CN203880649U - Light source module - Google Patents
Light source module Download PDFInfo
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- CN203880649U CN203880649U CN201420310671.3U CN201420310671U CN203880649U CN 203880649 U CN203880649 U CN 203880649U CN 201420310671 U CN201420310671 U CN 201420310671U CN 203880649 U CN203880649 U CN 203880649U
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- light
- light source
- circuit board
- conductive layer
- emitting component
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- 239000010410 layer Substances 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 70
- 239000011241 protective layer Substances 0.000 claims abstract description 56
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims description 42
- 239000011248 coating agent Substances 0.000 claims description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 10
- 238000003466 welding Methods 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A light source module comprises a circuit board and a light emitting element. The circuit board comprises a base material, a conductive layer and a protective layer, wherein the conductive layer and the protective layer are arranged on the surface of the base material in order, the protective layer comprises a first part, a second part and a hollow-out region, and a part of the conductive layer is exposed to the hollow-out region. The light emitting element is arranged on the circuit board, used for emitting light beams and provided with an electric connection portion and a light emitting body portion, wherein the electric connection portion is connected with the part of the conductive layer positioned in the hollow-out region, the light emitting body portion is positioned above the first part of the protective layer, the thickness of the first part is smaller than that of the second part, and the optical axis of each light beam is parallel to the surface of the base material approximately.
Description
Technical field
The utility model relates to a kind of light source module, especially relates to a kind of light source module with high-luminous-efficiency.
Background technology
Backlight module (Backlight Module; BLM) be one of the important spare part of Thin Film Transistor-LCD (TFT-LCD).Because TFT-LCD is non-self luminous display, must be by backlight throw light, penetrate the relevant spare parts such as Polarizer in TFT-LCD panel, liquid crystal layer, colored filter, finally enter people's eye imaging, realize the function showing.
Generally speaking, backlight module, according to the requirement of its scale, does and classifies with the position of light source setting, can be divided into side-light type (Edge Lighting) backlight module and full run-down type (Bottom Lighting) backlight module.Taking side light type back light module as example, side light type back light module more often adopts LED optical strip (LED Light Bar) as light source conventionally.Be attached at by surperficial coating technique (SMT) assembly being made on circuit board and LED optical strip is many light emitting diodes, then this LED optical strip be fixed on by the incidence surface of LGP.The folded acute angle of normal of the optical axis of the light beam that light emitting diode sends and LGP incidence surface is defined as beam incident angle, beam incident angle can have a great impact for the whole lighting efficiency of backlight module, in other words, when the light beam namely sending when light emitting diode enters LGP, if the angle of beam incident angle is larger, the ratio that reflects is also larger, enters optical efficiency also just poorer.
Particularly, whether light emitting diode is attached at after circuit board has crooked situation to produce, by the beam incident angle angular dimension after directly having influence on side light type back light module and having assembled.From the processing procedure of LED optical strip, carry out in the process of surface laminating processing at light emitting diode and circuit board, can (be for example scolding tin prior to solid-state electrical connection material is set on circuit board, comprise tin, nickel, the materials such as gold), again light emitting diode is placed in solid-state electrical connection material, now, can be according to the size of light emitting diode, by adjusting the thickness of solid-state electrical connection material, the beam incident angle angle that the rising angle of described light emitting diode is adjusted to after having assembled is close to zero, but can be through the higher back welding process of excess temperature in the process that surface laminating is processed, make solid-state electrical connection material transfer melting state to, with welding light emitting diode and circuit board, light emitting diode produces electrical connection with circuit board by the material that is electrically connected of melting, to make to be electrically connected material recovery be solid-state so that electrical connection keeps firm in cooling again.Wherein, in the time that solid-state electrical connection material transfers melting state to, light emitting diode easily produces displacement because being electrically connected subsiding of material, and is subject to the interference of board structure of circuit, makes the relative position of light emitting diode and circuit board easily produce crooked situation.Because after cooling, light emitting diode has produced crooked and has been fixed, and causes the beam incident angle angle after having assembled significantly to increase, and then reduce the whole lighting efficiency of backlight module.
Therefore, how to guarantee that the relative position of light emitting diode and circuit board is not because back welding process changes, the beam incident angle that is incident to LGP is close to zero, and then improves the overall light extraction efficiency of backlight module, one of emphasis of paying close attention to for those skilled in the art in fact.Chinese patent discloses and discloses a LED packaging body and LED encapsulation assembling structure for No. CN102208515A, TaiWan, China patent discloses the light-emitting component location structure that discloses backlight module for No. 201031971A1, TaiWan, China patent discloses No. 201227919A1 and discloses a light emitting module, TaiWan, China patent discloses No. 201336122A1 and discloses light-emitting diode light bar and manufacture method thereof, TaiWan, China new patent discloses light source module and backlight module No. M339004, TaiWan, China new patent discloses a light-emitting device No. M345444, U.S. Patent Bulletin discloses light source module No. US7909480B2, there is the display unit of described light source module and the manufacture method of light source module.
Utility model content
One of the purpose of this utility model is to provide a kind of light source module, its relative position of effectively guaranteeing light emitting diode and circuit board by structural improvement is not because back welding process changes, the beam incident angle that is incident to LGP is close to zero, and then improves the whole lighting efficiency of light source module.
Other object of the present utility model and advantage can be further understood from the disclosed technical characterictic of the utility model.
For reaching one of above-mentioned or partly or entirely object or other object, in an embodiment of the present utility model, a kind of light source module is proposed, comprise circuit board and light-emitting component.Circuit board comprises base material and is sequentially disposed at lip-deep conductive layer and the protective layer of base material.Protective layer comprises Part I, Part II and hollow out region, and hollow out region expose portion conductive layer.Light-emitting component is disposed at circuit board and in order to send light beam; light-emitting component has electrical connection section and luminous body; wherein electrical connection section is electrically connected with the partially conductive layer that is positioned at hollow out region; luminous body is positioned at the Part I top of described protective layer; and the thickness of Part I is less than the thickness of Part II, the optical axis of light beam is roughly parallel to the surface of base material.
In another embodiment of the present utility model, also comprise LGP, there is exiting surface, the relatively bottom surface of exiting surface and the incidence surface of connection exiting surface and bottom surface, wherein light-emitting component is disposed at by incidence surface, and normal and light beam that the optical axis of the light beam that light-emitting component sends is roughly parallel to incidence surface enter in LGP via incidence surface, and penetrate outside LGP via exiting surface.
In another embodiment of the present utility model, above-mentioned LGP is positioned at the Part II top of protective layer.
In another embodiment of the present utility model, also comprise conductive connection pads, be disposed between the electrical connection section of light-emitting component and the conductive layer of circuit board.
In another embodiment of the present utility model, the material of above-mentioned conductive connection pads comprises gold and nickel.
In another embodiment of the present utility model, above-mentioned circuit board also comprises the first adhesion coating being disposed between conductive layer and protective layer, and protective layer is glued at conductive layer by the first adhesion coating, and hollow out region expose portion the first adhesion coating.
In another embodiment of the present utility model, above-mentioned circuit board also comprises the second adhesion coating being disposed between base material and conductive layer, and conductive layer is glued at base material by the second adhesion coating.
In another embodiment of the present utility model, above-mentioned base material and the material of protective layer are non-conducting material.
In another embodiment of the present utility model, the material of above-mentioned conductive layer comprises copper.
In another embodiment of the present utility model, above-mentioned circuit board is flexible circuit board.
The utility model proposes a kind of light source module in addition, comprises circuit board and light-emitting component.Circuit board comprises base material and is sequentially disposed at lip-deep conductive layer and the protective layer of base material.Protective layer comprises physical layer and hollow out region.Hollow out region expose portion conductive layer, and hollow out region comprises the first section and the second section.Light-emitting component is disposed at circuit board and in order to send light beam.Light-emitting component has electrical connection section and luminous body.Electrical connection section is electrically connected with the partially conductive layer that is positioned at the first section, and luminous body is positioned at the top of the partially conductive layer of the second section, and luminous body do not contact each other with protective layer, and the optical axis of light beam is roughly parallel to the surface of base material.
