CN202986108U - Micro-array mould-free forming device based on surface acoustic wave - Google Patents
Micro-array mould-free forming device based on surface acoustic wave Download PDFInfo
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- CN202986108U CN202986108U CN 201220703137 CN201220703137U CN202986108U CN 202986108 U CN202986108 U CN 202986108U CN 201220703137 CN201220703137 CN 201220703137 CN 201220703137 U CN201220703137 U CN 201220703137U CN 202986108 U CN202986108 U CN 202986108U
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- 238000002493 microarray Methods 0.000 title claims abstract description 37
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 239000011344 liquid material Substances 0.000 claims abstract description 27
- 239000011521 glass Substances 0.000 claims abstract description 25
- 238000000465 moulding Methods 0.000 claims description 29
- 239000011358 absorbing material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 26
- 239000000463 material Substances 0.000 abstract description 22
- 230000008859 change Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 24
- 238000005516 engineering process Methods 0.000 description 16
- 238000001723 curing Methods 0.000 description 10
- 238000007493 shaping process Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical class CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 238000001015 X-ray lithography Methods 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- ORCSMBGZHYTXOV-UHFFFAOYSA-N bismuth;germanium;dodecahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.O.O.[Ge].[Ge].[Ge].[Bi].[Bi].[Bi].[Bi] ORCSMBGZHYTXOV-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 229920006334 epoxy coating Polymers 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011494 foam glass Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
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Abstract
The utility model discloses a micro-array mould-free forming device based on a surface acoustic wave. Two pairs of interdigital transducers are photoetched on a square piezoelectric base plate; interdigital transducers in each pair are symmetrical about the central axis of the square piezoelectric base plate; a square glass liquid groove is placed in the middle of the piezoelectric base plate and is cemented with the piezoelectric base plate; and a formed liquid material is placed into the glass liquid groove. The surface acoustic wave spreads in the piezoelectric base plate and energy of the surface acoustic wave is leaked into the formed liquid material at a certain angle to form a sound field; a signal generator and a power amplifier are adjusted to change the amplitude value, frequency and phase of the surface acoustic wave so that a needed stable micro-array structure is formed on the surface of the molded liquid material; and the structure is cured and formed under ultraviolet irradiation. The micro-array mould-free forming device disclosed by the utility model utilizes the sound field to rapidly form the liquid material to manufacture the surface micro-array structure; and no mould is used and the micro-array mould-free forming device is simple in a manufacturing process, low in equipment requirements, simple to operate, low in production cost, high in material utilization rate and high in production efficiency.
Description
Technical field
The utility model relates to the micro shaping device, especially relates to a kind of microarray mould-free forming device based on surface acoustic wave.
Background technology
Along with the progress of science and technology, product constantly develops to microminiaturization.Micro-system is as the research field of multidisciplinary intersection, merge the subjects such as machinery, electronics, material, mechanics, be used widely in fields such as biomedicine, Aero-Space, electronic information, particularly a brand-new technical field and industry have been opened up in the development and application of MEMS (MEMS).Micro-member is as the important component part of micro-system, and its moulding manufacture method is the focus of research always.Micro array structure refers to that the surface has the structure of small boss or dimple array, due to its special surperficial microarray pattern, have the large characteristics of specific area, therefore be applicable to carrier as chemical reaction catalyst with the augmenting response contact area, in addition, surface microarray pattern can produce larger frictional force, therefore is applicable to the extexine as general micro-member, as the extexine of bionics skin.At present, the moulding manufacturing technology of traditional micro-member mainly contains photoetching technique, LIGA technology, ultraprecise micro-machining, fast light curing etc.
Photoetching technique is mainly used in microelectronics.It is generally that semiconductor is processed, and adopts the mask plate of a part printing opacity, obtains the figure the same with mask plate by technology such as exposure, development, etchings.Due to the wearing and tearing of mask plate, the photoetching technique manufacturing life-span is very low, and its processing step is many in addition, and production efficiency is low.
LIGA technique is a kind of MEMS process technology based on the X-ray lithography technology, mainly comprises the X-ray Deep-Etch Synchrotron Radiation Lithography, and electroforming molding and injection molding copy three processing steps.Because X ray has the very high depth of parallelism, extremely strong radiation intensity, continuous spectrum, the 3-D solid structure size that the LIGA technology produces is larger, and precision is higher.But the LIGA technology generally needs special installation and noble metal, and cost is too high, and is time-consuming, and processing step is various.
The ultraprecise micro-machining is the method for utilizing microminiaturized process equipment that workpiece is processed, as little milling machine, little lathe etc.This method is identical with the machining equipment method of operating of macroscopic view, and still this micro-fabrication technology is had relatively high expectations to little manufacturing equipment, and the production cycle is long, and production efficiency is low.
Fast light curing molding method is based on the photocuring principle of liquid photosensitive material, utilizes light to make light-sensitive material generation photochemical reaction in liquid material, produces the fragment with initiating activity, the performed polymer in atarting material and monomer polymerization and crosslinking curing.Its technique is to fill with the liquid photosensitive material in liquid bath, ultraviolet light beam each minute layer cross section information by part under the control of control system is carried out point by point scanning on the light-sensitive material surface, make the material thin-layer that is scanned the zone produce photopolymerization reaction and solidify, form a thin layer of part.After one deck curing is complete, apply the new liquid material of one deck at the material surface that originally was cured, new one deck that solidifies is bonded on front one deck securely again, so repeats to obtain a 3D solid prototype until the manufacturing of whole part is complete.It is a kind of emerging micro shaping method that fast light curing molding method is applied to the micro shaping manufacturing, this forming technique belongs to the material stacking technology, with respect to traditional micro-fabrication technology, this technologic material utilization rate, shaping speed, precision are all higher, therefore adopt the surperficial micro array structure of Stereolithography method manufacturing than traditional micro-fabrication technology, very large advantage to be arranged, but the mode that pointwise, successively scanning are solidified has reduced its production efficiency, has limited development and the application of fast light curing micro shaping method.
Summary of the invention
For overcoming the defective of traditional micro shaping technology and fast light curing molding method, in conjunction with fast light curing molding method, utilize the sound field reflecting of ultrasonic surface wave, the utility model proposes a kind of microarray mould-free forming device based on surface acoustic wave.Utilize the ultrasonic surface wave of high frequency to make the stable sound field of formation in liquid material, liquid material is to produce micro array structure on the surface of liquid material at the interface that contacts with air, regulate amplitude, frequency, the phase place of ultrasonic surface wave, thereby change height, size, the position of microarray, at the desirable microarray pattern of liquid material surface formation, and utilize ultraviolet lamp to carry out illumination curing to the liquid material of moulding.
The technical scheme that its technical problem that solves the utility model adopts is:
The utility model is carved with two pairs of interdigital transducers at foursquare piezoelectric base unit plate glazing, every pair of interdigital transducer is arranged symmetrically with take foursquare piezoelectric base unit plate central shaft as axis, place foursquare glass liquid bath and cementing with the piezoelectric base unit plate in the middle of the piezoelectric base unit plate, be placed in the glass liquid bath by the liquid material of moulding.
In described two pairs of interdigital transducers, one side the every pair of interdigital electrode parallel with piezoelectric base unit panel edges separately post sound-absorbing material.
Described foursquare glass liquid bath is bottomless glass liquid bath, and is cementing by its glass wall and foursquare piezoelectric base unit plate.
The length of side of described foursquare glass liquid bath is less than or equal to the aperture of interdigital transducer.
The beneficial effect that the utlity model has is:
(1) the utility model makes the desirable microarray pattern of liquid material surface formation of moulding by ultrasonic surface wave, and by the UV-irradiation rapid curing, this method is applicable to the surperficial microarray moulding manufacturing of multiple material, comprises resin, coating, printing ink etc.;
(2) utilize the ultrasonic surface wave of high frequency to make the fluent material surface forming, shaping speed is fast, can solidify rapidly by the ultraviolet lighting liquid material, and the whole production process cycle is short, and production efficiency is high;
(3) the utility model device therefor is simple, photoetching interdigital transducer on the piezoelectric base unit plate, and manufacturing process is ripe, uses ultrasonic field to make fluid molding material, do not need mould, so manufacturing cost is lower;
(4) the utility model adopts the Stereolithography method, belongs to the material stacking technology, and with respect to traditional micro-fabrication technology, this technologic material utilization rate is higher.
Description of drawings
Fig. 1 is based on the microarray mould-free forming device schematic diagram of surface acoustic wave.
Fig. 2 is based on the microarray mould-free forming device wiring diagram of surface acoustic wave.
Fig. 3 is that ultrasonic surface wave is propagated schematic diagram in by the fluent material of moulding.
Fig. 4 is the microarray mould-free forming device schematic diagram based on surface acoustic wave after the excitating surface ripple.
Fig. 5 is based on the microarray mould-free forming device of surface acoustic wave and examines under a microscope adjusting figure.
Fig. 6 is solidified schematic diagram by the liquid material of moulding under UV-irradiation.
1. piezoelectric base unit plates in figure, 2. interdigital transducer, 3. glass liquid bath, 4. by the liquid material of moulding, 5. sound-absorbing material, 6. ultrasonic surface wave, 7, compressional wave, 8, Multi-channel signal generator, 9, power amplifier, 10. three-dimensional microscope, 11. ultraviolet lamps.
The specific embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
As shown in Figure 1, the utility model is carved with two pairs of interdigital transducers 2 at foursquare piezoelectric base unit plate 1 glazing, every pair of interdigital transducer 2 is arranged symmetrically with take foursquare piezoelectric base unit plate 1 central shaft as axis, place foursquare glass liquid bath 3 and cementing with piezoelectric base unit plate 1 in the middle of piezoelectric base unit plate 1, be placed in glass liquid bath 3 by the liquid material 4 of moulding.
Described foursquare glass liquid bath 3 is bottomless glass liquid bath, and is cementing by its glass wall and foursquare piezoelectric base unit plate 1, glass liquid bath 3 fill by liquid material 4 thickness of moulding less than or equal to 5mm.
The length of side of described foursquare glass liquid bath 3 is less than or equal to the aperture of interdigital transducer 2.
Microwaviness surface forming manufacturing installation of the present utility model is by piezoelectric base unit plate 1, two pairs of interdigital transducers 2, glass liquid baths 3, formed by the liquid material 4 of moulding.Concrete manufacture method based on the microarray mould-free forming device of surface acoustic wave is as follows:
(1) select 128 ° of lithium niobate (LiNbO that Y-X is tangential
3) as the material of piezoelectric base unit plate 1, the velocity of wave of surface acoustic wave is 3990m/s, with a square piezoelectric base unit plate 1 with piezo-electric effect through surface finish, it is the metal film of 1 micron in its surperficial deposited by electron beam evaporation evaporation a layer thickness, the aluminium film is as the material of metal film, piezoelectric base unit plate 1 material can be lithium niobate, synthetic quartz, lithium tantalate, bismuth germanium oxide etc., and described metal film can be aluminium film, copper aluminum composite membrane, aluminium titanium compound film etc.;
(2) with four mask plates that interdigital pattern is arranged that design and the symmetrical close contact in piezoelectric base unit plate 1 four limits that scribbles photoresist, expose with parallel ultraviolet light, again metal film is carried out etching, make four interdigital transducers that structure is identical, each interdigital transducer has 18 pairs of interdigital electrodes, the electrode width of interdigital electrode, electrode gap equates, be 0.1mm, cycle is 0.4mm, the aperture is 12mm, every pair of interdigital transducer 2 is arranged symmetrically with the parent plate central axis, and post sound-absorbing material 5 be foam glass between four limits of piezoelectric base unit plate 1 and corresponding four interdigital transducers 2,
(3) bottomless thin-walled glass liquid bath 3 length of sides are 10mm, and are bonding by colloid with piezoelectric base unit plate 1, and are placed in the middle of two pairs of interdigital transducers 2;
(4) be mixed equably by 80 parts of performed polymer epoxy resin, 20 parts of diluent n-butyl glycidyl ethers, 3 parts of light trigger mixed type triaryl hexafluorophosphoric acid sulfosalts and 1 part of sensitising agent isopropyl thioxanthone by mass fraction by the liquid material 4 of moulding, the liquid material 4 of the moulding that 1mm is thick is placed in transparent thin-walled glass liquid bath, and described performed polymer can be epoxy resin, coating or printing ink etc.
As Fig. 2, Fig. 3, Fig. 4, Fig. 5 and shown in Figure 6, the microarray Moldless molding method using no mold specific implementation process based on surface acoustic wave of the present utility model is as follows:
(1) as shown in Figure 2, to be placed on the plane of level based on the microarray mould-free forming device of surface acoustic wave, make liquid material 4 liquid levels of moulding smooth, the Multi-channel signal generator 8 that produces rf signal is connected with four interdigital transducers electrodes with power amplifier 9, Multi-channel signal generator 8 produces the signal of telecommunication of alternation, amplify through power amplifier 9, the passage 1 of Multi-channel signal generator 8 wherein, passage 2 respectively with the input channel 1 of power amplifier 9, input channel 2 is connected, the output channel 1 of power amplifier 9, output channel 2 correspondingly is connected with two pairs of interdigital transducers 2, make relative interdigital transducer 2 produce the ultrasonic surface wave that equates, for avoiding line numerous and diverse, the line of interdigital electrode can be welded on a pcb board.
