smart Network Interface Controller (NIC) card. Other expansion cards may include accelerator cards for networking, or other PCle-compatible devices. Although only a single expansion card 152 and cradle 150 are shown in fig. 3B, additional expansion cards like expansion card 152 may be disposed in other cradles like cradle 150 between printed circuit board 112 and chassis heat sink 114.

The material of the bracket 150 is a thermally conductive material, such as aluminum, copper, graphite, or the like, to transfer heat from the optical transceiver 140 to the chassis heat sink 114. Cradle 150 may also include positioning features (registration features) that allow cradle 150 to be attached to printed circuit board 112.

Chassis heat sink support 154 has a substantially flat surface to transfer heat to chassis heat sink 114. The chassis heat sink 114 includes a base 170, the base 170 having a bottom surface 172 and a top surface 174. The bottom surface 172 serves as a contact surface for heat spreading with the chassis heat sink support 154. A series of vertical fins 176 extend from the top surface 174. The vertical fins 176 increase the surface area available for dissipating heat from the chassis heatsink 114 to the ambient environment. A layer of conductive material 180 is interposed between bottom surface 172 and chassis heat sink support 154 to facilitate heat transfer.

Fig. 3C is a perspective view of the example bracket 150 of fig. 3B. As shown in detail in fig. 3B-3C, expansion card bracket 150 includes a chassis heat sink bracket 154 and a transceiver bracket 156. Connector bracket 158 connects chassis heat sink bracket 154 with transceiver bracket 156. In this example, the connector bracket 158 is approximately perpendicular to the chassis heat sink bracket 154 and the transceiver bracket 156. The chassis heat sink bracket 154, the transceiver bracket 156, and the connector bracket 158 are, in this example, arranged to cradle the expansion card 152 (FIG. 3B) and hold the expansion card 152 between the transceiver 140 on the printed circuit board 112 and the chassis heat sink 114. Thus, chassis heat sink bracket 154 and transceiver bracket 156 overlap expansion card 152 and each other.

In this example, chassis heat sink bracket 154, transceiver bracket 156, and connector bracket 158 of cradle 150 are fabricated as a single component. In other embodiments, chassis heat sink bracket 154, transceiver bracket 156, and connector bracket 158 of bracket 150 are fabricated as separate components that are locked or otherwise attached to one another.

Fig. 3D is an exploded perspective view of the components of component 100 that allow for heat transfer. As shown in detail in fig. 3D, the housing 142 in this example includes features to retain the heat sink 190. The heat sink 190 contacts the transceiver 140 through a hole on the top of each housing 142. The conductive patch 192 is placed between the optical transceiver 140 and a surface of the heat sink 190 to provide efficient heat transfer. Heat from the transceiver 140 is conducted by the heat sink 190 to the transceiver support 156. In this example, a layer of conductive material 194 is interposed between the heat sink 190 and the transceiver support 156 to promote efficient heat transfer.

Fig. 3E is a partial cross-sectional view of the printed circuit board 112 and transceiver bracket 156 of the example rack 150 (with the chassis heat sink bracket 154 and connector bracket 158 removed) showing the attachment features for the expansion card 152 of fig. 3A-3C. The transceiver support 156 includes an edge that supports the vertical card face plate 310. The panel 310 may hold the expansion card 152 to the bracket 150 via bracket and screw attachment of the expansion card 152 (not shown). The transceiver mount 156 has a vertical arm 312, the vertical arm 312 having a vertical tab 314, the vertical tab 314 being attachable to the chassis via screws. The second vertical arm 322 has a vertical tab 324, and the vertical tab 314 may be attached to the chassis via additional screws.

Fig. 4A is a front cross-sectional view of an example expansion card rack 150, the example expansion card rack 150 providing heat dissipation. Like elements in fig. 4A are labeled with like numerals as corresponding elements in fig. 3A-3D. The heat generation of the transceiver 140 is dissipated by the heat sink 190. The heat sink 190 is placed in the hole, which is at the top of the housing 142. An opposite surface of the heat sink 190 is in contact with the transceiver support 156 through a sheet 194 of conductive material. Heat is conducted through transceiver support 156 to connector support 158 and to chassis heat sink support 154. The heat is then dissipated by the chassis heat sink 114.

The expansion card bracket 150 allows installation of an expansion card 152 to increase the functionality of the assembly 100. The thermally conductive material of the expansion card bracket 150 allows for efficient dissipation of heat by spreading the heat of the transceiver 140 to the heat sink 114. This allows the fanless assembly 100 with the expansion card to operate by dissipating heat from the surrounding of the bracket 150 and the chassis heat sink 114.

For the typical design of an expansion card bracket inserted between the chassis heat sink 114 and the transceiver 140, various modifications are possible to improve thermal efficiency. The heat transfer properties of the expansion card bracket 150 allow additional expansion cards to be used in a fanless system. The expansion card can increase the operation capacity of the system without any additional heat management component.

Fig. 4B is a front cross-sectional view of a variation of some of the heat transport components of the system 100 of fig. 4A. Like elements in fig. 4B are labeled with the same numbers as corresponding elements in fig. 4A. The bracket 150 allows for mounting an expansion card 152 to the component 100. The bracket 150 is interposed between the transceiver 140 and the chassis heat sink 114. However, in contrast to the arrangement shown in fig. 4A, the transceiver 140 shown in fig. 4B does not have a separate heat sink 190. Instead, the example shown in fig. 4B, the transceiver mount 156 includes a protrusion 410, the protrusion 410 mating with the aperture of the housing 142. The protrusions 410 are in contact with the sheet 192 of conductive material. Thus, heat from the transceiver 140 is transferred to the transceiver mount 156 through the sheet 192 of conductive material. The heat is then conducted by the transceiver mounts 156 through the connector mounts 158 to the chassis heat sink mounts 154 to the chassis heat sink 114.

Although the lack of a heat sink on the transceiver 140 in fig. 4B is less thermally efficient than the arrangement of fig. 4A, the arrangement of fig. 4B is useful for optical transceiver applications with relatively low speeds because the low speed optical transceiver requires less cooling. The arrangement in fig. 4B also requires fewer components than the arrangement in fig. 4A.

The carrier 150 may optionally be provided with a layer of conductive material. The layers of conductive material include, for example, copper foil, graphite sheet, and graphene sheet on the exterior surfaces of chassis heat spreader support 154, transceiver support 156, and connector support 158 to facilitate heat transfer. Fig. 4C shows cradle 150 employing a single sheet of heat transfer material 450, which sheet or sheet 450 may be attached to chassis heat sink support 154, transceiver support 156, and connector support 158. Like elements in fig. 4C are labeled with like numbers as corresponding elements in fig. 4A. The thermally conductive sheet 450 may have an adhesive to which a release protective layer is previously applied. Alternatively, the adhesive may be applied to the bracket 150, and then may be applied to the conductive sheet 450. Thus, conductive patch 450 is attached to chassis heat sink bracket 154, transceiver bracket 156, and connector bracket 158 by adhesive. Alternatively, a single sheet 450 may be applied to the chassis heat sink bracket 154, the transceiver bracket 156, and the connector bracket 158 for different panels.

Referring to fig. 5A and 5B, another exemplary embodiment of an expansion card bracket is described. FIG. 5A illustrates a front cross-sectional view of another example fanless communication component 500, the example fanless communication component 500 allowing for the deployment of an expansion card holder 550. According to another example, the fanless communication component 500 allows for the configuration of an expansion card holder 550. Component 500 includes a housing 510 that holds a printed circuit board 512 and a chassis heat sink 514. A chassis heat sink 514 is attached to the top of the housing 510 to allow heat from the component 500 to be transferred to the surrounding external environment. The chassis heat sink 514 includes vertical fins 516 to assist in dissipating heat. The circuit board 512 also includes an expansion slot 530. In this example, the vertical patch panel 532 has an edge connector that is inserted into the slot 530. The vertical patch panel 532 has a receptacle 534, and the receptacle 534 supports an expansion card, as described below.

In this example, the printed circuit board 512 has an optical transceiver 540, the optical transceiver 540 being mounted in a housing 542 attached to the printed circuit board 512. In this example, there are four optical transceivers 540, but any number may be used. The optical transceiver 540 includes a socket outside the housing 510 for connecting an optical connector. The optical connectors are used to transmit and receive optical signals carried by the components of the printed circuit board 512.

