CN207303140U - Embedded led diode - Google Patents
Embedded led diode Download PDFInfo
- Publication number
- CN207303140U CN207303140U CN201721287374.1U CN201721287374U CN207303140U CN 207303140 U CN207303140 U CN 207303140U CN 201721287374 U CN201721287374 U CN 201721287374U CN 207303140 U CN207303140 U CN 207303140U
- Authority
- CN
- China
- Prior art keywords
- chip
- embedded
- thermally conductive
- conductive sheet
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000005538 encapsulation Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000037361 pathway Effects 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model belongs to diode technologies field, more particularly to embedded LED diode, including the substrate with printed circuit, chip, the substrate is equipped with the embedded hole for being embedded chip, chip is arranged in embedded hole, chip bottom face is in substrate bottom face bottom side, base plate bottom is equipped with heat sink, heat sink, which corresponds to, is equipped with groove at chip, chip bottom is embedded in groove, chip is connected by conducting wire with electrical property of substrate, substrate is externally provided with encapsulation, groove is provided distributed over the thermally conductive sheet to raise up of chip surrounding, thermally conductive sheet is extended upwardly in encapsulation, do not contacted between conducting wire and thermally conductive sheet, do not contacted between chip and thermally conductive sheet, chip is avoided junction temperature concentration occur, make embedded LED diode that there is longer service life.
Description
Technical field
The utility model belongs to diode technologies field, and in particular to embedded LED diode.
Background technology
LED white light emitting diodes are to belong to Energy -- Saving Illuminating Source of new generation, are to belong to solid-state light emitters, because it has height
Effect, the distinguishing feature of energy-saving and environmental protection, are applied to indoor and outdoor lighting, display backlight, bulkhead lamp, Tunnel Lamp, street lamp etc. by light is general
Lighting area.LED diodes junction temperature of chip in normal work compares concentration, and higher, production is required to heat conduction and heat dissipation performance
Product stability can reduce, and reduce the service life.Therefore, the cooling to chip and it is particularly important that, although existing LED diodes are set
There is radiator structure, but radiator structure is not directly connected with chip chamber, heat dissipation path length, radiating efficiency is low.
Utility model content
Technical problem to be solved in the utility model is in view of the foregoing drawbacks, there is provided embedded LED diode, heat dissipation effect
Rate is high, avoids chip from junction temperature concentration occur, embedded LED diode is had longer service life.
The technical solution that the utility model solves the use of its technical problem is as follows：
Embedded LED diode, including the substrate with printed circuit, chip, the substrate are equipped with and are embedded chip
Embedded hole, chip is arranged in embedded hole, and chip bottom face is in substrate bottom face bottom side, and base plate bottom is equipped with heat sink,
Heat sink, which corresponds to, is equipped with groove at chip, chip bottom is embedded in groove, and chip is connected by conducting wire with electrical property of substrate, substrate
Encapsulation is externally provided with, groove is provided distributed over the thermally conductive sheet to raise up of chip surrounding, and thermally conductive sheet is extended upwardly in encapsulation, led
Do not contact between line and thermally conductive sheet, do not contacted between chip and thermally conductive sheet, the heat at chip is absorbed and scattered and disappeared in time by heat sink, heat
Amount sinking pathway is small, and the heat of chip quickly directly scatters and disappears, and avoids occurring junction temperature concentration at chip, and heat dissipation is efficient, extends and is embedded in
The service life of formula LED diodes.
Further, the thermally conductive sheet upper end is to skewed away from package center.
Further, the thermally conductive sheet and chip chamber filling thermal plastic insulation.
Further, the conducting wire is passed through by thermally conductive sheet gap location.
Further, chip chamber is equipped with the encapsulation corresponding position chip, chip top of chamber is equipped with fluorescence coating, fluorescence coating
Do not contacted with chip chamber, and fluorescence coating forms a closure cavity with chip chamber, and inert gas, fluorescence coating upper lid are filled in cavity
Equipped with diffuser.
Further, the fluorescence layer structure coincide with chip top of chamber structure.
Further, the heat sink is copper coin, passes through heat conduction glue sticking between heat sink and substrate.
Further, the chip chamber section is inverted trapezoidal.
Further, the embedded hole, groove size are more than chip.
The beneficial effects of the utility model are：Using the above scheme, the heat at chip is absorbed and dissipated in time by heat sink
Lose, heat sinking pathway is small, and the heat of chip quickly directly scatters and disappears, and avoids occurring junction temperature concentration at chip, and heat dissipation is efficient, extends
The service life of embedded LED diode.
Brief description of the drawings
By detailed description below in conjunction with the accompanying drawings, the utility model is foregoing to incite somebody to action with other objects, features and advantages
Become apparent.
Fig. 1 is the cross section structure schematic diagram of the utility model.
Wherein：1 is substrate, and 11 be embedded hole, and 2 be chip, and 3 be heat sink, and 31 be groove, and 4 be conducting wire, and 5 is encapsulate, 51
It is thermally conductive sheet for chip chamber, 6,7 be thermal plastic insulation, and 8 be fluorescence coating, and 9 be cavity, and 10 be diffuser.