In another embodiment of the present utility model, above-mentioned light source module, also comprise LGP, there is exiting surface, the relatively bottom surface of exiting surface and the incidence surface of connection exiting surface and bottom surface, wherein light-emitting component is disposed at by incidence surface, and normal and light beam that the optical axis of the light beam that light-emitting component sends is roughly parallel to incidence surface enter in LGP via incidence surface, and penetrate outside LGP via exiting surface.
In another embodiment of the present utility model, above-mentioned LGP is positioned at the physical layer top of protective layer.
In another embodiment of the present utility model, above-mentioned light source module, also comprises conductive connection pads, is disposed between the electrical connection section of light-emitting component and the conductive layer of circuit board.
In another embodiment of the present utility model, the material of above-mentioned conductive connection pads comprises gold and nickel.
In another embodiment of the present utility model, above-mentioned circuit board also comprises the first adhesion coating being disposed between conductive layer and protective layer, and protective layer is glued at conductive layer by the first adhesion coating, and hollow out region expose portion the first adhesion coating.
In another embodiment of the present utility model, the first above-mentioned adhesion coating extends to second section in hollow out region, and light-emitting component contact portion the first adhesion coating.
In another embodiment of the present utility model, above-mentioned circuit board also comprises the second adhesion coating being disposed between base material and conductive layer, and conductive layer is glued at base material by the second adhesion coating.
In another embodiment of the present utility model, above-mentioned base material and the material of protective layer are non-conducting material.
In another embodiment of the present utility model, the material of above-mentioned conductive layer comprises copper.
In another embodiment of the present utility model, above-mentioned circuit board is flexible circuit board.
In another embodiment of the present utility model, above-mentioned luminous body contact portion conductive layer.
According to the above; light source module described in the utility model one embodiment; the protective layer of its circuit board has Part I and Part II; and the thickness of Part I is less than the thickness of Part II; particularly; the luminous body of light-emitting component is disposed at the Part I top of thinner thickness; under such structural design; can make the optical axis of the light beam that light-emitting component sends be roughly parallel to the normal of the incidence surface of LGP, the beam incident angle angle after having assembled is close to zero.In addition; in another embodiment; the protective layer of circuit board has physical layer and hollow out region; and hollow out region comprises the first section and the second section; particularly, the luminous body of light-emitting component is contacted with the partially conductive layer exposing from the second section, under such structural design; can make equally the optical axis of the light beam that light-emitting component sends be roughly parallel to the normal of the surface of base material and the incidence surface of LGP, the beam incident angle angle after having assembled is close to zero.The utility model can be according to the size of light emitting diode, select the luminous body configuration mode of light-emitting component, and do not need to adjust the thickness of solid-state electrical connection material, and then in reduction back welding process, when solid-state electrical connection material transfers melting state to, light emitting diode produces the incidence of displacement because being electrically connected subsiding of material, in order to the relative position of guaranteeing light emitting diode and circuit board not because back welding process changes, the beam incident angle that is incident to LGP is close to zero, and then improves the overall light extraction efficiency of backlight module.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Brief description of the drawings
Fig. 1 is depicted as the schematic top plan view of the light source module described in an embodiment of the present utility model.
Fig. 2 is depicted as along the generalized section of the AA line segment shown in Fig. 1.
Fig. 3 is depicted as the generalized section of the light source module described in another embodiment of the present utility model.
Fig. 4 is depicted as the generalized section of the light source module described in another embodiment of the present utility model.
1,1a, 1b: light source module
10,10a, 10b: circuit board
11: light-emitting component
12: LGP
13: conductive connection pads
100: surface
101: base material
102: conductive layer
103,103a: protective layer
104,104b: the first adhesion coating
105: the second adhesion coatings
111: electrical connection section
112: luminous body
121: exiting surface
122: bottom surface
123: incidence surface
B: physical layer
L: optical axis
P1: Part I
P2: Part II
O, O1: hollow out region
N: normal
R1: the first section
R2: the second section
T1, T2: thickness
Detailed description of the invention
About aforementioned and other technology contents, feature and effect of the present utility model, in the detailed description in following cooperation with reference to a preferred embodiment of accompanying drawing, can clearly present.The direction term of mentioning in following examples, for example: upper and lower, left and right, front or rear etc. are only the directions with reference to accompanying drawing.Therefore, the direction term of use is to be not used for limiting the utility model for illustrating.
Please refer to Fig. 1 and Fig. 2, Fig. 1 is the schematic top plan view of the light source module described in an embodiment of the present utility model.Fig. 2 is the generalized section along the AA line segment shown in Fig. 1.As shown in Figures 1 and 2, the light source module 1 described in the present embodiment comprises circuit board 10 and light-emitting component 11.Circuit board 10 comprises base material 101 and is sequentially disposed at the conductive layer 102 and protective layer 103 on the surface 100 of base material 101.Protective layer 103 comprises Part I P1, Part II P2 and hollow out region O.Hollow out region O exposes partially conductive layer 102.Light-emitting component 11 is disposed at circuit board 10 and in order to send light beam.Light-emitting component 11 has electrical connection section 111 and luminous body 112.The electrical connection section 111 of light-emitting component 11 is electrically connected with the partially conductive layer 102 that is positioned at hollow out region O.The luminous body 112 of light-emitting component 11 is positioned at the Part I P1 top of protective layer 103, and the thickness T 1 of the Part I P1 of protective layer 103 is less than the thickness T 2 of Part II P2.Under such structural design, the optical axis L of the light beam that light-emitting component 11 sends is roughly parallel to the surface 100 of base material 101.Light-emitting component 11 described in the present embodiment is for example the illuminated LED of side (Side View LED), and the optical axis of the light beam that LED sends is roughly parallel to the substrate surface of the circuit board of LED electrical connection, but the utility model is not limited to this.
The luminous body 112 of the light-emitting component 11 described in the present embodiment is for example the Part I P1 that is directly contacted with the protective layer 103 of circuit board 10, but the utility model is not limited to this.
Circuit board 10 described in the present embodiment is for example flexible circuit board (Flexible Print Circuit is called for short FPC), but the utility model is not limited to this.The base material 101 of the circuit board 10 described in the present embodiment is for example polyimides (Polyimide with the material of protective layer 103; PI), mylar (Polyester; or other non-conductive material, but the utility model is not limited to this PET).The material of the conductive layer 102 of the circuit board 10 described in the present embodiment is for example copper, but the utility model is not limited to this.
Light source module 1 described in the present embodiment also comprises LGP 12.LGP 12 has exiting surface 121, the relatively bottom surface 122 of exiting surface 121 and the incidence surface 123 of connection exiting surface 121 and bottom surface 122.Light-emitting component 11 is disposed at incidence surface 123 sides of LGP 12.Particularly, the optical axis of the light beam that light-emitting component 11 sends is roughly parallel to the normal N of the incidence surface 123 of LGP 12, and most of light beam enters in LGP 12 via incidence surface 123, then penetrates outside LGP 12 via exiting surface 121.It is worth mentioning that, in the present embodiment, LGP 12 is for example the Part II P2 top that is configured in protective layer 103, and in other words, the circuit board 10 described in the present embodiment extends to the below of LGP 12, but the utility model is not limited to this.Need special instruction, the light source module 1 described in the present embodiment is for example to have the member such as reflector plate and radiator structure, but above-mentioned these members are not feature of the present utility model place, hereat in Fig. 2, these members is omitted.In other embodiments, LGP 12 is for example the Part II P2 that is directly contacted with protective layer 103, but the utility model is not limited to this.
Light source module 1 described in the present embodiment also comprises conductive connection pads 13.Conductive connection pads 13 is disposed between the electrical connection section 111 of light-emitting component 11 and the conductive layer 102 of circuit board 10.Particularly, conductive connection pads 13 is directly contacted with the electrical connection section 111 of light-emitting component 11 and the conductive layer 102 of circuit board 10, is electrically connected to make light-emitting component 11 be fixed on each other and complete with circuit board 10.Conductive connection pads 13 described in the present embodiment is for example scolding tin, and material is for example tin, gold or nickel, but the utility model is not limited to this.
Circuit board 10 described in the present embodiment also comprise be disposed at the first adhesion coating 104 between conductive layer 102 and protective layer 103 and be disposed at base material 101 and conductive layer 102 between the second adhesion coating 105, but the utility model is not limited to this.The protective layer 103 of circuit board 10 is glued at conductive layer 102 by the first adhesion coating 104, and hollow out region O expose portion the first adhesion coating 104.The conductive layer 102 of circuit board 10 is glued at base material 101 by the second adhesive layer 105.The first adhesion coating 104 described in the present embodiment and the material of the second adhesion coating 105 are for example epoxy resin (Epoxy), mylar (Polyester) or acryl resin (Acrylic), but the utility model is not limited to this.
Through from the above; be less than the thickness T 2 of Part II P2 according to the thickness T 1 of its Part I of the adjusted size of light-emitting component 11 P1 by the protective layer 103 of the circuit board 10 described in the present embodiment; under such structural design; melt when conductive connection pads 13 process back welding process while subsiding; because the luminous body 112 of light-emitting component 11 is bearing on the Part I P1 that protective layer 103 thickness are less, the Part II P2 that light-emitting component 11 can not be protected layer 103 disturbs and has crooked situation to produce.Further guarantee that the optical axis L of the light beam that light-emitting component 11 sends is roughly parallel to the surface 100 of base material 101, the optical axis L of the light beam that namely light-emitting component 11 sends is roughly parallel to the normal N of the incidence surface 123 of LGP 12.
Please refer to Fig. 3, it is the generalized section of the light source module described in another embodiment of the present utility model.Light source module 1a described in the present embodiment is similar to the light source module 1 shown in Fig. 1 and Fig. 2; difference is; as shown in Figure 3, the circuit board 10a of the light source module 1a described in the present embodiment comprises base material 101 and is sequentially disposed at the conductive layer 102 and protective layer 103a on the surface 100 of base material 101.Protective layer 103a comprises physical layer B and hollow out region O1.Hollow out region O1 exposes partially conductive layer 102, and hollow out region O1 comprises the first section R1 and the second section R2.The electrical connection section 111 of light-emitting component 11 is electrically connected with the partially conductive layer 102 that is positioned at the first section R1.Luminous body 112 contacts of light-emitting component 11 are positioned at the partially conductive layer 102 of the second section R2.Under such structural design, can make equally the optical axis of the light beam that light-emitting component 11 sends be roughly parallel to the surface 100 of base material 101.
The LGP 12 of light source module 1a described in the present embodiment is for example the physical layer B top that is disposed at the protective layer 103a of circuit board 10a, that is to say, the circuit board 10a described in the present embodiment extends to the below of LGP 12, but the utility model is not limited to this.Need special instruction, the light source module 1a described in the present embodiment has the member such as reflector plate and radiator structure, but above-mentioned these members are not feature of the present utility model place, therefore in Fig. 3, these members is omitted.In other embodiments, LGP 12 is for example the physical layer B that is directly contacted with protective layer 103a, but the utility model is not limited to this.
In the present embodiment, the first adhesion coating 104 that the conductive connection pads 13 that light source module 1a has and circuit board 10a have and the structure of the second adhesion coating 105 are described and have been disclosed as previous embodiment, do not repeat them here.
Please refer to Fig. 4, it is the generalized section of the light source module described in another embodiment of the present utility model.Light source module 1b described in the present embodiment is similar to the light source module 1a shown in Fig. 3; difference is; as shown in Figure 4; circuit board 10b described in the present embodiment comprise be disposed at the first adhesion coating 104b between conductive layer 102 and protective layer 103a and be disposed at base material 101 and conductive layer 102 between the second adhesion coating 105; wherein the first adhesion coating 104b extends to the second section R2 of the hollow out region O1 of protective layer 103a, and the luminous body 112 of light-emitting component 11 is directly contacted with the first adhesion coating 104b of the second section R2 that extends to hollow out region O1.That is to say, the light-emitting component 11 described in the present embodiment is except being fixed on circuit board 10b by conductive connection pads 13, further by more stable being fixed on circuit board 10b of the first adhesion coating 104b.In addition, remaining member of the present embodiment is identical with the light source module 1a shown in Fig. 3, does not repeat them here.
To sum up institute is old, light source module described in the utility model embodiment wherein, the protective layer of its circuit board has Part I and Part II, and the thickness of Part I is less than the thickness of Part II, particularly, protective layer is according to the thickness of its Part I of adjusted size of light-emitting component and the thickness of Part II, and the luminous body of light-emitting component is disposed at the Part I top that thickness is less, under such structural design, can make the optical axis of the light beam that light-emitting component sends be roughly parallel to the surface of base material, the optical axis of the light beam that namely light-emitting component sends is roughly parallel to the normal of the incidence surface of LGP.In addition; in another embodiment; the protective layer of circuit board has physical layer and hollow out region; and hollow out region comprises the first section and the second section; particularly; circuit board makes the luminous body of light-emitting component directly be contacted with the partially conductive layer exposing from the second section according to the size of light-emitting component, or allows luminous body directly be contacted with to extend to the first adhesion coating of second section in hollow out region.That is to say, light-emitting component is except being fixed on circuit board by conductive connection pads, further by more stable being fixed on circuit board of the first adhesion coating, under such structural design, can make equally the optical axis of the light beam that light-emitting component sends be roughly parallel to the normal of the surface of base material and the incidence surface of LGP, guarantee that the relative position of light-emitting component and circuit board is not because back welding process changes, the beam incident angle that is incident to LGP is close to zero, and then improves the whole lighting efficiency of light source module.
The above, it is only preferred embodiment of the present utility model, can not limit the scope that the utility model is implemented with this, all equivalences of making according to the utility model claim and description change or amendment, all still belong in the scope of the utility model patent covering.Arbitrary embodiment of the present utility model or claim must not realize the disclosed whole objects of the utility model or advantage or feature in addition.In addition, summary part and utility model title are only for the use of auxiliary patent document retrieval, are not used for limiting the utility model scope required for protection." first ", " second " etc. in this description or claims, mentioned be only in order to name the title of assembly (element) or to distinguish different embodiment or scope, is not used for the quantitative upper limit of limiter assembly or lower limit.
Claims (22)
1. a light source module, comprises a circuit board and a light-emitting component,
Described circuit board comprises a base material and is sequentially disposed at a lip-deep conductive layer and a protective layer of described base material; wherein said protective layer comprises a Part I, a Part II and a hollow out region; and conductive layer described in the expose portion of described hollow out region
Described light-emitting component is disposed at described circuit board and in order to send a light beam; described light-emitting component has an electrical connection section and a luminous body; wherein said electrical connection section is electrically connected with the described conductive layer of part that is positioned at described hollow out region; described luminous body is positioned at the described Part I top of described protective layer; and the thickness of described Part I is less than the thickness of described Part II, an optical axis of described light beam is roughly parallel to the described surface of described base material.
2. light source module as claimed in claim 1, it is characterized in that described light source module also comprises that a LGP has a bottom surface of an exiting surface, relatively described exiting surface and connects an incidence surface of described exiting surface and described bottom surface, wherein said light-emitting component is disposed at by described incidence surface, and a normal and described light beam that the described optical axis of the described light beam that described light-emitting component sends is roughly parallel to described incidence surface enter in described LGP via described incidence surface, and penetrate outside described LGP via described exiting surface.
3. light source module as claimed in claim 2, is characterized in that described LGP is positioned at the described Part II top of described protective layer.
4. light source module as claimed in claim 1, is characterized in that described light source module also comprises that a conductive connection pads is disposed between the described electrical connection section of described light-emitting component and the described conductive layer of described circuit board.
5. light source module as claimed in claim 4, is characterized in that the material of described conductive connection pads comprises gold and nickel.
6. light source module as claimed in claim 1; it is characterized in that described circuit board also comprises one first adhesion coating being disposed between described conductive layer and described protective layer; described protective layer is glued at described conductive layer by described the first adhesion coating, and the first adhesion coating described in the expose portion of described hollow out region.
7. light source module as claimed in claim 1, is characterized in that described circuit board also comprises one second adhesion coating being disposed between described base material and described conductive layer, and described conductive layer is glued at described base material by described the second adhesion coating.
8. light source module as claimed in claim 1, the material that it is characterized in that described base material and described protective layer is non-conducting material.
9. light source module as claimed in claim 1, is characterized in that the material of described conductive layer comprises copper.
10. light source module as claimed in claim 1, is characterized in that described circuit board is flexible circuit board.
11. 1 kinds of light source modules, comprise a circuit board and a light-emitting component,
Described circuit board comprises a base material and is sequentially disposed at a lip-deep conductive layer and a protective layer of described base material; wherein said protective layer comprises a physical layer and a hollow out region; conductive layer described in the expose portion of described hollow out region; and described hollow out region comprises one first section and one second section
Described light-emitting component is disposed at described circuit board and in order to send a light beam; described light-emitting component has an electrical connection section and a luminous body; described electrical connection section is electrically connected with the described conductive layer of the part that is positioned at described the first section; described luminous body is positioned at the top of the described conductive layer of part of described the second section; and described luminous body does not contact each other with described protective layer, an optical axis of described light beam is roughly parallel to the described surface of described base material.
12. light source modules as claimed in claim 11, it is characterized in that described light source module also comprises that a LGP has a bottom surface of an exiting surface, relatively described exiting surface and connects an incidence surface of described exiting surface and described bottom surface, wherein said light-emitting component is disposed at by described incidence surface, and a normal and described light beam that the described optical axis of the described light beam that described light-emitting component sends is roughly parallel to described incidence surface enter in described LGP via described incidence surface, and penetrate outside described LGP via described exiting surface.
13. light source modules as claimed in claim 12, is characterized in that described LGP is positioned at the described physical layer top of described protective layer.
14. light source modules as claimed in claim 11, is characterized in that described light source module also comprises that a conductive connection pads is disposed between the described electrical connection section of described light-emitting component and the described conductive layer of described circuit board.
15. light source modules as claimed in claim 14, is characterized in that the material of described conductive connection pads comprises gold and nickel.
16. light source modules as claimed in claim 11; it is characterized in that described circuit board also comprises one first adhesion coating being disposed between described conductive layer and protective layer; described protective layer is glued at described conductive layer by described the first adhesion coating, and the first adhesion coating described in the expose portion of described hollow out region.
17. light source modules as claimed in claim 16, is characterized in that described the first adhesion coating extends to described second section in described hollow out region, and the first adhesion coating described in described light-emitting component contact portion.
18. light source modules as claimed in claim 11, is characterized in that described circuit board also comprises one second adhesion coating being disposed between described base material and described conductive layer, and described conductive layer is glued at described base material by described the second adhesion coating.
19. light source modules as claimed in claim 11, the material that it is characterized in that described base material and described protective layer is non-conducting material.
20. light source modules as claimed in claim 11, is characterized in that the material of described conductive layer comprises copper.
21. light source modules as claimed in claim 11, is characterized in that described circuit board is flexible circuit board.
22. light source modules as claimed in claim 11, is characterized in that conductive layer described in described luminous body contact portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420310671.3U CN203880649U (en) | 2014-06-11 | 2014-06-11 | Light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420310671.3U CN203880649U (en) | 2014-06-11 | 2014-06-11 | Light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203880649U true CN203880649U (en) | 2014-10-15 |
Family
ID=51681140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420310671.3U Expired - Lifetime CN203880649U (en) | 2014-06-11 | 2014-06-11 | Light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203880649U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200113A (en) * | 2015-06-01 | 2016-12-07 | 扬升照明股份有限公司 | Backlight module |
| WO2019041883A1 (en) * | 2017-08-31 | 2019-03-07 | 京东方科技集团股份有限公司 | Light source structure, electronic device, and light source structure manufacturing method |
| CN109585429A (en) * | 2017-09-25 | 2019-04-05 | 致伸科技股份有限公司 | Light source module |
-
2014
- 2014-06-11 CN CN201420310671.3U patent/CN203880649U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106200113A (en) * | 2015-06-01 | 2016-12-07 | 扬升照明股份有限公司 | Backlight module |
| WO2019041883A1 (en) * | 2017-08-31 | 2019-03-07 | 京东方科技集团股份有限公司 | Light source structure, electronic device, and light source structure manufacturing method |
| CN109585429A (en) * | 2017-09-25 | 2019-04-05 | 致伸科技股份有限公司 | Light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190121 Address after: Hsinchu Science Park, Taiwan, China Patentee after: Coretronic Corp. Address before: Xinzhu Science Industrial Park Patentee before: Yangsheng Lighting Co.,Ltd. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141015 |