CN202094093U - Substrate cleaning equipment - Google Patents
Substrate cleaning equipment Download PDFInfo
- Publication number
- CN202094093U CN202094093U CN 201020632867 CN201020632867U CN202094093U CN 202094093 U CN202094093 U CN 202094093U CN 201020632867 CN201020632867 CN 201020632867 CN 201020632867 U CN201020632867 U CN 201020632867U CN 202094093 U CN202094093 U CN 202094093U
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- water
- water tank
- sidewall
- substrate cleaning
- tank
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Abstract
The utility model discloses substrate cleaning equipment, which comprises a water tank, wherein the water tank is provided with a water inlet through which purified water and circulating water enter, a water outlet through which the purified water and the circulating water are drained, an overflowing mechanism for overflowing when the limit of a liquid surface is surpassed and a water pumping port for supplying water for cleaning two fluids; the water inlet, the water pumping port and the overflowing mechanism are arranged on the side wall of the water tank respectively; and the water outlet is formed at the bottom of the water tank. In the substrate cleaning equipment provided by the utility model, the water flow direction inside the water tank is changed by changing the position of the water inlet, so that automatic and circular flushing of dirt on the side wall and at the bottom of the water tank with water inside the water tank is realized, the quality of water in the cleaning equipment is kept in the production process, the cleaning degree of a glass substrate is increased, and the adherence of a photoresist and a membrane is ensured.
Description
Technical field
The utility model relates to the manufacturing equipment structure technology of LCD, relates in particular to a kind of substrate cleaning apparatus.
Background technology
LCD is a flat-panel monitor commonly used at present, and wherein (ThinFilm Transistor Liquid Crystal Display is called for short: TFT-LCD) be the main product in the LCD Thin Film Transistor-LCD.In the manufacture process of TFT-LCD, pollutant can cause a lot of products bad, therefore, cleaning equipment is used each link in production process widely, for example: clean before the film forming, photoresist cleaning before applying or the like, what TFT-LCD extensively adopted at present is four masking process, and this technical process is higher to the removal requirement of pollutant, and this just has higher requirement to cleaning equipment.
Existing substrate cleaning apparatus cisten mechanism as shown in Figure 1, the top of water tank is provided with water inlet A, the water tank bottom edge is provided with discharge outlet B, the pump mouth D that a sidewall of water tank is provided with the C of spilling water mechanism and cleans for two fluids.The pure water of initially packing in the water tank is extracted out through being used for two fluids cleaning (mixing that is pressure-air and water under high pressure is cleaned) or recirculated water after the filter filtration from pump mouth D and is cleaned, and the water after two fluids clean enters water tank from water inlet A and is recycled.
Yet, in the existing substrate cleaning apparatus, water mobile relatively poor, and the water that enters water tank is the sewage behind the cleaning base plate, along with the equipment growth of service time, the gathering of pollutant appears in tank inner wall and bottom easily, influences circulating water quality.And existing cleaning equipment is in service automatically, can only discharge the current on upper strata in the water tank by gap, current to tank inner wall and bottom can only manually regularly change water and cleaning, thereby can not guarantee to clean in the production process water quality in the water tank, cause to clean glass substrate, cause photoresist and membranous adherence bad.
The utility model content
The utility model provides a kind of substrate cleaning apparatus, can not guarantee the water quality in the cleaning equipment in the production process in order to solve existing substrate cleaning apparatus, causes cleaning glass substrate, causes photoresist and the bad defective of membranous adherence.
The utility model provides a kind of substrate cleaning apparatus, comprise: the discharge outlet that water tank, described water tank be provided with the water inlet that enters for pure water and recirculated water, discharge for pure water and recirculated water, when the feed flow face transfinites spilling water spilling water mechanism and be that two fluids clean the pump mouth that supplies water; Described water inlet, described pump mouth and described spilling water mechanism are separately positioned on the sidewall of described water tank, and described discharge outlet is arranged on the bottom of described water tank.
Aforesaid substrate cleaning apparatus, described discharge outlet is arranged on the bottom of described water tank, and the sidewall at close described water inlet place.
Aforesaid substrate cleaning apparatus, described discharge outlet is arranged on the bottom center of described water tank.
Aforesaid substrate cleaning apparatus also is provided with another water inlet on the sidewall adjacent with described water inlet place sidewall.
Aforesaid substrate cleaning apparatus also is provided with another water inlet on the sidewall relative with described water inlet place sidewall.
Aforesaid substrate cleaning apparatus, described spilling water mechanism is the gap that is arranged on sidewall of described water tank, perhaps for being arranged on the liquid level sensor on the described tank inner wall.
Substrate cleaning apparatus as mentioned above, described discharge outlet place is provided with a valve.
The substrate cleaning apparatus that the utility model provides, change the water (flow) direction of water tank inside by the position that changes water inlet, thereby the water Automatic Cycle that realizes water tank inside is washed away the dirt of water tank sidewall and bottom, kept the water quality in the cleaning equipment in process of production, improve the wash degree of glass substrate, thereby guaranteed photoresist and membranous adherence.
Description of drawings
Fig. 1 is the structural representation of existing substrate cleaning apparatus water tank;
The structural representation of substrate cleaning apparatus first embodiment that Fig. 2 provides for the utility model;
The structural representation of substrate cleaning apparatus second embodiment that Fig. 3 provides for the utility model;
The structural representation of substrate cleaning apparatus the 3rd embodiment that Fig. 4 provides for the utility model.
Reference numeral:
The I-water tank; The A-water inlet; A '-water inlet;
The B-discharge outlet; C-spilling water mechanism; The D-pump mouth;
The E-liquid level sensor.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model embodiment clearer, below in conjunction with the accompanying drawing among the utility model embodiment, technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment one
The structural representation of substrate cleaning apparatus first embodiment that Fig. 2 provides for the utility model, as shown in Figure 2, this cleaning equipment comprises: the discharge outlet B that water tank I, this water tank I be provided with the water inlet A that enters for pure water and recirculated water, discharge for pure water and recirculated water, when the feed flow face transfinites spilling water the C of spilling water mechanism and be that two fluids clean the pump mouth D that supplies water; Water inlet A, pump mouth D and the C of spilling water mechanism are separately positioned on the sidewall of water tank I, and discharge outlet B is arranged on the bottom of water tank I.
The substrate cleaning apparatus that present embodiment provides, change the water (flow) direction of water tank inside by the position that changes water inlet, thereby the water Automatic Cycle that realizes water tank inside is washed away the dirt of water tank sidewall and bottom, kept the water quality in the cleaning equipment in process of production, improve the wash degree of glass substrate, thereby guaranteed photoresist and membranous adherence.
Wherein, the water of initially packing among the water tank I is pure water, after pure water enters water tank I from water inlet A, is extracted out by high-pressure pump from pump mouth D, and after filtering through high pressure filter, water under high pressure and pressure-air form two fluids, spray on the substrate.Mixed pollutant or impurity in the water after the cleaning, these water are through being carried back water inlet A to carry out recycling again.Therefore, the water that enters the water tank I from water inlet A is formed by pure water with to the recirculated water after the substrate cleaning.
The water yield of packing among the water tank I is determined according to the water yield of needs in the substrate cleaning process; because the water yield in the water tank I is unfavorable for circulating of water when too big; therefore; usually the water yield in the water tank I can be arranged in certain scope; and the position of the C of spilling water mechanism is also limited according to the maximum amount of water of water tank I and is set; when the water yield in the water tank I surpasses set point; water overflows automatically from the C of spilling water mechanism; thereby keep the water yield in the water tank I all the time in reasonable range, prevent hypervolia in the water tank I and cause damage.And can be with part pollutant on the water surface and impurity band water tank I in the process that water overflows, therefore, the C of spilling water mechanism has also played the effect of blowdown to a certain extent.
Water inlet A, the C of spilling water mechanism and pump mouth D are separately positioned on the sidewall of water tank I, and the C of spilling water mechanism is positioned at pump mouth D top, and discharge outlet B is arranged on the bottom of water tank I.After recirculated water enters water tank I from water inlet A, the direction of current is shown in dotted line among Fig. 2 and arrow, because water inlet A is arranged on the sidewall of water tank I, and the current that enter water tank I have certain pressure, therefore, after current enter water tank, its sidewall that flows to direction and water tank I is vertical, promptly flows to the sidewall relative with water inlet A, when current touch the sidewall relative with water inlet A, current are through after the of short duration motion vertically downward, and resilience is to the sidewall at water inlet A place.
As can be seen, recirculated water after treatment is after water inlet A water tank inlet I, its movement locus be followed successively by water inlet A place sidewall to relative sidewall direction, vertical downward direction and relative sidewall to water inlet A place sidewall direction, and in this process current the flow through inwall of two vertical water tank I of water inlet A place sidewall and the bottom of water tank I, and touch water inlet A place sidewall and relative sidewall, promptly spreaded all over the inside of water tank I.Therefore, use equipment carries out in the process that substrate cleans, and current are washing away each sidewall and the bottom of water tank I all the time, and the pollutant of each inwall and bottom is washed into water tank I bottom, by water (flow) direction as can be seen, pollutant can accumulate in discharge outlet B near.
After equipment uses a period of time, open discharge outlet B, each sidewall of water tank I and the pollutant of bottom can be discharged water tank I.Realization is washed away the water circulation in the water tank I, prevents that pollutant is attached to sidewall or the bottom of water tank I, causes secondary pollution.
Embodiment two
Referring to Fig. 3, on the basis of last embodiment, the C of spilling water mechanism can be for being arranged on the gap on sidewall of water tank I, when the water yield in the water tank I surpasses set point, water overflows automatically from gap, thereby keeps the interior water yield of water tank I all the time in reasonable range.
As another kind of preferred implementation, the C of spilling water mechanism can also be the liquid level sensor E that is provided with on the water tank I inwall, E detects water surface elevation by liquid level sensor, when water surface elevation is higher than set point, the discharge outlet B that opens water tank I bottom discharges certain water yield, thereby the water yield in the water tank I is remained in the reasonable range.
Adopt the mode of liquid level sensor E, script can be discharged by lower drain port B from the water that the gap on the sidewall overflows, be deposited on the just easier discharge of pollutant of water tank bottom like this.In addition, in actual use, because water is from the process that gap overflows, because there is certain pressure in water, therefore the water that overflows from gap can clash near the inwall the gap, and this bump can cause the fluctuation of the water surface, thereby influences the speed that water overflows.Therefore, can only adopt liquid level sensor E to control water surface elevation, the control that makes water surface elevation is more steadily with accurate.
In addition,, can one valve be set, control the water yield and the water velocity that discharge outlet B flows out by this valve at discharge outlet B place for the water yield of discharging in the water tank I is controlled.This valve can adopt all kinds such as mechanical valve, electronic valve or combination valve, when the angle of valve open is big, can realize that water flows out water tank I apace, thereby makes the water of water tank inside wash away the bottom of water tank I fast, more helps the discharge of pollutant.When the angle of valve open hour, water flows out water tank I lentamente, thereby can control the water surface elevation in the water tank I more accurately.
Discharge outlet B can be arranged on the bottom of water tank I, and sidewall near water inlet A place, it is situation shown in Figure 2, recirculated water after water inlet A water tank inlet I, its movement locus be followed successively by water inlet A place sidewall to relative sidewall direction, vertical downward direction and relative sidewall to water inlet A place sidewall direction.Because discharge outlet B is near the sidewall at water inlet A place, therefore, recirculated water has almost spreaded all over the inside of water tank I.After equipment uses a period of time, open discharge outlet B, each sidewall of water tank I and the pollutant of bottom can be discharged water tank I.Realization circulates more completely to water tank I inside and washes away, and prevents that pollutant is attached to sidewall or the bottom of water tank I.
As another preferred embodiment, discharge outlet B can be arranged on the bottom center of water tank I, and, another water inlet A ' be set on another perhaps relative sidewall adjacent with water inlet A place sidewall.Adopt two water inlets to strengthen dynamics is washed away in the circulation of water tank I inside, increase scouring effect.
Preferably, on another sidewall relative, another water inlet A is set with water inlet A place sidewall, referring to Fig. 4, the water (flow) direction shown in dotted line and the arrow is as can be seen in the water tank I from Fig. 4, water inlet A and water inlet A ' inject pure water and recirculated water among the water tank I in the same way, and water flows to the bottom of water tank I simultaneously from two of water tank I relative sidewalls.In this process, current spread all over each sidewall of water tank I, and the current of both sides wash away under the acting in conjunction of gravity and impact to the bottom of water tank I after meeting, reached the effect of better washing away sidewall and water tank I bottom, in the substrate cleaning process, strengthened the self-loopa speed and the range of DO of the internal water of water tank I, more effective water tank I sidewall and the bottom dirt of preventing is residual.
It should be noted that at last: above embodiment only in order to the explanation the technical solution of the utility model, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (7)
1. substrate cleaning apparatus comprises: the discharge outlet that water tank, described water tank be provided with the water inlet that enters for pure water and recirculated water, discharge for pure water and recirculated water, when the feed flow face transfinites spilling water spilling water mechanism and be that two fluids clean the pump mouth that supplies water; It is characterized in that described water inlet, described pump mouth and described spilling water mechanism are separately positioned on the sidewall of described water tank, described discharge outlet is arranged on the bottom of described water tank.
2. substrate cleaning apparatus according to claim 1 is characterized in that described discharge outlet is arranged on the bottom of described water tank, and the sidewall at close described water inlet place.
3. substrate cleaning apparatus according to claim 1 is characterized in that described discharge outlet is arranged on the bottom center of described water tank.
4. according to each described substrate cleaning apparatus of claim 1-3, it is characterized in that, also be provided with another water inlet on the sidewall adjacent with described water inlet place sidewall.
5. according to each described substrate cleaning apparatus of claim 1-3, it is characterized in that, also be provided with another water inlet on the sidewall relative with described water inlet place sidewall.
6. according to each described substrate cleaning apparatus of claim 1-3, it is characterized in that described spilling water mechanism is the gap that is arranged on sidewall of described water tank, perhaps for being arranged on the liquid level sensor on the described tank inner wall.
7. according to the described substrate cleaning apparatus of claim 6, it is characterized in that described discharge outlet place is provided with a valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020632867 CN202094093U (en) | 2010-11-25 | 2010-11-25 | Substrate cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020632867 CN202094093U (en) | 2010-11-25 | 2010-11-25 | Substrate cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202094093U true CN202094093U (en) | 2011-12-28 |
Family
ID=45369142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020632867 Expired - Lifetime CN202094093U (en) | 2010-11-25 | 2010-11-25 | Substrate cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202094093U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106475897A (en) * | 2016-10-11 | 2017-03-08 | 京东方科技集团股份有限公司 | Substrate grinding device and substrate cleaning equipment |
-
2010
- 2010-11-25 CN CN 201020632867 patent/CN202094093U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106475897A (en) * | 2016-10-11 | 2017-03-08 | 京东方科技集团股份有限公司 | Substrate grinding device and substrate cleaning equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111228 |
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| CX01 | Expiry of patent term |