CN209562912U - A kind of printed wiring board of good heat dissipation effect - Google Patents
A kind of printed wiring board of good heat dissipation effect Download PDFInfo
- Publication number
- CN209562912U CN209562912U CN201821915630.1U CN201821915630U CN209562912U CN 209562912 U CN209562912 U CN 209562912U CN 201821915630 U CN201821915630 U CN 201821915630U CN 209562912 U CN209562912 U CN 209562912U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- printed wiring
- heat dissipation
- welded
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of printed wiring board of good heat dissipation effect, including loading plate, four, the top angular position of the loading plate is welded with support post, the top of four support posts is welded with screw rod, printed wiring board is socketed on four screw rods, connecting plate is welded with below the inner sidewall of four support posts, the connecting plate upper end is equipped with L-type support plate, the top of the heat sink is equidistantly welded with heat dissipation fin in the form of equal matrix, and the back side of printed wiring board is close at the top for the fin that radiates.The printed wiring board of this good heat dissipation effect, utilize the back side of heat dissipation fin and silicagel pad fitting printed wiring board on heat sink, to reduce the temperature that printed wiring board generates at work, to reduce the electronic component operating temperature of installation on a printed-wiring board, the service life of electronic component in printed wiring board is improved.
Description
Technical field
The utility model relates to printed wiring board art field, specially a kind of printed wiring board of good heat dissipation effect.
Background technique
Pcb board is also known as printed circuit board, is the supplier of electronic component electrical connection, can be installed on pcb board big
The electronic component of amount, in this way with the work of pcb board, electronic component will generate a large amount of heat, highly integrated on pcb board
Circuit structure can cause very big influence to heat dissipation.In the prior art usually on a printed circuit aperture and by key screw dissipate
Backing is fixed on printed circuit board ontology, this not only affects the cabling space on printed circuit board, but also artificial because needing
It assembles and increases production cost, and cooling fin is normally mounted at vacant position on printed circuit board, this makes cooling fin not be
It is directly in contact with electronic component in printed wiring board, heat dissipation effect is not fine.
Utility model content
The purpose of this utility model is to provide a kind of printed wiring board of good heat dissipation effect, to solve above-mentioned background technique
The problem of middle proposition.
To achieve the above object, the utility model provides the following technical solutions: a kind of printed wiring board of good heat dissipation effect,
Including loading plate, four, the top angular position of the loading plate is welded with support post, the top of four support posts
Portion is welded with screw rod, printed wiring board is socketed on four screw rods, the inner sidewall lower section of four support posts is
It is welded with connecting plate, the connecting plate upper end is equipped with L type supporting plate, and the quantity of the L-type support plate is four, and four L
The top of type supporting plate is welded with heat sink jointly, and the top of the heat sink is equidistantly welded with heat dissipation in the form of equal matrix and stuck up
Piece, and the back side of printed wiring board is close at the top for the fin that radiates.
This setting is existed using the back side of the heat dissipation fin fitting printed wiring board on heat sink with reducing printed wiring board
The temperature generated when work improves printing to reduce the electronic component operating temperature of installation on a printed-wiring board
The service life of electronic component on wiring board.
Preferably, the heat dissipation fin has four rows, and the heat dissipation between every two row heat dissipation fin in heat sink aligned on top
Silicagel pad is pasted on plate.
This setting silicagel pad has cooling function, can further be cooled down to printed wiring board.
Preferably, the first connecting hole is offered on four connecting plates, is offered on four L-type support plates
The second connecting hole to align with the first connection hole site, and the first connecting hole and the second connecting hole pass through threaded post and the first lock
Tight nut is attached.
This first connecting hole of setting, the second connecting hole, threaded post and the first locking nut can realize the installation of heat sink,
Heat dissipation fin and silicagel pad on heat sink is set to be close to printed wiring board.
Preferably, thermally conductive flat tube, and the width and heat sink of thermally conductive flat tube are welded in the middle part of the lower end surface of the heat sink
It is of same size, uniform welding has a radiating copper sheet from front to back in the groove of the thermally conductive flat tube, and the top of radiating copper sheet is solid
Surely heat sink is connected.
This setting can inject cooling water in thermally conductive flat tube, drive heat to scatter away by the flowing of water, can be into one
Step cools down heat sink, and the setting of radiating copper sheet can also siphon away the partial heat on heat sink, improve heat sink
Radiating rate, therefore accelerate the radiating rate of printed wiring board.
Preferably, the second locking nut is equipped between four screw rods and the contact surface of printed wiring board.
This is arranged for installing to printed wiring board.
