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CN202084018U - Touch panel - Google Patents

Touch panel Download PDF

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Publication number
CN202084018U
CN202084018U CN2011201473305U CN201120147330U CN202084018U CN 202084018 U CN202084018 U CN 202084018U CN 2011201473305 U CN2011201473305 U CN 2011201473305U CN 201120147330 U CN201120147330 U CN 201120147330U CN 202084018 U CN202084018 U CN 202084018U
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CN
China
Prior art keywords
metal wire
contact panel
conducting layer
transparency conducting
local
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Expired - Fee Related
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CN2011201473305U
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Chinese (zh)
Inventor
李志晏
黄冠铭
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RitFast Corp
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RitFast Corp
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Abstract

An embodiment of the utility model provides a touch panel, contain: a transparent substrate including a sensing region and a peripheral region; a plurality of transparent bridge lines partially covering the sensing area; an insulating layer partially covering the transparent bridging line; a plurality of metal lines partially covering the peripheral region; and a transparent conductive layer at least covering the transparent bridging line and the metal line, wherein the transparent conductive layer comprises a plurality of first units, a plurality of second units and a plurality of connecting lines, the plurality of first units and the plurality of second units are arranged in a staggered manner, the connecting lines are connected with two adjacent second units, the transparent bridging line is connected with two adjacent first units, and the plurality of metal lines are connected with the first units or the second units adjacent to the peripheral area. The utility model discloses a touch panel covers the metal wire through setting up transparent conducting layer to avoid the oxidation problem of metal wire and avoid the scratch problem of metal wire.

Description

Contact panel
Technical field
The utility model is about a kind of contact panel, particularly about a kind of contact panel that uses the metallic compound covering metal wire of high rigidity, with the problem of oxidation of avoiding metal wire and the scratch problem of avoiding metal wire.
Background technology
Contact panel has been widely used in fields such as household supplies, communication device and electronic information aid.Usually contact panel is applied as input interfaces such as PDA(Personal Digital Assistant), electronic product and game machine.The integration trend of contact panel and display screen can allow the user to choose the representative image (icon) that shows on the panel with finger or contact pen at present, so can make personal digital assistant, electronic product and game machine carry out the function of hobby.This kind contact panel also is applied to the public information inquiry system, and the public can be provided efficient operating system.
The tradition contact panel comprises a transparency carrier, and this transparency carrier has the surface that a plurality of sensing region constitutes, and the sensing region of described distribution is used for the sensing user and touches the signal that is caused with finger or contact pen, to import or to control.This sensing region is made of transparent conductive film, and for example: tin indium oxide (ITO), the user can touch the corresponding transparent conductive film that is shown in ad-hoc location on the display screen, can this device of valid function.
For effectively detecting the tram of user, there is the technology of a variety of contact panels to be developed with finger or contact pen touch panel.The existing contact panel 200 of Fig. 1 illustration, Fig. 2 is the sectional view along Fig. 1 center line 1-1.This contact panel 200 comprises a transparency carrier 201, one first transparency conducting layer 203, an insulation course 209 and one second transparency conducting layer 211.This first transparency conducting layer 203 is patterned and is formed on this transparency carrier 201 with the optical etching processing procedure, and it comprises a plurality of first modules 205 and connects alignment longitudinally arranges a plurality of first leads 207 of first module 205.This insulation course 209 covers this first transparency conducting layer 203 and this substrate 201.Second transparency conducting layer 211 of patterning is formed on this insulation course 209, and comprises a plurality of second electrode units 213 and connect a plurality of second leads 215 of arranging second unit 213 along lateral alignment.
This contact panel 200 has a plurality of metal wires 217 in addition, is located at a side of insulation course 209, makes each horizontal connection of this Unit second 213 be turned to the end that confluxes of described a plurality of these metal wires 217 by described a plurality of metal wires 217.This first transparency conducting layer 203 and this second transparency conducting layer 211 are covered on this substrate 201, and this insulation course 209 is covered in whole area on this substrate 201.
Yet this metal wire 217 is easy to airborne oxygen reaction oxidation take place, thereby increases resistance; For fear of the problem of oxidation of this metal wire 217, prior art must be at surface coated one protective seam (not being shown among the figure) of this metal wire 217, with this metal wire 217 with air insulated and avoid scratch.Yet this protective seam also can absorb light, thereby cause the light transmittance variation except increasing manufacturing cost.Therefore, need a kind of contact panel can overcome the shortcoming that above-mentioned existing contact panel has on the market.
