CN207625867U - A kind of good copper base of heat dissipation - Google Patents
A kind of good copper base of heat dissipation Download PDFInfo
- Publication number
- CN207625867U CN207625867U CN201721678051.5U CN201721678051U CN207625867U CN 207625867 U CN207625867 U CN 207625867U CN 201721678051 U CN201721678051 U CN 201721678051U CN 207625867 U CN207625867 U CN 207625867U
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- copper base
- lower layer
- heat dissipation
- upper layer
- slot
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of good copper bases of heat dissipation, upper layer copper base and lower layer's copper base including being provided with inlet opening and/or apopore, the upper and lower layer copper base is equipped with symmetrical blind slot, blind slot on upper and lower layer copper base can gang up and closed tunnel slot to being combined to be formed, liquid can be circulated by inlet opening and/or apopore in upper layer copper base and the tunnel slot of lower layer's copper base synthesis, and fool proof hole is additionally provided on the upper layer copper base and lower layer's copper base；The heat that this product can generate electronic device carrier takes in the copper metal of area bigger and radiates, and liquid after cooling is flowed back into heat sink again, the flowing so to move in circles can reach good whole plate heat dissipation performance by the cycle of liquid.The effect of the radiating mode of the utility model improves decades of times than traditional air cooling way, and high noisy when without wind-cooling heat dissipating, efficiently solves cooling and noise reduction problem.
Description
Technical field
The utility model is related to be based on the electronic circuit of printed circuit board (Printed Circuit Board, abbreviation PCB)
Thermal management technology field, especially a kind of good copper base of heat dissipation.
Background technology
With the high speed development of current electronic technology, electronic component continuous densification development, and the power of itself is not yet
Disconnected raising so that the heat that electronic product unit area generates is continuously increased, if heat cannot distribute in time, it will formed
Localized hyperthermia influences its job stability and even shortens the working life to make electronic component generate failure.Therefore heat dissipation effect
It is critically important for properties of product, it is contemplated that the thermal conductivity of copper is better than aluminium, so using copper on general powerful product
Plate is that metal substrate heat dissipation is more conducive to whole plate heat dissipation.
Since the heat dissipation effect of conventional metals substrate depends on the thermal conductivity of dielectric layer, the whole plate for limiting metal substrate dissipates
Thermal effect.When the thermal conductivity of dielectric layer does not obtain larger raising, need the product structure design by development of metallic substrate come
Improve PCB integral heat sink effects.
Invention content
In order to solve the above technical problems, the utility model provides a kind of good copper base of heat dissipation, by copper
It slots on plate and using the principle of the cold heat dissipation of liquid communication, the heat of copper base can be distributed further.
Technical solution adopted by the utility model to solve its technical problems is：
A kind of good copper base of heat dissipation, including it is provided with the upper layer copper base and lower layer's copper of inlet opening and/or apopore
Substrate, the upper layer copper base and lower layer's copper base are equipped with symmetrical blind slot, on upper layer copper base and lower layer's copper base
Blind slot can be ganged up and closed tunnel slot to being combined to be formed.
Further, the upper layer copper base and lower layer's copper base are ganged up and closed by heat-conducting glue to being formed after pressure viscosity knot
Tunnel slot.
Further, tunnel slot is of a straight line type or " Z " type or " S " type on upper and lower layer copper base.
Further, it is additionally provided with mutually matched fool proof hole on the upper layer copper base and lower layer's copper base.
Further, the thickness of the upper layer copper base and lower layer's copper base is respectively selected as 0.50~2.50mm.
Further, the thickness of the upper layer copper base and lower layer's copper base is respectively selected as 2.00mm.
The utility model has the beneficial effects that：A kind of good copper base of heat dissipation is provided, upper and lower layer copper base is being overlapped
Afterwards, the tunnel slot for foring a closing and ganging up enters tunnel slot by the effect driving liquid of Micropump, makes liquid in tunnel
Internal circulation flow, the heat that electronic device carrier can be generated by the cycle of liquid, take in the copper metal of area bigger into
Row heat dissipation, and liquid after cooling is flowed back into heat sink again, the flowing so to move in circles carries out heat absorption and heat release can
Reach good heat dissipation performance.The effect of the radiating mode of the utility model improves decades of times, and nothing than traditional air cooling way
High noisy when wind-cooling heat dissipating efficiently solves cooling and noise reduction problem.
In addition, upper and lower layer copper base is ganged up to formation after pressure viscosity knot by heat-conducting glue and closed tunnel slot, effectively carry
The high thermal conductivity and degree of adhesion of upper and lower layer copper base；Tunnel slot is of a straight line type on upper and lower layer copper base or " Z " type or " S "
Type centainly extends distance and time that liquid flows in tunnel slot, can effectively improve its endothermic effect；It is upper,
Be additionally provided with mutually matched fool proof hole on lower layer's copper base, can avoid user because of operating mistake, cause upper and lower layer copper base without
Method correctly overlaps.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural schematic diagram of the preferred embodiment of the utility model.
Specific implementation mode
Referring to Fig.1, the good copper base of a kind of heat dissipation, including to be provided with inlet opening 1 and/or the upper layer of apopore 3 copper-based
Plate 5 and lower layer's copper base 6, the upper layer copper base 5 and lower layer's copper base 6 are equipped with symmetrical blind slot 2, upper layer copper base
5 and lower layer's copper base on 6 blind slot 2 can be ganged up and closed tunnel slot, liquid can pass through inlet opening 1 to being combined to be formed
And/or apopore 3 is circulated in the tunnel slot that upper layer copper base 5 and the pressing of lower layer's copper base 6 are formed.
Further, the upper layer copper base 5 and lower layer's copper base 6 are ganged up and are closed to being formed after pressure viscosity knot by heat-conducting glue
Tunnel slot, be effectively improved the thermal conductivity and degree of adhesion of upper and lower layer copper base 5,6.
Further, the tunnel slot is of a straight line type or " Z " type or " S " type on upper and lower layer copper base 5,6, in this implementation
The tunnel slot uses the track of " Z " type, extends distance and time that liquid flows in tunnel slot, can be more effectively
Improve its endothermic effect.
Further, it is additionally provided with mutually matched fool proof hole 4 on the upper layer copper base 5 and lower layer's copper base 6, setting is anti-
Slow-witted hole 4 is to cause upper layer copper base 5 and lower layer's copper base 6 not to overlap correctly in order to avoid user is because of operating mistake.
Further, the thickness of the upper layer copper base 5 and lower layer's copper base 6 is respectively selected as 0.50~2.50mm.
Further, the thickness of the upper layer copper base 5 and lower layer's copper base 6 is respectively selected as 2.00mm, takes this thickness
Can corresponding tunnel slot can be set on upper and lower layer copper base 5,6, while ensure that the good heat dissipation effect of copper base
Fruit.
The specific make step of the utility model is：
1, it is the upper and lower layer copper base 5,6 of 0.50~2.50mm to select thickness；
2, inlet opening 1 and/or apopore 3 are drilled out on the copper base of upper layer；
3, the fool proof hole 4 that can mutually match and symmetrical blind slot 2 are drilled out on upper and lower layer copper base 5,6；
4, mechanization processing and brown are carried out on the copper surface of upper and lower layer copper base 5,6；
5, the blind slot 2 on upper and lower layer copper base 5,6 can be to being combined the tunnel slot to be formed and be ganged up；
6, according to heat conduction demand, the position of non-blind slot carries out filler processing with heat-conducting glue on stitching surface.
The utility model is a kind of good copper base of heat dissipation, even more a high-power tunnel slot type copper base, and dependence is micro-
The effect driving liquid of pump enters tunnel slot, makes liquid in tunnel internal circulation flow, is used again on the basis of the heat dissipation of copper and utilize liquid
The circulation of body further promotes its heat dissipation effect.
The technology of the utility model is relatively new, since good heat dissipation effect can be used for high-power electronic product or base station etc.
High-end devices.
The above, the only better embodiment of the utility model, but the utility model is not limited to above-mentioned reality
Example is applied, as long as it reaches the technique effect of the utility model with any same or similar means, should all belong to the utility model
Protection domain.
Claims (6)
1. a kind of good copper base of heat dissipation, it is characterised in that：Upper layer including being provided with inlet opening (1) and/or apopore (3)
Copper base (5) and lower layer's copper base (6), the upper layer copper base (5) and lower layer's copper base (6) are equipped with symmetrical blind slot
(2), the blind slot (2) on upper layer copper base (5) and lower layer's copper base (6) is ganged up and closed tunnel slot to being combined to be formed.
2. a kind of good copper base of heat dissipation according to claim 1, it is characterised in that：
The upper layer copper base (5) and lower layer's copper base (6) are ganged up and closed tunnel by heat-conducting glue to being formed after pressure viscosity knot
Slot.
3. a kind of good copper base of heat dissipation according to claim 1, it is characterised in that：
The tunnel slot is of a straight line type on upper and lower layer copper base (5,6) or " Z " type or " S " type.
4. a kind of good copper base of heat dissipation according to claim 1, it is characterised in that：
Mutually matched fool proof hole (4) is additionally provided on the upper layer copper base (5) and lower layer's copper base (6).
5. a kind of good copper base of heat dissipation according to claim 1, it is characterised in that：
The thickness of the upper layer copper base (5) and lower layer's copper base (6) is respectively selected as 0.50~2.50mm.
6. a kind of good copper base of heat dissipation according to claim 5, it is characterised in that：
The thickness of the upper layer copper base (5) and lower layer's copper base (6) is respectively selected as 2.00mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721678051.5U CN207625867U (en) | 2017-12-05 | 2017-12-05 | A kind of good copper base of heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721678051.5U CN207625867U (en) | 2017-12-05 | 2017-12-05 | A kind of good copper base of heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207625867U true CN207625867U (en) | 2018-07-17 |
Family
ID=62821494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721678051.5U Active CN207625867U (en) | 2017-12-05 | 2017-12-05 | A kind of good copper base of heat dissipation |
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| CN (1) | CN207625867U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511093A (en) * | 2020-04-09 | 2020-08-07 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN111739852A (en) * | 2020-05-28 | 2020-10-02 | 佛山市国星光电股份有限公司 | Heat dissipation substrate, power module, power device and heat dissipation substrate processing method |
| CN113056087A (en) * | 2021-01-28 | 2021-06-29 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channel and preparation method thereof |
| CN113260138A (en) * | 2021-05-20 | 2021-08-13 | 中国电子科技集团公司第二十九研究所 | Printed circuit board with embedded array micro-channel and preparation method |
| CN113286416A (en) * | 2021-05-20 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and preparation method thereof |
| CN113347779A (en) * | 2021-05-31 | 2021-09-03 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with vertical transmission structure and preparation method |
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
-
2017
- 2017-12-05 CN CN201721678051.5U patent/CN207625867U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511093A (en) * | 2020-04-09 | 2020-08-07 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN111511093B (en) * | 2020-04-09 | 2021-09-24 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN111739852A (en) * | 2020-05-28 | 2020-10-02 | 佛山市国星光电股份有限公司 | Heat dissipation substrate, power module, power device and heat dissipation substrate processing method |
| CN111739852B (en) * | 2020-05-28 | 2022-02-15 | 佛山市国星光电股份有限公司 | Heat dissipation substrate, power module, power device and heat dissipation substrate processing method |
| CN113056087A (en) * | 2021-01-28 | 2021-06-29 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channel and preparation method thereof |
| CN113260138A (en) * | 2021-05-20 | 2021-08-13 | 中国电子科技集团公司第二十九研究所 | Printed circuit board with embedded array micro-channel and preparation method |
| CN113286416A (en) * | 2021-05-20 | 2021-08-20 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and preparation method thereof |
| CN113347779A (en) * | 2021-05-31 | 2021-09-03 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with vertical transmission structure and preparation method |
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
| CN113784501B (en) * | 2021-08-17 | 2022-12-13 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
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