[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN207320398U - 电连接器及其组件 - Google Patents

电连接器及其组件 Download PDF

Info

Publication number
CN207320398U
CN207320398U CN201720672089.5U CN201720672089U CN207320398U CN 207320398 U CN207320398 U CN 207320398U CN 201720672089 U CN201720672089 U CN 201720672089U CN 207320398 U CN207320398 U CN 207320398U
Authority
CN
China
Prior art keywords
electric connector
weld part
chip module
circuit board
insulating body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720672089.5U
Other languages
English (en)
Inventor
许硕修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Foxconn Interconnect Technology Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Application granted granted Critical
Publication of CN207320398U publication Critical patent/CN207320398U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

本实用新型公开一种电连接器及其组件，用以将芯片模组电性连接至电路板，所述电连接器包括绝缘本体及若干导电端子，所述绝缘本体设置有用来容置芯片模组的收容空间及用来匹配电路板的安装面，所述导电端子具有凸伸入收容空间的第一焊接部与凸伸至所述安装面的第二焊接部，所述第一焊接部用来焊接于所述芯片模组，所述第二焊接部用来焊接于所述电路板。本实用新型之导电端子的两端分别焊接于芯片模组与电路板，结构更简单，制程更简便。

Description

电连接器及其组件
【技术领域】
本实用新型涉及一种电连接器及其组件，尤其有关一种电连接器的端子固持结构。
【背景技术】
中国台湾新型专利第M403772号公告了一种电连接器，所述电连接器设有第一锡球用以焊接至印刷电路板。芯片模组底部阵列设有若干第二锡球。电连接器需设置导电端子于上下两端同时固持第一锡球与第二锡球，从而实现芯片模组与印刷电路板之间的电性连接，所述电连接器结构复杂。
【实用新型内容】
本实用新型所要解决的技术问题在于：提供一种结构简单的电连接器。
为解决上述技术问题，本实用新型可采用如下技术方案：
一种电连接器，用以将芯片模组电性连接至电路板，所述电连接器包括绝缘本体及若干导电端子，所述绝缘本体设置有用来容置芯片模组的收容空间及用来匹配电路板的安装面，所述导电端子具有凸伸入收容空间的第一焊接部与凸伸至所述安装面的第二焊接部，所述第一焊接部用来焊接于所述芯片模组，所述第二焊接部用来焊接于所述电路板。
与现有技术相比，本实用新型中导电端子的两端分别焊接于芯片模组与电路板，结构更简单，制程更简便。
为解决上述技术问题，本实用新型可采用如下技术方案：
一种电连接器组件，包括芯片模组、电连接器及电路板，所述电连接器包括绝缘本体及固定在所述绝缘本体的若干导电端子，所述若干导电端子包括第一焊接部及第二焊接部，所述芯片模组收容在所述电连接器内且与所述导电端子的第一焊接部相焊接，所述电连接器安装在所述电路板且所述导电端子的第二焊接部与所述电路板相焊接。
与现有技术相比，本实用新型中导电端子的两端分别焊接于芯片模组与电路板，结构更简单，制程更简便。
【附图说明】
图1为本实用新型电连接器组件的立体图。
图2为图1所示电连接器组件的立体分解图。
图3为图1所示电连接器组件另一角度的立体分解图。
图4为图1所示电连接器组件的正视图。
图5为本实用新型导电端子被两个模板定位的示意图。
如下具体实施方式将结合上述附图进一步说明本实用新型。
【具体实施方式】
请参阅图1至图5，本实用新型公开了一种电连接器组合100，所述电连接器组合100包括电连接器10、芯片模组50及电路板60。所述电连接器10用以将芯片模组50电性连接至电路板60。所述电连接器10包括绝缘本体20、若干导电端子30及盖体40。若干导电端子30排列成行后，所述绝缘本体再通过注塑手段形成在所述若干导电端子30外侧。所述盖体40盖设于所述绝缘本体20上。所述盖体40压制住所述芯片模组50且与所述绝缘本体20相卡扣。在本实施例中，所述导电端子30为焊锡球结构，其含锡量为95.6％。
所述绝缘本体20包括本体部21及自所述本体部21向上延伸形成的挡墙24。所述挡墙24位于所述本体部21的四个角落。所述挡墙24的外侧设有用于与盖体40相卡合的卡扣部25。所述绝缘本体20设置有用来容置芯片模组50的收容空间22及用来匹配电路板60的安装面23。所述导电端子30具有凸伸入收容空间22的第一焊接部31与凸伸至所述安装面23的第二焊接部32。所述第一焊接部31用来焊接于芯片模组50，所述第二焊接部32用来焊接于电路板60。
所述盖体40包括主体部41及自所述主体部41向下延伸形成的挡止部43，所述主体部41与所述挡止部43之间设有间隔槽45。所述挡止部43位于所述主体部41的四个角落。所述挡止部43设有扣钩44，所述扣钩44扣合于所述卡扣部25。所述主体部41的中央位置设有通孔42。所述芯片模组50包括容纳在所述收容空间22的基部51及自所述基部51向上延伸的凸出部52，所述凸出部52穿过所述通孔42。所述基部51安装于所述绝缘本体20内，所述挡墙24用于限定所述基部51。
所述电连接器组合100的组装步骤如下：(1)先预先设置两个模板72，模板72上具有定位孔，上述若干锡球状的导电端子30先设置在一模板72的定位孔，另一模板71同样具有定位孔，定位在所述若干导电端子30的上方，然后将塑胶材料通过注塑方法注塑入，冷却后形成绝缘本体20，去除模板(71，72)后即可形成电连接器10；(2)先将芯片模组50安装在绝缘本体20的收容空间22内，然后盖上盖体40，将芯片模组50定位在绝缘本体20内，然后利用真空腔吸取在盖体40上；(3)将电连接器10移动至电路板60，同时高温过炉，导电端子30的第一焊接部31与第二焊接部32熔融而分别实现与芯片模组50的对接端子53与电路板60的导电片61焊接。
上述实施例为本实用新型的较佳实施方式，而非全部的实施方式，本领域普通技术人员通过阅读本实用新型说明书而对本实用新型技术方案采取的任何等效的变化，均为本实用新型的权利要求所涵盖。