Summary of the invention
The utility model provides a kind of contact panel, with the problem of oxidation of avoiding metal wire and the scratch problem of avoiding metal wire.
An embodiment of the present utility model provides a kind of contact panel, comprises: a transparency carrier comprises a sensing region and an outer peripheral areas; A plurality of transparent bridging lines, local this sensing region that covers; One insulation course, local this transparent bridging line that covers; A plurality of metal wires, local this outer peripheral areas that covers; An and transparency conducting layer, at least cover this transparent bridging line and this metal wire, this transparency conducting layer comprises a plurality of first modules, a plurality of Unit second and a plurality of connecting line, described a plurality of first module and described a plurality of second unit alternative arrangement, this connecting line connects two these adjacent Unit second, this transparent bridging line connects two these adjacent first modules, and described a plurality of metal wires are connected in this first module or this Unit second of contiguous this outer peripheral areas.
Further, this transparency conducting layer directly covers this metal wire.
Further, this insulation course comprises:
One first insulating regions, local this transparent bridging line that covers; And
One second insulating regions, local this metal wire that covers.
Further, this transparency conducting layer is arranged on this second insulating regions on this metal wire.
Further, respectively this bridging line is to be connected the shortest path between two adjacent these first modules.
Further, this bridging line is conductive oxide line or metal wire.
Further, this transparency conducting layer is a metal compound layer.
Further, this transparency carrier is glass plate or transparent polymer sheet material.
Another embodiment of the present utility model provides a kind of contact panel, comprises: a transparency carrier comprises a sensing region and an outer peripheral areas; One metal level comprises a plurality of local first metal wire and a plurality of local second metal wires that cover this outer peripheral areas that cover this sensing region; One insulation course, local this first metal wire that covers; An and transparency conducting layer, local this first metal wire and this second metal wire of covering, this transparency conducting layer comprises a plurality of first modules, a plurality of Unit second and a plurality of connecting line, described a plurality of first module and described a plurality of second unit alternative arrangement, this connecting line connects two these adjacent Unit second, this first metal wire connects two these adjacent first modules, and described a plurality of second metal wires are connected in this first module or this Unit second of contiguous this outer peripheral areas.
Further, this transparency conducting layer directly covers this second metal wire.
Further, this insulation course comprises:
One first insulating regions, local this first metal wire that covers; And
One second insulating regions, local this second metal wire that covers.
Further, this transparency conducting layer is arranged on this second insulating regions on this second metal wire.
Further, respectively this connecting line is to be connected the shortest path between two adjacent these Unit second.
Further, this connecting line is conductive oxide line or metal wire.
Further, this transparency conducting layer is a metal compound layer.
Further, this transparency carrier is glass plate or transparent polymer sheet material.
Contact panel of the present utility model covers metal wire by transparency conducting layer is set, with the problem of oxidation of avoiding metal wire and the scratch problem of avoiding metal wire.
Above summarize technical characterictic of the present utility model and advantage quite widely, make the utility model detailed description hereinafter be obtained preferable understanding.Other technical characterictic and the advantage that constitute claim target of the present utility model will be described in hereinafter.Have in the technical field under the utility model and know that usually the knowledgeable should be appreciated that, can quite easily utilize the notion that hereinafter discloses to can be used as modification or design other structure or technology and realize the purpose identical with the utility model with specific embodiment.Have in the technical field under the utility model and know that usually the knowledgeable also should be appreciated that, this class equivalence construction can't break away from the spirit and scope of the present utility model that accompanying claim defines.
