CN202167539U - LED support and LED - Google Patents
LED support and LED Download PDFInfo
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- CN202167539U CN202167539U CN2011202706196U CN201120270619U CN202167539U CN 202167539 U CN202167539 U CN 202167539U CN 2011202706196 U CN2011202706196 U CN 2011202706196U CN 201120270619 U CN201120270619 U CN 201120270619U CN 202167539 U CN202167539 U CN 202167539U
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Abstract
The utility model discloses an LED support and an LED. The LED support includes a first electrode plate, a second electrode plate and a die bond metal plate. The first electrode plate, the second electrode plate and the die bond metal plate are disposed in a pedestal separately. The die bond metal plate is provided with a die bond area used for fixing an LED chip. A first wire bonding area and a second wire bonding area are arranged respectively on a first metal plate and a second metal plate. Thus, the arrangement of the wire bonding areas is not restricted by the die bond area and the wire bonding area can be arranged in positions far from an LED solder tin pin as much as possible. An end of the die bond metal plate protrudes out of the pedestal and can conduct heat generated by the die bond area timely. Thus, the length of paths through which the heat generated by welding the LED solder tin pin is transmitted to the welding areas is long and the paths for heat transmission are few. As a result, the heat transmitted to the welding areas is limited, thereby avoiding welding spots in the wire welding area from forming insufficient solder or lead disconnection because of high temperature. The die bond metal plate can conduct the heat generated by the chip out timely. Therefore, the LED in the utility model has high luminous efficiency, good reliability and stable performance.
Description
Technical field
The utility model relates to field of photoelectric technology, is specifically related to a kind of LED (light-emitting diode) support and LED.
Background technology
Because multiple advantages such as light-emitting diode has high security, operates steadily, low energy consumption, high light efficiency, life-span are long are applied to panel computer, notebook computer, LCD, large scale liquid crystal TV and room lighting and outdoor lighting field more and more widely.See also a kind of existing led support shown in Figure 1; Comprise base 1; Base 1 is provided with cavity 2, also comprises cathode metal pole piece 3 and negative pole metal pole piece 4, and cathode metal pole piece 3 comprises anodal pin 30 and two first wire welding areas 31; Negative pole metal pole piece 4 comprises negative pole pin 40, second wire welding area 41 and is used for fixing the crystal bonding area 42 of LED luminescence chip, and the crystal bonding area 42 and second wire welding area boundlessness that is connected together is distinguished.Crystal bonding area 42 is horizontally disposed with near first wire welding area 31.
See also Fig. 2, during welding, earlier LED luminescence chip 5 is placed in crystal bonding area 42,51 respectively the two poles of the earth of LED luminescence chip 5 are drawn with lead-in wire 52 and to be welded on first wire welding area 31 and second wire welding area 41 through going between then.Adopt this mode can have following problem: boundlessness is distinguished because the crystal bonding area 42 and second wire welding area 41 are connected together; Cause second wire welding area 41 too near negative pole pin 40; Client's heat that (comprising negative pole pin 40) produces when the scolding tin pin of welding LED can be delivered to the solder joint in second wire welding area 41 rapidly; Cause this solder joint to come off and form the phenomenon of rosin joint, thereby influence the reliability of LED.
In addition, because the heat radiation of crystal bonding area 42 can only be derived through negative pole pin 40, area of dissipation is little, and the heat build-up that is prone to led chip is produced causes LED to go out a light decay, shortens the useful life of LED.
See also Fig. 3 and Fig. 4, therefore consistent among the crystal bonding area among Fig. 3, Fig. 4 and the setting of each wire welding area and Fig. 1 and Fig. 2 can exist the problems referred to above too in welding process.
The utility model content
The technical problem underlying that the utility model will solve is, the led support of a kind of good reliability, stable performance, long service life is provided and has the LED of this support.
For solving the problems of the technologies described above, the utility model provides a kind of led support, comprises the base that has cavity, and first electrode slice of separate setting in said base, second electrode slice and solid brilliant sheet metal; Said first electrode slice comprises first wire welding area that is laid in the said base and first pin that stretches out said base; Said second electrode slice comprises second wire welding area that is laid in the said base and second pin that stretches out said base; Said solid brilliant sheet metal is provided with the crystal bonding area that is used for fixing luminescence chip, and said solid at least one end of brilliant sheet metal extends said base, and extends at least one end and said first pin or the second pin homonymy in each end of said base.