Embodiment
The utility model is described further below in conjunction with the accompanying drawings.
Embodiment 1：With reference to Fig. 1, embedded LED diode, including the substrate 1 with printed circuit, chip 2, on substrate 1
Equipped with the embedded hole 11 for being embedded chip 2, chip 2 is arranged in embedded hole 11, and 2 bottom face of chip is in 1 bottom face bottom side of substrate,
1 bottom of substrate is equipped with copper heat sink 3, and by heat conduction glue sticking between heat sink 3 and substrate 1, heat sink 3 corresponds to be set at chip 2
Fluted 31,2 bottom of chip is embedded in groove 31, and chip 2 is bonded in groove 31 by thermal plastic insulation, embedded hole 11,
31 size of groove is more than chip 2, avoids chip 2 from being contacted with groove 31, embedded hole 11, and chip 2 is electrical by conducting wire 4 and substrate 1
Connection, substrate 1 are externally provided with encapsulation 5, and groove is provided distributed over the thermally conductive sheet 6 to raise up of 2 surrounding of chip, and thermally conductive sheet 6 is upward
Extend in encapsulation 5, do not contacted between conducting wire 4 and thermally conductive sheet 6, conducting wire 4 is passed through out of interval between thermally conductive sheet 6, and thermally conductive sheet 6 is with dissipating
Hot plate 3 is structure as a whole, and thermal plastic insulation 7 is filled between thermally conductive sheet 6 and chip 2, and the heat that chip 2 produces directly conducts cause heat dissipation
On plate 3,2 heat sinking pathway of chip is short, and radiating efficiency is high, avoids junction temperature at chip 2 from concentrating, heat dissipation is efficient, and chip 2 is embedded
In substrate 1, heat sink 3, chip 2 is protected, chip 2 is set more firm, and the heat of chip 2 is directly to substrate 1, heat dissipation
Plate 3 directly transmits, and the heat on substrate 1 is finally dissipated by heat sink 3, and heat sink 3 radiates efficiently, is transferred to the heat of encapsulation
Lack, and extend to the thermally conductive sheet 6 in encapsulation 5 heat encapsulated at 5 can be oriented to heat sink, so as to improve LED diodes
Radiating efficiency, and the thermally conductive sheet 6 for being centered around 2 surrounding of chip can hinder 2 heat of chip outwards to transmit, by thermally conductive sheet 6 absorb by
Heat sink 3 distributes, multi-faceted to radiate to chip 2, and heat dissipation is efficient, extend embedded LED diode service life and
6 upper end of thermally conductive sheet is the skewed of 5 centers of remote encapsulation, and the upper end for making multiple thermally conductive sheets 6 is in divergent shape in encapsulation 5, is improved
Efficiency of the thermally conductive sheet to encapsulation heat conduction and heat radiation.
The chip chamber 51 for being equipped with that section is inverted trapezoidal at 5 corresponding position chips 2 is encapsulated, the top of chip chamber 51 is equipped with fluorescence coating 8,
Do not contacted between fluorescence coating 8 and chip 2, and a closure cavity 9 is formed between fluorescence coating 8 and chip 2, helium (He), neon are filled in cavity 9
(Ne), any of inert gas such as argon (Ar), krypton (Kr), xenon (Xe), 8 upper lid of fluorescence coating is equipped with diffuser 10, printing opacity
The inner wall of cover 10 is arc, and fluorescence coating 8 is bonded with 10 inner wall of diffuser, and fluorescence coating 8 is arc, the inertia in cavity 9 and cavity 9
Gas can avoid the high temperature of chip from avoiding fluorescence coating from avoiding LED diodes from color occur because qualitative change occurs for high temperature to fluorescence coating transmission
Decline, the rule of the fluorescence coating of arc, the chip chamber of inverted trapezoidal and divergence of beam is coincide, and improves the light efficiency of LED diodes.
