CN113260138A - Printed circuit board with embedded array micro-channel and preparation method - Google Patents
Printed circuit board with embedded array micro-channel and preparation method Download PDFInfo
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- CN113260138A CN113260138A CN202110552478.5A CN202110552478A CN113260138A CN 113260138 A CN113260138 A CN 113260138A CN 202110552478 A CN202110552478 A CN 202110552478A CN 113260138 A CN113260138 A CN 113260138A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a printed circuit board embedded with an array micro-channel and a preparation method thereof, the circuit board comprises a metal core board (1), wherein the upper surface of the metal core board (1) is provided with a plurality of wiring layers (6) at the top, the lower surface of the metal core board is provided with a plurality of wiring layers (9) at the bottom, the metal core board (1) is embedded with an array heat dissipation micro-channel (2), and the array heat dissipation micro-channel (2) is connected with a liquid inlet and a liquid outlet (5). The invention integrates the metal core plate with embedded micro-channels in the printed circuit board, realizes high heat flux density heat dissipation, and meets the requirements of high-efficiency heat dissipation and high-density integration of low-profile arrays.
Description
Technical Field
The invention belongs to the technical field of microelectronic heat dissipation, and particularly relates to a printed circuit board with an embedded array micro-channel and a preparation method thereof.
Background
With the further increase of the requirements of electronic systems for low cost, miniaturization, multiple functions, etc., the rf aperture is developing towards high density, low profile integration. The existing traditional array integration mode based on brick type transceiving components can not meet the rigorous requirements of electronic systems gradually, and a new generation of low-profile array integration technical research based on tile type transceiving components is urgently needed to be developed, so that arrayed radio frequency transceiving channels are integrally integrated on a complete printed circuit board, and the weight of the system is further reduced.
However, the conventional printed circuit board mainly comprises an organic material and a copper wiring layer, and the requirement of high-power radio frequency aperture high-density integration is difficult to meet due to the low thermal conductivity of the organic material (generally < 1W/m · K). Chinese utility model patent CN211019412U proposes a copper-embedded printed circuit board, which is characterized in that in the production process of the printed circuit board, the copper block is pressed and embedded into the cavity groove of the printed circuit board, and the high thermal conductivity of the copper block is utilized (C)～400W/m.k) to meet the high-efficiency heat dissipation requirement of the high-power device. However, the printed circuit board based on passive heat dissipation has limited heat dissipation capability, and can only solve the heat dissipation problem of low heat flux density.
In order to meet the high-efficiency heat dissipation requirement of the high-power array radio-frequency aperture, a micro-channel heat dissipation technology can be adopted. Compared with the passive heat dissipation technology, the micro-channel heat dissipation technology has unique advantages: on one hand, the micro-channel heat dissipation technology using liquid as a cooling medium can realize heat transfer with large heat flow density; on the other hand, the heat convection coefficient of the liquid flowing heat exchange in the micro-channel is inversely proportional to the equivalent size of the channel, so that the heat exchange effect can be obviously improved while the equivalent size of the channel is reduced, and the volume can be greatly reduced, so that the structural size and the weight of the whole heat dissipation system are greatly simplified and reduced. The heat dissipation capability of the electronic system can be improved by combining the micro-channel technology with the preparation process of the printed circuit board.
However, for the array integrated system, how to reasonably arrange the arrayed efficient array heat dissipation micro-channel and the shunt network so as to realize high uniform heat and high uniform current; how to combine the array micro-channel heat dissipation technology with the printed circuit board high-density integration technology to realize the arrayed high-heat-flux heat dissipation and simultaneously meet the high-density integration requirement of the low-profile array is recently reported.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a printed circuit board with embedded array micro-channels and a preparation method thereof.
The purpose of the invention is realized by the following technical scheme:
the utility model provides a printed circuit board of embedded array microchannel, includes the metal core board, the metal core board upper surface is equipped with top multilayer wiring layer, and the lower surface is equipped with bottom multilayer wiring layer, the metal core board is embedded to have array heat dissipation microchannel, and liquid inlet and outlet are connected to array heat dissipation microchannel.
Further, the array radiating micro-channel comprises a plurality of micro-channel units and at least one shunt network.
Further, the micro flow channel unit is a serial micro flow channel structure or a parallel micro flow channel structure.
Furthermore, the cross-sectional dimension of the micro-channel in the micro-channel unit is smaller than or equal to the cross-sectional dimension of the shunt network.
Furthermore, the size of the liquid inlet and outlet is larger than or equal to the cross section of the shunt network.
