CN218630660U - Server - Google Patents

Abstract

The application discloses a server, includes: the air conditioner comprises a case, a first air inlet and a second air outlet, wherein the case is provided with a first end and a second end which are distributed at intervals along a first direction; the board card frame is positioned in the case; the force calculation plate module is positioned in the board card frame, and the radiating fins of the force calculation plate module extend along a first direction, so that two ends of each radiating fin are respectively close to the first air inlet and the first air outlet; and the heat dissipation fan is positioned in the case and used for exhausting the airflow flowing through the computing board module from the first air outlet. Like this, avoided two adjacent fin alignment along the air current direction of flow and produced the problem of windage, moreover, the fin can also utilize the clearance between two adjacent ASIC chips for the fin has bigger heat radiating area, can satisfy the high-efficient heat dissipation demand of server, and does benefit to and reaches the silence effect.

Description

Server

Technical Field

The present application relates to computer technologies, and in particular, to a server.

Background

In the related art, as the data processing capability of the server is stronger and stronger, the power consumption of the server is larger and larger, and correspondingly, the heat generated in the operation process of the server with high power consumption is larger and larger, so that how to provide a heat dissipation scheme for the server with high power consumption is a problem which needs to be solved urgently in the field.

At present, an Application Specific Integrated Circuit (ASIC) chip in a server has a large power, and accordingly, a demand for efficient heat dissipation is also large. In the related art, an air-cooling heat dissipation method is usually adopted to discharge heat generated in the working process of loads such as chips in a server and the like out of the server. Specifically, the server comprises a case, a force calculation plate is arranged in the case, a plurality of ASIC chips are arranged on the force calculation plate, radiating fins are arranged on each ASIC chip, and fans are arranged at an air inlet and an air outlet of the case respectively. However, the above layout of the server in the related art cannot satisfy the heat dissipation requirement.

SUMMERY OF THE UTILITY MODEL

The application provides a server, can satisfy the heat dissipation demand of server.

The application provides a server, including: the air conditioner comprises a case, a first air inlet and a second air outlet, wherein the case is provided with a first end and a second end which are distributed at intervals along a first direction; the board card frame is positioned in the case; the force calculation plate module is positioned in the board card frame, and a radiating fin in the force calculation plate module extends along the first direction, so that two ends of the radiating fin are respectively close to the first air inlet and the first air outlet; and the heat dissipation fan is positioned in the case and used for exhausting the airflow flowing through the computing board module from the first air outlet.

In one embodiment, the heat dissipation fan is disposed near the first air outlet.

In one embodiment, the card frame includes: the first side plate and the second side plate are distributed at intervals along a second direction, the second direction is perpendicular to the first direction, and the first side plate and the second side plate are respectively connected to the first plate body; the force calculation plate module is located in a space defined by the first plate body, the first side plate and the second side plate.

In an embodiment, a first opening end is defined by ends of the first board body, the first side board and the second side board facing the first air inlet, and sizes of the first air inlet along the first direction and the second direction are respectively greater than or equal to corresponding sizes of the first opening end.

In one embodiment, a second opening end is defined by one end of the first plate body, the first side plate and the second side plate facing the first air outlet, and the sizes of the first air outlet along the first direction and the second direction are respectively greater than or equal to the corresponding size of the second opening end; the heat dissipation fan is located between the second opening end and the first air outlet.

In one embodiment, the first side plate and the second side plate are respectively connected to the first panel perpendicularly.

In one embodiment, a first folding edge is arranged at one end of the first side plate, which is far away from the first plate body, a second folding edge is arranged at one end of the second side plate, which is far away from the first plate body, and the first folding edge and the second folding edge extend in directions which are far away from each other; the first flanging edge and the second flanging edge are detachably connected with the case respectively.

In one embodiment, the server further comprises: the power supply device and the main control board are positioned in the case and positioned outside the board card frame.

In one embodiment, a mounting member is disposed in the housing, and the mounting member is connected to at least one of the power supply device and the main control board.

In one embodiment, the first side plate of the card frame includes: the baffle plate and the interface plate are arranged side by side along the first direction; the interface board is detachably connected with the baffle, the first board body of the board card frame and the case respectively; the interface arranged on the interface board is used for electrically connecting the force calculation board module with the power supply device and the main control board respectively.

In one embodiment, the force computation board module further comprises: the heat conduction silicone grease layer is used for transferring heat generated by a chip of the force calculation plate in the force calculation plate module to the radiating fin.

