CN211478771U - Heat abstractor and head-mounted display device - Google Patents

Abstract

The utility model provides a heat abstractor and head-mounted display device can realize the effective heat dissipation of the device that generates heat on its mainboard. The heat dissipation device comprises a shell, a mainboard, a support and a heat dissipation structure, wherein the heat dissipation structure comprises a third conductor, a power supply, an N-type semiconductor, a P-type semiconductor, a first conductor and a second conductor, the power supply, the N-type semiconductor, the P-type semiconductor, the first conductor and the second conductor are arranged in the shell, the first conductor is connected with the positive electrode of the power supply, the second conductor is connected with the negative electrode of the power supply, and the first conductor, the N-type semiconductor, the third conductor, the P-type semiconductor and; the first conductor and the second conductor are both in heat conduction connection with the heating device through the first insulating heat conductor, and the third conductor is far away from the heating device than the first conductor and the second conductor so as to dissipate heat of the heating device when the conductive loop is electrified. The utility model discloses heat abstractor and head-mounted display device, its heat radiation structure is based on the peltier effect, and the heat dissipation reliability is high, and is effectual, noiselessness and do not receive ambient temperature to influence.

Description

Heat abstractor and head-mounted display device

Technical Field

The utility model belongs to the technical field of electronic equipment, concretely relates to heat abstractor and head-mounted display device, especially its heat radiation structure's improvement.

Background

With the continuous development of the virtual reality technology, in order to improve the experience of the terminal user, the processing capacity of some key modules of the mainboard of the head-mounted display device is stronger and stronger, the heat productivity is larger and larger, and therefore the heat dissipation problem becomes a very important link.

At present, VR glasses heat dissipation scheme has two kinds of forms of initiative heat dissipation and passive heat dissipation on the market usually, uses mostly to adopt fin and graphite fin etc. to carry out passive heat dissipation, and the passive form heat dissipation principle is in the heat soaking of heat source to other objects for example in the inside air of casing or product, forms the heat exchange and takes away the heat, and initiative heat dissipation does not have or installs equipment such as fan additional to increase gas flow speed and then takes away the heat.

Because the passive heat dissipation takes away heat in a heat exchange mode with the external environment, the passive heat dissipation is greatly influenced by the external temperature and has poor heat dissipation effect; the active heat dissipation needs to be additionally provided with devices such as a fan, the operation noise can be caused when the fan operates, and heat can be generated when the fan operates, so that the heat dissipation effect is influenced.

SUMMERY OF THE UTILITY MODEL

For solving the above-mentioned problem that prior art exists, the utility model provides a heat abstractor and head-mounted display device can realize the effective heat dissipation of the device that generates heat on its mainboard.

In order to solve the technical problem, the utility model adopts the following technical scheme to realize: a heat dissipation device comprises a shell, a main board, a support and a heat dissipation structure which is fixedly arranged on the support and used for dissipating heat of a heating device on the main board, wherein the main board and the support are fixedly arranged in the shell; the method is characterized in that: the heat dissipation structure comprises a third conductor, and a power supply, an N-type semiconductor, a P-type semiconductor, a first conductor and a second conductor which are arranged in the shell; the first conductor is connected with the positive pole of the power supply, the second conductor is connected with the negative pole of the power supply, and the first conductor, the N-type semiconductor, the third conductor, the P-type semiconductor and the second conductor are sequentially in conductive connection to form a conductive loop with the power supply; the first conductor and the second conductor are both in heat conduction connection with the heating device through a first insulating heat conductor, and the third conductor is far away from the heating device than the first conductor and the second conductor so as to dissipate heat of the heating device when the conductive loop is electrified.

The shell is provided with an opening for exposing the third conductor.

And a second insulating heat conductor covering the opening is fixedly arranged on the shell, and the second insulating heat conductor is in contact with the third conductor.

The main board and the support are located at the top of the shell, the main board is arranged on the support, the power supply is located on one side of the main board, the first conductor and the second conductor are located on the same horizontal plane, the third conductor is located above the first conductor and the second conductor, the N-type semiconductor is clamped between the first conductor and the third conductor, the P-type semiconductor is clamped between the second conductor and the third conductor, the first conductor is clamped between the N-type semiconductor and the first insulating heat conductor, and the second conductor is clamped between the P-type semiconductor and the first insulating heat conductor.

The first conductor and the N-type semiconductor are bonded through conductive adhesive, the N-type semiconductor and the third conductor are bonded through conductive adhesive, the third conductor and the P-type semiconductor are bonded through conductive adhesive, and the P-type semiconductor and the second conductor are bonded through conductive adhesive; the first conductor and the second conductor are both bonded with the first insulating heat conductor through double-sided adhesive tapes, and the second insulating heat conductor is bonded with the third conductor through double-sided adhesive tapes.

The third conductor is positioned in the shell and is attached to the inner wall of the shell.

And a third insulating heat conductor is clamped between the third conductor and the shell.

The mainboard and the support are located at the top of the shell, the mainboard is located on the support, the power supply is located on one side of the mainboard, and the N-type semiconductor, the P-type semiconductor, the first conductor, the second conductor and the third conductor are located above the mainboard.

The power supply and the mainboard are horizontally arranged, the first conductor and the second conductor are positioned on the same horizontal plane, the third conductor is positioned above the first conductor and the second conductor, the N-type semiconductor is positioned between the first conductor and the third conductor, and the P-type semiconductor is positioned between the second conductor and the third conductor.

A head-mounted display device comprises the heat dissipation device.

Compared with the prior art, the utility model discloses heat abstractor and head-mounted display device, its heat radiation structure that carries out the heat dissipation to the heating device on the mainboard include power, N type semiconductor, P type semiconductor, first electric conductor, second electric conductor and third electric conductor, the positive pole of first electric conductor connection power, the negative pole of second electric conductor connection power, first electric conductor, N type semiconductor, third electric conductor, P type semiconductor and second electric conductor are electrically conductively connected in proper order and constitute conductive loop with the power; according to the Peltier effect, a pair of thermocouples are formed by an N-type semiconductor and a P-type semiconductor, when direct current is introduced into the thermocouples from a power supply, heat absorption and heat release phenomena are generated at junctions of the thermocouples due to different introduction directions of the direct current, a cold end (a first conductor and a second conductor) is in heat conduction connection with a heating device on a mainboard of the head-mounted display device, and a hot end (a third conductor) is far away from the heating device and can conduct heat of the heating device out, so that the heating device is cooled; the heat dissipation mode can realize heat dissipation as long as the thermocouple is introduced with direct current, has high heat dissipation reliability and good effect, is noiseless and is not influenced by external temperature; in addition, the power supply for heat dissipation can use the power supply of the head-mounted display device, and the additional arrangement is not needed, so that the space occupied by the heat dissipation structure is reduced as much as possible, and the cost of the heat dissipation structure is reduced.

Drawings

Fig. 1 is a schematic view of a partial structure of the heat dissipation device of the present invention;

FIG. 2 is an exploded view of FIG. 1;

fig. 3 is a schematic view of a heat dissipation structure of the heat dissipation device of the present invention;

FIG. 4 is an enlarged view of portion A of FIG. 3;

FIG. 5 is a front view of FIG. 1;

FIG. 6 is a sectional view taken along line A-A of FIG. 5;

FIG. 7 is an enlarged view of portion A of FIG. 6;

FIG. 8 is a left side view of FIG. 1;

FIG. 9 is a sectional view taken along line A-A of FIG. 8;

FIG. 10 is an enlarged view of portion A of FIG. 9;

fig. 11 is a heat dissipation schematic diagram of the heat dissipation structure of the present invention.

Detailed Description

The technical solution of the present invention will be described in further detail with reference to the accompanying drawings and the detailed description.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Referring to fig. 1 to 10, a head-mounted display device according to an embodiment includes a display main body and a head-mounted assembly, where a heat dissipation device is mounted on the display main body. The heat dissipation device includes a housing 10 (usually an insulating injection molding member), a motherboard 20, a support 30, and a heat dissipation structure 40 fixed on the support 30 for dissipating heat of a heat generating device 21 (mainly a CPU) on the motherboard 20, wherein the motherboard 20 and the support 30 are fixed in the housing 10.

The heat dissipation structure 40 specifically includes a power supply 41, an N-type semiconductor 42, a P-type semiconductor 43, a first conductor 44, a second conductor 45, and a third conductor 46, wherein the power supply 41, the N-type semiconductor 42, the P-type semiconductor 43, the first conductor 44, and the second conductor 45 are located in the housing 10; the first conductor 44 is connected with the positive pole of the power supply 41 through a lead 47, the second conductor 45 is connected with the negative pole of the power supply 41 through a lead 48, and the first conductor 44, the N-type semiconductor 42, the third conductor 46, the P-type semiconductor 43 and the second conductor 45 are sequentially and electrically connected, so that the power supply 41, the first conductor 44, the N-type semiconductor 42, the third conductor 46, the P-type semiconductor 43 and the second conductor 45 form a conductive loop; the first conductor 44 and the second conductor 45 are connected with the heat generating device 21 through the first insulating heat conductor 49, specifically, in this embodiment, the first insulating heat conductor 49 is in contact with the heat generating device 21, and the first insulating heat conductor 49 is in contact with the first conductor 44 and the second conductor 45 to realize heat conducting contact connection; the third conductor 46 is far away from the heating device 21 than the first conductor 44 and the second conductor 45, i.e. not in contact with the heating device 21 and spaced far apart from the heating device 21, so that when the conductive loop is energized, heat generated by the heating device 21 is continuously transferred to the third conductor 46, and heat generated by the heating device 21 can be dissipated, thereby achieving the effect of dissipating heat from the heating device 21.

Specifically, in the head-mounted display device of this embodiment, the heat dissipation structure 40 is based on the peltier effect, that is, the heat dissipation structure is composed of two different conductors, i.e., the N-type semiconductor 42 and the P-type semiconductor 43, to form a pair of thermocouples, when the thermocouples are powered by a power supply with a direct current, an energy transfer phenomenon occurs, one of the joints releases heat to become hot and form a hot end, and the other joint absorbs heat to become cold and form a cold end, the heat dissipation principle refers to fig. 11, and the heat transfer direction is as shown by an arrow in fig. 11. The cold end (the first conductor 44 and the second conductor 45) is connected with the heating device 21 on the main board 20 of the head-mounted display device in a heat conducting manner, and the hot end (the third conductor 46) is far away from the heating device 21, so that the heat of the heating device 21 can be conducted out, and the heating device 21 is cooled; the heat dissipation mode can realize heat dissipation as long as the thermocouple is introduced with direct current, has high heat dissipation reliability and good effect, is noiseless and is not influenced by external temperature; in addition, the power supply 41 for heat dissipation may use the power supply of the head-mounted display device itself, and does not need to be additionally provided, thereby reducing the space occupied by the heat dissipation structure as much as possible and being beneficial to reducing the cost of the heat dissipation structure.

Further, as shown in fig. 1 to 10, in order to rapidly release the heat of the third heat conductor 46 as the heat release point to the outside of the housing 10, so as to improve the heat dissipation effect and efficiency, in this embodiment, an opening 11 for exposing the third electric conductor 46 is disposed on the housing 10, so as to accelerate the heat exchange between the third electric conductor 46 and the ambient air outside the housing 10, and improve the heat dissipation effect and the heat dissipation efficiency. Since the third conductive body 46 is both heat conductive and electrical conductive, the opening 11 may be insulated to ensure safety, for example, the opening 11 may be made as a grid or be formed by a plurality of closely spaced small holes to prevent a user from touching the third conductive body 46.

Preferably, the second insulating heat conductor 50 covering the opening 11 is fixed on the housing 10, and the second insulating heat conductor 50 is in contact with the third conductor 46. By providing the opening 11 and the second insulating heat conductor 50, the second insulating heat conductor 50 conducts heat, and contacts with the third electric conductor 46, so that heat of the third electric conductor 46 can be quickly transferred to the outside of the housing 10, and heat can be quickly dissipated; and the second insulating heat conductor 50 is insulating and covers the opening 11, so as to completely avoid the exposure of the third electric conductor 46, and ensure the use safety to the maximum extent, specifically, the second insulating heat conductor can be a ceramic sheet or a glass sheet and is adhered to the shell 10 through an insulating glue.

Since the front and rear viewing directions of the head-mounted display device cannot be blocked, the main board 20, the bracket 30, and the heat dissipation structure 40 are difficult to be disposed at the middle portion or even the bottom portion of the device, and an overhead structure is generally adopted, that is, as shown in fig. 3 and 4, the main board 20 and the bracket 30 are located at the top portion of the housing 10, the bracket 30 is an insulating member and can be fastened to the inner wall of the housing 10 by screws, the main board 20 is specifically disposed on the bracket 30, the power source 41 is located at one side of the main board 20, the first conductor 44 and the second conductor 45 are located at the same horizontal plane, the third conductor 46 is located above the first conductor 44 and the second conductor 45, the N-type semiconductor 42 is sandwiched between the first conductor 44 and the third conductor 46, the P-type semiconductor 43 is sandwiched between the second conductor 45 and the third conductor 46, the first conductor 44 is sandwiched between the N-type semiconductor 42 and the first insulator 49, the second conductor 45 is sandwiched between the P-type semiconductor 43 and the first insulating heat conductor 49. Specifically, in the present embodiment, the first conductor 44, the second conductor 45, and the third conductor 46 are all copper sheets, the first conductor 44 and the second conductor 45 are rectangular copper sheets with a smaller size, the third conductor 46 is a rectangular copper sheet with a larger size, and the N-type semiconductor 42 and the P-type semiconductor 43 are located at two ends of the third conductor 46. The heat dissipation structure 40 is arranged in a manner of being clamped up and down, so that the occupied space is favorably reduced, and the heat dissipation structure can be fixed without arranging other fixing structures through tight clamping among all the parts, so that the equipment structure is favorably simplified.

In order to further improve the stability of the heat dissipation structure 40, the first conductor 44 is bonded to the N-type semiconductor 42 through conductive adhesive, the N-type semiconductor 42 is bonded to the third conductor 46 through conductive adhesive, the third conductor 46 is bonded to the P-type semiconductor 43 through conductive adhesive, and the P-type semiconductor 43 is bonded to the second conductor 45 through conductive adhesive, so that the components are further bonded into a whole on the basis of mutual clamping, the overall stability of the heat dissipation structure 40 is improved, and the overall reliability of the head-mounted display device is further ensured.

Similarly, the first conductor 44 and the second conductor 45 are both bonded to the first insulating heat conductor 49 by double-sided adhesive tape, and the second insulating heat conductor 50 is bonded to the third conductor 46 by double-sided adhesive tape.

As another modification of this embodiment, the third conductive body 46 may also be located inside the casing 10 and attached to the inner wall of the casing 10, so that the heat of the third conductive body 46 as a heat release point is transferred to the casing 10 through heat conduction, and then is dissipated from the casing 10 to the outside of the casing 10. At this time, in order to improve the heat dissipation efficiency, a third insulating heat conductor is interposed between the third conductor 46 and the housing 10, and the function of the third insulating heat conductor is similar to that of the second insulating heat conductor 50 in the above embodiment, that is, the heat conduction is accelerated, so that the heat dissipation efficiency is improved.

As in the previous embodiment, the motherboard 20 and the bracket 30 are located at the top of the housing 10 and the motherboard 20 is located on the bracket 30, the power supply 41 is located at one side of the motherboard 20, and the N-type semiconductor 42, the P-type semiconductor 43, the first conductor 44, the second conductor 45, and the third conductor 46 are located above the motherboard 20. The first conductor 44 and the N-type semiconductor 42 are bonded by a conductive adhesive, the N-type semiconductor 42 and the third conductor 46 are bonded by a conductive adhesive, the third conductor 46 and the P-type semiconductor 43 are bonded by a conductive adhesive, and the P-type semiconductor 43 and the second conductor 45 are bonded by a conductive adhesive.

Meanwhile, the power supply 41 and the motherboard 20 are horizontally disposed, the first conductor 44 and the second conductor 45 are located on the same horizontal plane, the third conductor 46 is located above the first conductor 44 and the second conductor 45, the N-type semiconductor 42 is located between the first conductor 44 and the third conductor 46, and the P-type semiconductor 43 is located between the second conductor 45 and the third conductor 46.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or that equivalents may be substituted for elements thereof; such modifications and substitutions do not depart from the spirit and scope of the present invention, which is claimed.

Claims (10)

1. A heat dissipation device comprises a shell, a main board, a support and a heat dissipation structure which is fixedly arranged on the support and used for dissipating heat of a heating device on the main board, wherein the main board and the support are fixedly arranged in the shell; the method is characterized in that: the heat dissipation structure comprises a third conductor, and a power supply, an N-type semiconductor, a P-type semiconductor, a first conductor and a second conductor which are arranged in the shell; the first conductor is connected with the positive pole of the power supply, the second conductor is connected with the negative pole of the power supply, and the first conductor, the N-type semiconductor, the third conductor, the P-type semiconductor and the second conductor are sequentially in conductive connection to form a conductive loop with the power supply; the first conductor and the second conductor are both in heat conduction connection with the heating device through a first insulating heat conductor, and the third conductor is far away from the heating device than the first conductor and the second conductor so as to dissipate heat of the heating device when the conductive loop is electrified.

2. The heat dissipating device of claim 1, wherein: the shell is provided with an opening for exposing the third conductor.

3. The heat dissipating device of claim 2, wherein: and a second insulating heat conductor covering the opening is fixedly arranged on the shell, and the second insulating heat conductor is in contact with the third conductor.

4. The heat dissipating device of claim 3, wherein: the main board and the support are located at the top of the shell, the main board is arranged on the support, the power supply is located on one side of the main board, the first conductor and the second conductor are located on the same horizontal plane, the third conductor is located above the first conductor and the second conductor, the N-type semiconductor is clamped between the first conductor and the third conductor, the P-type semiconductor is clamped between the second conductor and the third conductor, the first conductor is clamped between the N-type semiconductor and the first insulating heat conductor, and the second conductor is clamped between the P-type semiconductor and the first insulating heat conductor.

5. The heat dissipating device of claim 4, wherein: the first conductor and the N-type semiconductor are bonded through conductive adhesive, the N-type semiconductor and the third conductor are bonded through conductive adhesive, the third conductor and the P-type semiconductor are bonded through conductive adhesive, and the P-type semiconductor and the second conductor are bonded through conductive adhesive; the first conductor and the second conductor are both bonded with the first insulating heat conductor through double-sided adhesive tapes, and the second insulating heat conductor is bonded with the third conductor through double-sided adhesive tapes.

6. The heat dissipating device of claim 1, wherein: the third conductor is positioned in the shell and is attached to the inner wall of the shell.

7. The heat dissipating device of claim 6, wherein: and a third insulating heat conductor is clamped between the third conductor and the shell.

8. The heat dissipating device of claim 6, wherein: the mainboard and the support are located at the top of the shell, the mainboard is located on the support, the power supply is located on one side of the mainboard, and the N-type semiconductor, the P-type semiconductor, the first conductor, the second conductor and the third conductor are located above the mainboard.

9. The heat dissipating device of claim 6, wherein: the power supply and the mainboard are horizontally arranged, the first conductor and the second conductor are positioned on the same horizontal plane, the third conductor is positioned above the first conductor and the second conductor, the N-type semiconductor is positioned between the first conductor and the third conductor, and the P-type semiconductor is positioned between the second conductor and the third conductor.

10. A head-mounted display device, characterized in that: comprising a heat sink according to any of claims 1-9.

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