With particular reference to FIG. 5B, an exemplary expansion card bracket 550 is attached to hold expansion card 552 between printed circuit board 512 and chassis heat sink 514. Bracket 550 includes a chassis heat sink support 554 and a transceiver support 556. Connector bracket 558 connects chassis heat sink bracket 554 and transceiver bracket 556. In this example, connector mount 558 is oriented approximately perpendicular to chassis heat sink mount 554 and transceiver mount 556. The transceiver holder 556 overlaps the expansion card 552, and is interposed between the expansion card 552 and the housing 542 of the transceiver 540 in fig. 5A. Chassis heat sink support 554 extends from connector support 558 in a direction opposite to the direction of transceiver support 556.

Referring back to fig. 5A, in this example, chassis heat sink support 554, transceiver support 556, and connector support 558 are arranged to position expansion card 552 between transceiver 540 and chassis heat sink 514. Heat generation from the transceiver 540 is dissipated by the conductive material layer 560, the conductive material layer 560 contacting the transceiver 540 and the transceiver support 556 to allow efficient heat transfer. Heat is conducted through the transceiver support 556 to the connector support 558 and to the chassis heat sink support 554. Chassis heat sink support 554 has a flat surface that is in thermal contact with the bottom surface of chassis heat sink 514. A layer of conductive material 562 is positioned between heat sink support 554 and chassis heat sink 514 to facilitate heat transfer. The heat is then dissipated by the chassis heat sink 514 to the ambient. A separate heat sink is added to each housing 542 for additional heat transfer. The individual heat sinks would sit in holes in the housing and contact the transceivers.

The expansion card bracket 550 allows installation of an expansion card 552 to add functionality to the component 500. The thermally conductive material of expansion card 550 allows for efficient dissipation of heat by spreading the heat from transceiver 540 to chassis heat sink 514. This allows fan-less component operation with additional expansion cards by dissipating heat from the surroundings of the bracket 550 and chassis heat sink 514.

Referring to fig. 6A and 6B, the fanless communication component includes an alternative expansion bracket that is different from the expansion bracket 150 shown in fig. 3C and further enhances heat conduction. Referring specifically to FIG. 6A, an alternative embodiment includes a fanless communication component 600, where the fanless communication component 600 allows for the deployment of an expansion card cradle 650 that enhances heat transfer. The assembly 600 includes a housing 610 that holds a printed circuit board 612 and a chassis heat sink 614. A chassis heat sink 614 is attached to the top of the housing 610 to allow heat from the component 600 to be transferred to the surrounding external environment. The chassis heat sink 614 includes vertical fins 616 to assist in heat dissipation. The circuit board 612 also includes an expansion slot 630. In this example, the vertical interposer 632 has an edge connector that is inserted into the expansion slot 630. The vertical riser 632 has a receptacle 634 that supports an expansion card, as described below.

In this example, the printed circuit board 612 has an optical transceiver 640, the optical transceiver 640 being mounted in a housing 642 and attached to the printed circuit board 612. Although this example depicts four optical transceivers 640, it should be understood that any number of optical transceivers may be used. The optical transceiver 640 includes a receptacle located outside the housing 610 for connecting an optical connector for transmitting and receiving optical signals carried by components of the printed circuit board 612.

The expansion card bracket 650 is attached to hold the expansion card 652 between the printed circuit board 612 and the chassis heat sink 614. Referring specifically to fig. 6B, cradle 650 includes chassis heat sink support 654 and transceiver support 656. The connector mount 658 connects the heat sink mount 654 and the transceiver mount 656. In this example, the connector mount 658 is oriented approximately perpendicular to the heat sink mount 654 and the transceiver mount 656.

The support 650 includes a heat pipe 660 to facilitate heat transfer through the support 650. In this example, the heat pipe 660 includes an interior region that holds a liquid. The liquid moves the heat absorbed by the heat pipe 660 through the interior of the heat pipe 660 in an efficient manner. In this example, heat pipe 660 has three sections 664,666, and 668 fluidly connected.

