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CN201852369U - Directionally-placed comprehensive heat exchanger - Google Patents

Directionally-placed comprehensive heat exchanger Download PDF

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Publication number
CN201852369U
CN201852369U CN201020618668XU CN201020618668U CN201852369U CN 201852369 U CN201852369 U CN 201852369U CN 201020618668X U CN201020618668X U CN 201020618668XU CN 201020618668 U CN201020618668 U CN 201020618668U CN 201852369 U CN201852369 U CN 201852369U
Authority
CN
China
Prior art keywords
heat exchanger
condenser
composite condenser
composite
horizontal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201020618668XU
Other languages
Chinese (zh)
Inventor
刘万辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Match Meter Kang Da Share Control Takeover Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201020618668XU priority Critical patent/CN201852369U/en
Application granted granted Critical
Publication of CN201852369U publication Critical patent/CN201852369U/en
Priority to PCT/CN2011/081958 priority patent/WO2012062203A1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00Evaporators; Condensers
    • F25B39/04Condensers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

A directionally-placed comprehensive heat exchanger comprises an outdoor heat exchanger, a composite condenser and a transfusion pump. The outdoor heat exchanger, the composite condenser and the transfusion pump are mutually connected to form a liquid refrigerant circulatory flowing channel. The directionally-placed comprehensive heat exchanger is characterized in that a horizontal composite condenser and a vertical composite condenser are mutually communicated and combined to form the composite condenser, one horizontal single-layered condenser or more than one horizontal single-layered condensers are communicated to form the horizontal composite condenser, and one vertical single-layered condenser or more than one vertical single-layered condensers are communicated to form the vertical composite condenser. The directionally-placed comprehensive heat exchanger has the advantages that the directionally-placed comprehensive heat exchanger is simple in structure, fine in stability, high in external heat exchange efficiency and wide in range of used liquid refrigerant.