In one embodiment, the heat sink includes: the cooling base plate and the plurality of cooling fins are positioned on the surface of the cooling base plate, which is far away from the computing plate, and are distributed at intervals along a second direction perpendicular to the first direction, and the cooling fins and the cooling base plate are arranged in an extending manner along the first direction; at least one side surface of the radiating fin is a wavy surface or a sawtooth surface.

In one embodiment, the heat dissipation fan includes a plurality of heat dissipation fans, and the plurality of heat dissipation fans are uniformly distributed.

In one embodiment, the force calculation board module comprises a plurality of force calculation board modules, and the plurality of force calculation board modules are uniformly distributed along a third direction, wherein the third direction is perpendicular to the first direction and the second direction.

The application provides a server, including: the air conditioner comprises a case, a first air inlet and a second air outlet, wherein the case is provided with a first end and a second end which are distributed at intervals along a first direction; the board card frame is positioned in the case; the force calculation plate module is positioned in the board card frame, and a radiating fin in the force calculation plate module is arranged in an extending manner along a first direction, so that two ends of the radiating fin are respectively close to the first air inlet and the first air outlet; and the heat dissipation fan is positioned in the case and used for exhausting the airflow flowing through the force calculation board module from the first air outlet. Therefore, at least along the flowing direction of the airflow, the radiating fins can fill the space where the force calculation plate in the force calculation plate module is located, the problem of wind resistance caused by the fact that two adjacent radiating fins are not aligned along the flowing direction of the airflow is avoided, and the radiating effect is improved; in addition, the heat radiating fins can also utilize the gap between two adjacent ASIC chips, so that the heat radiating fins have larger heat radiating area, further improve the heat radiating effect and meet the high-efficiency heat radiating requirement of the server; meanwhile, the air quantity is increased without increasing the rotating speed of a cooling fan, the noise of the server is not increased, and the silencing effect is favorably achieved.

Additional features and advantages of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the present application. Other advantages of the present application may be realized and attained by the instrumentalities and combinations particularly pointed out in the specification and the drawings.

Drawings

FIG. 1 is an exploded block diagram of a server according to an embodiment;

FIG. 2 is a first schematic structural diagram of a heat sink according to an embodiment;

fig. 3 is a first schematic structural diagram of the board card frame, the force calculation board module, and the heat dissipation fan according to an embodiment;

fig. 4 is a second schematic structural view of the board card frame, the computing board module, and the heat dissipation fan according to an embodiment;

FIG. 5 is a partially enlarged schematic view of portion A of FIG. 1;

fig. 6 is a schematic structural diagram of a heat sink according to an embodiment.

Description of the reference numerals:

1. a chassis; 1a, a first end; 1b, a second end; 11. an upper cover; 12. an outer frame; 121. a first air inlet; 122. a second air inlet; 123. a mounting member; 13. a bracket; 14. a handle;

2. a board card frame; 2a, a first open end; 2b, a second open end; 21. a first plate body; 22. a first side plate; 221. a first flanging edge; 222. an interface board; 2221. an interface board body; 2222. thirdly, folding the edges; 2223. fourthly, folding the edge; 2224. fifthly, folding the edges; 223. a baffle plate; 23. a second side plate; 231. Second flanging;

3. a force calculation board module; 31. a heat sink; 311. a heat-dissipating substrate; 312. a heat dissipating fin; 313. a heat conducting boss;

4. a heat radiation fan; 5. a power supply device; 6. a main control board; 7. and a lamp panel.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary intended for explaining the present invention, and should not be construed as limiting the present invention.

In the related art, in order to ensure the heat dissipation effect, the rotation speed of the fan is usually increased to increase the air volume, which in turn causes the noise of the server to be large.

The embodiment of the application provides a server, wherein radiating fins of a force calculation plate module in a board card frame are arranged to extend along the airflow flowing direction, the radiating fins can extend to two ends of the force calculation plate module and are respectively close to a first air inlet and a first air outlet, and a plurality of ASIC chips in the force calculation plate of the force calculation plate module are respectively in heat transfer contact with the radiating fins, so that the problem of wind resistance caused by the fact that two adjacent radiating fins are not aligned along the airflow flowing direction is avoided, and the radiating effect is improved; moreover, the heat radiating fins can also utilize the gap between two adjacent ASIC chips, so that the heat radiating fins have larger heat radiating area, the heat radiating effect is further improved, and the high-efficiency heat radiating requirement of the server can be met; meanwhile, the air quantity is increased without increasing the rotating speed of a cooling fan, the noise of the server is not increased, and the silencing effect is favorably achieved.

The structure, function and implementation process of the server provided by the embodiment of the present application are described below with reference to the accompanying drawings.

It is to be understood that other configurations and functions of the server according to the embodiments of the present application are known to those skilled in the art, and are not described herein in detail to reduce redundancy.

As shown in fig. 1, a server provided in an embodiment of the present application includes: the device comprises a case 1, a board card frame 2, a force calculation board module 3 and a heat radiation fan 4. The board card frame 2, the force calculation board module 3 and the heat dissipation fan 4 are located in the case 1.

For convenience of description, an arrow Y in fig. 1 is used to illustrate a first direction, i.e., the front of the server; arrow X in fig. 1 is used to illustrate the second direction, i.e. the right of the server; arrow Z in fig. 1 is used to illustrate the third direction, i.e. above the server.

Illustratively, the chassis 1 includes: the portable electronic device comprises an upper cover 11, an outer frame 12 and a bracket 13, wherein the outer frame 12 can be a rectangular or other frame structure, the upper cover 11 is arranged at the upper end of the outer frame 12, and the bracket 13 is arranged at the lower end of the outer frame 12. At least one of the upper cover 11 and the bracket 13 is detachably connected to the outer frame 12, so as to facilitate subsequent repair or replacement of components in the enclosure 1.

The casing 1 has a first end 1a and a second end 1b spaced apart from each other along the first direction Y. The first end 1a of the chassis 1 is a front end, and the second end 1b of the chassis 1 is a rear end. Of course, in other examples, the first end 1a of the chassis 1 may also be a rear end, and the second end 1b of the chassis 1 may also be a front end. The first end 1a is provided with a first air inlet 121, and the second end 1b is provided with a first air outlet (not shown). The first air inlet 121 and the first air outlet are respectively disposed on the outer frame 12.

For convenience of description, the present embodiment is described by taking the outer frame 12 as a rectangular frame structure as an example. The outer frame 12 may include: the front side plate and the rear side plate are distributed at intervals relatively, the left side plate and the right side plate are distributed at intervals relatively, the left side plate is connected with the left sides of the front side plate and the rear side plate respectively, and the right side plate is connected with the right sides of the front side plate and the rear side plate respectively. Wherein, preceding curb plate, posterior lateral plate, left side board and right side board can be structure as an organic whole, perhaps preceding curb plate, posterior lateral plate, left side board and right side board are connected through modes such as welding or spiro union, specifically can set up according to actual need.

The front side plate is provided with a first air inlet 121. In some examples, the first air inlet 121 may be a larger opening to facilitate increasing the amount of air to be supplied. In other examples, the first air inlet 121 includes a plurality of through holes distributed in a matrix shape, which is beneficial to reduce or even prevent external dust and the like from entering the chassis 1.

The rear side plate is provided with a first air outlet. In some examples, the first air outlet may be a larger opening to facilitate increasing the air output. In other examples, the first air outlet includes a plurality of through holes distributed in a matrix.

Of course, in other examples, the first air outlet may be disposed on the front side plate, and the first air inlet 121 may be disposed on the rear side plate; alternatively, the first air inlet 121 is provided on one of the left and right side plates, and the first air outlet is provided on the other.

In some examples, handles 14 are further provided on the left and right sides of the front side plate, respectively, and the handles 14 may be U-shaped to improve operational convenience in a scene of carrying or moving a server, etc.

The board card frame 2 is used for installing the force calculation board module 3 at a preset position in the case 1. Illustratively, the installation position of the force calculation plate module 3 is located in the right area in the chassis 1, and the board frame 2 fixes the force calculation plate module 3 in the right area in the chassis 1. Of course, the installation position of the force calculation board module 3 is not limited to this, for example, the installation position of the force calculation board module 3 may also be located in the left area in the chassis 1, and the installation position of the force calculation board module 3 may be specifically set according to actual needs.

As shown in fig. 1 and 3, the force calculation board module 3 is located in the board frame 2, and the force calculation board module 3 may be specifically disposed in a space enclosed by the board frame 2 and the chassis 1. The force computing board module 3 may include a force computing board and a heat sink 31, the force computing board and the heat sink 31 being in heat transfer contact so that heat generated during operation of the ASIC chip on the force computing board can be dissipated via the heat sink 31.

The computing Board may include a Printed Circuit Board (PCB), a power interface for electrically connecting the PCB with the power device 5 of the server, a main control Board interface for electrically connecting the PCB with the main control Board 6 of the server, and the like. The printed circuit board is provided with a plurality of ASIC chips (also called computational power chips) which are distributed to avoid heat concentration.

As shown in fig. 2 and fig. 1, the heat sink 31 may include a heat dissipation substrate 311 and a plurality of heat dissipation fins 312. A plurality of heat sink fins 312 may be located on a surface of the heat sink base plate 311 facing away from the force plate. The heat dissipation plate 31 extends along the second direction X, the plurality of heat dissipation fins 312 are distributed at intervals along the second direction X, and the gap between two adjacent heat dissipation fins 312 can be used for the airflow entering from the first air inlet 121 to pass through. Therefore, the radiating fins 31 have larger heat exchange area, and also have larger radiating area, which is beneficial to improving the radiating effect. Moreover, the heat dissipation fins 312 and the heat dissipation substrate 311 are both extended along the first direction Y, so that the two ends of the heat dissipation plate 31 are respectively close to the first air inlet 121 and the first air outlet, which is beneficial for filling the heat dissipation plate 31 in more areas, further increasing the heat dissipation area and improving the heat dissipation effect. In addition, the heat dissipation fins 312 also extend in the vertical third direction Z to have a larger heat dissipation area. The extending distance of the heat dissipation substrate 311 and the heat dissipation fins 312 along each direction may be set according to actual needs, and this embodiment is not limited herein.

In some examples, the heat sink 31 may extend forward to contact the area where the first air inlet 121 is located or have a relatively small gap. The radiating fins 31 can extend backwards to form relatively larger gaps in the areas where the first air outlets are located, and the radiating fans 4 are arranged in the gaps, so that the radiating fans 4 are arranged close to the first air outlets, the air flow after heat exchange with the radiating fins 31 can be prevented from staying in the space enclosed by the board card frame 2 and the case 1, the air flow after heat exchange with the radiating fins 31 can be discharged out of the case 1 from the first air outlets in time, and the radiating effect is improved. The gaps between the heat sink 31 and the area where the first air inlet 121 is located and the area where the first air outlet is located may be specifically set according to actual needs. Of course, in other examples, the heat dissipation fan 4 may be disposed near the first air inlet 121.

The server provided by the embodiment of the application comprises: the air conditioner comprises a case 1, a first air inlet 121 and a second air outlet 121, wherein the case 1 is provided with a first end 1a and a second end 1b which are distributed at intervals along a first direction Y; the board card frame 2 is positioned in the case 1; the force calculation plate module 3 is positioned in the board card frame 2, and the radiating fins 31 in the force calculation plate module 3 extend along the first direction Y, so that two ends of the radiating fins 31 are respectively close to the first air inlet 121 and the first air outlet; and the heat radiation fan 4 is positioned in the case 1 and used for discharging the airflow flowing through the computing board module 3 from the first air outlet. Therefore, at least along the direction of airflow flowing, the cooling fins 31 can fill the space where the force calculation plate of the force calculation plate module 3 is located, so that the problem of wind resistance caused by misalignment of two adjacent cooling fins 31 along the direction of airflow flowing is avoided, and the cooling effect is further improved; moreover, the heat sink 31 can also utilize the gap between two adjacent ASIC chips, so that the heat sink 31 has a larger heat dissipation area, thereby further improving the heat dissipation effect and meeting the high-efficiency heat dissipation requirement of the server; meanwhile, the rotating speed of the cooling fan 4 is not required to be increased to increase the air quantity, the noise of the server is not increased, and the silencing effect is favorably achieved.

In some embodiments, as shown in fig. 1 and 3, the board frame 2 includes: the first board body 21, the first side board 22 and the second side board 23 are distributed at intervals along the second direction X, the first side board 22 and the second side board 23 are respectively and vertically connected to the first board body 21, and the first side board 22 and the second side board 23 are turned over downwards relative to the first board body 21, so that the first board body 21, the first side board 22, the second side board 23 and the bracket 13 enclose an independent chamber; the force computing plate module 3 is located in the chamber. Therefore, the board card frame 2 and the force calculation plate module 3 can form a first heat dissipation channel, cold air entering from the first air inlet 121 can enter the first heat dissipation channel and exchange heat with the heat dissipation fins 31, and hot air after heat exchange is discharged out of the case 1 from the first air outlet, so that heat dissipation of the force calculation plate in heat transfer contact with the heat dissipation fins 31 is realized. Moreover, can be relatively independent with the outer space of integrated circuit board frame 2 through with first heat dissipation channel to ensure that the cold wind that gets into from first air intake 121 can both get into first heat dissipation channel, can also ensure that the hot-blast first air outlet of following the outflow of first heat dissipation channel is discharged in time.

Moreover, the first side plate 22 and the second side plate 23 are vertically connected to the first plate body 21, respectively, so that the layout of components in the server can be made more compact. Of course, in other examples, the included angle between the first side plate 22 and the first plate body 21 and the second side plate 23 may also be other angles, and may be specifically set according to actual needs.

In addition, along XY plane, fin 31 can fill in integrated circuit board frame 2, has great heat radiating area, does benefit to the fan that adopts low rotational speed, low noise, in addition the mode that induced drafts in first air outlet department for the temperature in integrated circuit board frame 2 is more even, reaches better radiating effect and silence effect, prolongs the life of product, and can do benefit to the compactness of server inner structure.

The first opening end 2a is defined by one end of the first plate body 21, the first side plate 22 and the second side plate 23 facing the first air inlet 121, and the sizes of the first air inlet 121 along the first direction Y and the second direction X are respectively greater than or equal to the corresponding size of the first opening end 2a, so that the area of the first opening end 2a is greater than or equal to the area of the area where the first air inlet 121 is located, and a sufficient air inlet amount is ensured.

A second opening end 2b is defined by one end of the first plate body 21, the first side plate 22 and the second side plate 23 facing the first air outlet, and the sizes of the first air outlet along the first direction Y and the second direction X are respectively greater than or equal to the corresponding size of the second opening end 2 b; the heat dissipation fan 4 is located between the second opening end 2b and the first air outlet, so that the area of the second opening end 2b is larger than or equal to the area of the area where the first air outlet is located, and the hot air is discharged conveniently.

With the above arrangement, the areas of the first open end 2a and the second open end 2b are also relatively large, enabling more airflow to pass through. Of course, in other examples, an end cover plate may be disposed at one end of the first plate 21, the first side plate 22, and the second side plate 23 facing the first air inlet 121, or at one end of the first plate 21, the first side plate 22, and the second side plate 23 facing the first air outlet, and the end cover plate is provided with corresponding openings for air to pass through.

In some examples, an end of the first side plate 22 facing away from the first board body 21 is provided with a first folded edge 221, an end of the second side plate 23 facing away from the first board body 21 is provided with a second folded edge 231, and the first folded edge 221 and the second folded edge 231 are detachably connected to the chassis 1, for example, the first folded edge 221 and the second folded edge 231 are respectively fastened to the bracket 13 of the chassis 1 by a plurality of fasteners. The first folding edge 221 and the second folding edge 231 extend in a direction away from each other, so as to improve the structural compactness inside the chassis 1. In other examples, the first side plate 22 and the second side plate 23 may be fixedly connected to the bracket 13 of the chassis 1 by welding or the like, or the first folding edge 221 and the second folding edge 231 may extend in opposite directions.

In some embodiments, as shown in fig. 1 and 4, the server further includes: power supply unit 5 and main control board 6, power supply unit 5 and main control board 6 are located quick-witted case 1, and power supply unit 5 and main control board 6 are located the board card frame 2 outside, specifically can be located the right side of board card frame 2. The interface at the first side plate 22 of the board frame 2 is used for electrically connecting the force calculation board module 3 with the power supply device 5 and the main control board 6 respectively. The power supply device 5 is used for supplying power to the force calculation board module 3, the cooling fan 4, the main control board 6 and the like in the case 1. The main control board 6 may be used to control the operating state of the server.

At least part of the first side plate 22 can be detachably connected with the first plate body 21, and the first side plate 22 can also be detachably connected with the bracket 13, so as to facilitate maintenance. Removable attachment means include, but are not limited to: and the fastening piece is used for fastening connection and clamping connection.

In some examples, as shown in fig. 4 and 5, the first side plate 22 includes an interface board 222 and a baffle 223, the interface board 222 and the baffle 223 are arranged side by side along the Y-axis direction, and the interface board 222 is detachably connected to the baffle 223, the first plate 21, and the bracket 13, so that convenience in mounting and dismounting the interface board 222 is improved, and subsequent maintenance is facilitated. The interface of the interface board 222 is used to electrically connect the force calculating board module 3 with the power supply device 5 and the main control board 6.

Illustratively, the interface board 222 includes an interface board body 2221 and a third folded edge 2222 at an upper end thereof, the third folded edge 2222 is folded toward the first board body 21 (i.e., folded toward the left side), the third folded edge 2222 may be located at a lower side of the first board body 21, and the third folded edge 2222 is detachably connected to a portion of the first board body 21 near the right edge by a fastener. Of course, the third folded edge 2222 may be located on the upper side of the first plate body 21. Alternatively, a portion of the first plate 21 near the right edge may be provided with a socket groove, in which the third turned edge 2222 at the upper end of the interface board 222 is inserted.

The interface board 222 has a fourth folded edge 2223 and a fifth folded edge 2224 on the rear side facing the baffle 223, the fourth folded edge 2223 is connected between the interface board body 2221 and the fifth folded edge 2224, the fourth folded edge 2223 is folded inward toward the board frame 1 with respect to the interface board body 2221, the fifth folded edge 2224 is folded in the direction facing the baffle 223 with respect to the fourth folded edge 2223, and the fifth folded edge 2224 is detachably connected to the baffle 223 by a fastener. Of course, the fourth folded edge 2223 may also be folded outward toward the board frame 2 relative to the interface board body 2221. Alternatively, a side of the baffle 223 facing the interface board 222 is provided with a socket groove, and the fifth turned edge 2224 is inserted into the socket groove.

The interface board 222 and the baffle 223 are detachably connected to the bracket 13 via the first turned-over edge 221 on the lower side.

In addition, the server can also include lamp plate 7, and lamp plate 7 can be connected with power supply unit 5 and 6 electricity of main control board, and main control board 6 can carry out corresponding visual cue according to the state control lamp plate 7 of server.

In some examples, the chassis 1 is provided with a second air inlet 122 and a second air outlet (not shown in the drawings), and the second air inlet 122 is disposed near at least one of the power supply device 5 and the main control board 6, so that the air flow entering the chassis 1 from the second air inlet 122 flows through at least one of the power supply device 5 and the main control board 6 and then is discharged from the second air outlet, so as to dissipate heat of at least one of the power supply device 5 and the main control board 6.

Taking the second air inlet 122 disposed in the area of the bracket 13 of the chassis 1 for mounting the power device 5 and the main control board 6 as an example, the second air inlet 122 includes a plurality of through holes distributed in a matrix form. The first side plate 22 of the board frame 2, the power supply device 5, the main control board 6, and portions of the chassis 1 can define a second heat dissipation channel. The rear side plate of the chassis 1 may be provided with a second air outlet.

When the server is in a working state, the cold air outside the case 1 can enter the second heat dissipation channel from the second air inlet 122, the cold air entering the second heat dissipation channel can exchange heat with the power supply device 5 and the main control board 6, and the hot air after heat exchange is discharged outside the case 1 from the second air outlet, so that heat dissipation is realized. In the power supply device 5, a fan or the like for driving the airflow to flow may be integrated to accelerate the airflow and ensure the heat dissipation effect.

Of course, in other examples, the area of the bracket 13 of the chassis 1 for mounting the power supply device 5 is provided with the second air inlet 122. Or, a second air inlet 122 is provided in an area of the bracket 13 of the enclosure 1 for installing the main control board 6. The second air inlet 122 may also be formed in the front side plate of the outer frame 12. The second air outlet may also be disposed at other positions of the chassis 1, such as on the upper cover 11 of the chassis 1 or the left side plate of the chassis 1.

In this embodiment, the first heat dissipation channel and the second heat dissipation channel where the force calculation board module 3 is located are independent from each other, so as to prevent hot air after heat exchange with the force calculation board module 3 from affecting the power supply device 5 and the main control board 6, and also prevent hot air after heat exchange with the power supply device 5 and the main control board 6 from affecting the force calculation board module 3, thereby ensuring heat dissipation effects on the force calculation board module 3, the power supply device 5, and the main control board 6. Of course, in other examples, the power supply device 5 and the main control board 6 may be located in separate heat dissipation channels.

In some examples, as in fig. 1, a mounting member 123 is disposed in the chassis 1, and the mounting member 123 may be a hollow ring structure. The mounting member 123 can be connected to the power supply device 5, and can improve the mounting reliability of the power supply device 5 and the strength of the housing 1, thereby extending the service life of the server. In other examples, at least one of lamp panel 7 and main control panel 6 may also be connected with mounting member 123. Wherein, the shape and size of the mounting member 123 can be set according to actual needs.

The inner space of the mounting member 123 forms an air guiding channel (not shown in the drawings), and the air guiding channel extends along the third direction Z to guide the airflow entering from the second air inlet 122 to flow to the power supply device 5 and/or the main control board 6, so as to increase the heat exchange area between the power supply device 5 and/or the main control board 6 and the airflow entering from the second air inlet 122, and thus improve the heat dissipation effect on the power supply device 5 and/or the main control board 6.

The air guide channel is provided with a plurality of air guide holes, and the plurality of air guide holes can be distributed at intervals along a third direction; or the air guide channel is provided with a long hole, and the length direction of the long hole is parallel to the third direction.

Exemplarily, power supply unit 5 and main control board 6 can be arranged side by side along second direction X, main control board 6 can be located between power supply unit 5 and integrated circuit board frame 2, installed part 123 can set up in the front end of power supply unit 5 and main control board 6, and installed part 123 is located one side that power supply unit 5 is close to main control board 6, make power supply unit 5 and main control board 6 can both be connected with this installed part 123, and the air current that the wind-guiding passageway of installed part 123 flows can flow to power supply unit 5 and main control board 6, thereby promote the radiating effect to power supply unit 5 and main control board 6.

Alternatively, the power supply device 5 and the main control board 6 may be stacked in the third direction Z, for example, the power supply device 5 is located above or below the main control board 6, the mounting member 123 may be disposed at the front ends of the power supply device 5 and the main control board 6, so that both the power supply device 5 and the main control board 6 can be connected to the mounting member 123, and the airflow flowing out from the air guide channel of the mounting member 123 can flow to the power supply device 5 and the main control board 6.

Of course, in other examples, separate mounting members 123 may be provided for the power supply device 5 and the main control board 6, and the implementation process may be similar to the foregoing examples, and will not be described herein again.

In some embodiments, the force calculation board module 3 further includes: the heat conduction silicone grease layer can be filled between the chip of the force calculation plate and the radiating fin 31, and the heat conduction silicone grease layer is used for transferring heat generated by the chip of the force calculation plate to the radiating fin 31 so as to improve heat transfer efficiency.

For example, as shown in fig. 2 and fig. 6, in the heat sink 31, a surface of the heat dissipation substrate 311 facing away from the heat dissipation fins 312 may be provided with a heat conduction boss 313, the heat conduction boss 313 extends in a direction facing away from the heat dissipation fins 312, and the heat conduction boss 313 is used for contacting with the ASIC chip to improve heat transfer efficiency between the ASIC chip and the heat sink 31. The thermally conductive bumps 313 may be in heat transfer contact with the ASIC chip through a thermally conductive silicone layer. Of course, the thermally conductive bosses 313 could also be in direct thermal transfer contact with the ASIC chip. In fig. 6, a rectangular frame beside the heat-conducting bump 313 can be used to illustrate the mounting position of the ASIC chip.

Illustratively, as shown in fig. 2 and 6, the computation force board has a plurality of ASIC chips thereon, and the surface of the heat dissipation substrate 311 is provided with a plurality of heat conductive bumps 313. At least one heat conduction boss 313 corresponds to each ASIC chip. Alternatively, two adjacent ASIC chips may share the thermally conductive boss 313. The size of the heat conducting bosses 313 can be set according to the size of the ASIC chip, and the number of the heat conducting bosses 313 can be set according to actual needs.

In some examples, at least one side surface of the heat dissipation fin 312 is a wavy surface or a serrated surface to increase a heat dissipation area and enhance a heat dissipation effect. Illustratively, both side surfaces of the heat dissipating fins 312 are wavy surfaces.

In some embodiments, as shown in fig. 1 and 3, the heat dissipation fan 4 includes a plurality of heat dissipation fans 4, and the plurality of heat dissipation fans 4 are uniformly distributed. For example, at least some of the plurality of heat dissipation fans 4 may be disposed side by side in the second direction X, or at least some of the plurality of heat dissipation fans 4 may be disposed in a stack in the third direction Z. The number of the heat dissipation fans 4 can be set according to the number and the requirement of the force calculation board modules 3.

The total size of the heat dissipation fan 4 along the third direction Z may be equal to the size of the second opening end 2b of the board frame 2 in the direction, so as to improve the heat dissipation effect. The total size of the heat dissipation fan 4 in the second direction X may be equal to the size of the second opening end 2b of the board frame 2 in the direction, so as to improve the heat dissipation effect.

The force calculation plate modules 3 are multiple, the force calculation plate modules 3 are uniformly distributed along a third direction Z, and the third direction Z is perpendicular to the first direction Y and the second direction X.

Illustratively, the force computing plate module 3 includes two force computing plate modules 3, and the two force computing plate modules 3 are stacked along the third direction Z. The two heat dissipation fans 4 are arranged side by side along the second direction X. The cooling fan 4 can be a fan with a rotation speed of 1800-2200RPM, so that a good cooling effect is achieved, and the noise of the server can be reduced.

The server of this embodiment, through setting up the integrated circuit board frame, relatively independent cavity can be enclosed into with the bracket of quick-witted case to the integrated circuit board frame, to calculate in the power board module locates this cavity, set up the fin that extends along air current flow direction in calculating the power board module, the radiating basal plate and the radiating fin of fin all extend along air current flow direction, and set up induced drafting radiator fan in the exit of air current, thus, not only do benefit to the mobility that improves the air current, make the temperature in the cavity more even, can also more effectually utilize the space in the cavity, increase heat radiating area, thereby very big promotion calculate the radiating effect of power board in the power board module, satisfy the high-efficient radiating demand of server, furthermore, do benefit to and realize the silence effect, user experience has been promoted. In addition, because the force calculation board module is positioned in the independent cavity, the force calculation board module and the heat generated by the power supply device, the main control board and other loads in the working process cannot interfere with each other, and the heat dissipation effect of the whole server is favorably ensured.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second", and the like used in the embodiments of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features of the embodiments of the present invention defined by the terms "first", "second", and the like, may explicitly or implicitly indicate that at least one of the features is included in the embodiments. In the description of the present invention, the word "plurality" means at least two or two and more, for example, two, three, four, etc., unless specifically limited otherwise in the examples.

In the present invention, unless otherwise explicitly specified or limited by the embodiments, the terms "mounted," "connected," and "fixed" appearing in the embodiments are to be understood in a broad sense, for example, the connection may be a fixed connection, a detachable connection, or an integrated connection, and it may be understood that the connection may also be a mechanical connection, an electrical connection, or the like; of course, they may be directly connected or indirectly connected through intervening media, or they may be interconnected within one another or in an interactive relationship. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific implementation.

In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

While embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (10)

1. A server, comprising:

the air conditioner comprises a case, a first air inlet and a second air outlet, wherein the case is provided with a first end and a second end which are distributed at intervals along a first direction;

the board card frame is positioned in the case;

the force calculation plate module is positioned in the board card frame, and a radiating fin in the force calculation plate module extends along the first direction, so that two ends of the radiating fin are respectively close to the first air inlet and the first air outlet;

and the heat dissipation fan is positioned in the case and used for exhausting the airflow flowing through the computing board module from the first air outlet.

2. The server according to claim 1, wherein the heat dissipation fan is disposed near the first air outlet.

3. The server of claim 1, wherein the board frame comprises: the first side plate and the second side plate are distributed at intervals along a second direction, the second direction is perpendicular to the first direction, and the first side plate and the second side plate are respectively connected to the first plate body;

the force calculation plate module is located in a space defined by the first plate body, the first side plate and the second side plate.

4. The server according to claim 3, wherein the ends of the first board body, the first side board and the second side board facing the first air inlet define a first open end, and the dimensions of the first air inlet in the first direction and the second direction are respectively greater than or equal to the corresponding dimensions of the first open end; and/or the presence of a gas in the gas,

a second opening end is defined by one end, facing the first air outlet, of the first plate body, the first side plate and the second side plate, and the sizes of the first air outlet along the first direction and the second direction are respectively larger than or equal to the corresponding sizes of the second opening end; the heat dissipation fan is located between the second opening end and the first air outlet.

5. The server according to claim 3, wherein the first side plate and the second side plate are respectively vertically connected to the first plate body;

a first turning edge is arranged at one end of the first side plate, which is far away from the first plate body, a second turning edge is arranged at one end of the second side plate, which is far away from the first plate body, and the first turning edge and the second turning edge extend in the directions far away from each other;

the first flanging edge and the second flanging edge are detachably connected with the case respectively.

6. The server according to claim 1, wherein the server further comprises: the power supply device and the main control board are positioned in the case and positioned outside the board card frame.

7. The server of claim 6, wherein a mount is disposed within the chassis, the mount being connected to at least one of the power supply unit and the main control board;

the first curb plate of integrated circuit board frame includes: the baffle and the interface board are arranged side by side along the first direction; the interface board is detachably connected with the baffle, the first board body of the board card frame and the case respectively; the interface arranged on the interface board is used for electrically connecting the force calculation board module with the power supply device and the main control board respectively.

8. The server of claim 1, wherein the force board module further comprises: the heat conduction silicone grease layer is used for transferring heat generated by a chip of the force calculation plate in the force calculation plate module to the radiating fin.

9. The server of claim 1, wherein the heat sink comprises: the heat dissipation base plate is arranged on the surface of the heat dissipation base plate, which is far away from the force calculation plate, the heat dissipation fins are distributed at intervals along a second direction perpendicular to the first direction, and the heat dissipation fins and the heat dissipation base plate are arranged in an extending manner along the first direction;

at least one side surface of the radiating fin is a wavy surface or a serrated surface.

10. The server according to any one of claims 1 to 9, wherein the heat dissipation fans include a plurality of heat dissipation fans, and the plurality of heat dissipation fans are evenly distributed;

or, the computation force plate module comprises a plurality of computation force plate modules which are uniformly distributed along a third direction, and the third direction is perpendicular to the first direction and the second direction.

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