Claims (10)

1.一种电连接器，用以将芯片模组电性连接至电路板，所述电连接器包括绝缘本体及若干导电端子，所述绝缘本体设置有用来容置芯片模组的收容空间及用来匹配电路板的安装面，其特征在于：所述导电端子具有凸伸入收容空间的第一焊接部与凸伸至所述安装面的第二焊接部，所述第一焊接部用来焊接于所述芯片模组，所述第二焊接部用来焊接于所述电路板。
2.如权利要求1所述的电连接器，其特征在于：所述导电端子为焊锡球结构。
3.如权利要求1所述的电连接器，其特征在于：所述电连接器还包括盖设于所述绝缘本体上的盖体，所述盖体设有向下延伸形成的挡止部；所述绝缘本体设有向上延伸的挡墙，所述挡墙的外侧设有用于与所述盖体相卡合的卡扣部。
4.如权利要求3所述的电连接器，其特征在于：所述挡墙形成在所述绝缘本体的四个角落。
5.如权利要求1所述的电连接器，其特征在于：所述若干导电端子排列成行后，所述绝缘本体再通过注塑手段形成在所述若干导电端子外侧。
6.如权利要求3所述的电连接器，其特征在于：所述盖体的中央位置设有通孔，所述芯片模组包括容纳在所述收容空间的基部及自所述基部向上延伸的凸出部，所述凸出部穿过所述通孔。
7.一种电连接器组件，包括芯片模组、电连接器及电路板，所述电连接器包括绝缘本体及固定在所述绝缘本体的若干导电端子，所述若干导电端子包括第一焊接部及第二焊接部，其特征在于：所述芯片模组收容在所述电连接器内且与所述导电端子的第一焊接部相焊接，所述电连接器安装在所述电路板且所述导电端子的第二焊接部与所述电路板相焊接。
8.如权利要求7所述的电连接器组件，其特征在于：所述导电端子为焊锡球结构。
9.如权利要求7所述的电连接器组件，其特征在于：电连接器组件还包括盖体，所述盖体压制住所述芯片模组且与所述绝缘本体相卡扣。
10.如权利要求7所述的电连接器组件，其特征在于：所述芯片模组与所述第一焊接部，以及所述第二焊接部与所述电路板同时过炉焊接。
CN201720672089.5U 2016-06-14 2017-06-09 电连接器及其组件 Expired - Fee Related CN207320398U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105208794 2016-06-14
TW105208794U TWM533354U (en) 2016-06-14 2016-06-14 Electrical connector

Publications (1)

Publication Number Publication Date
CN207320398U true CN207320398U (zh) 2018-05-04

Family

ID=58225999

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720672089.5U Expired - Fee Related CN207320398U (zh) 2016-06-14 2017-06-09 电连接器及其组件

Country Status (3)

Country Link
US (1) US10201096B2 (zh)
CN (1) CN207320398U (zh)
TW (1) TWM533354U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114496963A (zh) * 2021-12-30 2022-05-13 合肥鑫丰科技有限公司 一种使用可挠性基板的芯片封装结构

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108808285B (zh) 2017-05-05 2022-04-01 富顶精密组件（深圳）有限公司 电连接器组件
CN207781966U (zh) * 2018-01-15 2018-08-28 富士康(昆山)电脑接插件有限公司 电连接器组件及其夹持件

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4433886A (en) * 1981-12-17 1984-02-28 Elco Corporation Connector mounting for integrated circuit chip packages
US4558397A (en) * 1983-12-19 1985-12-10 Amp Incorporated Interposer connector for surface mounting a ceramic chip carrier to a printed circuit board
US4652973A (en) * 1985-09-04 1987-03-24 At&T Bell Laboratories Chip carrier mounting apparatus
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
US5099393A (en) * 1991-03-25 1992-03-24 International Business Machines Corporation Electronic package for high density applications
US5215472A (en) * 1991-08-22 1993-06-01 Augat Inc. High density grid array socket
US5221209A (en) * 1991-08-22 1993-06-22 Augat Inc. Modular pad array interface
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US5973393A (en) * 1996-12-20 1999-10-26 Lsi Logic Corporation Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits
US5877554A (en) * 1997-11-03 1999-03-02 Advanced Interconnections Corp. Converter socket terminal
US5917703A (en) * 1998-04-17 1999-06-29 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
US6213787B1 (en) * 1999-12-16 2001-04-10 Advanced Interconnections Corporation Socket/adapter system
US6644985B2 (en) * 2001-02-16 2003-11-11 Fci Americas Technology, Inc. Ball attached zero insertion force socket
US6672881B2 (en) * 2001-10-31 2004-01-06 Fci Americas Technology, Inc. Ball grid array socket
US6755668B2 (en) * 2002-11-20 2004-06-29 Tyco Electronics Corporation Surface mounted socket assembly
US6958616B1 (en) * 2003-11-07 2005-10-25 Xilinx, Inc. Hybrid interface apparatus for testing integrated circuits having both low-speed and high-speed input/output pins
US7114996B2 (en) * 2004-09-08 2006-10-03 Advanced Interconnections Corporation Double-pogo converter socket terminal
US7435102B2 (en) * 2005-02-24 2008-10-14 Advanced Interconnections Corporation Interconnecting electrical devices
US7220134B2 (en) * 2005-02-24 2007-05-22 Advanced Interconnections Corporation Low profile LGA socket assembly
US7690925B2 (en) * 2005-02-24 2010-04-06 Advanced Interconnections Corp. Terminal assembly with pin-retaining socket
US7790987B2 (en) * 2005-04-27 2010-09-07 Sony Computer Entertainment Inc. Methods and apparatus for interconnecting a ball grid array to a printed circuit board
US7293995B2 (en) * 2005-11-08 2007-11-13 Che-Yu Li & Company, Llc Electrical contact and connector system
US20070167038A1 (en) * 2006-01-18 2007-07-19 Glenn Goodman Hermaphroditic socket/adapter
EP2158642A1 (en) * 2007-06-18 2010-03-03 Tyco Electronics Nederland B.V. Connector for interconnecting surface-mount devices and circuit substrates
TWI366301B (en) * 2008-08-08 2012-06-11 Transfer carrier
CN201369452Y (zh) * 2009-03-18 2009-12-23 番禺得意精密电子工业有限公司 电连接装置
US8969734B2 (en) * 2009-04-01 2015-03-03 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
US7959446B1 (en) * 2009-12-22 2011-06-14 Lotes Co., Ltd. Electrical element and electrical connector
US8837162B2 (en) * 2010-05-06 2014-09-16 Advanced Micro Devices, Inc. Circuit board socket with support structure
US8938876B2 (en) * 2010-05-06 2015-01-27 Advanced Micro Devices, Inc. Method of mounting a circuit board
TWM403772U (en) 2010-09-30 2011-05-11 Hon Hai Prec Ind Co Ltd Electrical connector
JP5719566B2 (ja) * 2010-11-04 2015-05-20 新光電気工業株式会社 Ｉｃパッケージ用放熱板及び放熱板を有するｉｃパッケージの接続装置
TWM420880U (en) * 2011-05-10 2012-01-11 Hon Hai Prec Ind Co Ltd Electrical connector and assembly thereof
CN104852174B (zh) 2014-02-14 2018-08-31 富士康(昆山)电脑接插件有限公司 电连接器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114496963A (zh) * 2021-12-30 2022-05-13 合肥鑫丰科技有限公司 一种使用可挠性基板的芯片封装结构
CN114496963B (zh) * 2021-12-30 2022-12-23 合肥鑫丰科技有限公司 一种使用可挠性基板的芯片封装结构

Also Published As

Publication number Publication date
TWM533354U (en) 2016-12-01
US10201096B2 (en) 2019-02-05
US20170359905A1 (en) 2017-12-14

Similar Documents

Publication Publication Date Title
CN109462071B (zh) 电连接器
US6283769B1 (en) Electric connecting box
US8821188B2 (en) Electrical connector assembly used for shielding
KR101980975B1 (ko) 접지 요소를 형성하기 위해 접지 단자 및 접지 피스를 함께 구비하는 신호 커넥터
US9362687B1 (en) Electrical connector
KR20150056033A (ko) 표면실장형 전기접속단자
CN207320398U (zh) 电连接器及其组件
US20060128184A1 (en) Printed circuit board assembly having a BGA connection
TWM419248U (en) Electrical connector
US8052433B2 (en) Electrical connector having retention means arranged adjacent to passageway for holding fusible member thereto
US9397449B2 (en) Receptacle connector flexibly connected to a mother board
US7699628B2 (en) Electrical connector having reinforcement member attached to housing
US10547137B2 (en) Electrical connector
TWI506866B (zh) 電連接器
SG176336A1 (en) Sim card connector and sim card connector assembly including the same
TWM511699U (zh) 電連接器和球狀柵格陣列封裝組件
CN207691122U (zh) 一种带滤波功能的电缆连接器
TWM424673U (en) Electrical connector
CN102957055B (zh) 电连接器及其制造方法
CN206195001U (zh) 卡缘连接器
US7214071B1 (en) Electrical connector
CN110943317B (zh) 电连接器
CN209374712U (zh) CFast卡的改良结构
CN104167631B (zh) 电连接器
US7422450B2 (en) Electrical connector

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180504

Termination date: 20210609