Embodiment 2：With reference to Fig. 1, embedded LED diode, including the substrate 1 with printed circuit, chip 2, on substrate 1
Equipped with the embedded hole 11 for being embedded chip 2, chip 2 is arranged in embedded hole 11, and 2 bottom face of chip is in 1 bottom face bottom side of substrate,
1 bottom of substrate is equipped with copper heat sink 3, and by heat conduction glue sticking between heat sink 3 and substrate 1, heat sink 3 corresponds to be set at chip 2
Fluted 31,2 bottom of chip is embedded in groove 31, and chip 2 is bonded in groove 31 by thermal plastic insulation, embedded hole 11,
31 size of groove is more than chip 2, avoids chip 2 from being contacted with groove 31, embedded hole 11, and chip 2 is electrical by conducting wire 4 and substrate 1
Connection, substrate 1 are externally provided with encapsulation 5, and groove is provided distributed over the thermally conductive sheet 6 to raise up of 2 surrounding of chip, and thermally conductive sheet 6 is upward
Extend in encapsulation 5, do not contacted between conducting wire 4 and thermally conductive sheet 6, conducting wire 4 is passed through out of interval between thermally conductive sheet 6, and thermally conductive sheet 6 is with dissipating
Hot plate 3 is structure as a whole, and thermal plastic insulation 7 is filled between thermally conductive sheet 6 and chip 2, and the heat that chip 2 produces directly conducts cause heat dissipation
On plate 3,2 heat sinking pathway of chip is short, and radiating efficiency is high, avoids junction temperature at chip 2 from concentrating, heat dissipation is efficient, and chip 2 is embedded
In substrate 1, heat sink 3, chip 2 is protected, chip 2 is set more firm, and the heat of chip 2 is directly to substrate 1, heat dissipation
Plate 3 directly transmits, and the heat on substrate 1 is finally dissipated by heat sink 3, and heat sink 3 radiates efficiently, is transferred to the heat of encapsulation
Lack, and extend to the thermally conductive sheet 6 in encapsulation 5 heat encapsulated at 5 can be oriented to heat sink, so as to improve LED diodes
Radiating efficiency, and the thermally conductive sheet 6 for being centered around 2 surrounding of chip can hinder 2 heat of chip outwards to transmit, by thermally conductive sheet 6 absorb by
Heat sink 3 distributes, multi-faceted to radiate to chip 2, and heat dissipation is efficient, extend embedded LED diode service life and
6 upper end of thermally conductive sheet is the skewed of 5 centers of remote encapsulation, and the upper end for making multiple thermally conductive sheets 6 is in divergent shape in encapsulation 5, is improved
Efficiency of the thermally conductive sheet to encapsulation heat conduction and heat radiation.
The above, is only the preferred embodiment of the utility model, and limit in any form is not done to the utility model
System, it is every according to any simple modification made in the technical essence of the utility model to above example, equivalent variations, fall
Enter within the scope of protection of the utility model.
Claims (9)
1. embedded LED diode, including the substrate with printed circuit, chip, it is characterised in that：The substrate is equipped with
The embedded hole of chip is embedded, chip is arranged in embedded hole, and chip bottom face is in substrate bottom face bottom side, and base plate bottom is equipped with
Heat sink, heat sink, which corresponds to, is equipped with groove at chip, chip bottom is embedded in groove, and chip is connected by conducting wire and electrical property of substrate
Connect, substrate is externally provided with encapsulation, and groove is provided distributed over the thermally conductive sheet to raise up of chip surrounding, and thermally conductive sheet extends upwardly to envelope
In dress, do not contact between conducting wire and thermally conductive sheet, do not contacted between chip and thermally conductive sheet.
2. embedded LED diode according to claim 1, it is characterised in that：The thermally conductive sheet upper end is to remote
Package center it is skewed.
3. embedded LED diode according to claim 1, it is characterised in that：The thermally conductive sheet is filled with chip chamber
Thermal plastic insulation.
4. embedded LED diode according to claim 1, it is characterised in that：The conducting wire is by thermally conductive sheet gap location
Pass through.
5. embedded LED diode according to claim 1, it is characterised in that：Set at the encapsulation corresponding position chip
There is chip chamber, chip top of chamber is equipped with fluorescence coating, and fluorescence coating is not contacted with chip chamber, and fluorescence coating forms a closure with chip chamber
Cavity, fills inert gas in cavity, fluorescence coating upper lid is equipped with diffuser.
6. embedded LED diode according to claim 5, it is characterised in that：The fluorescence layer structure and chip chamber
Top structure coincide.
7. embedded LED diode according to claim 1, it is characterised in that：The heat sink is copper coin, heat sink
Pass through heat conduction glue sticking between substrate.
8. embedded LED diode according to claim 5, it is characterised in that：The chip chamber section is inverted trapezoidal.
9. embedded LED diode according to claim 1, it is characterised in that：The embedded hole, groove size are more than
Chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721287374.1U CN207303140U (en) | 2017-09-30 | 2017-09-30 | Embedded led diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721287374.1U CN207303140U (en) | 2017-09-30 | 2017-09-30 | Embedded led diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207303140U true CN207303140U (en) | 2018-05-01 |
Family
ID=62413435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721287374.1U Active CN207303140U (en) | 2017-09-30 | 2017-09-30 | Embedded led diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207303140U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140554A (en) * | 2021-04-16 | 2021-07-20 | 上海纬而视科技股份有限公司 | Take COB packaging substrate's LED circuit board |
-
2017
- 2017-09-30 CN CN201721287374.1U patent/CN207303140U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140554A (en) * | 2021-04-16 | 2021-07-20 | 上海纬而视科技股份有限公司 | Take COB packaging substrate's LED circuit board |
| CN113140554B (en) * | 2021-04-16 | 2024-03-19 | 上海纬而视科技股份有限公司 | LED circuit board with COB packaging substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 1303, Tower B, Hongrongyuan North Station Center, Minzhi Street North Station Community, Longhua District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Chenda Semiconductor Co.,Ltd. Address before: Room 2602, Zhonghang Yuan Dingcheng Building, Zhenhua Road, Huaqiang North Street, Shenzhen City, Guangdong Province, 518000 Patentee before: SHENZHEN CHENDAHANG ELECTRONICS CO.,LTD. |
|
| CP03 | Change of name, title or address |