Referring back to fig. 6A, in this example, chassis heat sink standoffs 654, transceiver standoffs 656, and connector standoffs 658 are arranged to position the expansion card 652 between the optical transceiver 640 and the chassis heat sink 614. Heat generation from the transceiver 640 is dissipated by the layer of conductive material 670, the layer of conductive material 670 contacting the transceiver 640 and the transceiver stand 656 to allow for efficient heat transfer. As described above, additional heat transfer may be achieved by providing a heat sink for each transceiver 640. Heat is conducted through transceiver stand-offs 656 (shown in fig. 6B) to connector stand-offs 658 and then to chassis heat sink stand-offs 654. Chassis heat sink support 654 has a flat surface that is in thermal contact with the bottom surface of chassis heat sink 614. A layer of conductive material 672 is located between the engine case support 654 and the case radiator 614 to facilitate heat transfer.

A section 666 of heat pipe 660 is embedded along the length of transceiver stand 656 of rack 600 and absorbs heat from transceiver 640. The liquid in section 666 is heated. Segments 668 are curved and arch up the connector bracket 658. The fluid in the bend section 668 receives heat from the liquid in the section 666. Final section 664 is embedded along the length of heat sink support 654, and the liquid in the section conveys heat to heat sink 614. The heat may then be dissipated by the chassis heat sink 614 to the ambient environment. In this example, although one heat pipe is embedded in the cradle 650, multiple heat pipes may be disposed along the length of the cradle 650 to promote increased heat transfer.

The terms "component," "module," "system" or the like as used herein generally refer to a computer-related entity, either hardware (e.g., circuitry), a combination of hardware and software, or an entity associated with a machine that performs one or more particular functions. For example, a component may be, but is not limited to being, a program running on a processor (e.g., a digital signal processor), a processor, an object, an executable, a thread of execution, a program, and/or a computer. By way of illustration, both an application running on a controller and the controller can be a component. One or more components may reside within a program and/or thread of execution and a component may be localized on one computer and/or distributed between two or more computers. In addition, the "device" may take the form of specially designed hardware; general hardware specially made by software executed thereon so that the hardware can perform a specific function; software stored on a computer readable medium; or a combination thereof.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. In addition, in the detailed description and/or claims, the terms "including," having, "" with, "or any other variation thereof, are intended to be inclusive in a manner similar to the term" comprising.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

While various embodiments of the present invention have been described in the foregoing, it should be understood that they have been presented by way of example only, and not limitation. Although the invention has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application. Thus, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. Rather, the scope of the present invention should be defined in accordance with the appended claims and their equivalents.

Claims (10)

1. A heat transport rack operable to hold an expansion card in an electronic component system having an optical transceiver and a chassis heat sink, the rack comprising:

a chassis heat sink support having a planar surface in thermal contact with a planar surface of the chassis heat sink;

a transceiver holder having a flat surface, thermally contacting the optical transceiver, and supporting the expansion card;

a connector mount coupled to the chassis heat sink mount and the transceiver mount, wherein heat from the optical transceiver is transferred to the chassis heat sink through the transceiver mount, the connector mount, and the chassis heat sink mount.

2. The bracket of claim 1, wherein the chassis heat sink mount and the transceiver mount are oriented substantially parallel to each other.

3. The cradle of claim 1, wherein the chassis heat sink stand and the transceiver stand overlap each other and the expansion card.

4. The cradle of claim 1, further comprising a heat pipe positioned within the chassis heat sink support, the transceiver support, and the connector support.

5. The stent of claim 1, wherein the stent is made of one of aluminum, graphite, or copper.

6. The stent of claim 1 further comprising a conductive sheet, the conductive sheet being copper foil, graphite sheet, graphene sheet on the outer surface of the stent.

7. An electronic component system, comprising:

a chassis radiator having a contact surface;

a printed circuit board;

a transceiver housing on the printed circuit board, the transceiver housing receiving an optical transceiver, the transceiver housing in thermal contact with the optical transceiver; and

an expansion card holder comprising:

a chassis heat sink support having a planar surface in thermal contact with the contact surface of the chassis heat sink;

a transceiver holder having a flat surface, thermally contacting the optical transceiver, and supporting an expansion card; and

a connector mount coupled to the chassis heat sink mount and the transceiver mount, wherein heat from the optical transceiver is transferred to the chassis heat sink through the transceiver mount, the connector mount, and the chassis heat sink mount.

8. The electronic component system of claim 7, further comprising a conductive strip between the contact surface of the chassis heat sink and the expansion card bracket.

9. The electronic component system of claim 7, wherein the expansion card support comprises a heat pipe.

10. The electronic component system of claim 7, wherein the printed circuit board includes components for performing 5G network operations.

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