CN202041018U - Semiconductor refrigerating and heating device - Google Patents
Semiconductor refrigerating and heating device Download PDFInfo
- Publication number
- CN202041018U CN202041018U CN2011201435534U CN201120143553U CN202041018U CN 202041018 U CN202041018 U CN 202041018U CN 2011201435534 U CN2011201435534 U CN 2011201435534U CN 201120143553 U CN201120143553 U CN 201120143553U CN 202041018 U CN202041018 U CN 202041018U
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- CN
- China
- Prior art keywords
- heat transfer
- transfer block
- semiconductor refrigerating
- semiconductor
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 50
- 238000010438 heat treatment Methods 0.000 title abstract 5
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 239000002826 coolant Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 6
- 238000001802 infusion Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 abstract 3
- 239000013589 supplement Substances 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 description 8
- 239000012080 ambient air Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A semiconductor refrigerating and heating device comprises a front heat exchanging block, a middle heat conduction block, a back heat exchanging block and semiconductor refrigerating slices. The back heat exchanging block is provided with a liquid supplement air outlet and a liquid refrigerant inlet/outlet used for liquid refrigerants to pass through. A bended liquid refrigerant flowing channel is arranged in the back heat exchanging block. The semiconductor refrigerating and heating device is characterized in that the front heat exchanging block, the middle heat conduction block, the back heat exchanging block and the semiconductor refrigerating slices are sequentially contacted and connected closely according to an order of the front heat exchanging block, the semiconductor refrigerating slice, the middle heat conduction block, the semiconductor refrigerating slice and the back heat exchanging block. The semiconductor refrigerating and heating device is simple in structure and high in refrigerating and heating efficiency.
Description
Technical field: the utility model relates to a kind of semiconductor refrigerating heat-producing machine, particularly a kind of semiconductor refrigerating heat-producing machine that is used for a kind of novel efficient on the semiconductor cold-storage and warm-storage case..
Background technology: at present, two kinds of semiconductor refrigeration boxes are arranged on the market. a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the fan radiation fin, not only can freeze but also can heat in the case, but refrigerating efficiency is low and obvious noise arranged, also having a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the heat pipe-type heat abstractor, refrigerating efficiency is high slightly, can not heat but freeze only in the case.
Summary of the invention: the purpose of this utility model provides a kind of so a kind of high efficiency semiconductor refrigerating heat-producing machine that is used on the semiconductor cold-storage and warm-storage case, and it has simple in structure, can select refrigeration arbitrarily or heat the characteristics that cooling and warming efficient is high.
The purpose of this utility model is to realize by following technical scheme: be made into suitable preceding heat transfer block with heat conductivility good metal material, the intermediate thermal conductivity piece, back heat transfer block, have the fluid infusion exhaust outlet on the back heat transfer block, liquid coolant inflow/the flow export that liquid coolant passes through, back heat transfer block inside has crooked liquid coolant flow passage, select suitable semiconductor chilling plate, it is characterized in that: preceding heat transfer block, the intermediate thermal conductivity piece, back heat transfer block and semiconductor chilling plate are according to preceding heat transfer block, semiconductor chilling plate, the intermediate thermal conductivity piece, semiconductor chilling plate, the order of back heat transfer block is closely contact connection successively.
Operation principle of the present utility model is such, here the refrigeration with the semiconductor cold-storage and warm-storage case illustrates, after the energising of semiconductor cold-storage and warm-storage case, the semiconductor refrigerating heat-producing machine is started working, heat transfer block draw heat in the case constantly before the semiconductor refrigerating heat-producing machine, heat is passed to the back heat transfer block, by the external heat exchanger that is connected with the back heat transfer block heat is dispersed in the ambient air again, semiconductor cold-storage and warm-storage case the temperature inside the box reduces, reach the purpose of refrigeration, back heat transfer block inside has crooked liquid coolant flow passage, can take away the heat that the semiconductor refrigerating heat-producing machine is drawn in the semiconductor cold-storage and warm-storage case case by the liquid coolant high efficiency, have then convenient production of fluid infusion exhaust outlet and maintenance on the back heat transfer block, if change the direction by the DC current of semiconductor chilling plate, the semiconductor cold-storage and warm-storage case will be changed into heated condition from refrigerating state.
Description of drawings: description of drawings of the present utility model is as follows:
Fig. 1 is the theory structure schematic diagram of embodiment of the present utility model;
Fig. 2 is the profile of back heat transfer block among the embodiment of the present utility model;
Among the figure: 1. heat transfer block before; 2. intermediate thermal conductivity piece.; 3. heat transfer block after; 4. semiconductor chilling plate; 5. liquid coolant inflow/flow export; 6. fluid infusion exhaust outlet; 7. liquid coolant flow passage
The specific embodiment: the utility model is described further below in conjunction with drawings and Examples:
As Fig. 1, shown in Figure 2, be made into suitable preceding heat transfer block 1 with heat conductivility good metal material, intermediate thermal conductivity piece 2, back heat transfer block 3, have fluid infusion exhaust outlet 6 on the back heat transfer block, liquid coolant inflow/the flow export 5 that liquid coolant passes through, back heat transfer block inside has crooked liquid coolant flow passage 7, select suitable semiconductor chilling plate 4, it is characterized in that: preceding heat transfer block 1, intermediate thermal conductivity piece 2, back heat transfer block 3 and semiconductor chilling plate 4 are according to preceding heat transfer block 1, semiconductor chilling plate 4, intermediate thermal conductivity piece 2, semiconductor chilling plate 4, the order of back heat transfer block 3 is closely contact connection successively.
Operation principle of the present utility model is such, here the refrigeration with the semiconductor cold-storage and warm-storage case illustrates, after the energising of semiconductor cold-storage and warm-storage case, the semiconductor refrigerating heat-producing machine is started working, heat transfer block 1 draw heat in the case constantly before the semiconductor refrigerating heat-producing machine, heat is passed to back heat transfer block 3, by the external heat exchanger that is connected with back heat transfer block 3 heat is dispersed in the ambient air again, semiconductor cold-storage and warm-storage case the temperature inside the box reduces, reach the purpose of refrigeration, back heat transfer block 3 inside have crooked liquid coolant flow passage 7, can take away the heat that the semiconductor refrigerating heat-producing machine is drawn in the semiconductor cold-storage and warm-storage case case by the liquid coolant high efficiency, have 6 convenient productions and maintenance of fluid infusion exhaust outlet on the back heat transfer block 3, if change the direction by the DC current of semiconductor chilling plate 4, the semiconductor cold-storage and warm-storage case will be changed into heated condition from refrigerating state.
Claims (2)
1. semiconductor refrigerating heat-producing machine, comprise preceding heat transfer block (1), intermediate thermal conductivity piece (2), back heat transfer block (3) and semiconductor chilling plate (4), it is characterized in that: preceding heat transfer block (1), intermediate thermal conductivity piece (2), back heat transfer block (3) and semiconductor chilling plate (4) are according to the order closely contact connection successively of preceding heat transfer block (1), semiconductor chilling plate (4), intermediate thermal conductivity piece (2), semiconductor chilling plate (4), back heat transfer block (3).
2. a kind of according to claim 1 semiconductor refrigerating heat-producing machine, it is characterized in that: have the liquid coolant inflows/flow export (5) that fluid infusion exhaust outlet (6), liquid coolant pass through on back heat transfer block (3), back heat transfer block (3) inside has the liquid coolant flow passage (7) of bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201435534U CN202041018U (en) | 2011-04-29 | 2011-04-29 | Semiconductor refrigerating and heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201435534U CN202041018U (en) | 2011-04-29 | 2011-04-29 | Semiconductor refrigerating and heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202041018U true CN202041018U (en) | 2011-11-16 |
Family
ID=44968459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201435534U Expired - Fee Related CN202041018U (en) | 2011-04-29 | 2011-04-29 | Semiconductor refrigerating and heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202041018U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845842A (en) * | 2016-09-19 | 2018-03-27 | 刘万辉 | A kind of batteries of electric automobile group Two-way Cycle ambient temperature control device |
-
2011
- 2011-04-29 CN CN2011201435534U patent/CN202041018U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845842A (en) * | 2016-09-19 | 2018-03-27 | 刘万辉 | A kind of batteries of electric automobile group Two-way Cycle ambient temperature control device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: SHEN MAOXIANG Effective date: 20150512 Owner name: CHONGQING SAIMI KANGDA INVESTMENT HOLDINGS CO., LT Free format text: FORMER OWNER: LIU WANHUI Effective date: 20150512 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 400050 DADUKOU, CHONGQING TO: 400000 JIANGJIN, CHONGQING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150512 Address after: 400000, 2-2, No. 1, block A, comprehensive building, demolition and resettlement complex, Jiangjin Industrial Park, Chongqing Patentee after: Chongqing match meter Kang Da share control takeover Co., Ltd Address before: 400050 Chongqing, Yangjiaping, a village of democracy, building 2, unit 2, building 1, No. 14 Patentee before: Liu Wanhui Patentee before: Shen Maoxiang |
|
| ASS | Succession or assignment of patent right |
Owner name: CHONGQING SAIMI KANGDA ELECTRICAL APPLIANCES MANUF Free format text: FORMER OWNER: CHONGQING SAIMI KANGDA INVESTMENT HOLDINGS CO., LTD. Effective date: 20150526 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150526 Address after: 400000, 2-2, No. 1, block A, comprehensive building, demolition and resettlement complex, Jiangjin Industrial Park, Chongqing Patentee after: Chongqing Saimi Kangda Electrical Appliance Manufacturing Co. Ltd. Address before: 400000, 2-2, No. 1, block A, comprehensive building, demolition and resettlement complex, Jiangjin Industrial Park, Chongqing Patentee before: Chongqing match meter Kang Da share control takeover Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20170429 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |