CN201008464Y - Cooling and warming mattress - Google Patents
Cooling and warming mattress Download PDFInfo
- Publication number
- CN201008464Y CN201008464Y CNU2006200333532U CN200620033353U CN201008464Y CN 201008464 Y CN201008464 Y CN 201008464Y CN U2006200333532 U CNU2006200333532 U CN U2006200333532U CN 200620033353 U CN200620033353 U CN 200620033353U CN 201008464 Y CN201008464 Y CN 201008464Y
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- CN
- China
- Prior art keywords
- cold
- container
- temperature control
- conduit
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Mattresses And Other Support Structures For Chairs And Beds (AREA)
Abstract
The utility model discloses a semi-conductive temperature control heat and cool mattress which is characterized in that the mattress is a blanket structure, between the interlayer of which a snakelike heat and cool conduit made from rubber material is arranged; the conduit and a subminiature diving pump arranged in a hermetic container connect to form a liquid closed loop; a semi-conductive cooling slice is arranged at one wall of the container; a radiator fan is arranged at the outer side of the semi-conductive cooling slice; when affusing the conduct liquid in the container and connecting with an electric motor and a temperature control circuit, the refrigeration and the heating are realized through the circulation of the conduct liquid in the loop. Compared with the existing technology, the utility model has the advantages of simple structure, low construction cost, good heat and cool effect, saving electricity, easy operation, and so on.
Description
Affiliated technical field
The utility model relates to a kind of semiconductor temperature cold and warm mattress, and it comprises pad, the cold and hot conduit of conduction and temperature control adjuster.
Background technology
At present, the semiconductor temperature cold and warm mattress of prior art all exists complex structure, changes in temperature weak effect and the high deficiency of manufacturing cost.
Summary of the invention
The purpose of this utility model be to overcome the above-mentioned deficiency of prior art and provide a kind of simple in structure, changes in temperature are effective and the semiconductor temperature cold and warm mattress of low cost of manufacture.
The purpose of this utility model is to realize like this, it is characterized in that described pad is a blanket type structure, the described cold and hot conduit that snakelike setting is made by elastomeric material between its interlayer, this conduit connects into the liquid closed loop with the miniature immersible pump that is arranged in the airtight container, the conductor refrigeration sheet is arranged on a wall of container, its outer end is provided with radiator fan, when in container, pouring into conductive liquid, and behind Connect Power machine and the temperature control circuit, then can be by the circulating cooling pyrogenicity of conductive liquid in the loop.This cold and warm mattress, because pad is the blanket type, thereby cooling and heating type is fast, and is effective.Simultaneously, also simple in structure, low cost of manufacture.Historical facts or anecdotes has showed above-mentioned purpose.
The utility model is recommended, and described conductor refrigeration sheet is made by bismuth telluride and solid alloy material thereof; Described temperature control circuit mainly comprises by three thermistors, IC integrated package and controllable silicon and forming.
Description of drawings
The utility model below will describe in detail by accompanying drawing (embodiment):
Fig. 1, be structural representation of the present utility model;
Fig. 2, be temperature control circuit schematic diagram of the present utility model.
The specific embodiment
With reference to Fig. 1, as can be seen, the utility model cold and warm mattress is made of the cold and hot conduit 2 of rubber, airtight container 3, built-in type miniature immersible pump 4 and the conductor refrigeration sheet 5 of blanket type interlayer pad 1, snakelike setting.Described airtight container 3 is provided with liquid perfusing hole 6 and the liquid level inspection venthole 7 of holding concurrently; Described conductor refrigeration sheet 5 is arranged on a wall of airtight container 3, and its outer end is provided with radiator fan 8.Go up external motor and temperature control circuit when connecting, and after the conductive liquid (water) of in container, annotating, then can work.
With reference to Fig. 2, provided temperature control circuit schematic diagram of the present utility model.As shown in the figure, this circuit mainly comprises by three thermistor Rt1, Rt2, Rt3, ic chip and controllable silicon V2 and forming.Rt1 and Rt2 detect the temperature in the container, and Rt3 is that the temperature to semiconductor refrigerating sheet radiating end detects, and to prevent unlikely burning out, controllable silicon V2 connects the operating circuit of conductor refrigeration sheet.Its course of work is as follows:
During refrigeration, K switch is in 1 grade.When temperature was higher than T1 in the container, a point was a high potential, the T1 conducting, and electric current makes the BG1 conducting by R7, the conducting that is triggered of 5 pin of IC input high potential, its 2 pin output level makes the V2 conducting, and the conductor refrigeration sheet is started working.When temperature in the container drops to T1 when following, though a point is an electronegative potential, T1 ends, because 2 pin of IC make 5 pin keep high potential by R9, so still conducting of IC, the conductor refrigeration sheet works on.When temperature in the container dropped to lower limit temperature T2, the b point was a high potential, the T2 conducting, and electric current makes the BG2 conducting by R6, and the 5 pin moments that cause IC are in electronegative potential, the IC upset, its 2 pin does not have level output, not conducting of V2, the conductor refrigeration sheet quits work.Have only when temperature recovery in the container during to ceiling temperature T1, above-mentioned control procedure is just restarted, and moves in circles, and temperature is remained between the T1-T2.When conductor refrigeration sheet radiating end temperature surpassed T3 design temperature (60 ℃), the C point was in high potential, and the T3 conducting makes 5 pin of IC be in electronegative potential, the IC upset, and its 2 pin does not have level output, not conducting of V2, the conductor refrigeration sheet quits work.
During pyrogenicity, K switch is allocated to 2 grades.Its course of work roughly the same.
That compared with the prior art the utility model has is simple in structure, cost is low, changes in temperature are effective, Power saving and the advantage such as easy to use.
Claims (3)
1. cold and warm mattress, comprise pad, the cold and hot conduit of conduction and temperature control adjuster, it is characterized in that described pad is a blanket type structure, the described cold and hot conduit that snakelike setting is made by elastomeric material between its interlayer, this conduit connects into the liquid closed loop with the miniature immersible pump that is arranged in the airtight container, the conductor refrigeration sheet is arranged on a wall of container, its outer end is provided with radiator fan, when in container, pouring into conductive liquid, and behind Connect Power machine and the temperature control circuit, then can be by the circulating cooling pyrogenicity of conductive liquid in the loop.
2. cold and warm mattress according to claim 1 is characterized in that described conductor refrigeration sheet made by bismuth telluride and solid alloy material thereof.
3. cold and warm mattress according to claim 1 and 2 is characterized in that described temperature control circuit mainly comprises by three thermistors, IC integrated package and controllable silicon to form.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006200333532U CN201008464Y (en) | 2006-03-07 | 2006-03-07 | Cooling and warming mattress |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006200333532U CN201008464Y (en) | 2006-03-07 | 2006-03-07 | Cooling and warming mattress |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201008464Y true CN201008464Y (en) | 2008-01-23 |
Family
ID=39043396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2006200333532U Expired - Fee Related CN201008464Y (en) | 2006-03-07 | 2006-03-07 | Cooling and warming mattress |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201008464Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009039737A1 (en) * | 2007-09-28 | 2009-04-02 | Zhiping Wang | Thermoelectric semiconductor constant temperature blanket |
CN105011622A (en) * | 2015-07-24 | 2015-11-04 | 吕志雪 | Semiconductor cooling/heating mattress |
CN106820760A (en) * | 2017-03-21 | 2017-06-13 | 东莞市海天磁业股份有限公司 | The safety-type water circulation cold and warm mattress of external Cooling and Heat Source |
-
2006
- 2006-03-07 CN CNU2006200333532U patent/CN201008464Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009039737A1 (en) * | 2007-09-28 | 2009-04-02 | Zhiping Wang | Thermoelectric semiconductor constant temperature blanket |
CN105011622A (en) * | 2015-07-24 | 2015-11-04 | 吕志雪 | Semiconductor cooling/heating mattress |
CN106820760A (en) * | 2017-03-21 | 2017-06-13 | 东莞市海天磁业股份有限公司 | The safety-type water circulation cold and warm mattress of external Cooling and Heat Source |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |