CN203071887U - LTCC broadband band pass filter - Google Patents
LTCC broadband band pass filter Download PDFInfo
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- CN203071887U CN203071887U CN 201220673463 CN201220673463U CN203071887U CN 203071887 U CN203071887 U CN 203071887U CN 201220673463 CN201220673463 CN 201220673463 CN 201220673463 U CN201220673463 U CN 201220673463U CN 203071887 U CN203071887 U CN 203071887U
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Abstract
The utility model discloses an LTCC broadband band pass filter. The circuit of the LTCC broadband band pass filter is provided with a symmetrical circuit structure, comprising the components as following from left to right: an inlet signal electrode, wherein an electric signal is input through the electrode; an output signal electrode, wherein an electric signal is output through the electrode; and a grounding electrode, wherein the LTCC broadband band pass filter is connected to the reference ground through the grounding electrode. According to the LTCC broadband band pass filter, an equivalent lumped-parameter element is achieved through an LTCC lamination structure, and the device dimension is substantially minimized under the same technology index prerequisition. Simultaneously, the band width of the band pass filter is large, insertion loss is little, outband inhibition is high, frequency selectivity is good, the LTCC broadband band pass filter can be processed to form a paster, which is east to integrate to other microwave assemblies, in addition, the LTCC broadband band pass filter is employed based on the LTCC technology, cost is low, and the LTCC broadband band pass filter is suitable for batch production.
Description
Technical field
The utility model belongs to electronic technology field, and it relates to a kind of band pass filter, and is specifically related to a kind of LTCC (LTCC) broadband band-pass filter.
Background technology
Band pass filter is very important a kind of element in the radio frequency microwave circuit, and in recent years, the fast development of field of wireless communication requires the frequency microwave band pass filter that littler volume, higher performance, lighter weight and lower cost will be arranged.With traditional processing and fabricating method: at first, band pass filter is difficult to accomplish wideer relative bandwidth; Secondly, the area that filter occupies is very big, can not satisfy the requirement of radio-frequency front-end device miniaturization; The 3rd, processing cost is relatively more expensive.Therefore, people utilize the thought with the planar structure three-dimensional, with the stacked elements that accounts for a large amount of areas at planar circuit originally in 3-D solid structure, thereby filter is realized under minimum area.Use the LTCC technology, can realize the requirement of circuit three-dimensional, three-dimensional structure, and ceramic component there is good characteristic, can satisfy existing market to miniaturization, low cost, high performance requirement.
The utility model content
The utility model provides a kind of broadband band-pass filter based on the LTCC technology, and this filter adopts 5 rank Chebyshev's band pass filter prototypes, and realizes equivalent lumped circuit model by the LTCC laminated construction.Lumped inductance adopts storehouse spiral inductance and lead inductance, utilizes the interconnection between the through hole realization different layers; Wherein, lumped capacity adopts vertical interdigital capacitor (VIC) structure and double layer capacity (MIM), and this implementation can significantly reduce filter size.
The technical scheme that the utility model adopts is: a kind of LTCC broadband band-pass filter, and its equivalent electric circuit is the symmetric circuit structure, from left to right comprises successively: an input signal electrode, by this electrode input electrical signal; An output signal electrode is by this electrode output signal of telecommunication; Grounding electrode is connected to reference to ground by grounding electrode; The first series LC resonant circuit (L1, C1), capacitor C 1 is received in the series connection of the input port on the described left side, and the output of capacitor C 1 is connected to inductance L 1; The second series LC resonant circuit (L3, C3), first series resonant circuit (L1, C1) output of middle inductance L 1 is linked into second series resonant circuit (L3, C3) middle inductance L 3 inputs, the output series connection access capacitor C 3 of L3; First antiresonant circuit (L2, C2), its access first series resonant circuit in parallel (L1, C1) (L3 is C3) between the middle inductance L 3 for middle inductance L 1 and second series resonant circuit; The 3rd series connection (right side) resonant circuit (L1, C1), the second series resonant circuit (L3, C3) C3 output series connection is linked into the 3rd series connection (right side) resonant circuit (L1, C1) L1 input, and the 3rd series connection (right side) resonant circuit (L1, C1 series connection C1) is linked into output port; (L2, C2), (L3, C3) (L1 is C1) between the middle inductance L 1 for middle capacitor C 3 and the 3rd series connection (right side) resonant circuit for its access second series resonant circuit in parallel for second parallel connection (right side) resonant circuit.