Description

The comprehensive heat exchanger of a kind of comprehensive placement
Technical field: the utility model relates to a kind of comprehensive heat exchanger, particularly a kind of comprehensive heat exchanger of comprehensive placement that is used for a kind of novel efficient on the semiconductor cold-storage and warm-storage.
Background technology: at present, two kinds of semiconductor refrigeration boxes are arranged on the market. a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the fan radiation fin, not only can freeze but also can heat in the case, but refrigerating efficiency is low and obvious noise arranged, also having a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the heat pipe-type heat abstractor, refrigerating efficiency is high slightly, can not heat but freeze only in the case.
Summary of the invention: the purpose of this utility model provides a kind of so comprehensive heat exchanger of a kind of high efficiency comprehensive placement that is used on the semiconductor cold-storage and warm-storage, the exchange capability of heat of it and surrounding air is much larger than common heat exchanger, thereby improves the refrigerating efficiency of semiconductor refrigerating heat-producing machine and the characteristics of heating efficiency.
The purpose of this utility model is to realize by following technical scheme: being made into suitable liquid coolant with heat conductivility good metal material can be at the external heat exchanger of internal flow, be made into composite condenser with heat conductivility good metal material, select suitable infusion pump for use, external heat exchanger, composite condenser and infusion pump are interconnected to constitute the circulation flow passage that liquid coolant flows, it is characterized in that: composite condenser is by horizontal composite condenser and vertically be interconnected combination and constituting of composite condenser, horizontal composite condenser is interconnected combination by one or more horizontal individual layer condenser and constitutes, and vertically composite condenser is interconnected combination by one or more vertical individual layer condenser and constitutes.
Operation principle of the present utility model is such, here freeze with the semiconductor cold-storage and warm-storage case and illustrate, start working after the energising of semiconductor cold-storage and warm-storage case, the semiconductor refrigerating heat-producing machine passes through indoor heat exchanger constantly from indoor draw heat, heat is passed to outdoor heat exchanger, indoor temperature reduces, reach the purpose of refrigeration, because the work of infusion pump, liquid coolant circulates in the comprehensive heat exchanger of a kind of so comprehensive placement, take the heat on the outdoor heat exchanger to composite condenser, be dispersed in the ambient air again, owing to being interconnected to make up by horizontal composite condenser and vertical composite condenser, composite condenser constitutes, horizontal composite condenser is interconnected combination by one or more horizontal individual layer condenser and constitutes, vertically composite condenser is interconnected combination by one or more vertical individual layer condenser and constitutes, vertically composite condenser is placed on the outer back side of semiconductor cold-storage and warm-storage case usually, horizontal composite condenser is placed on the outer bottom of semiconductor cold-storage and warm-storage case usually, the effective heat exchange area of this composite condenser and external environment condition is much larger than the common common composite condenser that has only single placed side and the effective heat exchange area of external environment condition, so very high with the heat exchange efficiency of external environment condition, can increase substantially the operating efficiency of semiconductor cold-storage and warm-storage case.
Description of drawings: description of drawings of the present utility model is as follows:
Fig. 1 is the theory structure schematic diagram of embodiment of the present utility model;
Among the figure: 1. outdoor heat exchanger; 2. composite condenser; 3. infusion pump; 4. vertical composite condenser; 5. horizontal composite condenser.
The specific embodiment: the utility model is described further below in conjunction with drawings and Examples:
As shown in Figure 1, being made into suitable liquid coolant with heat conductivility good metal material can be at the outdoor heat exchanger 1 of internal flow, be made into composite condenser 2 with heat conductivility good metal material, select suitable infusion pump 3 for use, outdoor heat exchanger 1, composite condenser 2 and infusion pump 3 are interconnected to constitute the circulation flow passage that liquid coolant flows, it is characterized in that: composite condenser 2 is by horizontal composite condenser 5 and vertically be interconnected combination and constituting of composite condenser 4, horizontal composite condenser 5 is interconnected combination by one or more horizontal individual layer condenser and constitutes, and vertically composite condenser 4 is interconnected combination by one or more vertical individual layer condenser and constitutes.
Operation principle of the present utility model is such, here freeze with the semiconductor cold-storage and warm-storage case and illustrate, warm the subtracting of semiconductor refrigeration started working after case is switched on, the semiconductor refrigerating heat-producing machine passes through indoor heat exchanger constantly from indoor draw heat, heat is passed to outdoor heat exchanger 1, indoor temperature reduces, reach the purpose of refrigeration, because the work of infusion pump 3, liquid coolant circulates in the comprehensive heat exchanger of a kind of so comprehensive placement, take the heat on the outdoor heat exchanger 1 to composite condenser 2, be dispersed in the ambient air again, owing to being interconnected to make up by horizontal composite condenser 5 and vertical composite condenser 4, composite condenser 2 constitutes, horizontal composite condenser 5 is interconnected combination by one or more horizontal individual layer condenser and constitutes, vertically composite condenser 4 is interconnected combination by one or more vertical individual layer condenser and constitutes, vertically composite condenser 4 is placed on the outer back side of semiconductor cold-storage and warm-storage case usually, horizontal composite condenser 5 is placed on the outer bottom of semiconductor cold-storage and warm-storage case usually, the effective heat exchange area of this composite condenser 2 and external environment condition is much larger than the common common composite condenser that has only single placed side and the effective heat exchange area of external environment condition, so very high with the heat exchange efficiency of external environment condition, can increase substantially the operating efficiency of semiconductor cold-storage and warm-storage case.

Claims (3)

1. comprehensive heat exchanger of comprehensive placement, comprise outdoor heat exchanger (1), composite condenser (2) and infusion pump (3), outdoor heat exchanger (1), composite condenser (2) and infusion pump (3) are interconnected to constitute the circulation flow passage of liquid coolant, it is characterized in that: composite condenser (2) is by horizontal composite condenser (5) and vertically be interconnected combination and constituting of composite condenser (4).
2. the comprehensive heat exchanger of a kind of according to claim 1 comprehensive placement is characterized in that: horizontal composite condenser (5) is communicated with by one or more horizontal individual layer condenser and forms.
3. the comprehensive heat exchanger of a kind of according to claim 1 comprehensive placement is characterized in that: vertically composite condenser (4) is made up of one or more vertical individual layer condenser connection.
CN201020618668XU 2010-11-11 2010-11-11 Directionally-placed comprehensive heat exchanger Expired - Fee Related CN201852369U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201020618668XU CN201852369U (en) 2010-11-11 2010-11-11 Directionally-placed comprehensive heat exchanger
PCT/CN2011/081958 WO2012062203A1 (en) 2010-11-11 2011-11-08 Omnidirectional integrated heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020618668XU CN201852369U (en) 2010-11-11 2010-11-11 Directionally-placed comprehensive heat exchanger

Publications (1)

Publication Number Publication Date
CN201852369U true CN201852369U (en) 2011-06-01

Family

ID=44094760

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020618668XU Expired - Fee Related CN201852369U (en) 2010-11-11 2010-11-11 Directionally-placed comprehensive heat exchanger

Country Status (2)

Country Link
CN (1) CN201852369U (en)
WO (1) WO2012062203A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012062205A1 (en) * 2010-11-11 2012-05-18 沈茂相 Omnidirectional cold-heat-complementary integrated heat exchanger
WO2012062203A1 (en) * 2010-11-11 2012-05-18 沈茂相 Omnidirectional integrated heat exchanger
CN102466367A (en) * 2010-11-11 2012-05-23 刘万辉 Directionally-placed comprehensive heat exchanger

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2773362A (en) * 1953-05-18 1956-12-11 Whirlpool Seeger Corp Refrigerators for freezing food and storage of frozen food
US2959939A (en) * 1958-05-01 1960-11-15 Carrier Corp Refrigerated storage unit
JPS5854612Y2 (en) * 1978-12-28 1983-12-13 株式会社富士通ゼネラル refrigerator
CN2563529Y (en) * 2002-08-30 2003-07-30 广东科龙电器股份有限公司 Inner tube combination structure for electric refrigerator
CN201331212Y (en) * 2008-12-28 2009-10-21 刘万辉 A new high-efficiency hot and cold complementary type integrated heat exchanger
CN201615648U (en) * 2010-02-24 2010-10-27 刘万辉 Novel practical semiconductor refrigeration and heat preservation box
CN201852351U (en) * 2010-11-11 2011-06-01 刘万辉 Omnibearing placed cold-heat complementary comprehensive heat exchanger
CN201852369U (en) * 2010-11-11 2011-06-01 刘万辉 Directionally-placed comprehensive heat exchanger
CN201954832U (en) * 2010-12-29 2011-08-31 刘万辉 Novel efficient and practical semiconductor refrigerating and heating box
CN202063404U (en) * 2010-12-29 2011-12-07 刘万辉 Multifunctional box of two uses of refrigeration and warm insulation of new high efficiency and utility type

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012062205A1 (en) * 2010-11-11 2012-05-18 沈茂相 Omnidirectional cold-heat-complementary integrated heat exchanger
WO2012062203A1 (en) * 2010-11-11 2012-05-18 沈茂相 Omnidirectional integrated heat exchanger
CN102466367A (en) * 2010-11-11 2012-05-23 刘万辉 Directionally-placed comprehensive heat exchanger

Also Published As

Publication number Publication date
WO2012062203A1 (en) 2012-05-18

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Free format text: FORMER OWNER: SHEN MAOXIANG

Effective date: 20150716

Owner name: CHONGQING SAIMI KANGDA INVESTMENT HOLDINGS CO., LT

Free format text: FORMER OWNER: LIU WANHUI

Effective date: 20150716

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150716

Address after: 402260 Jiangjin District, Chongqing Fu Industrial Park demolition and resettlement of the comprehensive building A District, building 2-2, No. 1

Patentee after: Chongqing match meter Kang Da share control takeover Co., Ltd

Address before: 400050 Chongqing, Yangjiaping, a village of democracy, building 2, unit 2, building 1, No. 14

Patentee before: Liu Wanhui

Patentee before: Shen Maoxiang

DD01 Delivery of document by public notice

Addressee: Chongqing match meter Kang Da share control takeover Co., Ltd

Document name: Notification to Pay the Fees

DD01 Delivery of document by public notice

Addressee: Chongqing match meter Kang Da share control takeover Co., Ltd

Document name: Notification of Termination of Patent Right

DD01 Delivery of document by public notice
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110601

Termination date: 20161111

CF01 Termination of patent right due to non-payment of annual fee