Furthermore, the width of the section of the micro-channel unit and the shunt network is less than or equal to 6 times of the thickness of the metal layer on the top of the metal core plate.
Further, the flow rate difference of the flow flowing through each micro-channel unit in the shunt network is less than 10%.
Further, the top multilayer wiring layer and the bottom multilayer wiring layer respectively comprise an organic wiring layer and a copper wiring layer which are distributed at intervals.
On the other hand, the invention also provides a preparation method of the printed circuit board with the embedded array micro-channel, which comprises the following steps:
s1: preparing a micro-channel unit and a shunt network on a metal core plate;
s2: welding the metal core plate with the micro-channel unit and the shunt network and the other metal core plate to obtain the metal core plate with the embedded array heat dissipation micro-channel;
s3: preparing a top multilayer wiring layer and a bottom multilayer wiring layer;
s4: carrying out surface lamination pretreatment on the metal core plate embedded with the array heat dissipation micro-flow channels;
s5: laminating a top multilayer wiring layer, a metal core plate embedded with an array heat dissipation micro-channel and a bottom multilayer wiring layer into a printed circuit board;
s6: and processing a liquid inlet and outlet on the printed circuit board.
Further, the lamination pretreatment includes blackening or browning.
The invention has the beneficial effects that:
(1) the metal core array micro-channel is embedded in the printed circuit board, and the array high heat flux density heat dissipation is realized by utilizing the enhanced heat dissipation effect of the micron-scale fluid. Compared with the common printed circuit board, the high-efficiency heat dissipation capacity of the printed circuit board is improved by more than 5 times; compared with a copper-embedded printed circuit board, the high-efficiency heat dissipation capacity of the printed circuit board is improved by more than 1 time.
(2) The metal core plate with the embedded array micro-channel is integrated in the printed circuit board, so that the arrayed high-density transmission of electric signals can be realized while the arrayed high-efficiency heat dissipation is realized. Compared with the integration method of a common printed circuit board and an external array metal micro-channel, the integration density can be improved by more than 1 time.
(3) By adding the arrayed efficient array heat dissipation micro-channels and the shunt network in the metal core plate, the system heat dissipation requirements of high heat uniformity and high current sharing are met.
(4) Controlling the typical size of the high-efficiency array heat dissipation micro-channel unit and the cross section of the flow channel in the shunt network, so that the typical size of the cross section of the flow channel of the shunt network is larger than or equal to the typical size of the flow channel of the arrayed high-efficiency array heat dissipation micro-channel, and the requirement of low flow resistance shunting is met; meanwhile, the maximum typical size of the cross section of the two flow channels is less than or equal to 6 times of the thickness of the metal layer at the top of the metal core plate, so that the problems of flow channel deformation, collapse and the like of the printed circuit board with embedded micro-flow channels in the laminating process are effectively avoided.
Drawings
FIG. 1 is a schematic cross-sectional view of a PCB with embedded micro-channels and an inlet/outlet port;
FIG. 2 is a schematic cross-sectional view of a metal core plate with embedded micro flow channel units and a shunt network according to example 1 of the present invention;
FIG. 3 is a schematic cross-sectional view of a metal core plate with embedded micro-flow channel units and a shunt network according to example 1 of the present invention;
fig. 4 is a schematic cross-sectional view of a top multi-layer wiring layer of a metal core board provided in embodiment 1 of the present invention;
fig. 5 is a schematic cross-sectional view of a bottom multi-layer wiring layer of a metal core board according to embodiment 1 of the present invention;
FIG. 6 is a schematic cross-sectional view of a printed circuit board with embedded array micro-fluidic channels according to example 2 of the present invention;
FIG. 7 is a process flow chart of a method for manufacturing a PCB with embedded micro-fluidic channels according to embodiment 2 of the present invention;
fig. 8 is a schematic cross-sectional view of a series-structured and parallel-structured high-efficiency array heat dissipation micro flow channel unit provided in embodiment 1 of the present invention.
Reference numerals: the device comprises a metal core plate 1, an array heat dissipation micro-channel 2, a shunt network 3, a micro-channel 4 unit, a liquid inlet and outlet 5, a top multilayer wiring layer 6, an organic wiring layer 7, a copper wiring layer 8, a bottom multilayer wiring layer 9 and a printed circuit board 10.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that, in order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments.
Thus, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1, which is a schematic cross-sectional view of a printed circuit board with an embedded array microchannel provided in this embodiment, the printed circuit board with an embedded microchannel specifically includes a metal core board 1, a top multilayer wiring layer 6 is disposed on an upper surface of the metal core board 1, a bottom multilayer wiring layer 9 is disposed on a lower surface of the metal core board 1, an array heat dissipation microchannel 2 is embedded in the metal core board 1, and the array heat dissipation microchannel 2 is connected to a liquid inlet and a liquid outlet 5.
As shown in fig. 4 and 5, the top multilayer wiring layer 6 and the bottom multilayer wiring layer 9 of the metal core board 1 provided in this embodiment are provided, and the top multilayer wiring layer 6 and the bottom multilayer wiring layer 9 are respectively provided with the organic wiring layer 7 and the copper wiring layer 8 which are distributed at intervals, so as to realize a multilayer circuit.
The array heat dissipation micro-channel 2 includes a plurality of micro-channel units 4 and at least one shunt network 3, as shown in fig. 2, which is a schematic cross-sectional view of a metal core board of the embedded array high-efficiency array heat dissipation micro-channel unit and the shunt network provided in this embodiment. Fig. 3 is a schematic cross-sectional view of a metal core board of the embedded arrayed high-efficiency array heat dissipation micro flow channel unit and the shunt network provided in this embodiment.
The micro flow channel unit 4 can be a serial micro flow channel structure, a parallel micro flow channel structure, a serial structure and a parallel structure, and has different heat dissipation capacities and different flow resistances. Fig. 8 is a schematic diagram of the serial micro flow channel structure and the parallel micro flow channel structure according to the present embodiment. Different structures are designed according to different requirements. If the liquid supply flow channel is wider and the heat dissipation flow channel is narrower, the parallel structure has good heat dissipation; if the width of the liquid supply flow channel is close to that of the heat dissipation flow channel, the series structure dissipates heat well.
The cross section size of the micro-channel in the micro-channel unit 4 is smaller than or equal to that of the shunt network 3, so that the requirement of low flow resistance shunting is met.
The size of the liquid inlet and outlet 5 is larger than or equal to the section of the flow dividing network 3, so that the requirement of low flow resistance liquid supply is met.
The cross section widths of the micro-channel unit 4 and the shunt network 3 are less than or equal to 6 times of the thickness of the metal layer on the top of the metal core plate 1, so that the problems of channel deformation, channel collapse and the like of the printed circuit board with embedded micro-channels in the laminating process are effectively avoided.
The flow difference of the flow passing through each micro-channel unit 4 in the shunt network 3 is less than 10% so as to ensure the shunt uniformity of each shunt area. The flow channel is realized by the same section, similar length and symmetrical structure.
According to the printed circuit board with the embedded array micro-channels, the metal core array micro-channels are embedded in the printed circuit board, and array high-heat-flux-density heat dissipation is achieved by means of the enhanced heat dissipation effect of the micron-scale fluid. Compared with the common printed circuit board, the high-efficiency heat dissipation capacity of the printed circuit board is improved by more than 5 times; compared with a copper-embedded printed circuit board, the high-efficiency heat dissipation capacity of the printed circuit board is improved by more than 1 time. The metal core plate with the embedded array micro-channel is integrated in the printed circuit board, so that the arrayed high-density transmission of electric signals can be realized while the arrayed high-efficiency heat dissipation is realized. Compared with the integration method of a common printed circuit board and an external array metal micro-channel, the integration density can be improved by more than 1 time. By adding the arrayed efficient array heat dissipation micro-channels and the shunt network in the metal core plate, the system heat dissipation requirements of high heat uniformity and high current sharing are met. The printed circuit board with the embedded array micro-channel provided by the embodiment also controls the typical sizes of the high-efficiency array heat dissipation micro-channel and the cross section of the channel in the shunt network, so that the typical size of the cross section of the channel in the shunt network is larger than or equal to that of the arrayed high-efficiency array heat dissipation micro-channel, and the requirement of low flow resistance shunting is met; meanwhile, the maximum typical size of the cross section of the two flow channels is less than or equal to 6 times of the thickness of the metal layer at the top of the metal core plate, so that the problems of flow channel deformation, collapse and the like of the printed circuit board with embedded micro-flow channels in the laminating process are effectively avoided.
Example 2
As shown in fig. 7, the method for manufacturing a printed circuit board with embedded array micro-channels provided in this embodiment specifically includes the following steps:
the method comprises the following steps: providing a flat and smooth copper core plate.
Step two: an arrayed high-efficiency array heat dissipation micro-channel unit and a shunt network are prepared on a copper core plate through precision machining.
Step three: and welding the copper core plate with the arrayed high-efficiency array heat dissipation micro-channel unit and the shunt network and another copper core plate by a vacuum diffusion welding method to obtain the copper core plate with the embedded array micro-channel.
Step four: a metal core top multilayer wiring layer prepared by a printed circuit board lamination process is provided.
Step five: a metal core bottom multilayer wiring layer prepared by a printed circuit board lamination process is provided.
Step six: and (3) carrying out lamination pretreatment on the metal core plate with the embedded array micro-flow channel in the third step, wherein the lamination pretreatment comprises blackening or browning and is used for enhancing the adhesive force.
Step seven: and laminating the multilayer wiring layer on the top of the copper core plate, the copper core plate with the embedded array micro-channel and the multilayer wiring layer on the bottom of the copper core plate into the printed circuit board with the embedded array micro-channel by a printed circuit board laminating process. FIG. 6 is a schematic cross-sectional view of a PCB with embedded micro flow channels in the array prepared in this example.
Step eight: and C, processing a liquid inlet and outlet on the printed circuit board embedded with the micro-channel in the step five by a depth control milling method.
The method for preparing the printed circuit board with the embedded array micro-channel provided by the embodiment can simply, conveniently and efficiently prepare the printed circuit board with the embedded array micro-channel provided by the embodiment.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a printed circuit board of embedded array microchannel which characterized in that, includes metal core board (1), metal core board (1) upper surface is equipped with top multilayer wiring layer (6), and the lower surface is equipped with bottom multilayer wiring layer (9), metal core board (1) is embedded to have array heat dissipation microchannel (2), and liquid inlet and outlet (5) are connected in array heat dissipation microchannel (2).
2. The micro flow channel embedded printed circuit board of claim 1, wherein the array heat dissipation micro flow channel (2) comprises a plurality of micro flow channel units (4) and at least one shunt network (3).
3. The micro flow channel embedded printed circuit board of claim 2, wherein the micro flow channel unit (4) is a serial micro flow channel structure or a parallel micro flow channel structure.
4. The printed circuit board with embedded array micro-channels as claimed in claim 2, wherein the cross-sectional dimension of the micro-channels in the micro-channel unit (4) is smaller than or equal to the cross-sectional dimension of the shunt network (3).
5. The printed circuit board of an embedded array micro flow channel as claimed in claim 2, wherein the size of the liquid inlet/outlet (5) is equal to or larger than the cross section of the shunt network (3).
6. The micro flow channel embedded printed circuit board of claim 2, wherein the cross-sectional width of the micro flow channel unit (4) and the shunt network (3) is 6 times or less the thickness of the metal layer on the top of the metal core plate (1).
7. The printed circuit board of embedded array micro flow channels of claim 2, wherein the flow rate difference of the micro flow channel units (4) flowing through the shunt network (3) is less than 10%.
8. The micro flow channel embedded printed circuit board as claimed in claim 2, wherein the top multilayer wiring layer (6) and the bottom multilayer wiring layer (9) each include organic wiring layers (7) and copper wiring layers (8) which are spaced apart.
9. A method for preparing a printed circuit board with embedded array micro-channels is characterized by comprising the following steps:
s1: preparing a micro-channel unit (4) and a shunt network (3) on a metal core plate (1);
s2: welding the metal core plate (1) with the micro-channel unit (4) and the shunt network (3) and another metal core plate (1) to obtain the metal core plate (1) embedded with the array heat dissipation micro-channel (2);
s3: preparing a top multilayer wiring layer (6) and a bottom multilayer wiring layer (9);
s4: carrying out surface lamination pretreatment on the metal core plate (1) embedded with the array heat dissipation micro-flow channel (2);
s5: laminating a top multilayer wiring layer (6), a metal core plate (1) embedded with an array heat dissipation micro-channel (2) and a bottom multilayer wiring layer (9) into a printed circuit board (10);
s6: a liquid inlet and outlet (5) is processed on the printed circuit board (10).
10. The method of claim 9, wherein the pre-lamination treatment comprises blackening or browning.
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| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
| CN113891546A (en) * | 2021-11-02 | 2022-01-04 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with reinforced structure micro-channel and preparation method thereof |
| CN114256175A (en) * | 2021-12-07 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
| CN114698230A (en) * | 2022-02-23 | 2022-07-01 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board three-dimensional integrated structure and preparation method thereof |
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| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
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| CN113891546A (en) * | 2021-11-02 | 2022-01-04 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with reinforced structure micro-channel and preparation method thereof |
| CN113891546B (en) * | 2021-11-02 | 2023-05-16 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channels with reinforced structures and preparation method thereof |
| CN114256175A (en) * | 2021-12-07 | 2022-03-29 | 中国电子科技集团公司第二十九研究所 | Tile type TR (transmitter-receiver) component embedded in micro-channel and preparation method thereof |
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