Capacitor C 1 (left side) comprises top crown 12b and bottom crown 12a, capacitor C 1 (right side) comprises top crown 16b and bottom crown 16a, capacitor C 2 (left side) comprises top crown 13b and bottom crown 13a, and capacitor C 2 (right side) comprises top crown 15b and bottom crown 15a, and capacitor C 3 comprises top crown 14b and bottom crown 14a.Planar spiral inductor L1 (left side) is metallic conductor sheet 12, planar spiral inductor L1 (right side) is metallic conductor sheet 16, planar spiral inductor L2 (left side) is metallic conductor sheet 13, and planar spiral inductor L2 (right side) is metallic conductor sheet 15, and storehouse inductance L 3 is made up of metallic conductor sheet 14c and 14d.
Inductance L described in the model 1 is planar spiral inductor, and L2 is lead inductance, and L3 is the storehouse inductance.What described capacitor C 1 was taked is the parallel flat capacitance structure, and C2, C3 take the double layer capacity structure, and it is realized by pole plate between the different layers.
The LTCC band pass filter comprises the multilayer dielectricity substrate, and wherein, the place is provided with metal level at the medium substrate upper surface; Be printed on the upper surface of substrate at the metal of lowermost encapsulated layer.1st, 3 metal conductor layers are metal ground, and this double layer of metal ground links together by sidewall.
The beneficial effects of the utility model are:
The utility model is to realize equivalent lumped-parameter element by the LTCC laminated construction, is realizing can reducing size of devices significantly under the equivalent technology index prerequisite.Simultaneously, this band pass filter bandwidth is very wide, and it is little to insert loss, and band is outer to suppress high, and frequency selectivity is fine, and can be processed into patch form, is convenient to other microwave components integratedly, and in addition, the utility model is based on LTCC technology, and cost is low, is fit to produce in batches.
Description of drawings
Fig. 1 is the equivalent circuit diagram of the utility model LTCC band pass filter prototype;
Fig. 2 is the encapsulation schematic diagram of the described LTCC band pass filter of the utility model specific embodiments;
Fig. 3 is the structural representation of the described LTCC band pass filter of the utility model embodiment;
Fig. 4 is the simulation result of the described LTCC band pass filter of the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Fig. 1 shows the structure of the LTCC broadband band-pass filter that the utility model provides.For convenience of explanation, only show the part relevant with the utility model.
A kind of LTCC broadband band-pass filter, its equivalent electric circuit is the symmetric circuit structure, from left to right comprises successively: an input signal electrode, by this electrode input electrical signal; An output signal electrode is by this electrode output signal of telecommunication; Grounding electrode is connected to reference to ground by grounding electrode; The first series LC resonant circuit (L1, C1), capacitor C 1 is received in the series connection of the input port on the described left side, and the output of capacitor C 1 is connected to inductance L 1; The second series LC resonant circuit (L3, C3), first series resonant circuit (L1, C1) output of middle inductance L 1 is linked into second series resonant circuit (L3, C3) middle inductance L 3 inputs, the output series connection access capacitor C 3 of L3; First antiresonant circuit (L2, C2), its access first series resonant circuit in parallel (L1, C1) (L3 is C3) between the middle inductance L 3 for middle inductance L 1 and second series resonant circuit; The 3rd series connection (right side) resonant circuit (L1, C1), the second series resonant circuit (L3, C3) C3 output series connection is linked into the 3rd series connection (right side) resonant circuit (L1, C1) L1 input, and the 3rd series connection (right side) resonant circuit (L1, C1 series connection C1) is linked into output port; (L2, C2), (L3, C3) (L1 is C1) between the middle inductance L 1 for middle capacitor C 3 and the 3rd series connection (right side) resonant circuit for its access second series resonant circuit in parallel for second parallel connection (right side) resonant circuit.
Corresponding in Fig. 3, capacitor C 1 (left side) comprises top crown 12b and bottom crown 12a, capacitor C 1 (right side) comprises top crown 16b and bottom crown 16a, capacitor C 2 (left side) comprises top crown 13b and bottom crown 13a, capacitor C 2 (right side) comprises top crown 15b and bottom crown 15a, and capacitor C 3 comprises top crown 14b and bottom crown 14a.Planar spiral inductor L1 (left side) is metallic conductor sheet 12, planar spiral inductor L1 (right side) is metallic conductor sheet 16, planar spiral inductor L2 (left side) is metallic conductor sheet 13, and planar spiral inductor L2 (right side) is metallic conductor sheet 15, and storehouse inductance L 3 is made up of metallic conductor sheet 14c and 14d.
Inductance L described in the model 1 is planar spiral inductor, and L2 is lead inductance, and L3 is the storehouse inductance.What described capacitor C 1 was taked is the parallel flat capacitance structure, and C2, C3 take the double layer capacity structure, and it is realized by pole plate between the different layers.
The LTCC band pass filter comprises the multilayer dielectricity substrate, and wherein, the place is provided with metal level at the medium substrate upper surface; Be printed on the upper surface of substrate at the metal of lowermost encapsulated layer.1st, 3 metal conductor layers are metal ground, and this double layer of metal ground links together by sidewall.
As shown in Figure 3, drawn 11 layers altogether, the most beneath and uppermost encapsulated layer does not draw, and annexation for convenience of explanation, layer with layer between space out as far as possible.Fig. 3 can not represent the proportionate relationship of the utility model band pass filter actual size.
Among Fig. 3, the 1st layer of metal is positioned at above the 1st layer the medium substrate, and the 2nd layer of metal is positioned at above the 2nd layer the medium substrate, and the 3rd layer of metal is positioned at above the 3rd layer the medium substrate, and by that analogy, the 11th layer metal is positioned at above the 11th layer medium substrate.The metal of the 1st layer of each layer in the 11th layer all adopts the LTCC typography to be printed on the upper surface of medium substrate, and the metal of lowermost encapsulated layer is printed on the lower surface of substrate, and all medium substrate materials all are the LTCC pottery.
The 1st layer of metal conductor layer 16 and the 3rd layer of metal conductor layer 13b and 15b are metal ground, all are connected with sidewall, and form two left-right symmetric capacitor C 2 with the 2nd layer of metal conductor layer 13a and metal conductor layer 15a.4th, do not arrange capacitor and inductor for 5,6,7 layers, which floor passes from this to have only metal cylinder, can reduce the ghost effect between inductance and electric capacity or inductance and the ground like this.The 8th layer of metal conductor layer is the input/output port of band pass filter, is positioned at the left and right sides, and connects the bottom crown 12a of symmetrical capacitor C 1 (left side) and the bottom crown 16a of C1 (right side).The top crown 12b that the 9th layer of metal conductor layer is symmetrical capacitor C 1 (left side) and the top crown 16b of C1 (right side), the top crown 12b of symmetry capacitor C 1 (left side) is connected in the metallic conductor sheet 12 of symmetrical inductance L 1 (left side), the top crown 16b of symmetry capacitor C 1 (right side) is connected in the metallic conductor sheet 16 of symmetrical inductance L 1 (right side), and the other end of L1 is connected with the bottom crown 13a of metal micro-strip with the 2nd layer symmetrical capacitor C 2 (left side) by metal cylinder again; Symmetry inductance L 2 (left side) is positioned at the 9th layer, realizes that by one section microstrip line an end directly is connected with the bottom crown 13a of symmetrical capacitor C 2 (left side) in the 2nd layer by metal cylinder, and the other end is by sidewall ground connection; Symmetry inductance L 2 (right side) also is positioned at the 9th layer, is to realize by one section microstrip line equally, and an end directly is connected with the bottom crown 15a of symmetrical capacitor C 2 (right side) in the 2nd layer by metal cylinder, and the other end is by sidewall ground connection; Inductance L 3 is the storehouse inductance, is respectively the 9th layer metallic conductor sheet 14d and the metallic conductor sheet 14c of 11th layer, and is connected with the bottom crown 13a of left side capacitor C 2 in the 2nd layer by metal cylinder.The top crown 14b that the bottom crown 14a that capacitor C 3 is made of the 10th layer of metal conductor layer and 11th layer metallic conductor sheet constitute forms jointly, and wherein bottom crown 14a is connected with the bottom crown 15a of the right capacitor C 2 in the 2nd layer by metal cylinder.
To have opened a diameter be 45 ° via hole to the top crown 13b of the right capacitor C 2 in the 3rd layer, is convenient to allow the diameter be that the metal column of 170 μ m passes.Consider that processing technology metal micro-strip line and metal cylinder junction all will add the metal tray that diameter is 250 μ m.In 2, the live width of spiral inductance and spacing are 100 μ m among the figure.
The overall package structural representation of the utility model broadband band-pass filter as shown in Figure 2, high order end is input port, low order end is output port, the front and back package wall is port ground.The relative dielectric constant ε of the LTCC ceramic dielectric that adopts
rBe 5.9, the losstangenttan of medium is 0.002, and metallic conductor adopts silver, and the thickness of every layer of ceramic dielectric is 40 μ m, and every layer of metal thickness is 10 μ m.
Simulation result is as shown in Figure 4:
This broadband band-pass filter centre frequency is 2.06GHz, and bandwidth is 0.98GHz, and the return loss in the passband is inserted loss less than 1.2 greater than 15dB, and filter has the outer suppression characteristic of good band.
To sum up, the LTCC band pass filter that the utility model provides has that volume is little, the frequency-selecting performance is good, can be processed into the surface mount elements form, is convenient to other microwave components integrated.And the utility model band pass filter is based on LTCC technology, low cost of manufacture, the suitable batch process in batches.This band pass filter can be widely used in the wireless radiofrequency communication fields such as mobile phone, Bluetooth system, WLAN (wireless local area network).
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.
Claims (4)
1. a LTCC broadband band-pass filter is characterized in that, the circuit of this LTCC broadband band-pass filter is the symmetric circuit structure, from left to right comprises successively: an input signal electrode, by this electrode input electrical signal; An output signal electrode is by this electrode output signal of telecommunication; Grounding electrode is connected to reference to ground by grounding electrode; The first series LC resonant circuit (L1, C1), electric capacity (C1) is received in the series connection of the input port on the described left side, and the output of electric capacity (C1) is connected to inductance (L1); The second series LC resonant circuit (L3, C3), first series resonant circuit (L1, C1) output of middle inductance (L1) is linked into second series resonant circuit (L3, C3) middle inductance (L3) input, the output series connection access electric capacity (C3) of inductance (L3); First antiresonant circuit (L2, C2), its access first series resonant circuit in parallel (L1, C1) (L3 is C3) between the middle inductance (L3) for middle inductance (L1) and second series resonant circuit; The 3rd series resonant circuit (L1, C1), the second series resonant circuit (L3, C3) (C3) output series connection is linked into the 3rd series resonant circuit (L1, C1) inductance (L1) input, and the 3rd series resonant circuit (L1, electric capacity C1) (C1) series connection is linked into output port; (L2, C2), (L3, C3) (L1 is C1) between the middle inductance (L1) for middle electric capacity (C3) and the 3rd series resonant circuit for its access second series resonant circuit in parallel for second antiresonant circuit.
2. LTCC broadband band-pass filter as claimed in claim 1, it is characterized in that, described electric capacity (C1) comprises top crown (12b) and bottom crown (12a), electric capacity (C1) comprises top crown (16b) and bottom crown (16a), electric capacity (C2) comprises top crown (13b) and bottom crown (13a), electric capacity (C2) comprises top crown (15b) and bottom crown (15a), and electric capacity (C3) comprises top crown (14b) and bottom crown (14a); Planar spiral inductor (L1) is metallic conductor sheet (12), planar spiral inductor (L1) is metallic conductor sheet (16), planar spiral inductor (L2) is metallic conductor sheet (13), planar spiral inductor (L2) is metallic conductor sheet (15), and storehouse inductance (L3) is made up of metallic conductor sheet (14c) and metallic conductor sheet (14d).
3. LTCC broadband band-pass filter as claimed in claim 1 is characterized in that, described emitter follower is made of a triode; Inductance described in the model (L1) is planar spiral inductor, and inductance (L2) is lead inductance, and inductance (L3) is the storehouse inductance; What described electric capacity (C1) was taked is the parallel flat capacitance structure, and electric capacity (C2, C3) is taked the double layer capacity structure, and it is realized by pole plate between the different layers.
4. LTCC broadband band-pass filter as claimed in claim 1 is characterized in that, described emitter follower is made of a triode; The LTCC band pass filter comprises the multilayer dielectricity substrate, and wherein, the place is provided with metal level at the medium substrate upper surface; Be printed on the upper surface of substrate at the metal of lowermost encapsulated layer; 1st, 3 metal conductor layers are metal ground, and this double layer of metal ground links together by sidewall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220673463 CN203071887U (en) | 2012-12-10 | 2012-12-10 | LTCC broadband band pass filter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220673463 CN203071887U (en) | 2012-12-10 | 2012-12-10 | LTCC broadband band pass filter |
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| CN203071887U true CN203071887U (en) | 2013-07-17 |
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| CN 201220673463 Expired - Fee Related CN203071887U (en) | 2012-12-10 | 2012-12-10 | LTCC broadband band pass filter |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
| CN108809269A (en) * | 2017-04-26 | 2018-11-13 | Tdk株式会社 | low-pass filter |
| CN108808185A (en) * | 2018-07-27 | 2018-11-13 | 广东风华高新科技股份有限公司 | A kind of LTCC bandpass filters suitable for L-band |
-
2012
- 2012-12-10 CN CN 201220673463 patent/CN203071887U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108809269A (en) * | 2017-04-26 | 2018-11-13 | Tdk株式会社 | low-pass filter |
| CN108809269B (en) * | 2017-04-26 | 2022-05-27 | Tdk株式会社 | Low-pass filter |
| CN107947752A (en) * | 2017-12-29 | 2018-04-20 | 中国电子科技集团公司第四十三研究所 | A kind of bandpass filter |
| CN108808185A (en) * | 2018-07-27 | 2018-11-13 | 广东风华高新科技股份有限公司 | A kind of LTCC bandpass filters suitable for L-band |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20131210 |