Preferably, the left and right sidewall of the loading plate is symmetrically welded back and forth installation trunnion, and installs and offer on trunnion
Installation screw.
This setting installation trunnion and installation screw are convenient for loading plate to be mounted in apparatus casing.
Compared with prior art, the utility model has the beneficial effects that the printed wiring board of this good heat dissipation effect, using dissipating
The back side of heat dissipation fin and silicagel pad fitting printed wiring board on hot plate, to reduce the temperature that printed wiring board generates at work
Degree improves electronics member device in printed wiring board to reduce the electronic component operating temperature of installation on a printed-wiring board
The service life of part.Wherein the setting of thermally conductive flat tube drives heat to scatter away for being passed through cooling water by the flowing of water, can
Further heat sink is cooled down, improves the radiating rate of printed wiring board.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model heat sink overlooking structure diagram；
Fig. 3 is enlarged structure schematic diagram at the A in the utility model Fig. 1.
In figure: 1 loading plate, 2 heat dissipation fins, 3 heat sinks, 4L type supporting plate, 5 installation trunnions, 6 silicagel pads, 7 thermally conductive flat
Pipe, 8 connecting plates, 9 radiating copper sheets, 10 screw rods, 11 support posts, 12 first connecting holes, 13 threaded posts, 14 first locking nuts,
15 installation screws, 16 printed wiring board, 17 second locking nuts, 18 second connecting holes.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of printed wiring board of good heat dissipation effect, packet
Loading plate 1 is included, four, the top angular position of the loading plate 1 is welded with support post 11, four support posts 11
Top be welded with screw rod 10, be socketed with printed wiring board 16 on four screw rods 10, four support posts 11
It is welded with connecting plate 8 below inner sidewall, 8 upper end of connecting plate is equipped with L-type support plate 4, the number of the L-type support plate 4
Amount is four, and the top of four L-type support plates 4 is welded with heat sink 3 jointly, and the top of the heat sink 3 is with equal matrix
Form is equidistantly welded with heat dissipation fin 2, and the back side of printed wiring board 16 is close at the top for the fin 2 that radiates.
Specifically, the heat dissipation fin 2 has four rows, and dissipating between every two row heat dissipation fin 2 in 3 aligned on top of heat sink
Silicagel pad 6 is pasted on hot plate 3.
Specifically, offering the first connecting hole 12 on four connecting plates 8, opened on four L-type support plates 4
Equipped with the second connecting hole 18 to align with 12 position of the first connecting hole, and the first connecting hole 12 and the second connecting hole 18 pass through spiral shell
Line column 13 and the first locking nut 14 are attached.
Specifically, being welded with thermally conductive flat tube 7, and the width of thermally conductive flat tube 7 and heat dissipation in the middle part of the lower end surface of the heat sink 3
Plate 3 it is of same size, in the groove of the thermally conductive flat tube 7 uniform welding has a radiating copper sheet 9 from front to back, and radiating copper sheet 9
Top is fixedly connected with heat sink 3, is connected with water filling port connector below the left end of the thermally conductive flat tube 7, and on the right side of thermally conductive flat tube 7
Side-lower is connected with water outlet connector, and the setting of water filling port connector and water outlet connector, which facilitates, injects cooling water into thermally conductive flat tube 7.From
And the temperature of heat sink 3 is further decreased, the heat dissipation effect of printed wiring board 16 can be improved.
Specifically, being equipped with the second locking nut 17 between four screw rods 10 and the contact surface of printed wiring board 16.
Specifically, the left and right sidewall of the loading plate 1 is symmetrically welded back and forth installation trunnion 5, and installs and opened up on trunnion 5
There is installation screw 15.
When specifically used, using on heat sink 3 heat dissipation fin 2 and silicagel pad 6 be bonded printed wiring board 16 the back side,
To reduce the temperature that printed wiring board 16 generates at work, to reduce the electronics member device being mounted in printed wiring board 16
Part operating temperature improves the service life of electronic component in printed wiring board 16.Wherein the setting of thermally conductive flat tube 7 is for being passed through
Cooling water drives heat to scatter away, can further cool down to heat sink 3, improve track by the flowing of water
The radiating rate of road plate 16.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of printed wiring board of good heat dissipation effect, including loading plate (1), it is characterised in that: the top of the loading plate (1)
Four angular positions are welded with support post (11), and the top of four support posts (11) is welded with screw rod (10),
It is socketed with printed wiring board (16) on four screw rods (10), is welded below the inner sidewall of four support posts (11)
Having connecting plate (8), connecting plate (8) upper end is equipped with L-type support plate (4), and the quantity of the L-type support plate (4) is four,
And the top of four L-type support plates (4) is welded with heat sink (3) jointly, the top of the heat sink (3) is in the form of equal matrix
It is equidistantly welded with heat dissipation fin (2), and the back side of printed wiring board (16) is close at the top of heat dissipation fin (2).
2. a kind of printed wiring board of good heat dissipation effect according to claim 1, it is characterised in that: the heat dissipation fin
(2) there are four rows in heat sink (3) aligned on top, and be pasted with silica gel on the heat sink (3) between every two row heat dissipation fin (2)
It pads (6).
3. a kind of printed wiring board of good heat dissipation effect according to claim 1, it is characterised in that: four connecting plates
(8) it offers the first connecting hole (12), is offered on four L-type support plates (4) and the first connecting hole (12) position on
The second connecting hole (18) to align is set, and the first connecting hole (12) and the second connecting hole (18) pass through threaded post (13) and first
Locking nut (14) is attached.
4. a kind of printed wiring board of good heat dissipation effect according to claim 1, it is characterised in that: the heat sink (3)
Lower end surface in the middle part of be welded with thermally conductive flat tube (7), and the width of thermally conductive flat tube (7) and heat sink (3) is of same size, described to lead
Uniform welding has radiating copper sheet (9) from front to back in the groove of hot flat tube (7), and is fixedly connected at the top of radiating copper sheet (9) scattered
Hot plate (3).
5. a kind of printed wiring board of good heat dissipation effect according to claim 1, it is characterised in that: four screw rods
(10) the second locking nut (17) are equipped between the contact surface of printed wiring board (16).
6. a kind of printed wiring board of good heat dissipation effect according to claim 1, it is characterised in that: the loading plate (1)
Left and right sidewall be symmetrically welded back and forth installation trunnion (5), and install trunnion (5) on offer installation screw (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821915630.1U CN209562912U (en) | 2018-11-21 | 2018-11-21 | A kind of printed wiring board of good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821915630.1U CN209562912U (en) | 2018-11-21 | 2018-11-21 | A kind of printed wiring board of good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209562912U true CN209562912U (en) | 2019-10-29 |
Family
ID=68300272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821915630.1U Active CN209562912U (en) | 2018-11-21 | 2018-11-21 | A kind of printed wiring board of good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209562912U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423532A (en) * | 2020-11-06 | 2021-02-26 | 常州亮鼎照明科技有限公司 | Strong stable LED luminotron three-parallel circuit board |
-
2018
- 2018-11-21 CN CN201821915630.1U patent/CN209562912U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112423532A (en) * | 2020-11-06 | 2021-02-26 | 常州亮鼎照明科技有限公司 | Strong stable LED luminotron three-parallel circuit board |
| CN112423532B (en) * | 2020-11-06 | 2022-02-18 | 常州亮鼎照明科技有限公司 | Strong stable LED luminotron three-parallel circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115079795A (en) | Liquid cooling server and liquid cooling heat dissipation hard disk module thereof | |
| CN209562912U (en) | A kind of printed wiring board of good heat dissipation effect | |
| CN210042381U (en) | PCB circuit board of high-efficient heat dissipation multilayer | |
| CN209545424U (en) | The IGBT structure of frequency converter | |
| CN101325859B (en) | Radiating device | |
| CN211429863U (en) | Composite circuit board with high heat dissipation performance | |
| CN220606146U (en) | Heat dissipation type PCB board | |
| CN208888733U (en) | A kind of passive thermally conductive cabinet of computer | |
| CN221103622U (en) | Integrated circuit board convenient to heat dissipation | |
| CN215872361U (en) | Novel PCB multilayer circuit board | |
| CN220456400U (en) | Arithmetic device and heat dissipation device | |
| CN221842804U (en) | Heat dissipation type circuit board | |
| CN217113204U (en) | Integrated radiator | |
| CN221240539U (en) | Heat dissipation type microelectronic assembly | |
| CN221264341U (en) | VPX main control board convenient for heat dissipation | |
| CN215642457U (en) | Power supply framework of high-density server | |
| CN212061084U (en) | Core plate heat radiation structure | |
| CN208488708U (en) | A kind of computer motherboard radiator | |
| CN218004835U (en) | Heat radiator for integrated circuit uses | |
| CN211090135U (en) | Multilayer circuit board | |
| CN218630660U (en) | Server | |
| CN219496740U (en) | Optical communication module with high heat dissipation rate | |
| CN213305850U (en) | High-end curved screen TV backlight circuit board | |
| CN216122990U (en) | Composite PCB (printed circuit board) | |
| CN218825441U (en) | Computer mainboard radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |