CN207652794U - A kind of printed wiring board upper nonconductive Film layer device - Google Patents
A kind of printed wiring board upper nonconductive Film layer device Download PDFInfo
- Publication number
- CN207652794U CN207652794U CN201721650094.2U CN201721650094U CN207652794U CN 207652794 U CN207652794 U CN 207652794U CN 201721650094 U CN201721650094 U CN 201721650094U CN 207652794 U CN207652794 U CN 207652794U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- film layer
- printed wiring
- layer device
- upper nonconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Coating Apparatus (AREA)
Abstract
The utility model is related to a kind of printed wiring board upper nonconductive Film layer devices, it includes workbench, the workbench is equipped with the conveying mechanism moved along X-direction, the conveying mechanism upper edge direction of advance is fixed with multigroup wiring board, every group of wiring board is made of N number of wiring board, N is the integer more than 1, corresponding one of which wiring board is provided with N number of brushing above the workbench, it is each to brush the inner cavity for including brush head and insulating film layer coating being provided to brush head, N number of brush is moved back and forth by an elevating mechanism drives edge Y direction, and it is moved back and forth by a driving mechanism drives edge Z-direction, insulating film layer coating to be coated in the circuit board.The utility model is designed reasonably, easy to use, easily controllable coating thickness, coating efficiency is good, high degree of automation.
Description
Technical field
The utility model is related to wiring board technology field more particularly to a kind of printed wiring board upper nonconductive Film layer devices.
Background technology
Wiring board is also known as circuit board, and conductive pattern and hole are arranged on base material, is used for replacing the bottom of previous electronic component
Disk, and realize the interconnection between electronic component, the mistake of wiring and assembly can be greatly reduced, improve automatization level
And production efficiency.In printed wiring board production process, need between two neighboring layer, outermost layer etc. carries out at insulation protection
Reason, common insulating materials have epoxyn.
Invention content
The purpose of this utility model is that in view of the deficiencies of the prior art, a kind of reasonable design is provided, and it is easy to use, it is easy to
Coating thickness is controlled, coating efficiency is good, the printed wiring board upper nonconductive Film layer device of high degree of automation.
To achieve the above object, the utility model uses following technical scheme：
A kind of printed wiring board upper nonconductive Film layer device comprising workbench, the workbench is equipped with to be moved along X-direction
Dynamic conveying mechanism, the conveying mechanism upper edge direction of advance are fixed with multigroup wiring board, and every group of wiring board is by N number of wiring board
Composition, N are the integer more than 1, and corresponding to one of which wiring board above the workbench is provided with N number of brushing, each brushes equal
The inner cavity of insulating film layer coating is provided including brush head and to brush head, N number of brushing is reciprocal by an elevating mechanism drives edge Y direction
It is mobile, and moved back and forth by a driving mechanism drives edge Z-direction, in the circuit board by the coating of insulating film layer coating.
It further includes the feeding pipeline for conveying insulating film layer coating, the feeding pipeline respectively in N number of brushing
Chamber is connected to.The design can ensure that inner cavity has sufficient insulating film layer coating, continuously to provide insulating film to brush head
Coating, it is ensured that brush head coating operation is uninterrupted, substantially increases coating efficiency and the degree of automation.
The driving mechanism includes the lead screw extended along Z-direction, and the lead screw is erected above workbench, and by lifting
Mechanism drives edge Y direction moves back and forth, and is threaded with N number of movable block on the lead screw, N number of movable block respectively with N number of painting
Brush connection, described lead screw one end drive positive and negative rotation by a stepper motor, to drive N number of brush to be moved back and forth along Z-direction.It should
Design uses the higher lead screw of precision in gearing and movable block to realize the reciprocating movement of brushing to apply insulating film layer
Material coating in the circuit board, makes it easier for the coating thickness for controlling insulating film layer coating, and coating operation stability is good.
The elevating mechanism is telescopic cylinder or telescopic oil cylinder.
The conveying mechanism is equipped with the fixing groove for fixing circuit board.The design can effectively avoid wiring board and coat
Position offset occurs in the process, substantially increases coating positioning accuracy.
The conveying mechanism is conveyer belt.
It further includes controller, and the controller is connect with driving mechanism, elevating mechanism and conveying mechanism respectively.The design
So that the technique of upper nonconductive Film layer realizes full-automation, greatly improve work efficiency.
The utility model uses above technical scheme, the conveying mechanism upper edge direction of advance to be fixed with multigroup wiring board,
Every group of wiring board is made of N number of wiring board, which makes it that can not only carry out upper nonconductive Film layer work to N number of wiring board simultaneously
Industry, and can wiring board be sent into or be sent out automatically upper nonconductive Film layer station, the automation of wiring board conveying is realized, is overcome
The defects such as security risk and operating efficiency existing for traditional artificial manual working be low；It is each brush include brush head and to
Brush head provides the inner cavity of insulating film layer coating, which enables brush head automatic dipping upper nonconductive Film coating so as to coating line at any time
Road plate, without being manually infected with insulating film layer coating.The utility model is designed reasonably, easy to use, easily controllable coating is thick
Degree, coating efficiency is good, high degree of automation.
Description of the drawings
The utility model is further elaborated in conjunction with attached drawing：
Fig. 1 is the structural schematic diagram of the utility model printed wiring board upper nonconductive Film layer device.
Specific implementation mode
As shown in Figure 1, the printed wiring board upper nonconductive Film layer device of the utility model, including workbench 1, the work
Make platform 1 and be equipped with the conveying mechanism 2 moved along X-direction, 2 upper edge direction of advance of the conveying mechanism is fixed with multigroup wiring board
3, every group of wiring board 3 is made of N number of wiring board 3, and N is the integer more than 1, the corresponding one of which line in 1 top of the workbench
Road plate 3 is provided with N number of brushing 4, each to brush 4 inner cavities that insulating film layer coating is provided including brush head 41 and to brush head 41
（It is not marked in figure）, N number of to brush 4 by the reciprocating movement of 5 drives edge Y direction of an elevating mechanism, and by 6 drives edge of a driving mechanism
Z-direction moves back and forth, and insulating film layer coating is coated in assist side 3.
It further includes the feeding pipeline 32 for conveying insulating film layer coating, and the feeding pipeline 32 brushes 4 with N number of respectively
Inner cavity connection.The design can ensure that inner cavity has sufficient insulating film layer coating, continuously to be provided to brush head 41
Insulating film layer coating, it is ensured that the coating operation of brush head 41 is uninterrupted, substantially increases coating efficiency and the degree of automation.
The driving mechanism 6 includes the lead screw 61 extended along Z-direction, and the lead screw 61 is erected at 1 top of workbench, and
It is moved back and forth by 5 drives edge Y direction of elevating mechanism, N number of movable block 62, N number of movable block is threaded on the lead screw 61
62 connect with N number of brushing 4 respectively, and 61 one end of the lead screw drives positive and negative rotation by a stepper motor 63, to drive N number of brushing 4
It is moved back and forth along Z-direction.The design uses the higher lead screw 61 of precision in gearing and movable block 62 to realize brushing 4
Reciprocating movement insulating film layer coating to be coated in assist side 3, the coating for making it easier for controlling insulating film layer coating is thick
Degree, coating operation stability are good.
The elevating mechanism 5 is telescopic cylinder or telescopic oil cylinder.
The conveying mechanism 2 is equipped with the fixing groove 21 for fixing circuit board 3.The design can effectively avoid wiring board 3
Position offset occurs in coating procedure, substantially increases coating positioning accuracy.
The conveying mechanism 2 is conveyer belt.
It further includes controller 7, and the controller 7 is connect with driving mechanism 6, elevating mechanism 5 and conveying mechanism 2 respectively.
The design makes the technique of upper nonconductive Film layer realize full-automation, greatly improves work efficiency.
The utility model uses above technical scheme, 2 upper edge direction of advance of the conveying mechanism to be fixed with multigroup wiring board
3, every group of wiring board 3 is made of N number of wiring board 3, which can carry out upper nonconductive Film layer to N number of wiring board 3 simultaneously
Operation, and the automation of the conveying of wiring board 3 is realized, without manually by wiring board 3 into and out upper insulation
Film layer station substantially increases coating work efficiency；Each brushing 4 includes brush head 41 and provides insulating film layer to brush head 41
The inner cavity of coating, the design enable 41 automatic dipping upper nonconductive Film coating of brush head to coat wiring board 3 at any time, without
Artificial contamination insulating film layer coating.
Above description should not have the scope of protection of the utility model any restriction.
Claims (7)
1. a kind of printed wiring board upper nonconductive Film layer device, including workbench, it is characterised in that：The workbench is equipped with along X
The conveying mechanism of axis direction movement, the conveying mechanism upper edge direction of advance are fixed with multigroup wiring board, and every group of wiring board is by N
A wiring board composition, N are the integer more than 1, and corresponding to one of which wiring board above the workbench is provided with N number of brushing, often
A brushing includes brush head and provides the inner cavity of insulating film layer coating to brush head, and N number of brushing is by an elevating mechanism drives edge Y-axis
Direction moves back and forth, and is moved back and forth by a driving mechanism drives edge Z-direction, and insulating film layer coating is coated assist side
On.
2. a kind of printed wiring board upper nonconductive Film layer device according to claim 1, it is characterised in that：It further includes being used for
The feeding pipeline of insulating film layer coating is conveyed, the feeding pipeline is connected to the inner cavity of N number of brushing respectively.
3. a kind of printed wiring board upper nonconductive Film layer device according to claim 1, it is characterised in that：The driving mechanism
Include the lead screw extended along Z-direction, the lead screw is erected above workbench, and from elevating mechanism drives edge Y direction toward
It is multiple mobile, N number of movable block is threaded on the lead screw, N number of movable block is connected with N number of brushing respectively, described lead screw one end
Positive and negative rotation is driven by a stepper motor, to drive N number of brush to be moved back and forth along Z-direction.
4. a kind of printed wiring board upper nonconductive Film layer device according to claim 1 or 3, it is characterised in that：The liter
Descending mechanism is telescopic cylinder or telescopic oil cylinder.
5. a kind of printed wiring board upper nonconductive Film layer device according to claim 1, it is characterised in that：The conveying mechanism
It is equipped with the fixing groove for fixing circuit board.
6. a kind of printed wiring board upper nonconductive Film layer device according to claim 1, it is characterised in that：The conveying mechanism
For conveyer belt.
7. a kind of printed wiring board upper nonconductive Film layer device according to claim 1, it is characterised in that：It further includes control
Device, the controller are connect with driving mechanism, elevating mechanism and conveying mechanism respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721650094.2U CN207652794U (en) | 2017-11-30 | 2017-11-30 | A kind of printed wiring board upper nonconductive Film layer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721650094.2U CN207652794U (en) | 2017-11-30 | 2017-11-30 | A kind of printed wiring board upper nonconductive Film layer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207652794U true CN207652794U (en) | 2018-07-24 |
Family
ID=62882020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721650094.2U Expired - Fee Related CN207652794U (en) | 2017-11-30 | 2017-11-30 | A kind of printed wiring board upper nonconductive Film layer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207652794U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113290895A (en) * | 2021-05-24 | 2021-08-24 | 李志新 | Processing technology of composite polypropylene packaging film |
-
2017
- 2017-11-30 CN CN201721650094.2U patent/CN207652794U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113290895A (en) * | 2021-05-24 | 2021-08-24 | 李志新 | Processing technology of composite polypropylene packaging film |
| CN113290895B (en) * | 2021-05-24 | 2023-01-24 | 惠州市广润环保科技有限公司 | Processing technology of composite polypropylene packaging film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180724 Termination date: 20191130 |