In a kind of embodiment of the utility model, said solid brilliant sheet metal has only an end to extend said base.
In a kind of embodiment of the utility model, said solid brilliant sheet metal has two ends to extend said base.
In a kind of embodiment of the utility model, said solid brilliant sheet metal extends a wherein end and said first pin or the second pin homonymy of said base, and the other end and said first pin and second pin be homonymy not.
In a kind of embodiment of the utility model, said solid brilliant sheet metal extends a wherein end and the said first pin homonymy, the other end and the said second pin homonymy of said base.
In a kind of embodiment of the utility model; Said solid brilliant sheet metal is between said first electrode slice and said second electrode slice; Or said first electrode slice and said second electrode slice be arranged at a side of said base, and said solid brilliant sheet metal is positioned at said first electrode slice or/and the relative opposite side of second electrode slice.
In a kind of embodiment of the utility model; Said first electrode slice comprises first matrix that is hidden in the said base; Said first wire welding area extends from said first matrix protrusion, and the connecting portion of said first wire welding area and said first matrix is entered to the external concave of said base;
Or/and said second electrode slice comprises second matrix that is hidden in the said base, said second wire welding area extends from said second matrix protrusion, and the connecting portion of said second wire welding area and said second matrix is entered to the external concave of said base.
The utility model also provides a kind of LED; Comprise luminescence chip and like each described led support of claim 1-8; Said luminescence chip is fixed in said crystal bonding area, and two electrodes of said luminescence chip are connected with said second wire welding area with said first wire welding area respectively through lead-in wire.
In a kind of embodiment of the utility model, said luminescence chip level or vertical is fixed in said crystal bonding area.
The beneficial effect of the utility model is: first electrode slice in the utility model, second electrode slice and solid separate being arranged in the base of brilliant sheet metal; Gu brilliant sheet metal comprises the crystal bonding area that is laid in the base, is used for fixing luminescence chip; And first wire welding area and second wire welding area are arranged at respectively on first electrode slice and second electrode slice; Be to be separate, discrete distribution between crystal bonding area and each wire welding area, so the setting of each wire welding area can not receive the restriction of crystal bonding area, can be arranged on position as much as possible away from LED scolding tin pin; It is more existing little many that the width of the connecting portion between each wire welding area and the corresponding with it LED scolding tin pin also can be provided with; Therefore weld each wire welding area path length of heat transferred of the scolding tin pin generation of LED, and the path that can transmit is few, the heat that can be transferred to wire welding area is limited; Avoid solder joint Yin Gaowen in the wire welding area formation rosin joint that comes off, or cause lead-in wire to break off.Therefore the reliability of the LED that provides of the utility model and the LED that has this led support is high, stable performance.
In addition, owing to be specifically designed to solid brilliant sheet metal and first electrode slice and the separate setting of second electrode slice that crystal bonding area is set, can reach thermoelectric effect of separating; Its at least one end extends base 2, and stretches out at least one end and first pin or the second pin homonymy that extends in each end of base, and does not take a side of base separately; Can be convenient to the installation setting of LED; Also can well cooperate, improve radiating efficiency greatly, and then improve the efficient of giving out light of LED with the heat abstractor that client is provided with; The light decay of avoiding Yin Gaowen to cause can prolong useful life of the LED that has this led support.
Description of drawings
Fig. 1 is a kind of led support structural representation of the utility model;
Fig. 2 is the sketch map of welding led chip in support shown in Figure 1;
Fig. 3 is the another kind of led support structural representation of the utility model;
Fig. 4 is the sketch map of welding led chip in support shown in Figure 3;
Fig. 5 is the led support structural representation one of a kind of embodiment of the utility model;
Fig. 6 is the led support structural representation two of a kind of embodiment of the utility model;
Fig. 7 is the led support structural representation three of a kind of embodiment of the utility model;
Fig. 8 is the led support structural representation four of a kind of embodiment of the utility model;
Fig. 9 is the led support structural representation five of a kind of embodiment of the utility model;
Figure 10 is the sketch map of welding led chip in support shown in Figure 8.
Embodiment
The utility model is through being provided with crystal bonding area and each wire welding area separately; Each wire welding area is separated with crystal bonding area to reach the purpose that thermoelectricity separates; Thereby the setting that makes each wire welding area does not receive the restriction of crystal bonding area; Can be arranged on position, cause the interior solder joint of wire welding area to come off when preventing to weld LED scolding tin pin and cause rosin joint or lead-in wire to break off, improve the reliability and stability of LED away from LED scolding tin pin.Crystal bonding area separates the heat radiation that independent setting also is beneficial to LED, avoids led chip Yin Gaowen and the light decay phenomenon occurs, and then prolong the useful life of LED.Combine accompanying drawing that the utility model is done further explain through embodiment below.
Led support in this example comprises the base that has cavity, and first electrode slice of separate setting in base, second electrode slice and solid brilliant sheet metal; Wherein, first electrode slice comprises first wire welding area that is laid in the base and first pin of protuberate basic unit; Second electrode slice comprises second wire welding area that is laid in the base and second pin of protuberate basic unit; Gu brilliant sheet metal is provided with the crystal bonding area that is used for fixing luminescence chip (being led chip); Gu and at least one end protuberate basic unit of brilliant sheet metal; So that timely the heat in the crystal bonding area is derived; Solid simultaneously brilliant sheet metal extends at least one end and first pin or the second pin homonymy in each end of base, also is beneficial to the heat abstractor of client setting and matches, with further raising radiating efficiency.
Above-mentioned first pin and second pin in this example can lay respectively at the relative both sides of base, for example can lay respectively at the horizontal both sides of base; When the solid brilliant sheet metal in this example has only an end to extend protuberate basic unit, this end can with first pin or the second pin homonymy, the external part of promptly solid brilliant sheet metal can be positioned at the horizontal any side of base.This moment, solid brilliant sheet metal can be located between first electrode slice or second electrode slice; Gu brilliant sheet metal also can be arranged on a side different with second electrode slice with first electrode slice, for example, can first electrode slice and second electrode slice be arranged on the same side, Gu brilliant sheet metal can be arranged on second electrode slice or/and the relative opposite side of first electrode slice.
But base can be all extended at the solid brilliant sheet metal two ends in this example, so that the heat of crystal bonding area generation is derived from both direction timely, the heat build-up of avoiding led chip to produce causes its luminous efficiency to descend, and light decay is serious and then shorten its useful life.
When solid brilliant sheet metal has two ends to extend base; Above-mentioned first pin and second pin can lay respectively at the relative both sides of base; Gu the extended end of brilliant sheet metal and the first pin homonymy; The extended other end can with the second pin homonymy, this moment, solid brilliant sheet metal also can be located between first electrode slice and second electrode slice; Or first electrode slice and second electrode slice be arranged at a side of base, solid brilliant sheet metal is arranged at first electrode slice or/and the relative opposite side of second electrode slice.
Certainly, when solid brilliant sheet metal has two ends to extend base, also can select the end and first pin or the second pin homonymy that stretch out in this example, the other end that stretches out and first pin and second pin be homonymy not.
It should be noted that; Also, groove covers the area in the base on first electrode slice in this example to reduce first electrode slice through being set; Thereby increase the contact area of packaging plastic and base bottom; What make packaging plastic and base combines more firmly, has also reduced the path of heat to the wire welding area transmission simultaneously, and the face packaging plastic is loosening to be caused when welding LED because of the metal heated phenomenon that causes solder joint to come off of being prone to thereby keep away.Concrete; First electrode slice in this example also comprises first matrix that is hidden in the base; First wire welding area extends from first matrix protrusion; The connecting portion of first wire welding area and first matrix is entered to the external concave of said base, can in the reliable soldering that guarantees first wire welding area, reduce the area of first wire welding area.
Equally; This example also can be chosen in similar groove is set on second electrode slice; Second electrode slice also comprises second matrix that is hidden in the base; Second wire welding area extends from second matrix protrusion, and second wire welding area is stated the connecting portion of second matrix and entered to the external concave of base, can in the reliable soldering that guarantees second wire welding area, reduce the area of second wire welding area.
Preferably, this example all is provided with above-mentioned groove on first electrode slice and second electrode slice, with the contact area of maximized increase packaging plastic and base, and the conducting path of the heat that produces during less welding external pin.
The luminescence chip of LED is fixed in the above-mentioned crystal bonding area in this example; Two electrodes of luminescence chip are connected with second wire welding area with first wire welding area respectively through lead-in wire; But and luminescence chip level in this example or vertical being fixed in the crystal bonding area; To guarantee under any circumstance to make luminescence chip can both be positioned at the center of support, guarantee that further color and brightness that LED is luminous are even.
First electrode slice in this example and second electrode slice all can be used as the negative or positive electrode metal pole piece that cooperates with the both positive and negative polarity of led chip, are that cathode metal pole piece, second electrode slice are that negative pole metal pole piece is that example further specifies with first electrode slice in this example.First wire welding area on the corresponding cathode metal pole piece matches with the anodal pin of led chip, and first pin is anodal pin, and second wire welding area on the negative pole metal pole piece matches with the negative pole pin of LED, and second pin is the negative pole pin; Below in conjunction with accompanying drawing the utility model is done detailed explanation.
Please refer to Fig. 5; This support that illustrates comprises the base 1 that has cavity 2; Separate being provided with cathode metal pole piece 3, negative pole metal pole piece 4 and consolidating brilliant sheet metal 6 in base 1, an end of cathode metal pole piece 3 and negative pole metal pole piece 4 protuberate basic units 1 is respectively anodal pin 30 and negative pole pin 40; Cathode metal pole piece 3 and negative pole metal pole piece 4 all are arranged on the left side of base 1; Gu brilliant sheet metal 6 is located at the right side of base 1; Gu the crystal bonding area 61 of brilliant sheet metal 6 left ends is between first wire welding area 31 and second wire welding area 41; Right-hand member protuberate basic unit 1 to be conducting the heats that produce in the crystal bonding area 61 timely, and right-hand member stretches out also and can cooperate with the heat abstractor that client is provided with easily, with the raising radiating efficiency.
Cathode metal pole piece 3 among Fig. 5 comprises a groove 32 and groove 42 to the external concave of base 1 respectively with negative pole metal pole piece 4; Groove 32 is formed by the connecting portion that first wire welding area 31 and cathode metal pole piece 3 are hidden between first matrix in the base, and first wire welding area 31 extends from first matrix protrusion.Groove 42 is formed by the connecting portion that second wire welding area 41 and negative pole metal pole piece 4 are hidden between second matrix in the base, and second wire welding area 41 extends from second matrix protrusion.The setting of groove 32 and groove 42 can reduce the area of cathode metal pole piece 3 and negative pole metal pole piece 4 covering bases 1; Because the adhesion of the PPA of packaging plastic and base is a lot of by force than the adhesion of metal pole piece; Therefore increase it and combine more reliably, also can reduce heat simultaneously to path that wire welding area transmits with the bonded area of base 1 can make packaging plastic and base 1.
See also Fig. 6; The solid brilliant sheet metal 6 that this illustrates still has only an end (being right-hand member) protuberate basic unit 1; The crystal bonding area 61 of its left end is also between first wire welding area 31 and second wire welding area 41; The maximum difference of itself and Fig. 5 medium-height trestle is that the anodal pin 30 of cathode metal pole piece 3 is positioned at the left side of base, and the negative pole pin 40 of negative pole metal pole piece 4 is positioned at the right side of base 1.An end that is negative pole pin 40 and solid brilliant sheet metal 6 protuberate basic units 1 is in the same side.An end of solid brilliant sheet metal 6 protuberate basic units 1 also can be arranged on the left side of base 1 among Fig. 6, promptly with anodal pin 30 homonymies.
See also Fig. 7; The solid brilliant sheet metal 6 that this illustrates still has only an end (being left end) protuberate basic unit 1; The crystal bonding area 61 of its right-hand member and first wire welding area 31 and second wire welding area 41 are oppositely arranged; The difference of itself and Fig. 6 medium-height trestle also is, cathode metal pole piece 3 and negative pole metal pole piece 4 all are arranged on the front side of base.And the rear side that solid brilliant sheet metal 6 is arranged on base 1 is relative with cathode metal pole piece 3.Also can be arranged on base 1 rear side relative with negative pole metal pole piece 4 for solid brilliant sheet metal 6 among Fig. 7, and consolidate the right-hand member protuberate basic unit 1 of brilliant sheet metal 6 this moment, and crystal bonding area 61 just is arranged on the right-hand member of solid brilliant sheet metal 6.
Fig. 5-7 is that the end protuberate basic unit 1 with solid brilliant sheet metal 6 be the explanation that example is done the utility model, is that example further specifies the utility model with the two ends protuberate basic unit 1 of consolidating brilliant sheet metal 6 below:
See also Fig. 8; Among this figure solid brilliant sheet metal 6 about end extend out to the left and right sides of base 1 respectively; Gu and the right-hand member of brilliant sheet metal 6 is positioned at the rear end on the right side of base 1; Gu the left end of brilliant sheet metal 6 is positioned at the front end in the left side of base 1, the left and right sides that the anodal pin 30 of cathode metal pole piece 3 and negative pole metal pole piece 4 and negative pole pin 40 lay respectively at base 1, the two concrete distributing position is opposite with the left and right two ends distribution position of solid brilliant sheet metal 6.Crystal bonding area 61 is arranged at the zone line of solid brilliant sheet metal 6; Crystal bonding area 61 is between first wire welding area 31 and second wire welding area 41; The size of crystal bonding area 61 allows luminescence chip level or vertical setting; To guarantee under any circumstance to make luminescence chip can both be positioned at the center of support, guarantee that LED luminous color and brightness are even.
When the two ends of solid brilliant sheet metal 6 all during protuberate basic unit 1; Cathode metal pole piece 3 and negative pole metal pole piece 4 also can be arranged at the same side of base; See also Fig. 9, cathode metal pole piece 3 and negative pole metal pole piece 4 all are provided with the front side with base 1, Gu brilliant sheet metal 6 is arranged at the rear side of base 1; The anodal pin 30 and the negative pole pin 40 of cathode metal pole piece 3 and negative pole metal pole piece 4 lays respectively at the left and right sides of base 1, and all respectively near the front end of the left and right sides of base 1.Gu the right ends of brilliant sheet metal 6 is then distinguished the left and right sides of protuberate basic unit 1, and lay respectively at the rear end of base 1 left back both sides.
The concrete distributed and arranged of solid brilliant sheet metal 6, cathode metal pole piece 3 and negative pole metal pole piece 4 can specifically be selected according to actual conditions in this example, is not only a limitation and an above-mentioned mode that respectively illustrates.For example; In Fig. 9; Can be with consolidating brilliant sheet metal 6 clockwise or be rotated counterclockwise 90 degree; Make its two ends extend out to the both sides, front and back of base 1 respectively, and the position of corresponding adjustment cathode metal pole piece 3 and negative pole metal pole piece 4, crystal bonding area 61 is got final product between first wire welding area 31 and second wire welding area 41.
Can know that to sum up the crystal bonding area in the led support that the utility model provides is arranged with each wire welding area branch, separate to reach thermoelectric; Make the setting of each wire welding area not receive the restriction of crystal bonding area, avoid wire welding area, and then can prolong and reduce when welding LED heat delivered to the path of wire welding area too near LED scolding tin pin; Avoid the solder joint Yin Gaowen of wire welding area to come off, simultaneously, crystal bonding area and each wire welding area branch heat of also being more convenient in the crystal bonding area that is arranged is in time derived; Cooperate with the heat abstractor that client is provided with easily,, improve radiating efficiency with further increase area of dissipation; The light decay of avoiding high temperature to cause, the physical life of prolongation LED.
Be that example further specifies with welding process shown in Figure 10 below.
See also Figure 10, during welding, earlier with luminescence chip 5 levels or vertical being placed in the crystal bonding area 6, luminescence chip 5 is positioned at the centre of support, to guarantee the uniformity of color and brightness, improves the performance of LED.Select horizontal positioned in this example.Be connected to second wire welding area through 51 the negative poles that go between then and weld, be connected to first wire welding area through 52 the positive poles that go between and weld luminescence chip with luminescence chip.When client is welded two scolding tin pins of LED; First wire welding area 31 and the distance more existing length of second wire welding area 41 between anodal pin 30 and negative pole pin 40 many; Therefore and the setting of pole piece upper groove has also reduced the path of heat delivered greatly in this example, welds heat transferred that the scolding tin pin of LED the produces path length to first wire welding area 31 and second wire welding area 41, and transmission path is few; The heat that can be transferred to is limited; Avoid the solder joint Yin Gaowen in the wire welding area to come off, simultaneously, the heat that crystal bonding area produces also can be directly by at the bottom of the two ends of consolidating brilliant sheet metal 6 and the client heat dissipating layer support export cavity that cooperates with two ends.Guarantee the welding quality of the solder joint in each wire welding area, thereby improved the reliability of LED.The lifting of radiating efficiency has then guaranteed the luminous efficiency of luminescence chip, prolongs the physical life of LED.
Above content is the further explain that combines concrete execution mode that the utility model is done, and can not assert that the practical implementation of the utility model is confined to these explanations.For the those of ordinary skill of technical field under the utility model, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be regarded as belonging to the protection range of the utility model.
Claims (10)
1. a led support is characterized in that, comprises the base that has cavity, and first electrode slice of separate setting in said base, second electrode slice and solid brilliant sheet metal; Said first electrode slice comprises first wire welding area that is laid in the said base and first pin that stretches out said base; Said second electrode slice comprises second wire welding area that is laid in the said base and second pin that stretches out said base; Said solid brilliant sheet metal is provided with the crystal bonding area that is used for fixing luminescence chip, and said solid at least one end of brilliant sheet metal extends said base, and extends at least one end and said first pin or the second pin homonymy in each end of said base.
2. support as claimed in claim 1 is characterized in that, said solid brilliant sheet metal has only an end to extend said base.
3. support as claimed in claim 1 is characterized in that, said solid brilliant sheet metal has two ends to extend said base.
4. support as claimed in claim 3 is characterized in that, said solid brilliant sheet metal extends a wherein end and said first pin or the second pin homonymy of said base, and the other end and said first pin and second pin be homonymy not.
5. support as claimed in claim 3 is characterized in that, said solid brilliant sheet metal extends a wherein end and the said first pin homonymy, the other end and the said second pin homonymy of said base.
6. like each described support of claim 1-5; It is characterized in that; Said solid brilliant sheet metal is between said first electrode slice and said second electrode slice; Or said first electrode slice and said second electrode slice be arranged at a side of said base, and said solid brilliant sheet metal is positioned at said first electrode slice or/and the relative opposite side of second electrode slice.
7. like each described support of claim 1-5; It is characterized in that; Said first electrode slice comprises first matrix that is hidden in the said base; Said first wire welding area extends from said first matrix protrusion, and the connecting portion of said first wire welding area and said first matrix is entered to the external concave of said base;
Or/and said second electrode slice comprises second matrix that is hidden in the said base, said second wire welding area extends from said second matrix protrusion, and the connecting portion of said second wire welding area and said second matrix is entered to the external concave of said base.
8. support as claimed in claim 6 is characterized in that, said solid brilliant sheet metal extends a wherein end and the said first pin homonymy, the other end and the said second pin homonymy of said base.
9. LED; It is characterized in that; Comprise luminescence chip and like each described led support of claim 1-8, said luminescence chip is fixed in said crystal bonding area, two electrodes of said luminescence chip are connected with said second wire welding area with said first wire welding area respectively through lead-in wire.
10. LED as claimed in claim 9 is characterized in that, said luminescence chip level or vertical is fixed in said crystal bonding area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202706196U CN202167539U (en) | 2011-07-28 | 2011-07-28 | LED support and LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202706196U CN202167539U (en) | 2011-07-28 | 2011-07-28 | LED support and LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202167539U true CN202167539U (en) | 2012-03-14 |
Family
ID=45803347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202706196U Expired - Lifetime CN202167539U (en) | 2011-07-28 | 2011-07-28 | LED support and LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202167539U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594605A (en) * | 2013-11-05 | 2014-02-19 | 广东长盈精密技术有限公司 | LED photoelectric component |
| WO2016078051A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| WO2016078052A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| CN106997918A (en) * | 2017-05-26 | 2017-08-01 | 厦门市东太耀光电子有限公司 | A kind of LED chip front pad structure |
| CN107946432A (en) * | 2017-12-13 | 2018-04-20 | 博罗县正润光电有限公司 | One kind is molded uniform LED support |
-
2011
- 2011-07-28 CN CN2011202706196U patent/CN202167539U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594605A (en) * | 2013-11-05 | 2014-02-19 | 广东长盈精密技术有限公司 | LED photoelectric component |
| WO2016078051A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| WO2016078052A1 (en) * | 2014-11-20 | 2016-05-26 | 史利利 | Led support and led light emitting unit |
| CN106997918A (en) * | 2017-05-26 | 2017-08-01 | 厦门市东太耀光电子有限公司 | A kind of LED chip front pad structure |
| CN107946432A (en) * | 2017-12-13 | 2018-04-20 | 博罗县正润光电有限公司 | One kind is molded uniform LED support |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120314 |
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| CX01 | Expiry of patent term |