Description of drawings
The existing contact panel of Fig. 1 illustration;
Fig. 2 is the sectional view along Fig. 1 center line 1-1;
Fig. 3 to Fig. 6 is a vertical view, the preparation method of the contact panel of illustration the utility model one embodiment;
Fig. 7 is the embodiment along the sectional view of Fig. 6 center line 2-2;
Fig. 8 is the embodiment along the sectional view of Fig. 6 center line 3-3;
Fig. 9 is another embodiment along the sectional view of Fig. 6 center line 3-3;
Figure 10 is the embodiment again along the sectional view of Fig. 6 center line 3-3;
Figure 11 to Figure 14 is a vertical view, the preparation method of the contact panel of another embodiment of illustration the utility model;
Figure 15 is the embodiment along the sectional view of Figure 14 center line 4-4;
Figure 16 is the embodiment along the sectional view of Figure 14 center line 5-5;
Figure 17 is another embodiment along the sectional view of Figure 14 center line 5-5;
Figure 18 is another embodiment along the sectional view of Figure 14 center line 5-5;
Figure 19 is the embodiment again along the sectional view of Figure 14 center line 5-5;
Figure 20 to Figure 22 is a vertical view, the preparation method of the contact panel of another embodiment of illustration the utility model;
Figure 23 is the sectional view along Figure 22 center line 6-6;
Figure 24 is the sectional view along Figure 22 center line 7-7; And
Figure 25 is another embodiment along the sectional view of Figure 22 center line 7-7.
Embodiment
Fig. 3 to Fig. 6 is a vertical view, the preparation method of the contact panel 10 of illustration the utility model one embodiment.With reference to figure 3, a transparency carrier 11 at first is provided, it comprises a sensing region 13 and an outer peripheral areas 15.In an embodiment of the present utility model, the material of this transparency carrier 11 is glass or transparent polymer sheet material, for example: polycarbonate (PC) and Polyvinylchloride (PVC).Afterwards, form a plurality of transparent bridging lines 17, its local this sensing region 13 that covers.In an embodiment of the present utility model, described a plurality of transparent bridging lines 17 are formed with an optical etching technology, and its material is a conductive oxide, for example tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO), or metal.This optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
With reference to figure 4, form an insulation course 18, it comprises a plurality of insulating regions 19, each local this transparent bridging line 17 that covers.In an embodiment of the present utility model, described a plurality of insulating regions 19 is formed with an optical etching technology, and respectively locally cover described a plurality of bridging lines 17, this optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.In an embodiment of the present utility model, the relative both ends of each bridging line 17 are not then covered by this insulating regions 19, and the material of this insulating regions 19 is transparent polymer materials, for example: photoresist.
With reference to figure 5, form a plurality of metal wires 21, its local this outer peripheral areas 15 that covers.In an embodiment of the present utility model, described a plurality of metal wires 21 are formed with an optical etching technology, this optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
With reference to figure 6, form a transparency conducting layer 30, at least cover this transparent bridging line 17 and this metal wire 21, this transparency conducting layer 30 comprises a plurality of first modules 31, a plurality of second unit 35, a plurality of first connecting lines 33 and a plurality of second connecting line 37, described a plurality of first module 31 and described a plurality of second unit 35 are alternative arrangement, this first connecting line 33 connects two these adjacent Unit second 35, this transparent bridging line 17 connects two these adjacent first modules 31, described a plurality of metal wire 21 is this first module 31 or this Unit second 35 that are connected in contiguous this outer peripheral areas 15, and described a plurality of second connecting lines 37 cover described a plurality of metal wires 21.
In an embodiment of the present utility model, respectively this transparent bridging line 17 is to be connected 31 paths the shortest of two adjacent first modules.In an embodiment of the present utility model, the material of this transparency conducting layer 30 is metallic compounds, routine tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO).This optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.The material of this transparency carrier 31 is glass or transparent polymer sheet material, for example: polycarbonate (PC) and Polyvinylchloride (PVC).
Fig. 7 is the sectional view along Fig. 6 center line 2-2, and Fig. 8 is the embodiment along the sectional view of Fig. 6 center line 3-3.With reference to figure 7, this transparent bridging line 17 and described a plurality of first connecting line 33 are isolated mutually by 19 of this insulating regions.With reference to figure 8, this transparency conducting layer 30 covers described a plurality of metal wires 21.The utility model uses second connecting line 37 of this transparency conducting layer 30 to cover this metal wire 21, and this transparency conducting layer 30 is metallic compounds, is difficult for oxidation; In addition, the hardness of this transparency conducting layer 30 is higher than the hardness of this metal wire 21, is difficult for by scratch.
Fig. 9 is another embodiment along the sectional view of Fig. 6 center line 3-3.Embodiment compared to Fig. 8 directly is formed at this metal wire 21 on this transparency carrier 11; The embodiment of Fig. 9 directly is formed at this transparent bridging line 17 on this transparency carrier 11, this metal wire 21 directly is formed on this transparent bridging line 17 again.Generally speaking, the embodiment of Fig. 8 and Fig. 9 all uses second connecting line 37 of this transparency conducting layer 30 to cover this metal wire 21, and this transparency conducting layer 30 is metallic compounds, is difficult for oxidation; In addition, the hardness of transparency conducting layer 30 is higher than the hardness of this metal wire 21, is difficult for by scratch.
Figure 10 is the embodiment again along the sectional view of Fig. 6 center line 3-3.Embodiment compared to Fig. 8 directly is formed at this metal wire 21 on this transparency carrier 11; The embodiment of Figure 10 directly is formed at this transparent bridging line 17 on this transparency carrier 11 and covers these transparent bridging lines 17 with the insulating regions 19 of this insulation course 18, this metal wire 21 directly is formed on this insulating regions 19 again.Generally speaking, the embodiment of Fig. 8 and Figure 10 all uses second connecting line 37 of this transparency conducting layer 30 to cover this metal wire 21, and this transparency conducting layer 30 is metallic compounds, is difficult for oxidation; In addition, the hardness of transparency conducting layer 30 is higher than the hardness of this metal wire 21, is difficult for by scratch.
Existing metal wire must be at surface coated one protective seam of this metal wire because of being easy to airborne oxygen reaction oxidative phenomena to take place; Relatively, the utility model uses this transparency conducting layer 30 to cover described a plurality of metal wires 21 can to economize and omit prior art and must but still can avoid metal wire oxidation and scratch problem at surface coated one protective seam of metal wire.
Figure 11 to Figure 14 is a vertical view, the preparation method of the contact panel 60 of another embodiment of illustration the utility model.With reference to Figure 11, a transparency carrier 61 at first is provided, it comprises a sensing region 63 and an outer peripheral areas 65.In an embodiment of the present utility model, the material of this transparency carrier 61 is glass or transparent polymer sheet material, for example: polycarbonate (PC) and Polyvinylchloride (PVC).Afterwards, form a plurality of local transparent bridging lines 67 that cover this sensing region 63.In an embodiment of the present utility model, described a plurality of transparent bridging lines 67 are formed with an optical etching technology, and its material is a conductive oxide, for example tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO).This optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
With reference to Figure 12, form a plurality of local metal wires 69 that cover this outer peripheral areas 65.In an embodiment of the present utility model, described a plurality of metal wires 69 are formed with an optical etching technology.This optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
With reference to Figure 13, form an insulation course 70, comprise a plurality of first insulating regions 71 and second insulating regions 73, these first insulating regions, 71 local these transparent bridging lines 67 that cover, these second insulating regions, 73 local these metal wires 69 that cover.In an embodiment of the present utility model, this insulation course 70 is formed with an optical etching technology, and the relative both ends of each bridging line 67 then cover by this insulation course 70, and the material of this insulation course 70 is transparent polymer materials, for example: photoresist.
With reference to Figure 14, form a transparency conducting layer 80, at least cover this transparent bridging line 67 and this metal wire 69, this transparency conducting layer 80 comprises a plurality of first modules 81, a plurality of second unit 85, a plurality of first connecting lines 83 and a plurality of second connecting line 87, described a plurality of first module 81 and described a plurality of second unit 85 are alternative arrangement, this first connecting line 83 connects two these adjacent Unit second 85, this transparent bridging line 67 connects two these adjacent first modules 81, described a plurality of metal wire 69 is this first module 81 or this Unit second 85 that are connected in contiguous this outer peripheral areas 65, and described a plurality of second connecting lines 87 cover described a plurality of metal wires 69.This first connecting line 83 is to be connected 85 paths the shortest, two adjacent these Unit second.
In an embodiment of the present utility model, respectively this bridging line 67 is to be connected 81 paths the shortest of two adjacent first modules.In an embodiment of the present utility model, the material of this transparency conducting layer 80 is metallic compounds, routine tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO).This optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
Figure 15 is the sectional view along Figure 14 center line 4-4, and Figure 16 is the sectional view along Figure 14 center line 5-5.With reference to Figure 15, this transparent bridging line 67 and described a plurality of first connecting line 83 are isolated mutually by 71 of this first insulating regions.With reference to Figure 16, in an embodiment of the present utility model, a plurality of second connecting lines 87 of this transparency conducting layer 80 cover described a plurality of metal wires 69.The utility model uses second connecting line 87 of this transparency conducting layer 80 to cover this metal wire 69, and this transparency conducting layer 80 is metallic compounds, is difficult for oxidation; In addition, and the hardness of this transparency conducting layer 80 is higher than the hardness of this metal wire 69, is difficult for by scratch.
Figure 17 is another embodiment along the sectional view of Figure 14 center line 5-5.This metal wire 69 directly is formed on this transparency carrier 61 and covers after these metal wires 69 with the insulating regions 73 of this insulation course 70 compared to the embodiment of Figure 16, a plurality of second connecting lines 87 with this transparency conducting layer 80 are formed on this insulating regions 73 again; The embodiment of Figure 17 be formed at this metal wire 69 on this transparency carrier 61 after, promptly directly a plurality of second connecting lines 87 of this transparency conducting layer 80 are formed on this metal wire 69.
Figure 18 is another embodiment along the sectional view of Figure 14 center line 5-5.This metal wire 69 directly is formed on this transparency carrier 61 and covers after these metal wires 69 with the insulating regions 73 of this insulation course 70 compared to the embodiment of Figure 16, a plurality of second connecting lines 87 with this transparency conducting layer 80 are formed on this insulating regions 73 again; The embodiment of Figure 18 is formed at this transparent bridging line 67 on this transparency carrier 61, and this metal wire 69 is formed on this transparent bridging line 67, and a plurality of second connecting lines 87 with this transparency conducting layer 80 are formed on this metal wire 69 again.
Figure 19 is another embodiment along the sectional view of Figure 14 center line 5-5.This metal wire 69 directly is formed on this transparency carrier 61 and covers after these metal wires 69 with the insulating regions 73 of this insulation course 70 compared to the embodiment of Figure 16, a plurality of second connecting lines 87 with this transparency conducting layer 80 are formed on this insulating regions 73 again; The embodiment of Figure 19 is formed at this transparent bridging line 67 on this transparency carrier 61, and this metal wire 69 is formed on this transparent bridging line 67, insulating regions 73 with this insulation course 70 covers this metal wire 69 again, and a plurality of second connecting lines 87 of this transparency conducting layer 80 are formed on this insulating regions 73.
Generally speaking, the embodiment of Figure 16 to Figure 19 all uses a plurality of second connecting lines 87 of this transparency conducting layer 80 to cover this metal wire 69, and this transparency conducting layer 80 is metallic compounds, is difficult for oxidation; In addition, the hardness of transparency conducting layer 80 is higher than the hardness of this metal wire 69, is difficult for by scratch.Existing metal wire must be at surface coated one protective seam of this metal wire because of being easy to airborne oxygen reaction oxidative phenomena to take place; Relatively, the utility model uses this transparency conducting layer 80 to cover described a plurality of metal wires 71 can to economize and omit prior art and must but still can avoid metal wire oxidation and scratch problem at surface coated one protective seam of metal wire.
Figure 20 to Figure 22 is a vertical view, the preparation method of the contact panel 100 of another embodiment of illustration the utility model.With reference to Figure 20, a transparency carrier 101 at first is provided, it comprises a sensing region 103 and an outer peripheral areas 105.In an embodiment of the present utility model, the material of this transparency carrier 101 is glass or transparent polymer sheet material, for example: polycarbonate (PC) and Polyvinylchloride (PVC).Afterwards, form a metal level 110, comprise a plurality of local first metal wire 107 and a plurality of local second metal wires 109 that cover this outer peripheral areas 105 that cover this sensing region 103.In an embodiment of the present utility model, this metal level 110 is formed with an optical etching technology, comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
With reference to Figure 21, form an insulation course 120, comprise a plurality of first insulating regions 121 and second insulating regions 123, these first insulating regions, 121 local these first metal wires 107 that cover, these second insulating regions, 123 local these second metal wires 109 that cover.In an embodiment of the present utility model, this insulation course 120 is formed with an optical etching technology, and the relative both ends of each first metal wire 107 are not then covered by this insulation course 120, and the material of this insulation course 120 is transparent polymer materials, for example: photoresist.
With reference to Figure 22, form a transparency conducting layer 130, cover this first metal wire 107 and this second metal wire 109 at least.In an embodiment of the present utility model, this transparency conducting layer 130 comprises a plurality of first modules 131, a plurality of second unit 135, a plurality of first connecting lines 133 and a plurality of second connecting line 137, described a plurality of first module 131 and described a plurality of second unit 135 are alternative arrangement, this first connecting line 133 connects two these adjacent Unit second 135, these first metal wire, 107 lines connect two these adjacent first modules 131, described a plurality of second metal wire 109 is connected in this first module 131 or this Unit second 135 of contiguous this outer peripheral areas 105, and described a plurality of second connecting lines 137 cover described a plurality of metal wires 109.
In an embodiment of the present utility model, respectively this first metal wire 107 is to be connected 131 paths the shortest of two adjacent first modules.In an embodiment of the present utility model, the material of this transparency conducting layer 130 is metallic compounds, routine tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO).This optical etching technology comprise sputter, coating, exposure, soft roasting, hard roasting, develop, baking and other step.
Figure 23 is the sectional view along Figure 22 center line 6-6, and Figure 24 is the sectional view along Figure 22 center line 7-7.With reference to Figure 23, this first metal wire 107 and this first connecting line 133 are isolated mutually by 121 of this first insulating regions.With reference to Figure 24, second connecting line 137 of this transparency conducting layer 130 covers described a plurality of metal wires 109.The utility model uses second connecting line 137 of this transparency conducting layer 130 to cover this metal wire 106, and this transparency conducting layer 130 is metallic compounds, is difficult for oxidation; In addition, the hardness of this transparency conducting layer 130 is higher than the hardness of this metal wire 109, is difficult for by scratch.
Figure 25 is another embodiment along the sectional view of Figure 22 center line 7-7.This metal wire 109 directly is formed on this transparency carrier 101 and covers these metal wires 109 with the insulating regions 123 of this insulation course 120 compared to the embodiment of Figure 24, a plurality of second connecting lines 137 with this transparency conducting layer 130 are formed on this insulating regions 123 again; After the embodiment of Figure 25 is formed at this metal wire 109 on this transparency carrier 101, promptly directly a plurality of second connecting lines 137 of this transparency conducting layer 130 are formed on this metal wire 109.
Existing metal wire must be at surface coated one protective seam of this metal wire because of being easy to airborne oxygen reaction oxidative phenomena to take place; Relatively, the utility model uses this transparency conducting layer 130 to cover described a plurality of metal wires 109 and can economize and omit prior art and must be coated with a protective seam on the surface of metal wire, but still can avoid metal wire oxidation and scratch problem.
Technology contents of the present utility model and technical characterstic have disclosed as above, yet have in the technical field under the utility model and know that usually the knowledgeable should be appreciated that, in the utility model spirit and scope that attached claim is defined after not deviating from, teaching of the present utility model and announcement can be done all replacements and modification.For example, above many technologies of Jie Shiing can diverse ways be implemented or are replaced with other technology, perhaps adopt the combination of above-mentioned two kinds of modes.
In addition, composition, device, method or the step of the technology of the interest field of this case specific embodiment that is not limited to above disclose, board, manufacturing, material.Have in the technical field under the utility model and know that usually the knowledgeable should be appreciated that, based on the utility model teaching and disclose composition, device, method or the step of technology, board, manufacturing, material, no matter existed now or developer in the future, it is to carry out the essence identical functions in the identical mode of essence with this case embodiment announcement person, and reach the identical result of essence, also can be used in the utility model.Therefore, following claim is in order to contain composition, device, method or the step in order to this type of technology, board, manufacturing, material.

Claims (16)

1. a contact panel is characterized in that, this contact panel comprises:
One transparency carrier comprises a sensing region and an outer peripheral areas;
A plurality of transparent bridging lines, local this sensing region that covers;
One insulation course, local this transparent bridging line that covers;
A plurality of metal wires, local this outer peripheral areas that covers; And
One transparency conducting layer, at least cover this transparent bridging line and this metal wire, this transparency conducting layer comprises a plurality of first modules, a plurality of Unit second and a plurality of connecting line, described a plurality of first module and described a plurality of second unit alternative arrangement, this connecting line connects two these adjacent Unit second, this transparent bridging line connects two these adjacent first modules, and described a plurality of metal wires are connected in this first module or this Unit second of contiguous this outer peripheral areas.
2. contact panel as claimed in claim 1 is characterized in that: this transparency conducting layer directly covers this metal wire.
3. contact panel as claimed in claim 1 is characterized in that: this insulation course comprises:
One first insulating regions, local this transparent bridging line that covers; And
One second insulating regions, local this metal wire that covers.
4. contact panel as claimed in claim 3 is characterized in that: this transparency conducting layer is arranged on this second insulating regions on this metal wire.
5. contact panel as claimed in claim 1 is characterized in that: respectively this bridging line is to be connected the shortest path between two adjacent these first modules.
6. contact panel as claimed in claim 1 is characterized in that: this bridging line is conductive oxide line or metal wire.
7. contact panel as claimed in claim 1 is characterized in that: this transparency conducting layer is a metal compound layer.
8. contact panel as claimed in claim 1 is characterized in that: this transparency carrier is glass plate or transparent polymer sheet material.
9. a contact panel is characterized in that, this contact panel comprises:
One transparency carrier comprises a sensing region and an outer peripheral areas;
One metal level comprises a plurality of local first metal wire and a plurality of local second metal wires that cover this outer peripheral areas that cover this sensing region;
One insulation course, local this first metal wire that covers; And
One transparency conducting layer, local this first metal wire and this second metal wire of covering, this transparency conducting layer comprises a plurality of first modules, a plurality of Unit second and a plurality of connecting line, described a plurality of first module and described a plurality of second unit alternative arrangement, this connecting line connects two these adjacent Unit second, this first metal wire connects two these adjacent first modules, and described a plurality of second metal wires are connected in this first module or this Unit second of contiguous this outer peripheral areas.
10. contact panel as claimed in claim 9 is characterized in that: this transparency conducting layer directly covers this second metal wire.
11. contact panel as claimed in claim 9 is characterized in that: this insulation course comprises:
One first insulating regions, local this first metal wire that covers; And
One second insulating regions, local this second metal wire that covers.
12. contact panel as claimed in claim 11 is characterized in that: this transparency conducting layer is arranged on this second insulating regions on this second metal wire.
13. contact panel as claimed in claim 9 is characterized in that: respectively this connecting line is to be connected the shortest path between two adjacent these Unit second.
14. contact panel as claimed in claim 9 is characterized in that: this connecting line is conductive oxide line or metal wire.
15. contact panel as claimed in claim 9 is characterized in that: this transparency conducting layer is a metal compound layer.
16. contact panel as claimed in claim 9 is characterized in that: this transparency carrier is glass plate or transparent polymer sheet material.
CN2011201473305U 2011-04-22 2011-05-11 Touch panel Expired - Fee Related CN202084018U (en)

Applications Claiming Priority (2)

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TW100207108 2011-04-22
TW100207108U TWM422111U (en) 2011-04-22 2011-04-22 Touch panel

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CN102662519A (en) * 2012-01-20 2012-09-12 友达光电股份有限公司 Touch panel and manufacturing method thereof
CN102799311A (en) * 2012-07-13 2012-11-28 北京京东方光电科技有限公司 Touch screen, electronic equipment including same and method for manufacturing same
CN103186272A (en) * 2011-12-29 2013-07-03 宸鸿科技(厦门)有限公司 Touch-control panel and manufacturing method thereof
US10705657B2 (en) * 2013-12-02 2020-07-07 Samsung Display Co., Ltd. Touch panel having sense patterns of mesh type metal grids, display apparatus, and method of manufacturing the touch panel
CN112909048A (en) * 2019-12-04 2021-06-04 三星显示有限公司 Sensing unit and display device having the same

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CN103186272A (en) * 2011-12-29 2013-07-03 宸鸿科技(厦门)有限公司 Touch-control panel and manufacturing method thereof
WO2013097628A1 (en) * 2011-12-29 2013-07-04 宸鸿科技(厦门)有限公司 Touch panel and manufacturing method thereof
CN103186272B (en) * 2011-12-29 2016-10-05 宸鸿科技(厦门)有限公司 Contact panel and manufacture method thereof
CN102662519A (en) * 2012-01-20 2012-09-12 友达光电股份有限公司 Touch panel and manufacturing method thereof
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