(2) as Fig. 3, shown in Figure 4, open two alternate electrical signals that frequency is 10Mhz-20Mhz of Multi-channel signal generator 8 inputs, alternating signal power through power amplifier 9 outputs is 5-20W, excite respectively two pairs of interdigital transducers 2, form electric field and make the 1 surface generation mechanical oscillation of piezoelectric base unit plate between interdigital electrode, produce the ultrasonic surface wave 6 with Multi-channel signal generator 8 output electrical signals same frequencys, propagate along piezoelectric base unit plate 1 to both sides and produce table ultrasonic surface wave 6, the ultrasonic surface wave 6 of wherein propagating towards the piezoelectric base unit panel edges is absorbed by sound-absorbing material 5, the ultrasonic surface wave 6 of propagating towards piezoelectric base unit plate center has produced a compressional wave 7 when running into by the fluent material 4 of moulding, compressional wave 7 enters by the fluent material 4 of moulding take the refraction angle as θ r, four compressional waves 7 form stable sound field in by the fluent material 4 of moulding, make under the superposition of this sound field by the liquid material 4 stable microarray patterns of surface formation of moulding.
(3) as shown in Figure 5, utilize three-dimensional microscope 10 to observe the pattern of microarray, regulate Multi-channel signal generator 8 and change respectively two frequency f of inputting alternate electrical signals, by formula λ=c/f, in formula, c is velocity of wave, λ is wavelength, correspondingly change the wavelength of ultrasonic surface wave 6, thereby regulator solution surface microarray is at horizontal plane x, size on the y direction, regulate the phase place Φ that Multi-channel signal generator 8 changes respectively two input alternating signals, correspondingly change the phase place of ultrasonic surface wave 6, realize that the liquid surface microarray is at horizontal plane x, movement on the y direction, regulating power amplifier 9 changes the amplitude A of ultrasonic surface wave 6, height corresponding to regulator solution surface microarray, finally make the liquid material 4 required microarray patterns of surface formation of moulding.
(4) as shown in Figure 6, after being regulated by liquid material 4 surface configurations of moulding, adopt ultraviolet lamp 5 to shine 5-10 minute under the power output of 200W-300W, solidified rapidly by the liquid material 4 of moulding.
Two pairs of interdigital transducers of this example can be to size, the position of microarray, highly regulate, and also can be circular layout to interdigital transducer with many, makes the microarray degree of regulation higher.
The above-mentioned specific embodiment is used for the utility model of explaining; rather than the utility model is limited; in the protection domain of spirit of the present utility model and claim, any modification and change to the utility model is made all fall into protection domain of the present utility model.
Claims (4)
1. microarray mould-free forming device based on surface acoustic wave, it is characterized in that: be carved with two pairs of interdigital transducers at foursquare piezoelectric base unit plate (1) glazing, every pair of interdigital transducer is arranged symmetrically with take foursquare piezoelectric base unit plate (1) central shaft as axis, place foursquare glass liquid bath (3) and cementing with piezoelectric base unit plate (1) in the middle of piezoelectric base unit plate (1), be placed in glass liquid bath (3) by the liquid material of moulding (4).
2. a kind of microarray mould-free forming device based on surface acoustic wave according to claim 1 is characterized in that: in described two pairs of interdigital transducers, the every pair of interdigital electrode with piezoelectric base unit plate (1) separately one side the edge parallel post sound-absorbing material (5).
3. a kind of microarray mould-free forming device based on surface acoustic wave according to claim 1, it is characterized in that: described foursquare glass liquid bath (3) is bottomless glass liquid bath, and is cementing by its glass wall and foursquare piezoelectric base unit plate (1).
4. a kind of microarray mould-free forming device based on surface acoustic wave according to claim 1, it is characterized in that: the length of side of described foursquare glass liquid bath (3) is less than or equal to the aperture of interdigital transducer (2).
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| CN 201220703137 CN202986108U (en) | 2012-12-18 | 2012-12-18 | Micro-array mould-free forming device based on surface acoustic wave |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009632A (en) * | 2012-12-18 | 2013-04-03 | 浙江大学 | Microarray die-free forming device based on surface acoustic wave and forming method |
| CN106079439A (en) * | 2016-06-14 | 2016-11-09 | 西安交通大学 | A kind of Meta Materials photocuring printing device utilizing ultrasonic wave added to touch clamping |
| CN109622346A (en) * | 2018-12-20 | 2019-04-16 | 张隆弟 | A kind of novel array structure of ultrasonic transducer |
-
2012
- 2012-12-18 CN CN 201220703137 patent/CN202986108U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103009632A (en) * | 2012-12-18 | 2013-04-03 | 浙江大学 | Microarray die-free forming device based on surface acoustic wave and forming method |
| CN103009632B (en) * | 2012-12-18 | 2015-03-18 | 浙江大学 | Microarray die-free forming device based on surface acoustic wave and forming method |
| CN106079439A (en) * | 2016-06-14 | 2016-11-09 | 西安交通大学 | A kind of Meta Materials photocuring printing device utilizing ultrasonic wave added to touch clamping |
| CN109622346A (en) * | 2018-12-20 | 2019-04-16 | 张隆弟 | A kind of novel array structure of ultrasonic transducer |
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